Two-component liquid resin composition and power module

Abstract

Provided is a two-component liquid resin composition comprising a first liquid and a second liquid, wherein: the first liquid contains an epoxy resin (A) and an inorganic filler (C); the second liquid contains a curing agent (B) and the inorganic filler (C); and the stress coefficient ɑxE, calculated as the product of a linear expansion coefficient ɑ and a flexural modulus E, is at most 190.

Description

Two-component liquid resin composition and power module

[0001] The present invention relates to a two-component liquid resin composition and a power module.

[0002] Epoxy resins are used as encapsulating materials to seal substrates and semiconductor elements. An example of a technology related to encapsulating materials is the technology described in Patent Document 1.

[0003] Patent Document 1 describes a semiconductor encapsulant filler and a semiconductor encapsulant composition using the same, with the objective of providing a semiconductor encapsulant filler that is incorporated into the encapsulant to reduce the coefficient of thermal expansion of the encapsulant and maintain the encapsulant at a low viscosity to improve its permeability. The filler is characterized by comprising an inorganic substance and an organic layer having functional groups that can react with an epoxy resin, which is chemically bonded to the surface of the inorganic substance. The patent also describes a semiconductor encapsulant containing this filler and an epoxy resin.

[0004] Japanese Patent Publication No. 2009-67890

[0005] The present invention provides a two-component liquid resin composition that can suppress the occurrence of warping when cured, and a power module using the above two-component liquid resin composition.

[0006] The inventors diligently conducted research to achieve the above objectives. As a result, they discovered that a two-component liquid resin composition containing epoxy resin, a curing agent, and an inorganic filler, and that by setting the stress coefficient calculated as the product of the coefficient of linear expansion and the modulus of elasticity to a specific range, the occurrence of warping during curing can be suppressed, thus completing the present invention.

[0007] According to the present invention, the following two-component liquid resin composition and power module are provided.

[0008] [1] A two-component liquid resin composition comprising a first liquid and a second liquid, wherein the first liquid contains an epoxy resin (A) and an inorganic filler (C), and the second liquid contains a curing agent (B) and an inorganic filler (C), and the stress coefficient α × E calculated by the product of the linear expansion coefficient α according to (Method 1) below and the flexural modulus E according to (Method 2) below is 190 or less. (Method 1) A mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After slowly cooling the cured product to 25°C, it is cut to dimensions of 10 mm × 5 mm × 5 mm to obtain a test piece. The test piece is set in a thermomechanical analyzer and measurements are taken under the conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The measurement data is analyzed and the average linear expansion coefficient in the temperature range from 50°C to 150°C is defined as the linear expansion coefficient α (ppm / K). (Method 2) A mixture of the first liquid and the second liquid is poured into a mold with a hole (width 4 mm, length 100 mm, height 120 mm), heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut out to dimensions of 4 mm × 10 mm × 100 mm to obtain a test piece. The flexural modulus E (GPa) of the test piece is measured at 25°C in accordance with JIS K 6911:2006, under conditions of a test speed of 2 mm / min and a support distance of 64 mm. [2] The two-component liquid resin composition described in [1] above, wherein the linear expansion coefficient α is 5 ppm / K or more and 38 ppm / K or less. [3] The two-component liquid resin composition according to [1] or [2] above, wherein the flexural modulus E is 5 GPa or more and 38 GPa or less. [4] The two-component liquid resin composition according to any one of [1] to [3] above, wherein the epoxy resin (A) comprises an alicyclic epoxy resin. [5] The two-component liquid resin composition according to [4] above, wherein the content of the alicyclic epoxy resin is 50 parts by mass or more and 100 parts by mass or less when the content of the epoxy resin (A) is 100 parts by mass. [6] The two-component liquid resin composition according to any one of [1] to [5] above, wherein the content of the epoxy resin (A) is 1% by mass or more and 30% by mass or less when the entire two-component liquid resin composition is 100% by mass.[7] The two-component liquid resin composition according to [6], wherein the content of the epoxy resin (A) is 5% by mass or more and 30% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. [8] The two-component liquid resin composition according to any one of [1] to [7], wherein the curing agent (B) contains an acid anhydride. [9] The two-component liquid resin composition according to [8], wherein the acid anhydride contains one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic acid anhydride, methylcyclohexane-1,2-dicarboxylic acid anhydride, and methyltetrahydrophthalic anhydride.

[10] The two-component liquid resin composition according to any one of [1] to [9], wherein the content of the curing agent (B) is 1% by mass or more and 20% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass.

[11] The two-component liquid resin composition according to any one of [1] to

[10] above, wherein the inorganic filler (C) comprises one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate.

[12] The average particle size D of the inorganic filler (C) when the cumulative value in the volume frequency particle size distribution measured by laser diffraction scattering method reaches 50%. ５０A two-component liquid resin composition according to any one of [1] to

[11] above, wherein the particle size is 0.5 μm or more and 100 μm or less.

[13] A two-component liquid resin composition according to any one of [1] to

[12] above, wherein the content of the inorganic filler (C) is 65% by mass or more and 90% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass.

[14] A two-component liquid resin composition according to any one of [1] to

[13] above, wherein at least one of the first liquid and the second liquid further contains a stress-reducing agent.

[15] A two-component liquid resin composition according to

[14] above, wherein the stress-reducing agent contains rubber particles.

[16] A two-component liquid resin composition according to

[14] or

[15] above, wherein the content of the stress-reducing agent is 1.0% by mass or more and 10.0% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass.

[17] A two-component liquid resin composition according to any one of [1] to

[16] , wherein at least one of the first liquid and the second liquid further comprises a settling inhibitor.

[18] A two-component liquid resin composition according to

[17] , wherein the settling inhibitor comprises one or more selected from the group consisting of layered inorganic minerals and nanosilica.

[19] A two-component liquid resin composition according to

[18] , wherein the layered inorganic mineral comprises one or more selected from the group consisting of clay and talc.

[20] A two-component liquid resin composition according to any one of

[17] to

[19] , wherein the content of the settling inhibitor is 0.01% by mass or more and 2.00% by mass or less when the entire two-component liquid resin composition is considered as 100% by mass.

[21] A two-component liquid resin composition according to any one of [1] to

[20] , wherein at least one of the first liquid and the second liquid further comprises a curing accelerator.

[22] The two-component liquid resin composition according to

[21] , wherein the curing accelerator comprises one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organophosphines, and Lewis acid catalysts.

[23] The two-component liquid resin composition according to

[21] or

[22] , wherein the content of the curing accelerator is 0.01% by mass or more and 1.00% by mass or less when the entire two-component liquid resin composition is considered as 100% by mass.

[24] A two-component liquid resin composition according to any one of [1] to

[23] above, wherein the viscosity η of the mixture of the first liquid and the second liquid, measured using an E-type viscometer and a 3° × R14 cone rotor at a rotation speed of 5 rpm and a temperature of 60°C, is 1.0 Pa·s or more and 15.0 Pa·s or less.

[25] A two-component liquid resin composition according to any one of [1] to

[24] above, wherein the glass transition temperature according to the following (Method 3) is 150°C or more and 300°C or less. (Method 3) A mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After slowly cooling the cured product to 25°C, it is cut out to dimensions of 10 mm × 5 mm × 5 mm to obtain a test piece. The test piece is set in a thermomechanical analyzer and measured under the conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The glass transition temperature (°C) is calculated from the measurement data.

[26] A two-component liquid resin composition according to any one of [1] to

[25] above, wherein the amount of warping according to (Method 4) is 30 μm or less. (Method 4) A case is made by bonding a copper plate (C1020 P, 85 mm long x 60 mm wide x 1.5 mm thick) as a bottom plate to an outer frame made of phenolic resin molding material measuring 70 mm long (outer dimensions) x 50 mm wide (outer dimensions) x 3 to 5 mm thick (64 mm long (inner dimensions) x 40 to 44 mm wide (inner dimensions)) using an epoxy resin adhesive. 45 g of a mixture of the first liquid and the second liquid, which has been preheated to 60°C, is poured into the case. The mixture is heated with the case at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. The cured product is slowly cooled to 25°C, and the amount of warpage (μm) is calculated from the change in shape of the bottom plate before and after curing using a three-dimensional measuring instrument.

[27] A two-component liquid resin composition according to any one of [1] to

[26] above, which can be used to seal a power module comprising a power module substrate including a circuit layer and a power semiconductor element on the circuit layer of the power module substrate by a casting method.

[28] A two-component liquid resin composition according to any one of [1] to

[27] above, wherein the solvent content is 0.50% by mass or less.

[29] A two-component liquid resin composition according to any one of [1] to

[28] above, wherein the stress coefficient α × E is 100 or more.

[30] A power module comprising: a power module substrate including a circuit layer; a power semiconductor element on the circuit layer of the power module substrate; and a sealing material for sealing the power module substrate and the power semiconductor element, wherein the sealing material includes a cured product of a two-component liquid resin composition as described in any of [1] to

[29] above.

[31] The power module according to

[30] above, wherein the power semiconductor element includes one or more selected from the group consisting of MOS transistors and insulated gate bipolar transistors (IGBTs).

[0009] According to the present invention, it is possible to provide a two-component liquid resin composition that can suppress the occurrence of warping when cured, and a power module using the above two-component liquid resin composition.

[0010] Embodiments of the present invention will be described below. In this specification, numerical ranges indicated using "~" indicate a range that includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in one step can be arbitrarily combined with the upper or lower limit of a numerical range in another step. In numerical ranges described in this specification, the upper or lower limit of that numerical range may be replaced with the values ​​shown in the examples. "A or B" means that either A or B is included, or both are included. Unless otherwise specified, the materials exemplified in this specification can be used individually or in combination of two or more. In this specification, the content of each component in the composition means the total amount of multiple substances present in the composition if there are multiple substances corresponding to each component in the composition, unless otherwise specified. In this specification, the statement "when the entire two-component liquid resin composition (or first liquid and second liquid) is 100% by mass" means excluding components such as solvents that volatilize when the two-component liquid resin composition is cured.

[0011] [Two-component liquid resin composition] The two-component liquid resin composition of this embodiment is a two-component liquid resin composition consisting of a first liquid and a second liquid, wherein the first liquid contains epoxy resin (A) and inorganic filler (C), and the second liquid contains curing agent (B) and inorganic filler (C), and the stress coefficient α × E calculated by the product of the linear expansion coefficient α according to (Method 1) below and the flexural modulus E according to (Method 2) below is 190 or less. From the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, the stress coefficient α × E of the two-component liquid resin composition of this embodiment is preferably 100 or more, more preferably 120 or more, even more preferably 130 or more, even more preferably 140 or more, even more preferably 150 or more, and preferably 189 or less, more preferably 188 or less. Furthermore, the stress coefficient α × E of the two-component liquid resin composition of this embodiment is preferably 100 to 190, more preferably 120 to 190, even more preferably 130 to 190, even more preferably 140 to 189, and even more preferably 150 to 188, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured.

[0012] (Method 1) A mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut to dimensions of 10 mm × 5 mm × 5 mm to obtain a test specimen. The test specimen is set in a thermomechanical analyzer and measurements are taken under the conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The measurement data is analyzed and the average linear expansion coefficient in the temperature range of 50°C to 150°C is defined as the linear expansion coefficient α (ppm / K).

[0013] (Method 2) A mixture of the first liquid and the second liquid is poured into a mold with a hole (width 4 mm, length 100 mm, height 120 mm), heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut out to dimensions of 4 mm × 10 mm × 100 mm to obtain a test specimen. The bending modulus of elasticity E (GPa) of the test specimen is measured at 25°C in accordance with JIS K 6911:2006, under conditions of a test speed of 2 mm / min and a support distance of 64 mm.

[0014] The inventors have found that by setting the product of the coefficient of linear expansion α and the flexural modulus E to a specific numerical range, the effect of thermal shrinkage deformation of the cured product of a two-component liquid resin composition can be suppressed, and as a result, the occurrence of warping upon curing can be suppressed. In other words, the two-component liquid resin composition of this embodiment can suppress the occurrence of warping upon curing by satisfying the above configuration.

[0015] The coefficient of linear expansion α of the two-component liquid resin composition of this embodiment is preferably 5 ppm / K or more and 38 ppm / K or less, more preferably 6 ppm / K or more and 35 ppm / K or less, even more preferably 7 ppm / K or more and 30 ppm / K or less, even more preferably 8 ppm / K or more and 25 ppm / K or less, even more preferably 9 ppm / K or more and 20 ppm / K or less, and even more preferably 10 ppm / K or more and 15 ppm / K or less, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured.

[0016] The flexural modulus E of the two-component liquid resin composition of this embodiment is preferably 5 GPa or more and 38 GPa or less, more preferably 6 GPa or more and 38 GPa or less, even more preferably 7 GPa or more and 35 GPa or less, even more preferably 8 GPa or more and 30 GPa or less, even more preferably 9 GPa or more and 25 GPa or less, and even more preferably 10 GPa or more and 20 GPa or less, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured.

[0017] The viscosity η of the mixture of the first and second liquids of the two-component liquid resin composition of this embodiment, measured using an E-type viscometer and a 3° × R14 cone rotor at a rotation speed of 5 rpm and a temperature of 60°C, is preferably 1.0 Pa·s to 15.0 Pa·s, more preferably 2.0 Pa·s to 13.0 Pa·s, even more preferably 3.0 Pa·s to 11.0 Pa·s, even more preferably 4.0 Pa·s to 9.0 Pa·s, and even more preferably 4.5 Pa·s to 7.0 Pa·s, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured.

[0018] An example of an E-type viscometer that can be used to measure the viscosity η of the two-component liquid resin composition of this embodiment is the TV-200 manufactured by Toki Sangyo Co., Ltd.

[0019] The glass transition temperature of the two-component liquid resin composition of this embodiment, as determined by the following method (3), is preferably 150°C to 300°C, more preferably 160°C to 290°C, even more preferably 170°C to 280°C, even more preferably 180°C to 270°C, even more preferably 190°C to 260°C, and even more preferably 190°C to 250°C, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured.

[0020] (Method 3) A mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut to dimensions of 10 mm × 5 mm × 5 mm to obtain a test specimen. The test specimen is set in a thermomechanical analyzer and measured under conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The glass transition temperature (°C) is calculated from the measurement data.

[0021] Examples of thermomechanical analyzers that can be used to measure the glass transition temperature of the two-component liquid resin composition of this embodiment include the TMA7100 manufactured by Hitachi High-Tech Science Corporation.

[0022] The amount of warping of the two-component liquid resin composition according to this embodiment, as determined by the following method (4), is preferably 30 μm or less, more preferably 28 μm or less, and even more preferably 26 μm or less, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured. Furthermore, the lower limit of the amount of warping of the two-component liquid resin composition according to the following method (4) is not particularly limited, but for example, it is 0 μm or more.

[0023] (Method 4) A case is made by bonding a copper plate (C1020 P, 85 mm long x 60 mm wide x 1.5 mm thick) as a bottom plate to an outer frame made of phenolic resin molding material measuring 70 mm long (outer dimensions) x 50 mm wide (outer dimensions) x 3-5 mm thick (64 mm long (inner dimensions) x 40-44 mm wide (inner dimensions)) using epoxy resin adhesive. 45 g of a mixture of the first liquid and the second liquid, preheated to 60°C, is poured into the case. The mixture is heated with the case at 160°C for 1 hour, then at 180°C for 2 hours to obtain a cured product. The cured product is slowly cooled to 25°C, and the amount of warping (μm) is calculated from the change in shape of the bottom plate before and after curing using a three-dimensional measuring instrument.

[0024] Examples of 3D measuring instruments that can be used to measure the amount of warpage of the two-component liquid resin composition of this embodiment include the Keyence One-Shot 3D Shape Measuring Machine (product name: VR-5000).

[0025] The components used in the two-component liquid resin composition of this embodiment will be described in detail below.

[0026] (Epoxy resin (A)) The two-component liquid resin composition of this embodiment contains epoxy resin (A) as the first liquid. The epoxy resin of this embodiment is preferably an alicyclic epoxy resin; a bisphenol type epoxy resin such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylenediisopridiene)bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylenediisopridiene)bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4'-cyclohexydiene bisphenol type epoxy resin), phenol novolac type epoxy resin, cresol novolac type epoxy resin, trisphenol group methane type novolac type epoxy resin Novolac epoxy resins such as tetraphenol group ethane type novolac epoxy resins and novolac epoxy resins having a condensed ring aromatic hydrocarbon structure; aromatic glycidylamine type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, and aminophenol type glycidylamine; aminophenol type epoxy resins; biphenyl type epoxy resins; arylalkylene type epoxy resins such as xylylene type epoxy resins and biphenyl aralkyl type epoxy resins; naphthalene type epoxy resins such as naphthylene ether type epoxy resins, naphthol type epoxy resins, naphthalenediol type epoxy resins, bifunctional to tetrafunctional epoxy type naphthalene resins, binaphthyl type epoxy resins, and naphthalene aralkyl type epoxy resins; anthracene type epoxy resins; phenoxy type epoxy resins; dicyclopentadiene type epoxy resins; norbornene type epoxy resins; adamantane type epoxy resins;Containing one or more selected from the group consisting of fluorene-type epoxy resins, and more preferably containing one or more selected from the group consisting of alicyclic epoxy resins and aminophenol-type epoxy resins from the viewpoint of further improving the fluidity of the two-component liquid resin composition, and even more preferably containing an alicyclic epoxy resin.;

[0027] From the viewpoint of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, and from the viewpoint of further improving the performance balance of the strength, hardness, elastic modulus, thermal expansion rate, thermal conductivity, heat dissipation, and electrical properties of the cured product of the two-component liquid resin composition, preferably contains an alicyclic epoxy resin that is liquid at 25°C, and more preferably, vinylcyclopentadiene dioxide, vinylcyclohexene monodioxide, vinylcyclohexene dioxide, dicyclopentadiene oxide, 3,4-epoxy-1-[8,9-epoxy-2,4-dioxaspiro[5.5]undecan-3-yl]-cyclohexane and other epoxy-[epoxy-oxaspiro C ８－１５ alkyl]-cyclo C ５－１２ alkane; 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate, 4,5-epoxycyclooctylmethyl-4',5'-epoxycyclooctanecarboxylate and other epoxy C ５－１２ cycloalkyl C １－３ alkyl-epoxy C ５－１２ cycloalkanecarboxylate; bis(2-methyl-3,4-epoxycyclohexylmethyl)adipate and other bis(C １－３ alkyl epoxy C ５－１２ cycloalkyl C １－３ alkyl)dicarboxylate, and more preferably epoxy C ５－１２ cycloalkyl C １－３ alkyl-epoxy C ５－１２It contains a cycloalkane carboxylate, and more preferably 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate. A commercially available product of 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexanecarboxylate is Daicel Corporation's trade name: Celoxide 2021P (epoxy equivalent: 128-140).

[0028] When the epoxy resin (A) of this embodiment includes an alicyclic epoxy resin, the content of the alicyclic epoxy resin is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, even more preferably 70 parts by mass or more, even more preferably 80 parts by mass or more, even more preferably 90 parts by mass or more, and even more preferably 95 parts by mass or more, when the content of epoxy resin (A) in the two-component liquid resin composition of this embodiment is 100 parts by mass, and the upper limit is not particularly limited, but for example it may be 100 parts by mass or less. Furthermore, when the epoxy resin (A) of this embodiment includes an alicyclic epoxy resin, the content of the alicyclic epoxy resin is preferably 50 parts by mass or more and 100 parts by mass or less, more preferably 60 parts by mass or more and 100 parts by mass or less, even more preferably 70 parts by mass or more and 100 parts by mass or less, even more preferably 80 parts by mass or more and 100 parts by mass or less, even more preferably 90 parts by mass or more and 100 parts by mass or less, and even more preferably 95 parts by mass or more and 100 parts by mass or less, when the content of epoxy resin (A) in the two-component liquid resin composition of this embodiment is 100 parts by mass.

[0029] The epoxy resin (A) content in the two-component liquid resin composition of this embodiment is preferably 1% to 30% by mass, more preferably 2% to 30% by mass, even more preferably 3% to 30% by mass, even more preferably 5% to 30% by mass, even more preferably 6% to 25% by mass, even more preferably 7% to 20% by mass, and even more preferably 7% to 15% by mass, when the entire two-component liquid resin composition is considered as 100% by mass.

[0030] (Curing agent (B)) The two-component liquid resin composition of this embodiment contains a curing agent (B) as the second liquid. The curing agent (B) preferably contains an acid anhydride, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the cured product of the two-component liquid resin composition in terms of strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, and electrical properties.

[0031] From the viewpoint of further suppressing the occurrence of warping when a two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the cured product of the two-component liquid resin composition in terms of strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, and electrical properties, the acid anhydrides are preferably dodecenyl succinic anhydride, polyadipic anhydride, polyazelaic anhydride, polysebacic anhydride, poly(ethyl octadecanediic acid) anhydride, poly(phenylhexadecanedioic acid) anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methylhymic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexendicarboxylic acid anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic acid anhydride, and ethylene glycol. It comprises one or more selected from the group consisting of bistrimellitate, hetic anhydride, tetrahydrophthalic anhydride, methylnadic anhydride (methyl-5-norbornene-2,3-dicarboxylic anhydride), methylhymic anhydride (methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride), methylcyclohexane-1,2-dicarboxylic anhydride, and 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, more preferably one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic anhydride, methylcyclohexane-1,2-dicarboxylic anhydride, and methyltetrahydrophthalic anhydride, and even more preferably methyl-5-norbornene-2,3-dicarboxylic anhydride.

[0032] The content of the curing agent (B) in the two-component liquid resin composition of this embodiment is preferably 1% to 20% by mass, more preferably 2% to 18% by mass, even more preferably 3% to 16% by mass, even more preferably 4% to 14% by mass, even more preferably 5% to 12% by mass, and even more preferably 6% to 10% by mass, when the entire two-component liquid resin composition is considered as 100% by mass.

[0033] (Inorganic filler (C)) The two-component liquid resin composition of this embodiment contains an inorganic filler (C) in the first liquid and the second liquid. The inorganic filler (C) preferably comprises one or more selected from the group consisting of silica, alumina, zircon, iron oxide, zinc oxide, titanium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, glass fiber, glass flakes, alumina fiber, carbon fiber, graphite, carbon black, ferrite, graphite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, manganese carbonate, magnesium carbonate, barium sulfate, potassium titanate, calcium silicate, inorganic balloons, and silver powder, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the two-component liquid resin composition, and the strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, and electrical properties of the cured product of the two-component liquid resin composition. More preferably, it comprises one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate. The inorganic filler may also be subjected to surface treatment. Surface treatments include, but are not limited to, alkylation, trimethylsilylation, silicone treatment, and treatment with silane coupling agents.

[0034] From the perspective of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, as well as improving the balance of performance such as the fluidity of the two-component liquid resin composition, the strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, and electrical properties of the cured product of the two-component liquid resin composition, the shape of the inorganic filler (C) in the present embodiment is preferably fibrous, amorphous, or spherical, and more preferably spherical. Also, from the perspective of reducing the manufacturing cost of the two-component liquid resin composition, the shape of the inorganic filler (C) in the present embodiment is more preferably amorphous. Here, the spherical shape may be a true sphere, an ellipse, or a substantially spherical shape including an oval shape. The aspect ratio (ratio of the long diameter to the short diameter) of the inorganic filler (C) in the present embodiment is preferably 1.3 or less, more preferably 1.2 or less, and even more preferably 1.1 or less.

[0035] In the volume frequency particle size distribution of the inorganic filler (C) in the present embodiment measured by the laser diffraction scattering method, the average particle diameter D when the cumulative value is 50% ５０ is preferably 0.5 μm or more and 100 μm or less, more preferably 1.0 μm or more and 100 μm or less, even more preferably 3.0 μm or more and 100 μm or less, even more preferably 5.0 μm or more and 90 μm or less, even more preferably 7.0 μm or more and 80 μm or less, even more preferably 10 μm or more and 70 μm or less, even more preferably 12 μm or more and 60 μm or less, even more preferably 15 μm or more and 50 μm or less, even more preferably 17 μm or more and 40 μm or less, and even more preferably 20 μm or more and 30 μm or less, from the perspective of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, as well as improving the balance of performance such as the fluidity of the two-component liquid resin composition, the strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation, and electrical properties of the cured product of the two-component liquid resin composition. The inorganic filler (C) in the present embodiment has the above average particle diameter D ５０ within the range, and may contain an inorganic filler having two or more different average particle diameters D ５０

[0036] The average particle diameter D of the inorganic filler (C) in the present embodiment ５０It can be measured by, for example, a laser diffraction scattering measurement method using a laser diffraction type particle size distribution measuring device (for example, SALD-7000 manufactured by Shimadzu Corporation).

[0037] From the viewpoint of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance such as the fluidity of the two-component liquid resin composition, the strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation property, and electrical properties of the cured product of the two-component liquid resin composition, when the entire two-component liquid resin composition is 100% by mass, it is preferably 65% by mass or more and 90% by mass or less, more preferably 67% by mass or more and 90% by mass or less, still more preferably 69% by mass or more and 87% by mass or less, still more preferably 71% by mass or more and 85% by mass or less, still more preferably 73% by mass or more and 84% by mass or less, still more preferably 75% by mass or more and 83% by mass or less.

[0038] From the viewpoint of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, and from the viewpoint of further improving the fluidity of the first liquid, when the entire first liquid is 100% by mass, it is preferably 50% by mass or more and 90% by mass or less, more preferably 55% by mass or more and 88% by mass or less, still more preferably 60% by mass or more and 85% by mass or less, still more preferably 65% by mass or more and 80% by mass or less, still more preferably 70% by mass or more and 80% by mass or less.

[0039] From the viewpoint of further suppressing the occurrence of warpage when the two-component liquid resin composition is cured, and from the viewpoint of further improving the fluidity of the second liquid, when the entire second liquid is 100% by mass, it is preferably 50% by mass or more and 90% by mass or less, more preferably 55% by mass or more and 90% by mass or less, still more preferably 60% by mass or more and 89% by mass or less, still more preferably 65% by mass or more and 88% by mass or less, still more preferably 70% by mass or more and 87% by mass or less, still more preferably 75% by mass or more and 86% by mass or less, still more preferably 80% by mass or more and 85% by mass or less.

[0040] (Stress-reducing agent) In this embodiment, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the fluidity of the two-component resin composition and the strength, hardness, elastic modulus, and thermal expansion coefficient of the cured product of the two-component resin composition, preferably at least one of the first liquid and the second liquid further contains a stress-reducing agent, and more preferably the first liquid further contains a stress-reducing agent.

[0041] The stress-reducing agent preferably includes rubber particles, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the fluidity of the two-component resin composition and the strength, hardness, elastic modulus, and thermal expansion coefficient of the cured product of the two-component resin composition. The rubber particles preferably include core-shell type rubber particles, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the fluidity of the two-component resin composition and the strength, hardness, elastic modulus, and thermal expansion coefficient of the cured product of the two-component resin composition. Core-shell type rubber particles refer to rubber particles in which a part or all of the surface of a particulate core component, mainly composed of a crosslinked rubber-like polymer, is coated with a shell component by graft polymerization of a polymer different from the core component onto the surface of the particulate core component.

[0042] The core component preferably includes crosslinked rubber particles. The crosslinked rubber particles preferably include one or more selected from the group consisting of diene rubber, acrylic rubber, and polysiloxane rubber, and more preferably include one or more selected from the group consisting of butadiene rubber, acrylic rubber, silicone rubber, butyl rubber, nitrile rubber, styrene rubber, synthetic natural rubber, and ethylene propylene rubber.

[0043] The shell component preferably comprises one or more selected from the group consisting of diene rubber, acrylic rubber, and polysiloxane rubber, and more preferably comprises a polymer polymerized from one or more monomers selected from the group consisting of acrylic acid esters, methacrylic acid esters, and aromatic vinyl compounds. The shell component is preferably graft polymerized onto the core component and chemically bonded to the polymer constituting the core component. When a crosslinked rubber-like polymer composed of a polymer of styrene and butadiene is used as the core component, the shell component preferably comprises a polymer of methyl methacrylate, which is a methacrylic acid ester, and styrene, which is an aromatic vinyl compound.

[0044] The average particle diameter of the primary particles of the core-shell type rubber particles is preferably 50 nm to 500 nm, more preferably 50 nm to 300 nm, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance of the fluidity of the two-component resin composition and the strength, hardness, elastic modulus, and thermal expansion coefficient of the cured product of the two-component resin composition.

[0045] Examples of commercially available stress-reducing agents include “Paraloid®” EXL-2655 (manufactured by Kureha Chemical Industry Co., Ltd.), which consists of a butadiene alkyl methacrylate styrene copolymer; “Stafiloid®” AC-3355 and TR-2122 (manufactured by Takeda Pharmaceutical Company Limited), which consist of an acrylic acid ester / methacrylate copolymer; “PARALOID®” EXL-2611 and EXL-3387 (manufactured by Rohm & Haas), which consist of a butyl acrylate / methyl methacrylate copolymer; and the “KaneAce®” MX series (manufactured by Kaneka Corporation).

[0046] The stress-reducing agent can also be obtained as a masterbatch-type epoxy resin in which core-shell type rubber particles are pre-dispersed in the epoxy resin. Examples of such core-shell type rubber particle-dispersed epoxy resins include "KaneAce®" (manufactured by Kaneka Corporation) and "Acryset® BP Series" (manufactured by Nippon Shokubai Co., Ltd.). By using such a masterbatch-type core-shell type rubber particle-dispersed epoxy resin, the dispersion state of the core-shell type rubber particles in the resulting resin composition can be improved. Commercially available core-shell type rubber particle dispersed epoxy resins include Kaneka Corporation's KaneAce MX series, such as MX-113, MX-120, MX-125, MX-128, MX-130, MX-135, MX-136, MX-156, MX-153, MX-257, MX-150, MX-154, MX-960, MX-170, MX-267, MX-965, MX-217, MX-416, MX-451, MX-553, MX-710, and MX-714.

[0047] The content of the stress-reducing agent in the two-component liquid resin composition of this embodiment is preferably 1.0% to 10.0% by mass, more preferably 1.2% to 9.0% by mass, even more preferably 1.5% to 8.0% by mass, even more preferably 1.8% to 7.0% by mass, and even more preferably 2.0% to 6.5% by mass, when the entire two-component liquid resin composition is considered as 100% by mass.

[0048] (Settling Inhibitor) The two-component liquid resin composition of this embodiment preferably further contains a settling inhibitor in at least one of the first liquid and the second liquid, and more preferably both the first liquid and the second liquid further contain a settling inhibitor, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0049] The settling inhibitor preferably comprises one or more selected from the group consisting of an inorganic thickener (excluding the inorganic filler (C) described above) and a dispersant, and more preferably comprises an inorganic thickener, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0050] - Inorganic thickener The anti-settling agent in this embodiment preferably includes one or more selected from the group consisting of layered inorganic minerals and nanosilica, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0051] The layered inorganic mineral preferably comprises one or more selected from the group consisting of clay and talc, and more preferably comprises organic clay, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0052] From the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition, the clay preferably contains one or more selected from the group consisting of kaolin, smectite, illite, bentonite (montmorillonite), hectorite, pyrophyllite, ataprugite, sepiolite, and laponite, and more preferably contains bentonite. Furthermore, the organic clay preferably contains one or more selected from the group consisting of organic kaolin, organic smectite, organic illite, organic bentonite (organic montmorillonite), organic hectorite, organic pyrophyllite, organic atuprugite, organic sepiolite, and organic laponite, more preferably organic bentonite, even more preferably bentonite ion-exchanged with a quaternary ammonium salt, even more preferably bentonite ion-exchanged with a quaternary alkylammonium salt, even more preferably bentonite ion-exchanged with a quaternary alkylammonium salt containing at least one alkyl group having 6 to 24 carbon atoms, and even more preferably bentonite ion-exchanged with a quaternary alkylammonium salt containing at least one alkyl group having 12 to 22 carbon atoms. Here, organic clay refers to a layered silicate (clay) in which organic compounds are interposed between layers of silicate planes stacked in a layered fashion. Between the stacked silicate planes, there are intermediate layer cations, such as sodium ions or calcium ions, which maintain the layered crystalline structure. By ion exchange between the intermediate layer cations and the organic cations, the organic compounds chemically bond to the surface of the silicate planes and are inserted into the interlayers.

[0053] In the organic clay, the organic compound ion-exchanged with the intermediate layer cation preferably comprises a quaternary ammonium salt, more preferably a quaternary alkylammonium salt, even more preferably a quaternary alkylammonium salt containing at least one alkyl group having 6 to 24 carbon atoms, even more preferably a quaternary alkylammonium salt containing at least one alkyl group having 12 to 22 carbon atoms, and even more preferably one or more selected from the group consisting of trimethylstearylammonium salt, dimethylstearylbenzylammonium salt, dimethyloctadecylammonium salt, oleylbis(2-hydroxyethyl)methylammonium salt, dimethylstearylammonium salt, benzyldimethylstearylammonium salt, and dimethyldistearylammonium salt.

[0054] Examples of commercially available organic bentonite include Benton 34, Benton SD-1, Benton SD-2, Benton SD-3, Benton 57, Benton 52, etc. from ELEMENTIS; Esben NX, Esben N400, Esben WX, Esben NZ, Esben, Esben W, Esben C, Esben E, Esben NZ70, Esben NTO, Esben NX80, Esben NO12S, Esben NEZ, Esben NO12, Esben NE, etc. from Hojun; and Kunibis 110, Kunibis 120, Kunibis 127, etc. from Kunimine Industries. Examples of commercially available organic hectorite used in this embodiment include Benton 27, Benton 38, etc. from ELEMENTIS.

[0055] The nanosilica contained in the inorganic thickener of this embodiment refers to the average particle size D of the primary particles when the cumulative value in the volume frequency particle size distribution measured by laser diffraction scattering method reaches 50%. ５０ This refers to particles with a diameter of less than 0.100 μm. The above average particle size D of nanosilica. ５０From the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition, the average particle size D of nanosilica is preferably 0.090 μm or less, more preferably 0.080 μm or less, even more preferably 0.070 μm or less, even more preferably 0.060 μm or less, even more preferably 0.050 μm or less, even more preferably 0.040 μm or less, even more preferably 0.030 μm or less, and even more preferably 0.020 μm or less. The lower limit is not particularly limited, but for example, it may be 0.001 μm or more, 0.003 μm or more, 0.005 μm or more, 0.008 μm or more, or 0.010 μm or more. ５０ This can be measured, for example, by a laser diffraction scattering measurement method using a laser diffraction particle size distribution analyzer (e.g., SALD-7000, manufactured by Shimadzu Corporation).

[0056] As the nanosilica in this embodiment, for example, Rheoroseal QS09, Rheoroseal QS10, Rheoroseal QS102, Rheoroseal CP102, Rheoroseal QS20, Rheoroseal QS20L, Rheoroseal QS30, Rheoroseal QS40, etc., manufactured by Tokuyama Corporation can be used.

[0057] - Dispersant The dispersant of this embodiment preferably contains an ester compound containing a long-chain hydrocarbon group, more preferably one or more selected from the group consisting of a carboxylic acid ester compound containing a long-chain hydrocarbon group, a phosphate ester compound containing a long-chain hydrocarbon group, a sulfate ester compound containing a long-chain hydrocarbon group, a nitrate ester compound containing a long-chain hydrocarbon group, and a carbonate ester compound containing a long-chain hydrocarbon group, and even more preferably one or more selected from the group consisting of a carboxylic acid ester compound containing a long-chain hydrocarbon group and a phosphate ester compound containing a long-chain hydrocarbon group.

[0058] In the ester compound containing long-chain hydrocarbon groups of this embodiment, the long-chain hydrocarbon group preferably comprises one or more selected from the group consisting of alkylene groups, alkyl groups, alkenyl groups, aralkyl groups, aryl groups, and aryl groups in which one, two, or three hydrogen atoms of the hydrocarbon are substituted by substituents, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition, and more preferably comprises one or more selected from the group consisting of alkylene groups, alkyl groups, and alkenyl groups. The long-chain hydrocarbon group may be linear or branched. Some of the hydrogens in the long-chain hydrocarbon group may be substituted by substituents such as hydroxyl groups, aldehyde groups, carbonyl groups, carboxyl groups, amino groups, nitro groups, sulfo groups, and halogen groups. The long-chain hydrocarbon group may contain oxygen-containing bonding groups such as ether bonds and ester bonds in the long chain.

[0059] In the ester compound containing long-chain hydrocarbon groups of this embodiment, the ester group preferably comprises one or more selected from the group consisting of carboxylic acid ester groups, phosphate ester groups, sulfate ester groups, nitrate ester groups, and carbonate ester groups, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition, and more preferably comprises one or more selected from the group consisting of carboxylic acid ester groups and phosphate ester groups.

[0060] In this embodiment, the carbon number of the long-chain hydrocarbon group in the ester compound containing the long-chain hydrocarbon group is preferably 4 or more, more preferably 6 or more, even more preferably 8 or more, even more preferably 10 or more, and preferably 1000 or less, more preferably 800 or less, even more preferably 600 or less, even more preferably 400 or less, and even more preferably 200 or less, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity of the two-component liquid resin composition.

[0061] The mass-average molecular weight of the ester compound containing long-chain hydrocarbon groups in this embodiment is preferably 300 or more, more preferably 400 or more, even more preferably 500 or more, even more preferably 600 or more, even more preferably 700 or more, even more preferably 800 or more, and preferably 50,000 or less, more preferably 30,000 or less, even more preferably 15,000 or less, and even more preferably 10,000 or less, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition, and preferably 50,000 or less, more preferably 30,000 or less, even more preferably 15,000 or less, and even more preferably 10,000 or less. Furthermore, the mass-average molecular weight of the ester compound containing long-chain hydrocarbon groups in this embodiment is preferably 300 to 50,000, more preferably 400 to 50,000, even more preferably 500 to 50,000, even more preferably 600 to 30,000, even more preferably 700 to 15,000, and even more preferably 800 to 10,000, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0062] The ester compound containing long-chain hydrocarbon groups in this embodiment preferably includes one or more selected from the group consisting of polyhydroxycarboxylic acid esters, acidic phosphate esters, and carboxyl group-containing polymer modified products, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of storage stability and fluidity performance of the two-component liquid resin composition.

[0063] Examples of commercially available polyhydroxycarboxylic acid esters in this embodiment include BYK-R606 manufactured by BIC Chemie Japan.

[0064] Examples of commercially available acidic phosphate esters for this embodiment include BYK-W9010 manufactured by BIC Chemie Japan.

[0065] Examples of commercially available carboxyl group-containing polymer modified products of this embodiment include Floren G-700, Floren G-900, Floren G-1500, and NC-500, all manufactured by Kyoeisha Chemical Co., Ltd.

[0066] The content of the settling inhibitor in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 2.00% by mass or less, more preferably 0.05% by mass or more and 1.50% by mass or less, even more preferably 0.06% by mass or more and 1.00% by mass or less, even more preferably 0.07% by mass or more and 0.80% by mass or less, even more preferably 0.08% by mass or more and 0.50% by mass or less, even more preferably 0.09% by mass or more and 0.30% by mass or less, and even more preferably 0.10% by mass or more and 0.20% by mass or less, when the entire two-component liquid resin composition is considered as 100% by mass.

[0067] The content of the settling inhibitor in the first liquid of this embodiment is preferably 0.01% by mass or more and 2.00% by mass or less, more preferably 0.03% by mass or more and 1.50% by mass or less, even more preferably 0.05% by mass or more and 1.00% by mass or less, even more preferably 0.08% by mass or more and 0.80% by mass or less, even more preferably 0.10% by mass or more and 0.50% by mass or less, and even more preferably 0.15% by mass or more and 0.30% by mass or less, when the entire first liquid is considered as 100% by mass.

[0068] The content of the settling inhibitor in the second liquid of this embodiment is preferably 0.01% by mass or more and 2.00% by mass or less, more preferably 0.01% by mass or more and 1.50% by mass or less, even more preferably 0.01% by mass or more and 1.00% by mass or less, even more preferably 0.01% by mass or more and 0.80% by mass or less, even more preferably 0.01% by mass or more and 0.50% by mass or less, even more preferably 0.03% by mass or more and 0.30% by mass or less, even more preferably 0.05% by mass or more and 0.20% by mass or less, and even more preferably 0.08% by mass or more and 0.15% by mass or less, when the entire second liquid is considered as 100% by mass.

[0069] (Curing accelerator) In this embodiment, from the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance between the curability of the two-component resin composition and the strength and hardness of the cured product of the two-component resin composition, preferably at least one of the first liquid and the second liquid further contains a curing accelerator, and more preferably the second liquid further contains a curing accelerator.

[0070] The curing accelerator of this embodiment preferably comprises one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organophosphines, and Lewis acid catalysts, and more preferably comprises a quaternary ammonium salt, from the viewpoint of further suppressing the occurrence of warping when a two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance between the curability of the two-component resin composition and the strength and hardness of the cured product of the two-component resin composition.

[0071] The tertiary amine preferably includes one or more selected from the group consisting of trimethylamine, triethylamine, tripropylamine, tributylamine, and benzyldimethylamine.

[0072] The quaternary ammonium salt preferably includes one or more selected from the group consisting of diazabicycloundecene organic salts such as DBU[1,8-diazabicyclo[5.4.0]undecene-7] octylate (manufactured by Sunapro Co., Ltd., trade name: SA102), DBN[1,5-diazabicyclo[4.3.0]-5-nonene], quaternary ammonium salts which are salts of tertiary amines and carboxylic acids (manufactured by Sunapro Co., Ltd., trade name: U-CAT2313), octadecyltrimethylammonium chloride (manufactured by NOF Corporation, trade name: Nissan Cation), and tetraalkyl (each alkyl group has 1 to 18 carbon atoms) ammonium salts (e.g., tetraethylammonium bromide, tetrabutylammonium bromide, tetraalkylammonium carboxylate (carboxylic acid has 1 to 12 carbon atoms)). The curing accelerator of this embodiment more preferably contains an organic acid salt of diazabicycloundecene, from the viewpoint of further suppressing the occurrence of warping when a two-component liquid resin composition is cured, and from the viewpoint of further improving the balance of performance between the curability of the two-component resin composition and the strength and hardness of the cured product of the two-component resin composition.

[0073] The imidazoles preferably include one or more selected from the group consisting of 1-benzyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole, and 1-benzyl-2-phenylimidazole.

[0074] The organophosphine preferably includes one or more selected from the group consisting of triphenylphosphine, triphenylphosphine-triphenylborate, tris(p-methoxyphenyl)phosphine, and tetraphenylphosphonium-tetraphenylborate.

[0075] The Lewis acid catalyst preferably comprises one or more selected from the group consisting of boron trifluoride amine complexes, boron trichloride amine complexes, and boron trifluoride ethylamine complexes.

[0076] The content of the curing accelerator in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 1.00% by mass or less, more preferably 0.03% by mass or more and 0.80% by mass or less, even more preferably 0.05% by mass or more and 0.50% by mass or less, even more preferably 0.08% by mass or more and 0.30% by mass or less, and even more preferably 0.10% by mass or more and 0.20% by mass or less, when the entire two-component liquid resin composition is considered as 100% by mass.

[0077] (Other components) The two-component liquid resin composition of this embodiment may optionally contain a flame retardant, a coupling agent, a colorant such as carbon black, a defoamer such as a silicone defoamer, and so on.

[0078] The flame retardant of this embodiment preferably comprises one or more selected from the group consisting of aluminum oxide, magnesium hydroxide, zinc borate, zinc molybdate, antimony trioxide, antimony pentoxide, phosphazene, brominated epoxy resin, and brominated polycarbonate, and more preferably comprises one or more selected from the group consisting of antimony trioxide and brominated epoxy resin.

[0079] The amount of flame retardant in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 20.00% by mass or less, more preferably 0.05% by mass or more and 15.00% by mass or less, even more preferably 0.10% by mass or more and 10.00% by mass or less, even more preferably 0.50% by mass or more and 8.00% by mass or less, and even more preferably 1.00% by mass or more and 6.00% by mass or less, when the entire two-component liquid resin composition is considered as 100% by mass.

[0080] The coupling agent of this embodiment preferably comprises one or more selected from the group consisting of epoxysilane coupling agents, aminosilane coupling agents, ureidosilane coupling agents, and mercaptosilane coupling agents, and more preferably comprises an epoxysilane coupling agent, from the viewpoint of improving the interfacial strength between the epoxy resin (A) and the inorganic filler (C).

[0081] The epoxysilane coupling agent preferably comprises one or more selected from the group consisting of γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and more preferably comprises γ-glycidoxypropyltrimethoxysilane. The aminosilane coupling agent preferably comprises one or more selected from the group consisting of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-phenyl-γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-(6-aminohexyl)3-aminopropyltrimethoxysilane, and N-(3-(trimethoxysilylpropyl)-1,3-benzenedimethanane). The ureidosilane coupling agent, for example, comprises one or more selected from the group consisting of γ-ureidopropyltriethoxysilane and hexamethyldisilazane.

[0082] The content of the coupling agent in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 1.00% by mass or less, more preferably 0.03% by mass or more and 0.80% by mass or less, even more preferably 0.05% by mass or more and 0.60% by mass or less, and even more preferably 0.08% by mass or more and 0.40% by mass or less, when the entire two-component liquid resin composition is considered as 100% by mass.

[0083] The coloring agent of this embodiment preferably comprises one or more selected from the group consisting of carbon black, titanium dioxide, barium sulfate, iron black, iron oxide, aniline black, and alizanin, and more preferably comprises carbon black.

[0084] The colorant content in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 0.50% by mass or less, more preferably 0.02% by mass or more and 0.40% by mass or less, even more preferably 0.03% by mass or more and 0.30% by mass or less, and even more preferably 0.04% by mass or more and 0.20% by mass or less, when the entire two-component liquid resin composition is considered to be 100% by mass.

[0085] The defoaming agent of this embodiment preferably comprises one or more selected from the group consisting of silicone-based defoaming agents, fluorine-based defoaming agents, and polymer-based defoaming agents, and more preferably comprises a silicone-based defoaming agent.

[0086] The amount of the defoaming agent in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more and 1.00% by mass or less, more preferably 0.03% by mass or more and 0.80% by mass or less, even more preferably 0.05% by mass or more and 0.60% by mass or less, even more preferably 0.08% by mass or more and 0.40% by mass or less, and even more preferably 0.08% by mass or more and 0.20% by mass or less, when the entire two-component liquid resin composition is considered to be 100% by mass.

[0087] From the viewpoint of further suppressing the occurrence of warping when the two-component liquid resin composition is cured, the solvent content in the two-component liquid resin composition of this embodiment is preferably 0.50% by mass or less, more preferably 0.30% by mass or less, even more preferably 0.10% by mass or less, even more preferably 0.05% by mass or less, even more preferably 0.01% by mass or less, and even more preferably substantially solvent-free, when the entire two-component liquid resin composition is considered to be 100% by mass. Here, "substantially solvent-free" refers to the case where the solvent content in the two-component liquid resin composition is less than 0.05% by mass.

[0088] The solvent in the two-component liquid resin composition of this embodiment includes, for example, one or more selected from the group consisting of water, methanol, ethanol, acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, cellosorb-based solvents, carbitol-based solvents, anisole, and N-methylpyrrolidone.

[0089] (Method for Manufacturing a Two-Component Liquid Resin Composition) The method for manufacturing the two-component liquid resin composition of this embodiment will be described in detail below. The two-component liquid resin composition of this embodiment can be manufactured by thoroughly mixing and stirring, using known methods, the following components from the above-mentioned components: epoxy resin (A), inorganic filler (C), and other components as the first liquid, and curing agent (B), inorganic filler (C), and other components as the second liquid. If the two-component liquid resin composition of this embodiment contains a stress-reducing agent, the stress-reducing agent can preferably be mixed with the epoxy resin (A), inorganic filler (C), and other components in at least one of the first and second liquids, more preferably in the first liquid. If the two-component liquid resin composition of this embodiment contains a settling inhibitor, the settling inhibitor can preferably be mixed with the epoxy resin (A), inorganic filler (C), and other components in at least one of the first and second liquids, more preferably in both the first and second liquids, or with the curing agent (B), inorganic filler (C), and other components. If the two-component liquid resin composition of this embodiment contains a curing accelerator, the curing accelerator can preferably be mixed with the curing agent (B), inorganic filler (C), and other components in at least one of the first and second liquids, more preferably in the second liquid.

[0090] Methods for mixing and stirring each component to obtain the first or second liquid in the two-component liquid resin composition of this embodiment include using a mixer or other mixing machine, and a kneader or similar machine.

[0091] The two-component liquid resin composition of this embodiment is used as a mixed solution obtained by mixing the first and second liquids. Methods for mixing the first and second liquids include using a mixer or other mixing machine, or a kneader or similar machine.

[0092] In the two-component liquid resin composition of this embodiment, when the first liquid and the second liquid are further mixed, the content of the second liquid is preferably 50 parts by mass or more and 300 parts by mass or less, more preferably 70 parts by mass or more and 250 parts by mass or less, and even more preferably 90 parts by mass or more and 200 parts by mass or less, when the amount of the first liquid is 100 parts by mass, from the viewpoint of further improving the balance of performance of the fluidity, heat resistance during curing, and mechanical properties of the two-component liquid resin composition.

[0093] (Uses of the two-component liquid resin composition) The two-component liquid resin composition of this embodiment can preferably be used to seal a power module comprising a power module substrate including a circuit layer and a power semiconductor element on the circuit layer of the power module substrate by a casting method.

[0094] [Power Module] The power module of this embodiment comprises a power module substrate including a circuit layer, a power semiconductor element on the circuit layer of the power module substrate, and a sealing material for sealing the power module substrate and the power semiconductor element, wherein the sealing material includes a cured product of the two-component liquid resin composition of this embodiment described above.

[0095] The power module of this embodiment may be a small to medium-sized power module for home appliances, computers, etc., or a large power module for controlling automobiles, railway vehicles, substations, etc. Preferably, the power module of this embodiment is one or more selected from the group consisting of rectifiers, frequency converters, regulators, and inverters.

[0096] The power semiconductor elements in the power module of this embodiment preferably include one or more selected from the group consisting of rectifier diodes, power transistors, MOS transistors, insulated gate bipolar transistors (IGBTs), thyristors, gate turn-off thyristors (GTOs), and triacs, and more preferably include one or more selected from the group consisting of MOS transistors and insulated gate bipolar transistors (IGBTs).

[0097] The power module of this embodiment can be obtained by pouring the two-component liquid resin composition of this embodiment onto power semiconductor elements mounted on a power module substrate on which a circuit layer has been formed, so as to cover the substrate and the power semiconductor elements, and then curing the two-component liquid resin composition by heating. It is preferable to vacuum degas the two-component liquid resin composition during and / or before and after casting. Vacuum degassing removes air and other particles contained in the two-component liquid resin composition, making it possible to obtain a power module with fewer voids in the cured product of the two-component liquid resin composition. The heating method used to cure the two-component liquid resin composition of this embodiment is not particularly limited, and conventionally known methods such as hot air circulation heating, infrared heating, and high-frequency heating can be employed.

[0098] The heating temperature of the power module in this embodiment is preferably 100°C or higher, more preferably 110°C or higher, even more preferably 120°C or higher, and even more preferably 130°C or higher, from the viewpoint of improving the performance balance between the reliability and mechanical strength of the power module, and preferably 220°C or lower, more preferably 210°C or lower, and even more preferably 200°C or lower.

[0099] The heating time for the power module in this embodiment is preferably 30 seconds or more, more preferably 60 seconds or more, and even more preferably 300 seconds or more, from the viewpoint of improving the performance balance between the reliability and mechanical strength of the power module, and preferably 10 hours or less, more preferably 5 hours or less, and even more preferably 3 hours or less, from the viewpoint of the manufacturing efficiency of the power module.

[0100] Although embodiments of the present invention have been described above, these are merely examples, and various other configurations can be adopted. Furthermore, the present invention is not limited to the embodiments described above, and modifications, improvements, etc., within the scope that can achieve the objectives of the present invention are included in the present invention.

[0101] The present invention will be described in more detail below with reference to examples, but the present invention is not limited thereto.

[0102] <Examples and Comparative Examples> The components shown in "First Liquid" in Table 1 were mixed in the amounts (parts by mass) shown in Table 1 to obtain the first liquid (main component). Separately, the components shown in "Second Liquid" in Table 1 were mixed in the amounts (parts by mass) shown in Table 1 to obtain the second liquid (curing agent). Then, the first liquid and the second liquid were mixed in the ratio shown in "Mixing Ratio (First Liquid / Second Liquid)" in Table 1 to produce a mixed liquid (liquid resin composition). Details of each component in Table 1 are as follows.

[0103] <Epoxy Resin (A)> ・Epoxy Resin 1: 3,4-Epoxycyclohexylmethyl-3',4'-Epoxycyclohexanecarboxylate (Alicyclic epoxy resin, manufactured by Daicel Corporation, Celoxide 2021P) ・Epoxy Resin 2: Aminophenol type epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER630) <Curing Agent (B)> ・Curing Agent 1: Methylnadic anhydride (manufactured by Resonaq Corporation, MHAC-P) ・Curing Agent 2: Methyltetrahydrophthalic anhydride (manufactured by Resonaq Corporation, HN-2200) ・Curing Agent 3: Methyltetrahydrophthalic anhydride (manufactured by Resonaq Corporation, HN-2000) <Inorganic Filler (C)> ・Inorganic Filler 1: Spherical fused silica (manufactured by Denka Corporation, FB-950, average particle size D ５０: 23 μm) <Settling Inhibitor (D)> - Settling Inhibitor 1: Organic Bentonite (ELEMENTIS, Benton SD-2) - Settling Inhibitor 2: Organic Bentonite (Hojun, Esben N400) <Stress Reducing Agent> - Stress Reducing Agent 1: Core-Shell Type Rubber Particles (Kaneka, MX-553, Core-Shell Type Rubber Particle Dispersed Epoxy Resin with Alicyclic Epoxy Resin (Celoxide 2021P) and Core-Shell Type Rubber Particles in a Mass Ratio of 7:3) <Curing Accelerator> - Curing Accelerator 1: DBU-Octylate (Sunapro, U-CAT SA102)

[0104] <Other ingredients> ・Flame retardant 1: Brominated epoxy resin (DIC Corporation, EPICLON 153) ・Flame retardant 2: Antimony trioxide (Nippon Seikou Co., Ltd., PATOX-K) ・Coloring agent 1: Carbon black (Mitsubishi Chemical Corporation, Carbon #5) ・Coupling agent 1: Epoxysilane coupling agent (Momentive Performance Materials, Inc., A-187) ・Defoaming agent 1: Silicone-based defoaming agent (Nissou Sangyo Co., Ltd., TSA750) ・Defoaming agent 2: Silicone-based defoaming agent (Shin-Etsu Chemical Co., Ltd., KS603)

[0105] Average particle diameter D of the above inorganic filler ５０ The values ​​used were those obtained when the cumulative value of the volume-based particle size distribution was 50%, measured by the laser diffraction scattering method using a laser diffraction particle size distribution analyzer (SALD-7000, manufactured by Shimadzu Corporation).

[0106] <Physical Property Evaluation> The following physical properties were measured for the mixed solutions obtained in each example and comparative example.

[0107] (Viscosity) For the mixtures of the first and second liquids obtained in each example and comparative example, the viscosity η (Pa·s) was measured at a rotation speed of 5 rpm and a temperature of 60°C using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product name: TV-200) and a 3° × R14 cone rotor (rotor No. 4). At this time, the viscosity η measurement result was taken from the viscosity 1 minute after the rotation of the cone rotor set in the E-type viscometer started. The results are shown in Table 1.

[0108] (Glass Transition Temperature) The mixture of the first and second liquids obtained in each example and comparative example was poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product was slowly cooled to 25°C, it was cut to dimensions of 10 mm × 5 mm × 5 mm to obtain test specimens. The test specimens were set in a thermomechanical analyzer (Hitachi High-Tech Science Corporation, TMA7100) and measured under conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The glass transition temperature (°C) was calculated from the measurement data. The results are shown in Table 1.

[0109] (Coefficient of Linear Expansion) 40 g of the mixture of the first and second liquids obtained in each example and comparative example was poured into a 40 mL aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product was slowly cooled to 25°C, it was cut to dimensions of 10 mm × 5 mm × 5 mm to obtain test specimens. The test specimens were set in a thermomechanical analyzer (Hitachi High-Tech Science Corporation, TMA7100) and measurements were taken under the conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The measurement data was analyzed and the average coefficient of linear expansion in the temperature range from 50°C to 150°C was determined as the coefficient of linear expansion α (ppm / K). The results are shown in Table 1.

[0110] (Flexural Modulus) 90 g of a mixture of the first and second liquids obtained in each example and comparative example was poured into a mold with a hole (width 4 mm, length 100 mm, height 120 mm), heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product was slowly cooled to 25°C, it was cut out to dimensions of 4 mm × 10 mm × 100 mm to obtain test specimens. The flexural modulus E (GPa) of the test specimens was measured at 25°C in accordance with JIS K 6911:2006, under conditions of a test speed of 2 mm / min and a support distance of 64 mm. The results are shown in Table 1.

[0111] (Stress coefficient) Using the linear expansion coefficient α (ppm / K) and the flexural modulus E (GPa) obtained from the above (linear expansion coefficient) and (flexural modulus), the product of the linear expansion coefficient α (ppm / K) and the flexural modulus E (GPa) was calculated to obtain the stress coefficient α × E. The results are shown in Table 1.

[0112] (Warping amount and warping judgment) A case was fabricated by bonding a copper plate (C1020 P, 85 mm long x 60 mm wide x 1.5 mm thick) as a bottom plate to an outer frame made of phenolic resin molding material (Sumitomo Bakelite Co., Ltd., product name: PM-9825 (Type: J Black)) measuring 70 mm (outer dimensions) x 50 mm (outer dimensions) x 3-5 mm thick (64 mm (inner dimensions) x 40-44 mm wide (inner dimensions)) using epoxy resin adhesive (ThreeBond Fine Chemical Co., Ltd., product name: ThreeBond 2088E) as the bottom plate. 45 g of a mixture of the first and second liquids obtained in each example and comparative example, preheated to 60°C, was poured into the above case. The mixture was heated in the case at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. The cured material was slowly cooled to 25°C, and the amount of warping (μm) was calculated from the change in shape of the base plate before and after curing using a 3D measuring instrument (Keyence Corporation, One-Shot 3D Shape Measuring Machine, VR-5000). The results were evaluated according to the following criteria. The results are shown in Table 1. A: Warping amount is 30 μm or less B: Warping amount exceeds 30 μm

[0113]

[0114] This application claims priority based on Japanese Patent Application No. 2024-230146, filed on 26 December 2024, and incorporates all of its disclosures herein.

Claims

It is a two-component liquid resin composition consisting of a first liquid and a second liquid. The first liquid comprises an epoxy resin (A) and an inorganic filler (C). The second liquid comprises a curing agent (B) and an inorganic filler (C), A two-component liquid resin composition in which the stress coefficient α × E, calculated by the product of the linear expansion coefficient α according to Method 1 below and the flexural modulus E according to Method 2 below, is 190 or less. (Method 1) The mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut out to dimensions of 10 mm x 5 mm x 5 mm to obtain a test piece. The aforementioned test specimen is placed in a thermomechanical analyzer, and measurements are taken under conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The measurement data is analyzed, and the average linear expansion coefficient in the temperature range of 50°C to 150°C is defined as the linear expansion coefficient α (ppm / K). (Method 2) A mixture of the first liquid and the second liquid is poured into a mold with a hole (4 mm wide, 100 mm long, and 120 mm high), heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut out to dimensions of 4 mm x 10 mm x 100 mm to obtain a test piece. For the aforementioned test specimen, the flexural modulus E (GPa) at 25°C was measured in accordance with JIS K 6911:2006, under conditions of a test speed of 2 mm / min and a support distance of 64 mm. 　 The two-component liquid resin composition according to claim 1, wherein the coefficient of linear expansion α is 5 ppm / K or more and 38 ppm / K or less. 　 The two-component liquid resin composition according to claim 1 or 2, wherein the flexural modulus E is 5 GPa or more and 38 GPa or less. 　 The two-component liquid resin composition according to any one of claims 1 to 3, wherein the epoxy resin (A) comprises an alicyclic epoxy resin. 　 The two-component liquid resin composition according to claim 4, wherein the content of the alicyclic epoxy resin is 50 parts by mass or more and 100 parts by mass or less, when the content of the epoxy resin (A) is 100 parts by mass. 　 The two-component liquid resin composition according to any one of claims 1 to 5, wherein the content of the epoxy resin (A) is 1% by mass or more and 30% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 The two-component liquid resin composition according to claim 6, wherein the content of the epoxy resin (A) is 5% by mass or more and 30% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 The two-component liquid resin composition according to any one of claims 1 to 7, wherein the curing agent (B) contains an acid anhydride. 　 The two-component liquid resin composition according to claim 8, wherein the acid anhydride comprises one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic acid anhydride, methylcyclohexane-1,2-dicarboxylic acid anhydride, and methyltetrahydrophthalic anhydride. 　 The two-component liquid resin composition according to any one of claims 1 to 9, wherein the content of the curing agent (B) is 1% by mass or more and 20% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 The two-component liquid resin composition according to any one of claims 1 to 10, wherein the inorganic filler (C) comprises one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate. 　 The average particle size D of the inorganic filler (C) when the cumulative value reaches 50% in the volume frequency particle size distribution measured by laser diffraction scattering method. ５０ A two-component liquid resin composition according to any one of claims 1 to 11, wherein the particle size is 0.5 μm or more and 100 μm or less. 　 The two-component liquid resin composition according to any one of claims 1 to 12, wherein the content of the inorganic filler (C) is 65% by mass or more and 90% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 The two-component liquid resin composition according to any one of claims 1 to 13, wherein at least one of the first liquid and the second liquid further comprises a stress-reducing agent. 　 The two-component liquid resin composition according to claim 14, wherein the stress-reducing agent contains rubber particles. 　 The two-component liquid resin composition according to claim 14 or 15, wherein the content of the stress-reducing agent is 1.0% by mass or more and 10.0% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 The two-component liquid resin composition according to any one of claims 1 to 16, wherein at least one of the first liquid and the second liquid further comprises a settling inhibitor. 　 The two-component liquid resin composition according to claim 17, wherein the settling inhibitor comprises one or more selected from the group consisting of layered inorganic minerals and nanosilica. 　 The two-component liquid resin composition according to claim 18, wherein the layered inorganic mineral comprises one or more selected from the group consisting of clay and talc. 　 The two-component liquid resin composition according to any one of claims 17 to 19, wherein the content of the settling inhibitor is 0.01% by mass or more and 2.00% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. 　 A two-component liquid resin composition according to any one of claims 1 to 20, wherein at least one of the first liquid and the second liquid further comprises a curing accelerator. 　 The two-component liquid resin composition according to claim 21, wherein the curing accelerator comprises one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organophosphines, and Lewis acid catalysts. 　 The two-component liquid resin composition according to claim 21 or 22, wherein the content of the curing accelerator is 0.01% by mass or more and 1.00% by mass or less when the entire two-component liquid resin composition is considered to be 100% by mass. A two-component liquid resin composition according to any one of claims 1 to 23, wherein the viscosity η of the mixture of the first liquid and the second liquid, measured using an E-type viscometer and a 3° × R14 cone rotor at a rotation speed of 5 rpm and a temperature of 60°C, is 1.0 Pa·s or more and 15.0 Pa·s or less. 　 A two-component liquid resin composition according to any one of claims 1 to 24, wherein the glass transition temperature by the following method (method 3) is 150°C or more and 300°C or less. (Method 3) The mixture of the first liquid and the second liquid is poured into an aluminum cup, heated at 160°C for 1 hour, and then heated at 180°C for 2 hours to obtain a cured product. After the cured product is slowly cooled to 25°C, it is cut out to dimensions of 10 mm x 5 mm x 5 mm to obtain a test piece. The aforementioned test specimen is placed in a thermomechanical analyzer, and measurements are taken under conditions of a temperature range of 0°C to 320°C and a heating rate of 10°C / min. The glass transition temperature (°C) is calculated from the measurement data. A two-component liquid resin composition according to any one of claims 1 to 25, wherein the amount of warping by the following method (Method 4) is 30 μm or less. (Method 4) A case is constructed by bonding a copper plate (C1020 P, 85 mm long x 60 mm wide x 1.5 mm thick) as a base plate to an outer frame made of phenolic resin molding material measuring 70 mm (outer dimensions) x 50 mm (outer dimensions) x 3-5 mm thick (inner dimensions 64 mm long x 40-44 mm wide) using epoxy resin adhesive. 45 g of a mixture of the first and second liquids, preheated to 60°C, is poured into the case. The mixture is heated with the case at 160°C for 1 hour, then at 180°C for 2 hours to obtain a cured product. The cured product is slowly cooled to 25°C, and the amount of warping (μm) is calculated from the change in shape of the base plate before and after curing using a three-dimensional measuring instrument. A two-component liquid resin composition according to any one of claims 1 to 26, which can be used to seal a power module comprising a power module substrate including a circuit layer and a power semiconductor element on the circuit layer of the power module substrate by a casting method. 　 A two-component liquid resin composition according to any one of claims 1 to 27, wherein the solvent content is 0.50% by mass or less. 　 The two-component liquid resin composition according to any one of claims 1 to 28, wherein the stress coefficient α × E is 100 or more. 　 A power module substrate including a circuit layer, Power semiconductor elements are provided on the circuit layer of the power module substrate, A sealing material for sealing the power module substrate and the power semiconductor element, Equipped with, A power module wherein the sealing material includes a cured product of the two-component liquid resin composition described in any one of claims 1 to 29. 　 The power module according to claim 30, wherein the power semiconductor element includes one or more selected from the group consisting of MOS transistors and insulated gate bipolar transistors (IGBTs).

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