Display device

Abstract

This display device may comprise: a plurality of display modules, at least some of which include a substrate and a plurality of inorganic light-emitting devices mounted on the substrate; and a frame for supporting the plurality of display modules such that the plurality of display modules are horizontally arranged in an M*N matrix. The frame may comprise: a glass core layer; a first fiber-reinforced layer formed on a first surface of the glass core layer and configured to face the substrates of the plurality of display modules; and a second fiber-reinforced layer formed on a second surface, which is the surface opposite to the first surface of the glass core layer.

Description

Display device

[0001] The present disclosure relates to a display device that displays an image by combining modules in which self-luminous inorganic light-emitting elements are mounted on a substrate.

[0002] A display device is a type of output device that visually displays data information, such as characters and shapes, as well as images.

[0003] Generally, liquid crystal panels requiring a backlight or OLED (Organic Light-Emitting Diode) panels, composed of films of organic compounds that emit light in response to an electric current, have been primarily used as display devices. However, liquid crystal panels have problems such as slow response times and high power consumption; furthermore, because they cannot emit light themselves and require a backlight, miniaturization (i.e., size minimization) is difficult. Additionally, while OLED panels do not require a backlight because they emit light themselves and can be made thin, they are susceptible to burn-in (degradation), a phenomenon where specific parts of the previous image remain visible even after a screen change, as the lifespan of subpixels expires when the same image is displayed for a long time.

[0004] Accordingly, micro light-emitting diode (micro LED or μ LED) display panels are being researched as new panels to replace them, in which inorganic light-emitting elements are mounted on a substrate and the inorganic light-emitting elements themselves are used as pixels.

[0005] A micro light-emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and is composed of a plurality of inorganic light-emitting diodes (inorganic LEDs) each having a size of 100 micrometers or less.

[0006] Although these LED panels are also self-emissive devices, they are inorganic light-emitting devices, so the burn-in phenomenon of OLEDs does not occur, and they offer excellent brightness, resolution, power consumption, and durability.

[0007] Compared to liquid crystal display (LCD) panels that require backlighting, micro LED display panels offer better contrast, response time, and energy efficiency. While both organic light-emitting diodes (OLEDs) and inorganic light-emitting devices like micro LEDs are energy-efficient, micro LEDs offer higher brightness, luminous efficiency, and a longer lifespan than OLEDs.

[0008] In addition, by arranging LEDs on a circuit board in pixel units, it is possible to manufacture display modules at the board level, and it is easy to produce them in various resolutions and screen sizes to meet customer orders.

[0009] At least one embodiment of the present disclosure provides a display device with improved manufacturing efficiency.

[0010] Embodiments of the present disclosure provide a lightweight display device.

[0011] Embodiments of the present disclosure provide a display device with reduced thickness.

[0012] Embodiments of the present disclosure provide a seamless display device.

[0013] One embodiment of the present disclosure provides a display device including a frame having an improved structure.

[0014] The technical problems to be solved in this document are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art to which this invention belongs from the description below.

[0015] A display device according to an exemplary embodiment of the present disclosure may include: a plurality of display modules, wherein at least some of which include a substrate and a plurality of inorganic light-emitting elements mounted on the substrate; and a frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form. The frame may include: a glass core layer; a first fiber reinforcement layer formed on a first surface of the glass core layer and configured to face the substrates of the plurality of display modules; and a second fiber reinforcement layer formed on a second surface opposite to the first surface of the glass core layer.

[0016] A display device according to an exemplary embodiment of the present disclosure may include: a plurality of micro LED modules; a frame configured to face the rear of the plurality of micro LED modules and maintain a gap between the plurality of micro LED modules; and a chassis formed on the rear side of the plurality of micro LED modules and the rear side of the frame. The frame may include: a first fiber reinforcing layer facing the rear of the plurality of micro LED modules and comprising at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer); a second fiber reinforcing layer spaced rearward from the first fiber reinforcing layer and facing the chassis, comprising the same material as the first fiber reinforcing layer; a glass core layer disposed between the first fiber reinforcing layer and the second fiber reinforcing layer; and a first adhesive layer disposed between the first fiber reinforcing layer and the glass core layer and configured to bond the first fiber reinforcing layer and the glass core layer. and may include a second adhesive layer disposed between the second fiber reinforcing layer and the glass core layer and configured to bond the second fiber reinforcing layer and the glass core layer.

[0017] FIG. 1 is a perspective view of a display device according to one embodiment of the present disclosure.

[0018] FIG. 2 is an exploded view of the main components of a display device according to one embodiment of the present disclosure.

[0019] FIG. 3 is an enlarged cross-sectional view of a part of a display module according to one embodiment of the present disclosure.

[0020] FIG. 4 is a perspective view showing the rear side of a display module according to one embodiment of the present disclosure.

[0021] FIG. 5 is a perspective view of a frame according to one embodiment of the present disclosure.

[0022] FIG. 6 is a cross-sectional view of a frame according to one embodiment of the present disclosure.

[0023] FIG. 7 is an enlarged view of an example of a fiber-reinforced layer according to one embodiment of the present disclosure.

[0024] FIG. 8 is an enlarged view of an example of a fiber-reinforced layer according to one embodiment of the present disclosure.

[0025] FIG. 9 is an enlarged view of an example of a fiber-reinforced layer according to one embodiment of the present disclosure.

[0026] FIG. 10 is an enlarged view of an example of a fiber-reinforced layer according to one embodiment of the present disclosure.

[0027] FIG. 11 is an exploded perspective view of an example of a frame according to one embodiment of the present disclosure.

[0028] FIG. 12 is an exploded perspective view of an example of a frame according to one embodiment of the present disclosure.

[0029] FIG. 13 is a cross-sectional view of a plurality of display modules and a frame of a display device according to one embodiment of the present disclosure.

[0030] FIG. 14 is an enlarged cross-sectional view of a plurality of display modules and a part of a frame of a display device according to one embodiment of the present disclosure shown in FIG. 13.

[0031] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0032] In relation to the description of the drawings, similar reference numerals may be used for similar or related components.

[0033] The singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.

[0034] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0035] The term "and / or" includes a combination of multiple related described components or any of the multiple related described components.

[0036] The terms "part," "module," and "component" may be implemented in hardware or software. Depending on the embodiments, a plurality of "parts," "modules," and "components" may be implemented as a single component, or a single "part," "module," or "component" may include a plurality of components.

[0037] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in other aspects (e.g., importance or order).

[0038] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0039] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0040] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0041] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0042] The meaning of "identical" includes items that are similar in attributes or similar within a certain range. Furthermore, "identical" implies "substantially identical." In the sense of being substantially identical, numerical values ​​that fall within the margin of error in manufacturing or differences that do not hold significance relative to a reference value should be understood as being included within the scope of being "identical."

[0043] Meanwhile, terms such as "front," "back," "left," "right," "up," and "down" used in the following description are defined based on the drawings, and the shape and position of each component are not limited by these terms. For example, "front" and "back" may each be defined based on the X-axis shown in the drawings. For example, "left" and "right" may each be defined based on the Y-axis shown in the drawings. For example, "up" and "down" may each be defined based on the Z-axis shown in the drawings. For example, based on the display device (1) shown in FIG. 1, the direction for displaying an image may be defined as the front (+X direction), and the direction opposite to the front may be defined as the back (-X direction).

[0044] In the drawing, some components of the display device (1), including a plurality of inorganic light-emitting elements (50), are micro-sized components with a size of several μm to several hundred μm. For convenience of explanation, the scale of some components (e.g., a plurality of inorganic light-emitting elements (50), a substrate (40), a frame (100), etc.) is exaggerated.

[0045] Hereinafter, exemplary embodiment(s) of the present disclosure will be described in detail with reference to the accompanying drawings.

[0046] FIG. 1 is a perspective view of a display device according to one embodiment of the present disclosure. FIG. 2 is an exploded view of the main components of a display device according to one embodiment of the present disclosure. FIG. 3 is an enlarged cross-sectional view of a part of a display module according to one embodiment of the present disclosure. FIG. 4 is a perspective view showing the rear view of a display module according to one embodiment of the present disclosure.

[0047] A display device (1) is a device that displays information, data, etc., in the form of characters, shapes, graphs, images, etc. For example, a TV, PC, mobile device, digital signage, etc., can be implemented as a display device (1).

[0048] According to one embodiment of the present disclosure, as illustrated in FIGS. 1 and 2, a display device (1) may include a display panel (20) for displaying an image, a board (25) for driving and / or controlling the display panel (20), a frame (100) configured to support the display panel (20), and a chassis (10) configured to cover the rear of the display panel (20) and the rear of the frame (100).

[0049] The display panel (20) may include a plurality of display modules (30A-30w). The display panel (20) may include a driving board that drives each of the display modules (30A-30w) and a TOCN board (Timing controller board) that generates timing signals required for controlling each of the display modules (30A-30w).

[0050] The board (25) may include a circuit board for driving and / or controlling the display device (1). For example, the board (25) may include at least one of a power board for supplying power to the display panel (20), a control board for controlling the overall operation of the display panel (20), and a communication board for communicating with an external device.

[0051] The chassis (10) can support the display panel (20) and / or the frame (100). The chassis (10) may be arranged to cover the rear of a plurality of display modules (30A-30w) and / or the rear of the frame (100). For example, the chassis (10) may be positioned to face the second fiber reinforcement layer (130) of the frame (100) to be described later.

[0052] The chassis (10) can be installed on the floor via a stand or on a wall via a hanger, etc. The chassis (10) may be referred to as a case (10), a housing (10), etc.

[0053] Multiple display modules (30A-30w) can be arranged vertically and horizontally so as to be adjacent to each other. Multiple display modules (30A-30w) can be arranged in an M * N matrix form. In this embodiment, 49 multiple display modules (30A-30w) are provided and arranged in a 7 * 7 matrix form, but there are no restrictions on the number or arrangement method of the multiple display modules (30A-30w).

[0054] A plurality of display modules (30A-30w) may be installed on the frame (100). A plurality of display modules (30A-30w) may be mounted on the frame (100). A plurality of display modules (30A-30w) may be coupled to the frame (100). A plurality of display modules (30A-30w) may be installed on the frame (100) through various known methods, such as magnetic force using a magnet, a mechanical fitting structure, or adhesive bonding. A chassis (10) is coupled to the rear side of the frame (100), and the chassis (10) may form the rear exterior of the display device (1). The frame (100) may include a plurality of module openings (101) formed to correspond to the plurality of display modules (30A-30w).

[0055] The chassis (10) may include a metal material. Accordingly, heat generated from a plurality of display modules (30A-30w) and the frame (100) can be easily conducted to the chassis (10), thereby increasing the heat dissipation efficiency of the display device (1).

[0056] Unlike what is illustrated in the drawing, each of the multiple display modules (30A-30w) can be applied to a display device. That is, the display modules (30A-30w) can each be installed and applied as a single unit in electronic products or battlefields requiring various displays, such as wearable devices, portable devices, handheld devices, and various other displays. As illustrated in the drawing, the display modules (30A-30w) can be applied to display devices such as PC (personal computer) monitors, high-resolution TVs and signage, and electronic displays through multiple assembly arrangements in a matrix type.

[0057] Multiple display modules (30A-30w) may have substantially the same configuration. Therefore, the description of any one display module described below may be equally applicable to all other display modules.

[0058] One of the multiple display modules (30A-30w) is described as a first display module (30A).

[0059] The first display module (30A) may be formed in a quadrangle shape. The first display module (30A) may be provided in a rectangular shape or a square shape. However, the shape is not limited thereto and may include other shapes other than a quadrangle.

[0060] The first display module (30A) may include edges (31, 32, 33, 34) formed with respect to the front (+X direction).

[0061] As illustrated in FIG. 3, a plurality of display modules (30A-30w) may each include a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted on the substrate (40). The plurality of inorganic light-emitting elements (50) may be mounted on the mounting surface (41) of the substrate (40). In FIG. 3, for convenience of explanation, the thickness of some components, such as the substrate (40), may be depicted as exaggeratedly thick.

[0062] The substrate (40) can be formed in a quadrangle shape. As described above, a plurality of display modules (30A-30w) can each be provided in a quadrangle shape, and the substrate (40) can be formed in a quadrangle shape to correspond thereto. The substrate (40) can be provided in a rectangular shape or a square shape. The substrate (40) may include four borders corresponding to the borders (31, 32, 33, 34) of the first display module (30A).

[0063] The substrate (40) may include a base substrate (42), a mounting surface (41) forming one side of the base substrate (42), a rear surface (43) forming the other side of the base substrate (42) and positioned opposite to the mounting surface (41), and a side surface (45) positioned between the mounting surface (41) and the rear surface (43).

[0064] The mounting surface (41) may be arranged to face a plurality of weapon light-emitting elements (50). The mounting surface (41) may be arranged to face a cover (70) to be described later. The rear surface (43) may be arranged to face the chassis (10).

[0065] The substrate (40) may include a TFT layer (Thin Film Transistor, 44) provided to drive inorganic light-emitting elements (50). The TFT layer (44) may be formed on a base substrate (42). The base substrate (42) may include a glass material, and the substrate (40) may be referred to as a glass substrate (40). That is, the substrate (40) may include a COG (Chip on Glass) type substrate.

[0066] The Thin Film Transistor (TFT) constituting the TFT layer (44) is not limited to a specific structure or type and can be composed of various embodiments. That is, the TFT of the TFT layer (44) according to one embodiment can be implemented as an LTPS (Low Temperature Poly Silicon) TFT, oxide TFT, Si (poly silicon, or a-silicon) TFT, as well as an organic TFT, graphene TFT, etc.

[0067] The TFT layer (44) can be replaced with a CMOS (Complementary Metal-Oxide Semiconductor) type or n-type MOSFET or p-type MOSFET transistor when the base substrate (42) of the substrate (40) is provided as a silicon wafer.

[0068] The substrate (40) may include a first pad electrode (44a) and a second pad electrode (44b). The first pad electrode (44a) and the second pad electrode (44b) may be provided to electrically connect the inorganic light-emitting elements (50) and the TFT layer (44). For example, the first pad electrode (44a) and the second pad electrode (44b) may be provided as a pair.

[0069] A plurality of inorganic light-emitting elements (50) may include inorganic light-emitting elements (50) formed from an inorganic material, with a width, length, and height each having a size of several μm to several tens of μm. For example, the inorganic light-emitting element (50) may have a short side length of 100 μm or less among the width, length, and height. For example, the inorganic light-emitting element (50) may be picked up from a sapphire or silicon wafer and transferred to a substrate (40). For example, the inorganic light-emitting element (50) may be picked up and transferred through various methods, such as an electrostatic method using an electrostatic head or a stamp method using an elastic polymer material such as PDMS or silicon as a head. However, the present disclosure is not limited to the examples described above, and the inorganic light-emitting element (50) may be mounted on the substrate (40) through various methods.

[0070] Meanwhile, the plurality of inorganic light-emitting elements (50) may be referred to as a plurality of micro LEDs (50). The plurality of display modules (30A-30w) may be referred to as a plurality of micro LED modules (30A-30w).

[0071] For example, each of the plurality of inorganic light-emitting elements (50) may be a light-emitting structure comprising a first semiconductor (58a), an active layer (58c), a second semiconductor (58b), a first contact electrode (57a) and a second contact electrode (57b).

[0072] Each of the plurality of inorganic light-emitting elements (50) may include a first semiconductor (58a) and a second semiconductor (58b). The second semiconductor (58b) may be closer to the substrate (40) than the first semiconductor (58a). The first semiconductor (58a) and the second semiconductor (58b) may be arranged with an active layer (58c) in between. Either of the first semiconductor (58a) and the second semiconductor (58b) may be an n-type semiconductor, and the other of the first semiconductor (58a) and the second semiconductor (58b) may be a p-type semiconductor. Electrons may exist in either of the first semiconductor (58a) and the second semiconductor (58b), and holes may exist in the other of the first semiconductor (58a) and the second semiconductor (58b). Light may be generated while these electrons and holes recombine in the active layer (58c).

[0073] Each of the plurality of inorganic light-emitting elements (50) may include an active layer (58c). The active layer (58c) may include a material that emits light through the recombination of electrons and holes. The active layer (58c) may be disposed between the first semiconductor (58a) and the second semiconductor (58b). The active layer (58c) may be formed between the first semiconductor (58a) and the second semiconductor (58b). The active layer (58c) may be provided to generate light.

[0074] Each of the plurality of inorganic light-emitting elements (50) may include a light-emitting surface (54). The inorganic light-emitting element (50) may include a bottom surface (56) positioned opposite the light-emitting surface (54). The inorganic light-emitting element (50) may include a side surface (55) connecting the light-emitting surface (54) and the bottom surface (56). The light-emitting surface (54) may be positioned to face forward. The light-emitting surface (54) may emit light toward the cover (70).

[0075] Each of the plurality of inorganic light-emitting elements (50) may include a first contact electrode (57a) and a second contact electrode (57b). Although not clearly illustrated in the drawing, either the first contact electrode (57a) and the second contact electrode (57b) may be configured to be electrically connected to the first semiconductor (58a) and the other to be electrically connected to the second semiconductor (58b). The first contact electrode (57a) may be configured to correspond to the first pad electrode (44a), and the second contact electrode (57b) may be configured to correspond to the second pad electrode (44b). For example, the first contact electrode (57a) and the second contact electrode (57b) may be provided as a pair.

[0076] For example, the first contact electrode (57a) and the second contact electrode (57b) may be in the form of a flip chip arranged horizontally and facing the same direction (opposite direction of light emission).

[0077] The first contact electrode (57a) and the second contact electrode (57b) may be formed on the bottom surface (56). That is, the first contact electrode (57a) and the second contact electrode (57b) may be positioned on the opposite side of the light-emitting surface (54) and thus on the opposite side of the direction in which light is irradiated. The first contact electrode (57a) and the second contact electrode (57b) may be positioned to face the mounting surface (41) and may be arranged to be electrically connected to the TFT layer (44). A light-emitting surface (54) that irradiates light in the opposite direction to the direction in which the first contact electrode (57a) and the second contact electrode (57b) are positioned may be positioned.

[0078] Accordingly, light generated in the active layer (58c) can be irradiated through the light-emitting surface (54) without interference with the first contact electrode (57a) and / or the second contact electrode (57b).

[0079] The first contact electrode (57a) and the second contact electrode (57b) can be electrically connected to the first pad electrode (44a) and the second pad electrode (44b), respectively, formed on the mounting surface (41) side of the substrate (40).

[0080] Each of the plurality of display modules (30A-30w) may include a conductive adhesive layer (47) configured to electrically connect an inorganic light-emitting element (50) and a substrate (40). The conductive adhesive layer (47) may be configured to mediate the electrical bonding of contact electrodes (57a, 57b) and pad electrodes (44a, 44b). The conductive adhesive layer (47) may electrically bond the first contact electrode (57a) and the first pad electrode (44a), and electrically bond the second contact electrode (57b) and the second pad electrode (44b). The conductive adhesive layer (47) may be disposed on the substrate (40). At least a portion of the conductive adhesive layer (47) may be disposed between the first contact electrode (57a) and the first pad electrode (44a) and between the second contact electrode (57b) and the second pad electrode (44b).

[0081] For example, the conductive adhesive layer (47) may be an anisotropic conductive layer. The anisotropic conductive layer may have a structure in which an anisotropic conductive adhesive is attached to a protective film and conductive balls (47a) are dispersed in an adhesive resin. The conductive balls (47a) are conductive spheres surrounded by a thin insulating film, and can electrically connect conductors to each other as the insulating film breaks due to pressure.

[0082] When multiple inorganic light-emitting elements (50) are mounted on a substrate (40), if pressure is applied to an anisotropic conductive layer, the insulating film of the conductive ball (47a) is broken so that the contact electrodes (57a, 57b) of the inorganic light-emitting elements (50) and the pad electrodes (44a, 44b) of the substrate (40) can be electrically connected.

[0083] The anisotropic conductive layer (47) may include an anisotropic conductive film (ACF) in the form of a film and / or anisotropic conductive paste (ACP) in the form of a paste.

[0084] However, the present disclosure is not limited to the examples described above, and the conductive adhesive layer (47) may include solder or other suitable conductive material. After a plurality of inorganic light-emitting elements (50) are aligned on a substrate (40), the plurality of inorganic light-emitting elements (50) may be bonded to the substrate (40) through a reflow process.

[0085] A plurality of inorganic light-emitting elements (50) may include a red light-emitting element (51), a green light-emitting element (52), and a blue light-emitting element (53). The light-emitting elements (50) may be mounted on the mounting surface (41) of a substrate (40) by forming a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) as a single unit. A series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53) may form a single pixel. At this time, the red light-emitting element (51), green light-emitting element (52), and blue light-emitting element (53) may each form a sub-pixel.

[0086] For example, the red light-emitting element (51), the green light-emitting element (52), and the blue light-emitting element (53) may be arranged in a line at predetermined intervals, or may be arranged in a shape other than a triangle, but the shape is not limited thereto and may include other shapes.

[0087] The substrate (40) may include a light-absorbing layer (44c) to absorb external light and improve contrast. The light-absorbing layer (44c) may be formed on the entire mounting surface (41) of the substrate (40). The light-absorbing layer (44c) may be formed between the TFT layer (44) and the conductive layer (47).

[0088] At least one of the plurality of display modules (30A-30w) may further include a black matrix (48) formed between the plurality of inorganic light-emitting elements (50).

[0089] The black matrix (48) can perform the function of complementing the light absorption layer (44c) formed entirely on the mounting surface (41) side of the substrate (40). That is, the black matrix (48) can improve the contrast of the screen by absorbing external light and making the substrate (40) appear black. Preferably, the black matrix (48) can have a black color.

[0090] According to one embodiment of the present disclosure, a black matrix (48) is formed to be placed between pixels formed by a series of red light-emitting elements (51), green light-emitting elements (52), and blue light-emitting elements (53). However, the black matrix (48) may be formed more finely to partition each of the light-emitting elements (51, 52, 53) as sub-pixels within each pixel.

[0091] The black matrix (48) can be formed in a grid shape having horizontal and vertical patterns to be placed between pixels.

[0092] The black matrix (48) can be formed by applying a light-absorbing ink onto a conductive adhesive layer (47) and then curing it through an ink-jet process, or by coating a light-absorbing film onto the conductive adhesive layer (47).

[0093] That is, in the conductive adhesive layer (47) formed entirely on the mounting surface (41), a black matrix (48) can be formed between a plurality of inorganic light-emitting elements (50) that are not mounted.

[0094] Each of the plurality of display modules (30A-30w) may include a cover (70) provided to cover a substrate (40) and a plurality of inorganic light-emitting elements (50). The cover (70) may include a functional film having optical performance. The cover (70) can protect the substrate (40) and the plurality of inorganic light-emitting elements (50) from external forces. The cover (70) can prevent foreign substances, etc. from entering the substrate (40) and the plurality of inorganic light-emitting elements (50). As an example, the cover (70) may form the front surface (301) of the display module.

[0095] Each of the plurality of display modules (30A-30w) may include a cover adhesive layer (75). The cover adhesive layer (75) may be configured to attach the cover (70) to the substrate (40) and the plurality of inorganic light-emitting elements (50). The cover adhesive layer (75) may minimize light loss or reflection. For example, the cover adhesive layer (75) may be an Optically Clear Adhesive (OCA) in the form of a film such as double-sided tape or an Optically Clear Resin (OCR) in the form of an amorphous liquid.

[0096] Each of the plurality of display modules (30A-30w) may include a heat dissipation member (60) provided to dissipate heat generated from the substrate (40). The heat dissipation member (60) may be attached to the rear surface (43) of the substrate (40). For example, the heat dissipation member (60) may form a part of the rear surface (302) of the display module.

[0097] Each of the plurality of display modules (30A-30w) may include an adhesive tape (70) disposed between the rear surface (43) and the heat dissipation member (60) to bond the rear surface (43) of the substrate (40) and the heat dissipation member (60).

[0098] A plurality of inorganic light-emitting elements (50) can be electrically connected sequentially to an upper wiring layer, a side wiring layer, and a rear wiring layer (43b). The upper wiring layer can be formed on the rear side of a conductive layer (47). The side wiring can be formed on the side (45) of the substrate (40). The rear wiring layer (43b) can be formed on the rear side (43). An insulating layer (43c) covering the rear wiring layer (43b) can be provided on the rear side of the rear wiring layer (43b).

[0099] Referring to FIG. 4, the first display module (30A) may include a driving circuit board (80) provided to electrically control a plurality of inorganic light-emitting elements (50) mounted on a mounting surface (41). The driving circuit board (80) may be formed as a printed circuit board (PCB).

[0100] The first display module (30A) may include a flexible film (81) connecting the driving circuit board (80) and the rear wiring layer (43b) so that the driving circuit board (80) is electrically connected to a plurality of inorganic light-emitting elements (50).

[0101] One end of the flexible film (81) can be connected to a rear connection pad (43d) that is placed on the rear surface (43) of the substrate (40) and electrically connected to a plurality of inorganic light-emitting elements (50).

[0102] The rear connection pad (43d) can be electrically connected to the rear wiring layer (43b). Accordingly, the rear connection pad (43d) can electrically connect the rear wiring layer (43b) and the flexible film (81).

[0103] The flexible film (81) can transmit power and electrical signals from the driving circuit board (80) to the plurality of inorganic light-emitting elements (50) as it is electrically connected to the rear connection pad (43d).

[0104] For example, the flexible film (81) can be formed from an FFC (Flexible Flat cable) or a COF (Chip On Film), etc.

[0105] The flexible film (81) may include a first flexible film (81a) and a second flexible film (81b). The first flexible film (81a) can transmit data signals from the driving circuit board (80) to the substrate (40). For example, the first flexible film (81a) may be provided as a COF. The second flexible film (81b) can transmit power from the driving circuit board (80) to the substrate (40). For example, the second flexible film (81b) may be provided as an FFC.

[0106] In the drawings, the first flexible film (81a) is depicted as being provided as a single unit, but the present disclosure is not limited to what is depicted in the drawings, and the first flexible film (81a) may be provided as a plurality. In the drawings, the second flexible film (81b) appears to be provided as a plurality, but the present disclosure is not limited to what is depicted in the drawings, and the second flexible film (81b) may be provided as a single unit.

[0107] The driving circuit board (80) can be electrically connected to the board (25, see FIG. 2). The board (25) can be placed on the rear side of the frame (100), and the board (25) can be connected to the driving circuit board (80) via a cable.

[0108] The heat dissipation member (60) may be configured to be in contact with the substrate (40). The heat dissipation member (60) and the substrate (40) may be bonded by an adhesive tape (70, see FIG. 3) placed between the rear surface (43) of the substrate (40) and the heat dissipation member (60).

[0109] The heat dissipation member (60) may be formed of a material with high thermal conductivity or implemented with a configuration with high thermal conductivity. For example, the heat dissipation member (60) may be made of aluminum, but is not limited thereto and may include a suitable heat dissipation member.

[0110] Heat generated from a plurality of inorganic light-emitting elements (50) mounted on a substrate (40) and a TFT layer (44) of the substrate (40) can be transferred to a heat dissipation member (60). Heat generated from the substrate (40) is easily transferred to the heat dissipation member (60), and the substrate (40) can be prevented from rising above a certain temperature.

[0111] The area of ​​the substrate (40) may be larger than the area of ​​the heat dissipation member (60). When the substrate (40) and the heat dissipation member (60) are bonded together, the four edges of the substrate (40) may be arranged to be positioned further outward than the four edges of the heat dissipation member (60), based on the center of the substrate (40) and the heat dissipation member (60).

[0112] Generally, since the thermal expansion rate of the heat dissipation member (60) is higher than the thermal expansion rate of the substrate (40), when heat is transferred to each display module (30A-30w), the expansion value of the heat dissipation member (60) may be higher than the expansion value of the substrate (40).

[0113] If the four edges of the substrate (40) correspond to the four edges of the heat dissipation member (60) or are positioned further inward, the edges of the heat dissipation member (60) may protrude outward from the substrate (40) as the heat dissipation member (60) undergoes thermal expansion. In this case, the gap (g, see FIG. 13 and FIG. 14) formed between each of the display modules (30A-30w) may be formed irregularly. Accordingly, the visibility of some seams may increase, and the sense of unity of the screen of the display panel (20) may be reduced.

[0114] However, when the four edges of the substrate (40) are positioned outside the four edges of the heat dissipation member (60), the heat dissipation member (60) does not protrude outside the four edges of the substrate (40) even if the heat dissipation member (60) undergoes thermal expansion, and accordingly, the gap (g, see FIG. 13 and FIG. 14) formed between each display module (30A-30w) can be maintained at a constant level.

[0115] Meanwhile, the substrate (40) forms a screen and is configured to be larger than the heat dissipation member (60) and can be placed in front of the heat dissipation member (60). Based on this, the gap (g) formed between the plurality of display modules (30A-30w) substantially corresponds to the gap formed between the substrates (40). The user may not perceive the gap formed between the heat dissipation members (60) and may perceive only the gap formed between the substrates (40). In the present disclosure, in terms of maintaining the gap (g) formed between the plurality of display modules (30A-30w), the thermal expansion coefficient of each display module (30A-30w) can be defined as approximately the thermal expansion coefficient of the substrate (40). For example, if the substrate (40) is a glass substrate, the thermal expansion coefficient of each display module can be understood to be substantially the same or similar to the thermal expansion coefficient of the glass.

[0116] FIG. 5 is a perspective view of a frame according to one embodiment of the present disclosure. FIG. 6 is a cross-sectional view of a frame according to one embodiment of the present disclosure.

[0117] The frame (100) can support a plurality of display modules (30A-30w) so that the plurality of display modules (30A-30w) are horizontally arranged in an M*N matrix form (see FIG. 2). The frame (100) can be positioned at the rear of the plurality of display modules (30A-30w). The frame (100) can be positioned at the front of the chassis (10).

[0118] While the display device (1) is in operation, heat may be generated in the substrate (40), the plurality of inorganic light-emitting elements (50) mounted on the substrate (40), and / or various electronic circuits (substrates). At this time, the coefficient of thermal expansion (CTE) of the components constituting the display device (1) may differ, and the amount of thermal expansion of each component may also differ. When the plurality of display modules (30A-30w) of the display device (1) are exposed to high temperatures for a long time, the gap (g, see FIG. 13 and FIG. 14) between the plurality of display modules (30A-30w) may not be maintained at a constant level. The gap (g) formed between the plurality of display modules (30A-30w) may be formed irregularly, and accordingly, the visibility of the seam formed by the gap (g) may increase, thereby reducing the sense of unity of the screen of the display panel (20).

[0119] According to one embodiment of the present disclosure, the frame (100) may have a structure for compensating for the amount of thermal expansion occurring for each component of the display device (1). The frame (100) may be configured to maintain a constant gap (g) formed between a plurality of display modules (30A-30w). To this end, the thermal expansion coefficient of the frame (100) may be approximately the same as or similar to the thermal expansion coefficient of each of the plurality of display modules (30A-30w). This minimizes the perception of the seam of the display panel (20) and prevents the integrity of the display panel (20) from being degraded.

[0120] Referring to FIGS. 5 and 6, a frame (100) according to one embodiment of the present disclosure may include a glass core layer (110), a first fiber reinforcing layer (120), and a second fiber reinforcing layer (130).

[0121] The frame (100) may include a glass core layer (110). The glass core layer (110) may be disposed between the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130). The glass core layer (110) may be disposed on the rear side of the first fiber reinforcing layer (120) and on the front side of the second fiber reinforcing layer (130).

[0122] The glass core layer (110) may include a first surface (111) and a second surface (112). The second surface (112) may be the opposite side of the first surface (111). For example, the first surface (111) of the glass core layer (110) may be adjacent to a plurality of display modules (30A-30w) rather than the chassis (10) (see FIG. 2). For example, the second surface (112) of the glass core layer (110) may be adjacent to the chassis (10) rather than the plurality of display modules (30A-30w) (see FIG. 2).

[0123] The glass core layer (110) may include a glass material. For example, the coefficient of thermal expansion of the glass core layer (110) may be approximately 3.0 μ / K to 4.0 μ / K. However, the present disclosure is not limited to the above-described examples, and the range of the coefficient of thermal expansion of the glass core layer (110) may vary depending on the required performance of the display device (1), the arrangement of components, etc.

[0124] The thickness of the glass core layer (110) may vary depending on the required rigidity of the frame (100). Here, the thickness of the glass core layer (110) is based on the stacking direction of the plurality of layers (110, 120, 130) of the frame (100).

[0125] The frame (100) may include a first fiber reinforcing layer (120). The first fiber reinforcing layer (120) may be attached to a glass core layer (110). The first fiber reinforcing layer (120) may be attached to a first surface (111) of the glass core layer (110). The first fiber reinforcing layer (120) may be attached to the first surface (111) of the glass core layer (110) and positioned to face a plurality of display modules (30A-30w). The first fiber reinforcing layer (120) may be configured to face the substrates (40) of the plurality of display modules (30A-30w). The first fiber reinforcing layer (120) may be positioned to face the rear surface (302, see FIG. 3 and FIG. 14) of the plurality of display modules (30A-30w). The first fiber reinforcement layer (120) can be configured to form the front surface of the frame (100).

[0126] The coefficient of thermal expansion of the first fiber reinforcing layer (120) may be configured to correspond to the coefficient of thermal expansion of the glass core layer (110). The coefficient of thermal expansion of the first fiber reinforcing layer (120) may be substantially the same or similar to the coefficient of thermal expansion of the glass core layer (110). The coefficient of thermal expansion of the first fiber reinforcing layer (120) may be substantially the same or similar to the coefficient of thermal expansion of a plurality of display modules (30A-30w). For example, the coefficient of thermal expansion of the first fiber reinforcing layer (120) may be substantially the same or similar to the coefficient of thermal expansion of glass.

[0127] The first fiber reinforcing layer (120) may include at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer).

[0128] The frame (100) may include a second fiber reinforcement layer (130). The second fiber reinforcement layer (130) may be attached to the glass core layer (110). The second fiber reinforcement layer (130) may be attached to a second surface (112) of the glass core layer (110). The second fiber reinforcement layer (130) may be attached to the second surface (112) of the glass core layer (110) and positioned to face the chassis (10). The second fiber reinforcement layer (130) may be spaced rearward (-X direction) from the first fiber reinforcement layer (120). The second fiber reinforcement layer (130) may be configured to form the rear surface of the frame (100).

[0129] The coefficient of thermal expansion of the second fiber reinforcing layer (130) may be configured to correspond to the coefficient of thermal expansion of the glass core layer (110). The coefficient of thermal expansion of the second fiber reinforcing layer (130) may be substantially the same or similar to the coefficient of thermal expansion of the glass core layer (110). The coefficient of thermal expansion of the second fiber reinforcing layer (130) may be substantially the same or similar to the coefficient of thermal expansion of a plurality of display modules (30A-30w). For example, the coefficient of thermal expansion of the second fiber reinforcing layer (130) may be substantially the same or similar to the coefficient of thermal expansion of glass.

[0130] The second fiber reinforcement layer (130) may include at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer).

[0131] The first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be composed of the same material. For example, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be CFRP. For example, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be GFRP. For example, the weaving method (i.e., type) of the first fiber reinforcing layer (120) and the weaving method of the second fiber reinforcing layer (130) may be the same. The glass core layer (110) may be provided in a sandwich structure between the same materials. Thus, the frame (100) may have a stable structure. For example, when the frame (100) receives or loses heat, the first surface (111) and the second surface (112) of the glass core layer (110) may have approximately the same temperature change behavior.

[0132] In summary, the frame (100) may have a structure comprising a glass core layer (110) and a first fiber reinforcing layer (120) and a second fiber reinforcing layer (130) attached to each of the two sides (111, 112) of the glass core layer (110). The thermal expansion coefficient of the first fiber reinforcing layer (120) and the thermal expansion coefficient of the second fiber reinforcing layer (130) may be the same or similar to the thermal expansion coefficient of the glass core layer (110). Additionally, the thermal expansion coefficient of the first fiber reinforcing layer (120) and the thermal expansion coefficient of the second fiber reinforcing layer (130) may be the same or substantially similar to the thermal expansion coefficient of the substrate (40). Since the thermal expansion coefficients of the layers (110, 120, 130) constituting the frame (100) are the same or substantially similar, the thermal expansion rate (or thermal contraction rate) occurring in each layer may be approximately the same or substantially similar. Thus, the flatness of the frame (100) can be maintained even when the frame (100) is exposed to heat. Internal stress caused by temperature changes between the layers (110, 120, 130) constituting the frame (100) can be minimized, and the durability of the frame (100) can be improved and its lifespan extended.

[0133] The thermal expansion coefficient of the first fiber reinforcing layer (120) of the frame (100) may be the same as or similar to the thermal expansion coefficient of the plurality of display modules (30A-30w). Heat may be generated in various components during the operation of the display device (1). While the plurality of display modules (30A-30w) are deformed by heat, the first fiber reinforcing layer (120) may deform in correspondence with the plurality of display modules (30A-30w). This prevents damage to the plurality of display modules (30A-30w). Additionally, the gap (g) formed between the plurality of display modules (30A-30w) may be maintained at a constant level. Since the gap (g) formed between the display modules (30A-30w) is maintained at a constant level, the sense of unity of the screen of the display panel (20) may not be reduced.

[0134] The frames applied to existing display devices have a structure in which CFRP is laminated to a panel with steel attached to both sides of a polyethylene (PE) core layer. In the case of such a structure, an additional process of laminating CFRP must be involved after the process of attaching steel to both sides of the polyethylene (PE) core layer. Furthermore, as a frame containing steel is applied to a display device, the weight of the display device increases and its thickness may increase. Consequently, there are difficulties in applying existing frames to displays with large screens.

[0135] The frame (100) according to the present disclosure may have a three-layer structure comprising a glass core layer (110), a first fiber reinforcing layer (120), and a second fiber reinforcing layer (130). Thus, no additional process may be required other than the process of attaching the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) to both sides (111, 112) of the glass core layer (110). Thus, the manufacturing efficiency of the frame (100) may be improved. In addition, compared to conventional frames, the frame (100) according to the present disclosure may be relatively lighter in weight and thinner in thickness. Thus, the display device (1) can be configured to be light and slim, and it is easy to manufacture a large screen.

[0136] The frame (100) may include a first adhesive layer (140). The first adhesive layer (140) may be disposed between the first fiber reinforcing layer (120) and the glass core layer (110). The first adhesive layer (140) may be configured to bond the first fiber reinforcing layer (120) and the glass core layer (110). The rear surface of the first fiber reinforcing layer (120) may be attached to the first surface (111) of the glass core layer (110) by the first adhesive layer (140).

[0137] The frame (100) may include a second adhesive layer (150). The second adhesive layer (150) may be disposed between the second fiber reinforcing layer (130) and the glass core layer (110). The second adhesive layer (150) may be configured to bond the second fiber reinforcing layer (130) and the glass core layer (110). The front surface of the second fiber reinforcing layer (130) may be attached to the second surface (112) of the glass core layer (110) by the second adhesive layer (150).

[0138] FIG. 7 is an enlarged view of an example of a fiber-reinforced layer according to an embodiment of the present disclosure. FIG. 8 is an enlarged view of an example of a fiber-reinforced layer according to an embodiment of the present disclosure. FIG. 9 is an enlarged view of an example of a fiber-reinforced layer according to an embodiment of the present disclosure. FIG. 10 is an enlarged view of an example of a fiber-reinforced layer according to an embodiment of the present disclosure.

[0139] Referring to FIGS. 7 to 11, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) can each be formed in various weaving ways.

[0140] The coefficient of thermal expansion of the first fiber reinforcing layer (120) can be determined (i.e., based on, corresponding) by the weaving method of the first fiber reinforcing layer (120). The coefficient of thermal expansion of the first fiber reinforcing layer (120) may vary depending on the weaving method of the first fiber reinforcing layer (120). The coefficient of thermal expansion of the second fiber reinforcing layer (130) can be determined by the weaving method of the second fiber reinforcing layer (130). The coefficient of thermal expansion of the second fiber reinforcing layer (130) may vary depending on the weaving method of the second fiber reinforcing layer (130).

[0141] The weaving method of the first fiber reinforcing layer (120) may vary depending on the thermal expansion coefficient of the glass core layer (110) and / or the pitch (p, see FIG. 14) between the plurality of inorganic light-emitting elements (50). The weaving method of the first fiber reinforcing layer (120) may be determined by considering the thermal expansion coefficient of the glass core layer (110) and / or the pitch (p) between the plurality of inorganic light-emitting elements (50). The weaving method of the second fiber reinforcing layer (130) may vary depending on the thermal expansion coefficient of the glass core layer (110) and / or the pitch (p) between the plurality of inorganic light-emitting elements (50). The weaving method of the second fiber reinforcing layer (130) may be determined by considering the thermal expansion coefficient of the glass core layer (110) and / or the pitch (p) between the plurality of inorganic light-emitting elements (50). A detailed explanation thereof will be provided later.

[0142] The first fiber reinforcing layer (120) may be composed of a Fabric series (see FIG. 7 to 9) in which the fibers are arranged to intersect in multiple directions, or a Unidirectional (UD) series (see FIG. 10) in which the fibers are arranged in a line in one direction. The second fiber reinforcing layer (130) may be composed of a Fabric series (see FIG. 7 to 9) in which the fibers are arranged to intersect in multiple directions, or a Unidirectional (UD) series (see FIG. 10) in which the fibers are arranged in a line in one direction.

[0143] The first fiber reinforcing layer (120) may be configured to be woven in a Plain (see FIG. 7), Twill (see FIG. 8), Satin (see FIG. 9), or Unidirectional (UD) (see FIG. 10). The second fiber reinforcing layer (130) may be configured to be woven in a Plain (see FIG. 7), Twill (see FIG. 8), Satin (see FIG. 9), or Unidirectional (UD) (see FIG. 10).

[0144] For example, referring to FIG. 7, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) can each be formed in a plain weave manner. The plain weave pattern can be formed such that the weft (w1) and the warp (w2) intersect in a 1:1 ratio. The plain weave pattern can be formed by repeating the process in which the weft (w1) passes over one warp (w2) and then passes under one warp (w2).

[0145] For example, referring to FIG. 8, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) can each be constructed in a twill weave pattern. The twill weave pattern can be constructed such that the weft thread (w3) crosses over two or more warp threads (w4). The twill weave pattern can be constructed such that the weft thread (w3) and warp thread (w4) cross in a 2:2 or 3:3 ratio. In the twill weave pattern, if the weft thread (w3) and warp thread (w4) are constructed to cross in a 2:2 ratio, the weft thread (w3) may pass over two warp threads (w4) and then pass under two warp threads (w4) in a continuous manner, and this process may be repeated.

[0146] For example, referring to FIG. 9, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) can each be constructed using a satin weave method. The satin weave pattern can be configured so that the weft threads (w5) cross only once while skipping over several warp threads (w6). When manufactured with a satin weave pattern, the intersection points can be dispersed, so the surface of the fabric can be smooth.

[0147] For example, referring to FIG. 10, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) can each be configured in a unidirectional (UD) weave. The unidirectional (UD) weave can be configured so that the fiber bundles are arranged in only one direction. Additionally, the spacing between fibers can be maintained constant.

[0148] The thermal expansion coefficient of the first fiber reinforcing layer (120) may vary depending on the weaving method (e.g., Plain, Twill, Satin, Unidirectional (UD), etc.) of the first fiber reinforcing layer (120). This is because the fiber arrangement method of each weaving method can affect the thermal expansion behavior. Similarly, the thermal expansion coefficient of the second fiber reinforcing layer (130) may vary depending on the weaving method or type (e.g., Plain, Twill, Satin, Unidirectional (UD), etc.) of the second fiber reinforcing layer (130).

[0149] For example, the degree of crimp varies depending on the weaving method of the first fiber reinforcing layer (120). For example, the degree of crimp varies depending on the weaving method of the second fiber reinforcing layer (130). A crimp may refer to a bend (curved portion) that occurs when fibers cross each other. The more crimp there is, the higher the coefficient of thermal expansion, and the less crimp there is, the lower the coefficient of thermal expansion. For example, in the case of the Unidirectional (UD) method, the crimp is relatively small, so the coefficient of thermal expansion is relatively lower compared to other weaving methods. For example, in the case of the Plain method, the crimp is relatively large, so the coefficient of thermal expansion is relatively higher compared to other weaving methods. For example, the coefficient of thermal expansion may increase in the order of Unidirectional (UD), Satin, Twill, and Plain methods. The weaving method of the first fiber reinforcing layer (120) can be selected according to the required thermal expansion coefficient of the first fiber reinforcing layer (120), and the weaving method of the second fiber reinforcing layer (130) can be selected according to the required thermal expansion coefficient of the second fiber reinforcing layer (130).

[0150] FIG. 11 is an exploded perspective view of an example of a frame according to one embodiment of the present disclosure. FIG. 12 is an exploded perspective view of an example of a frame according to one embodiment of the present disclosure.

[0151] Referring to FIGS. 11 and 12, the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) according to one embodiment of the present disclosure may be woven in a unidirectional (UD) manner. A frame (100) according to one embodiment of the present disclosure may include a glass core layer (110), a first fiber reinforcing layer (120) composed of a unidirectional (UD) series multilayer structure, and a second fiber reinforcing layer (130) composed of a unidirectional (UD) series multilayer structure.

[0152] For example, referring to FIG. 11, the frame (100) may include a glass core layer (110), a first fiber reinforcing layer (120) composed of a unidirectional (UD) series 2-ply structure, and a second fiber reinforcing layer (130) composed of a unidirectional (UD) series 2-ply structure.

[0153] The first fiber reinforcing layer (120) may include a first UD layer (121) and a second UD layer (122).

[0154] The first UD layer (121) may be attached to the first surface (111) of the glass core layer (110). The first UD layer (121) may include a first fiber bundle (f1) extending in a first direction (D1).

[0155] The second UD layer (122) may be laminated on the front surface of the first UD layer (121). The second UD layer (122) may be positioned to face a plurality of display modules (30A-30w) (see FIG. 2). The second UD layer (122) may be configured to contact the rear surface (302, see FIG. 3 and FIG. 14) of the plurality of display modules (30A-30w). The second UD layer (122) may include a second fiber bundle (f2) extending in a second direction (D2) different from the first direction (D1).

[0156] The second fiber reinforcing layer (130) may include a third UD layer (131) and a fourth UD layer (132).

[0157] The third UD layer (131) may be attached to the second surface (112) of the glass core layer (110). The third UD layer (131) may include a third fiber bundle (f3) extending in the first direction (D1).

[0158] The fourth UD layer (132) may be laminated on the rear side of the third UD layer (131). The fourth UD layer (132) may be positioned toward the chassis (10) (see FIG. 2). The fourth UD layer (132) may include a fourth fiber bundle (f4) extending in a second direction (D2).

[0159] For example, referring to FIG. 12, the frame (100) may include a glass core layer (110), a first fiber reinforcing layer (120) composed of a unidirectional (UD) series 3-layer (3-ply) structure, and a second fiber reinforcing layer (130) composed of a unidirectional (UD) series 3-layer (3-ply) structure.

[0160] The first fiber reinforcing layer (120) may include a fifth UD layer (123), a sixth UD layer (124), and a seventh UD layer (125).

[0161] The fifth UD layer (123) may be attached to the first surface (111) of the glass core layer (110). The first UD layer (121) may include a fifth fiber bundle (f5) extending in the first direction (D1).

[0162] The sixth UD layer (124) may be spaced forward (+X direction) from the fifth UD layer (123). The sixth UD layer (124) may be positioned toward a plurality of display modules (30A-30w) (see FIG. 2). The sixth UD layer (124) may be configured to contact the rear surface (302, see FIG. 3 and FIG. 14) of the plurality of display modules (30A-30w). The sixth UD layer (124) may include a sixth fiber bundle (f6) extending in a first direction (D1).

[0163] The seventh UD layer (125) may be disposed between the fifth UD layer (123) and the sixth UD layer (124). The seventh UD layer (125) may be attached to the front of the fifth UD layer (123) and the rear of the sixth UD layer (124). The seventh UD layer (125) may include a seventh fiber bundle (f7) extending in a second direction (D2).

[0164] The second fiber reinforcing layer (130) may include an eighth UD layer (133), a ninth UD layer (134), and a tenth UD layer (135).

[0165] The eighth UD layer (133) may be attached to the second surface (112) of the glass core layer (110). The eighth UD layer (133) may include an eighth fiber bundle (f8) extending in the first direction (D1).

[0166] The ninth UD layer (134) may be spaced rearward (-X direction) from the eighth UD layer (133). The ninth UD layer (134) may be positioned toward the chassis (10) (see FIG. 2). The ninth UD layer (134) may include a ninth fiber bundle (f9) extending in a first direction (D1).

[0167] The 10th UD layer (135) may be disposed between the 8th UD layer (133) and the 9th UD layer (134). The 10th UD layer (135) may be attached to the rear surface of the 8th UD layer (133) and the front surface of the 9th UD layer (134). The 10th UD layer (135) may include a 10th fiber bundle (f10) extending in a second direction (D2).

[0168] Meanwhile, in FIGS. 11 and 12, the first direction (D1) and the second direction (D2) are depicted as roughly intersecting, but the present disclosure is not limited thereto. Also, in FIGS. 11 and 12, the first direction (D1) is depicted as roughly corresponding to the vertical direction (Z direction) and the second direction (D2) is depicted as roughly corresponding to the horizontal direction (Y direction), but the present disclosure is not limited thereto. It is sufficient that the first direction (D1) and the second direction (D2) are different from each other, and the first direction (D1) and the second direction (D2) can each be defined as various directions.

[0169] FIG. 13 is a cross-sectional view of a plurality of display modules and a frame of a display device according to one embodiment of the present disclosure. FIG. 14 is an enlarged cross-sectional view of a portion of the plurality of display modules and a frame of a display device according to one embodiment of the present disclosure shown in FIG. 13.

[0170] FIG. 13 illustrates three display modules (30A, 30H, 30O) among a plurality of display modules (30A-30w) as an example. The three display modules (30A, 30H, 30O) may represent the plurality of display modules (30A-30w). FIG. 14 illustrates an enlarged view of a part of the display module (30A) and a part of the display module (30H) shown in FIG. 13. For convenience of explanation, the display modules may be schematically illustrated in FIG. 13 and FIG. 14. For convenience of explanation, only the main components may be illustrated in FIG. 13 and FIG. 14, and some components may be omitted.

[0171] Referring to FIGS. 13 and 14, a frame (100) may be configured to support a plurality of display modules (30A-30w). The plurality of display modules (30A-30w) may be arranged in the frame (100). The rear surface (302) of the plurality of display modules (30A-30w) may be attached to the frame (100). The rear surface (302) of the plurality of display modules (30A-30w) may be attached to a first fiber reinforcing layer (120) of the frame (100). For example, each of the plurality of display modules (30A-30w) may be mounted to the first fiber reinforcing layer (120) of the frame (100) through an adhesive member. For example, the adhesive member may be provided on the rear surface (302) of each display module. The rear surface (302) of a plurality of display modules (30A-30w) and the first fiber reinforcement layer (120) of the frame (100) can come into contact.

[0172] The frame (100) can be configured to maintain a constant gap (g) between a plurality of display modules (30A-30w). As described above, the thermal expansion coefficient of the first fiber reinforcing layer (120) and the thermal expansion coefficient of the second fiber reinforcing layer (130) can be configured to correspond to the thermal expansion coefficient of the glass core layer (110), and the thermal expansion coefficient of the first fiber reinforcing layer (120) can be configured to correspond to the thermal expansion coefficient of the plurality of display modules (30A-30w). Thus, the frame (100) can expand or contract in correspondence with the plurality of display modules (30A-30w), and the gap (g) can be maintained at a constant level. When the gap (g) is maintained at a constant level, the seam formed by the gap (g) may not be highlighted. As a result, the sense of unity of the screen of the display panel (20) is maintained, and the user's visual discomfort may be reduced. Ultimately, the display device (1) can create a seamless viewing environment and increase user satisfaction.

[0173] According to one embodiment of the present disclosure, the coefficient of thermal expansion of the first fiber reinforcing layer (120) may be determined (i.e., based on or corresponding to) by the pitch (p, hereinafter referred to as the inorganic light-emitting element pitch) of two adjacent inorganic light-emitting elements among a plurality of inorganic light-emitting elements (50). According to one embodiment of the present disclosure, the coefficient of thermal expansion of the second fiber reinforcing layer (130) may be determined by the inorganic light-emitting element pitch (p). The inorganic light-emitting element pitch (p) may refer to the distance between the center of the first inorganic light-emitting element (50) and the center of the second inorganic light-emitting element (50) adjacent to the first inorganic light-emitting element (50). For example, considering Weber's law, when the inorganic light-emitting element pitch (p) is small, the change in the gap (g) due to thermal expansion (or thermal contraction) may be relatively prominent. For example, considering Weber's law, when the inorganic light-emitting element pitch (p) is small, the change in the gap (g) due to thermal expansion (or thermal contraction) may not be relatively prominent. That is, the larger the inorganic light-emitting element pitch (p), the less sensitively the change in the gap (g) can be perceived by the user. Therefore, the larger the inorganic light-emitting element pitch (p), the first fiber reinforcing layer (120) can allow for a material or weaving method with a high coefficient of thermal expansion. The larger the inorganic light-emitting element pitch (p), the second fiber reinforcing layer (130) can allow for a material or weaving method with a high coefficient of thermal expansion.

[0174] According to one embodiment of the present disclosure, as the pitch (p) of the inorganic light-emitting element increases, the weaving method of the first fiber reinforcing layer (120) can be configured to be applied in the order of Unidirectional (UD), Satin, Twill, and Plain. This is because, as described above, the coefficient of thermal expansion of the first fiber reinforcing layer (120) increases in the order of Unidirectional (UD), Satin, Twill, and Plain. For example, when manufactured using the Unidirectional (UD) weaving method, the coefficient of thermal expansion of the first fiber reinforcing layer (120) is smaller than the coefficient of thermal expansion of the first fiber reinforcing layer (120) when manufactured using the Plain weaving method.

[0175] According to one embodiment of the present disclosure, as the pitch (p) of the inorganic light-emitting element increases, the weaving method of the second fiber reinforcing layer (130) can be configured to be applied in the order of Unidirectional (UD), Satin, Twill, and Plain. This is because, as described above, the coefficient of thermal expansion of the second fiber reinforcing layer (130) increases in the order of Unidirectional (UD), Satin, Twill, and Plain. For example, when manufactured using the Unidirectional (UD) weaving method, the coefficient of thermal expansion of the second fiber reinforcing layer (130) is smaller than the coefficient of thermal expansion of the second fiber reinforcing layer (130) when manufactured using the Plain weaving method.

[0176] For example, when the inorganic light-emitting element pitch (p) is less than the first reference pitch (e.g., approximately 0.84 mm), the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be formed using a Unidirectional (UD) weaving method. For example, when the inorganic light-emitting element pitch (p) is greater than the first reference pitch and less than the second reference pitch (e.g., approximately 1.0 mm), the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be formed using a Unidirectional (UD) weaving method, a Satin weaving method, or a Twill weaving method. For example, when the inorganic light-emitting element pitch (p) is greater than the second reference pitch, they may be formed using a Unidirectional (UD) weaving method, a Satin weaving method, a Twill weaving method, or a Plain weaving method. Meanwhile, the first reference pitch and the second reference pitch may vary depending on the size and components of the display device (1).

[0177] According to various exemplary embodiments of the present disclosure, a display device may comprise a plurality of display modules, each comprising a plurality of display modules (30A-30w), each comprising a substrate (40) and a plurality of inorganic light-emitting elements (50) mounted on the substrate; and a frame (100) that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form. The frame (100) may include a glass core layer (110). The frame (100) may include a first fiber reinforcement layer (120) attached to a first surface (111) of the glass core layer and configured to face the substrates of the plurality of display modules. The frame (100) may include a second fiber reinforcement layer (130) attached to a second surface (112) opposite to the first surface of the glass core layer.

[0178] The first fiber reinforcing layer (120) may include at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer).

[0179] The second fiber reinforcing layer (130) may include at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer).

[0180] The first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be made of the same material.

[0181] The thermal expansion coefficient of the first fiber reinforcing layer (120) may be configured to correspond to the thermal expansion coefficient of the glass core layer (110). The thermal expansion coefficient of the second fiber reinforcing layer (130) may be configured to correspond to the thermal expansion coefficient of the glass core layer (110).

[0182] The thermal expansion coefficient of the first fiber reinforcing layer (120) can be determined by the pitch (p) of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements (50). The thermal expansion coefficient of the second fiber reinforcing layer (130) can be determined by the pitch (p) of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements (50).

[0183] The coefficient of thermal expansion of the first fiber reinforcing layer (120) may be determined by the weaving method of the first fiber reinforcing layer (120). The first fiber reinforcing layer (120) may be configured to be woven in a Plain, Twill, Satin, or Unidirectional (UD) manner.

[0184] The coefficient of thermal expansion of the second fiber reinforcing layer (130) may be determined by the weaving method of the second fiber reinforcing layer (130). The second fiber reinforcing layer (130) may be configured to be woven in a Plain, Twill, Satin, or Unidirectional (UD) manner.

[0185] As the pitch (p) of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements (50) increases, the weaving method of the first fiber reinforcing layer (120) can be configured to be applied in the order of Unidirectional (UD), Satin, Twill, and Plain.

[0186] As the pitch (p) of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements (50) increases, the weaving method of the second fiber reinforcing layer (130) can be configured to be applied in the order of Unidirectional (UD), Satin, Twill, and Plain.

[0187] When the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) are woven in a unidirectional (UD) manner, the first fiber reinforcing layer (120) may include a first UD layer (121) that includes a fiber bundle (f1) extending in a first direction and is attached to the first surface (111) of the glass core layer, and a second UD layer (122) that includes a fiber bundle (f2) extending in a second direction different from the first direction and is laminated on the front surface of the first UD layer (121) and configured to contact the rear surface (302) of the plurality of display modules. When the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) are woven in a unidirectional (UD) manner, the second fiber reinforcing layer (130) may include a third UD layer (131) that includes fiber bundles (f3) extending in the first direction and is attached to the second surface (112) of the glass core layer, and a fourth UD layer (132) that includes fiber bundles (f4) extending in the second direction and is configured to be laminated on the back surface of the third UD layer (131).

[0188] When the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) are woven in a unidirectional (UD) manner, the first fiber reinforcing layer (120) may include a first UD layer (123) that includes a fiber bundle (f5) extending in a first direction and is attached to the first surface (111) of the glass core layer, a second UD layer (124) that includes a fiber bundle (f6) extending in the first direction and is configured to contact the rear surface (302) of the plurality of display modules, and a third UD layer (125) that includes a fiber bundle (f7) extending in a second direction different from the first direction and is disposed between the first UD layer (123) and the second UD layer (124). When the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) are woven in a unidirectional (UD) manner, the second fiber reinforcing layer (130) may include a fourth UD layer (133) attached to the second surface (112) of the glass core layer and containing fiber bundles (f8) extending in the first direction, a fifth UD layer (134) spaced rearward from the fourth UD layer (133) and containing fiber bundles (f9) extending in the first direction, and a sixth UD layer (135) disposed between the fourth UD layer (133) and the fifth UD layer (134) and containing fiber bundles (f10) extending in the second direction.

[0189] Each of the plurality of inorganic light-emitting elements (50) may include: a first semiconductor (58a); a second semiconductor (58b) adjacent to the substrate than the first semiconductor; an active layer (58c) disposed between the first semiconductor and the second semiconductor and configured to generate light; a first contact electrode (57a) electrically connected to the first semiconductor and disposed on the opposite side of the light-emitting surface (54) of the inorganic light-emitting element; and a second contact electrode (57b) electrically connected to the second semiconductor and disposed on the opposite side of the light-emitting surface (54) of the inorganic light-emitting element. The substrate (40) may include a first pad electrode (44a) configured to correspond to the first contact electrode; and a second pad electrode (44b) configured to correspond to the second contact electrode. The display device may further include a conductive adhesive layer (47) disposed between the first contact electrode (57a) and the first pad electrode (44a) and between the second contact electrode (57b) and the second pad electrode (44b) so as to electrically connect the plurality of inorganic light-emitting elements (50) and the substrate (40).

[0190] It may include a chassis (10) arranged to face the second fiber reinforcement layer (130) of the frame (100) and configured to cover the rear of the plurality of display modules and the rear of the frame.

[0191] The above substrate (40) may include glass.

[0192] According to various exemplary embodiments of the present disclosure, a display device may comprise: a plurality of micro LED modules (30A-30w); a frame (100) configured to be positioned toward the rear of the plurality of micro LED modules and to maintain a gap (g) between the plurality of micro LED modules; and a chassis (10) provided to cover the rear of the plurality of micro LED modules and the rear of the frame. The frame (100) comprises: a first fiber reinforcing layer (120) positioned toward the rear of the plurality of micro LED modules and comprising at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer); and a second fiber reinforcing layer (130) positioned toward the chassis and spaced rearward from the first fiber reinforcing layer, and made of the same material as the first fiber reinforcing layer. It may include: a glass core layer (110) disposed between the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130); a first adhesive layer (140) disposed between the first fiber reinforcing layer (120) and the glass core layer (110) and configured to bond the first fiber reinforcing layer and the glass core layer; and a second adhesive layer (150) disposed between the second fiber reinforcing layer (130) and the glass core layer (110) and configured to bond the second fiber reinforcing layer and the glass core layer.

[0193] Each of the above plurality of micro LED modules may include a glass substrate (40); and a plurality of micro LEDs (50) mounted on the glass substrate (40). Each of the above plurality of micro LEDs may include a first semiconductor (58a); a second semiconductor (58b) adjacent to the glass substrate than the first semiconductor; and an active layer (58c) disposed between the first semiconductor and the second semiconductor and configured to generate light.

[0194] The thermal expansion coefficient of the first fiber reinforcing layer (120) and the thermal expansion coefficient of the second fiber reinforcing layer (130) can be configured to correspond to the thermal expansion coefficient of the glass core layer (110).

[0195] The thermal expansion coefficient of the first fiber reinforcing layer (120) and the thermal expansion coefficient of the second fiber reinforcing layer (130) can be determined by the pitch (p) of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements (50).

[0196] The coefficient of thermal expansion of the first fiber reinforcing layer (120) is determined by the weaving method of the first fiber reinforcing layer (i.e., base, corresponding), and the coefficient of thermal expansion of the second fiber reinforcing layer (130) can be determined by the weaving method of the second fiber reinforcing layer. Each of the first fiber reinforcing layer (120) and the second fiber reinforcing layer (130) may be configured to be woven in a Plain, Twill, Satin, or Unidirectional (UD) manner.

[0197] A display device (1) according to various exemplary embodiments of the present disclosure may include a frame (100) composed of a glass core layer (110), a first fiber reinforcing layer (120), and a second fiber reinforcing layer (130). Since the frame (100) does not contain steel material, it may be relatively lightweight and thin. Additionally, the thermal expansion coefficient of the frame (100) may be configured to be the same as or substantially similar to the thermal expansion coefficient of a plurality of display modules, thereby allowing the gap (g) between the plurality of display modules to be maintained constant.

[0198] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0199] Specific embodiments have been illustrated and described above. However, the invention is not limited to the embodiments described above, and those skilled in the art may make various modifications without departing from the essence of the technical concept of the invention as described in the following claims.

Claims

1. A plurality of display modules, wherein at least a portion comprises a substrate and a plurality of inorganic light-emitting elements mounted on the substrate; and A frame that supports the plurality of display modules so that the plurality of display modules are horizontally arranged in an M*N matrix form; The above frame is, Glass core layer; A first fiber reinforcement layer formed on a first surface of the glass core layer and configured to face the substrates of the plurality of display modules; and A display device comprising: a second fiber reinforcement layer formed on a second surface opposite to the first surface of the glass core layer.

2. In Paragraph 1, A display device comprising at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer), wherein the first fiber reinforcing layer comprises 3. In Paragraph 1, A display device comprising at least one of CFRP (Carbon Fiber Reinforced Polymer) and GFRP (Glass Fiber Reinforced Polymer), wherein the second fiber reinforcement layer comprises the above-mentioned second fiber reinforcement layer.

4. In Paragraph 1, A display device comprising the same material as the first fiber reinforcing layer and the second fiber reinforcing layer.

5. In Paragraph 1, A display device configured such that the thermal expansion coefficient of the first fiber reinforcing layer and the thermal expansion coefficient of the second fiber reinforcing layer correspond to the thermal expansion coefficient of the glass core layer.

6. In Paragraph 1, A display device in which the thermal expansion coefficient of the first fiber reinforcing layer and the thermal expansion coefficient of the second fiber reinforcing layer are determined by the pitch of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements.

7. In Paragraph 6, The coefficient of thermal expansion of the first fiber reinforcing layer is determined by the weaving of the first fiber reinforcing layer, and The first fiber reinforcing layer comprises at least one weave of Plain, Twill, Satin, or Unidirectional (UD) in a display device.

8. In Paragraph 6, The coefficient of thermal expansion of the second fiber reinforcing layer is determined by the weaving of the second fiber reinforcing layer, and The second fiber reinforcement layer comprises at least one weave of Plain, Twill, Satin, or Unidirectional (UD) in a display device.

9. In Paragraph 7, A display device configured such that as the pitch of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements increases, the weaving of the first fiber reinforcing layer is applied in the order of Unidirectional (UD), Satin, Twill, and Plain.

10. In Paragraph 8, A display device configured such that as the pitch of two adjacent inorganic light-emitting elements among the plurality of inorganic light-emitting elements increases, the weaving of the second fiber reinforcing layer is applied in the order of Unidirectional (UD), Satin, Twill, and Plain.

11. In Paragraph 1, When the first fiber reinforcing layer and the second fiber reinforcing layer include a unidirectional (UD) weave, The first fiber reinforcement layer above is, A first UD layer formed on the first surface of the glass core layer, comprising a first fiber bundle extending in a first direction, and It includes a second UD layer comprising a second fiber bundle extending in a second direction different from the first direction, and configured to be laminated on the front surface of the first UD layer and contact the rear surface of the plurality of display modules. The second fiber reinforcement layer above is, A third UD layer comprising a third fiber bundle extending in the first direction and attached to the second surface of the glass core layer, and A display device comprising a fourth fiber bundle extending in the second direction and a fourth UD layer laminated on the rear surface of the third UD layer.

12. In Paragraph 1, When the first fiber reinforcing layer and the second fiber reinforcing layer include a unidirectional (UD) weave, The first fiber reinforcement layer above is, A first UD layer formed on the first surface of the glass core layer, comprising a first fiber bundle extending in a first direction, and A second UD layer comprising a second fiber bundle extending in the first direction and configured to contact the rear surface of the plurality of display modules, and It includes a third fiber bundle extending in a second direction different from the first direction, and a third UD layer disposed between the first UD layer and the second UD layer, The second fiber reinforcement layer above is, A fourth UD layer comprising a fourth fiber bundle extending in the first direction and attached to the second surface of the glass core layer, and A fifth UD layer comprising a fifth fiber bundle extending in the first direction and spaced rearward from the fourth UD layer, and A display device comprising a sixth fiber bundle extending in the second direction and a sixth UD layer disposed between the fourth UD layer and the fifth UD layer.

13. In Paragraph 12, At least one of the plurality of inorganic light-emitting elements above is, First semiconductor; A second semiconductor adjacent to the substrate than the first semiconductor; An active layer disposed between the first semiconductor and the second semiconductor and configured to generate light; A first contact electrode electrically connected to the first semiconductor and disposed on the opposite side of the light-emitting surface of the inorganic light-emitting element; and A second contact electrode electrically connected to the second semiconductor and disposed on the opposite side of the light-emitting surface of the inorganic light-emitting element; comprising The above substrate is, A first pad electrode connected to the first contact electrode; and A second pad electrode connected to the second contact electrode; comprising The above display device is, A display device further comprising: a conductive adhesive layer electrically connected to the plurality of inorganic light-emitting elements and the substrate, with at least a portion disposed between the first contact electrode and the first pad electrode and between the second contact electrode and the second pad electrode.

14. In Paragraph 1, A display device comprising a chassis formed on the rear of the plurality of display modules and on the rear of the frame, facing the second fiber reinforcement layer of the frame.

15. In Paragraph 1, The above substrate is a display device including glass.

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