Multi-layered copper foil manufacturing apparatus, and manufacturing method thereof

Abstract

The present invention relates to a copper foil manufacturing apparatus and, more specifically, to a multi-layered copper foil manufacturing apparatus and manufacturing method in which an anode plate and a cathode roller in an electrolytic bath containing a copper foil electrolyte are provided to manufacture a copper foil, and a multi-layered metal layer is formed on the copper foil such that electrical conductivity is improved and corrosion resistance and wear resistance are provided. The present invention comprises: a thin film forming device including at least one from among a copper foil forming device, which continuously forms a copper foil by means of a copper foil forming roller of a cathode positioned in a copper foil electrolytic bath and an anode positioned in the vicinity thereof, a winding roller, which winds a copper foil body including a copper foil layer continuously supplied from the copper foil forming device, a silver foil forming device, which is positioned between the copper foil forming device and the winding roller and forms a silver foil layer on the outside of the copper foil layer passing through the inside of a silver foil plating bath, and a nickel foil forming device, which is positioned between the copper foil forming device and the winding roller and forms a nickel thin film layer on the outside of the copper foil layer passing through the inside of a nickel plating bath; and an anti-rust device, which is positioned between the copper foil forming device and the winding roller and performs anti-rust treatment on the outside of the copper foil layer, wherein each device of the thin film forming device includes: a plating bath; a plating roller which is positioned at the center under the plating bath and which guides the copper foil, that is a continuously passing cathode, to be disposed in a "V" shape; and anodes provided on both sides thereof diagonally to be parallel to the copper foil progressing in the "V" shape in both directions wit

Description

Multilayer copper foil manufacturing apparatus and method of manufacturing the same

[0001] The present invention relates to a copper foil manufacturing apparatus, and more specifically, to a multilayer copper foil manufacturing apparatus and method having improved electrical conductivity and corrosion resistance and wear resistance by forming a multilayer metal layer on the copper foil, in addition to manufacturing a copper foil by providing an anode plate and a cathode roller of an electrolytic cell containing a copper foil electrolyte.

[0002] Generally, a large copper foil roller is positioned within an electrolytic cell containing copper foil electrolyte, and a positive electrode is formed at a predetermined distance from the roller. Copper foil is manufactured continuously by applying a negative electrode to the roller. The utilization of copper foil produced in this way is steadily increasing, as it is used in semiconductor manufacturing, circuit board manufacturing, and the production of various electronic components. Generally, because copper foil has good electrical conductivity, it is primarily used in precision circuits and components, and it offers the advantages of being convenient to use and inexpensive compared to other materials. Recently, as it is increasingly used in sensitive circuits such as high-capacity power transmission and AI material components, it is required to possess even greater circuit stability. On the other hand, while it must be able to be used for a long time without deformation even under such high-precision applications, corrosion resistance and wear resistance are required as the usage environment becomes increasingly diversified; however, there is a concern that copper foil manufactured with these characteristics in mind may have reduced electrical conductivity. In particular, copper foil is susceptible to heat and acid, so this weakness must be compensated for, and it must also possess wear resistance as it undergoes multiple stages during manufacturing and use. Therefore, there is an urgent need for technical proposals for copper foil materials that can possess corrosion resistance and wear resistance while improving electrical conductivity.

[0003] The present invention aims to resolve the aforementioned problems by providing wear resistance and corrosion resistance through copper foil surface treatment. Another objective of the present invention is to improve the corrosion and wear resistance of the outer surface while incorporating a multilayer structure within the inner layer for enhanced signal stability. Furthermore, yet another objective of the present invention is to simplify the manufacturing process and improve product quality by enabling a single series of manufacturing processes to be carried out for the production of a multilayer copper foil, thereby eliminating the need to move materials to multiple manufacturing sites.

[0004] As a technical solution for achieving the above objective, the present invention comprises a thin layer forming device including at least one of the following devices: a copper foil forming device that continuously forms a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell and a surrounding positive electrode; a winding roller for winding a copper foil body including a copper foil layer continuously supplied from the copper foil forming device; a silver foil forming device located between the copper foil forming device and the winding roller and forming a silver foil layer outwardly toward a copper foil layer passing through the interior of a silver foil plating tank; and a nickel foil forming device located between the copper foil forming device and the winding roller and forming a nickel foil layer outwardly toward a copper foil layer passing through a nickel plating tank. The present invention provides a multilayer copper foil manufacturing apparatus characterized by comprising a rust prevention device positioned between the copper foil forming apparatus and the winding roller and performing rust prevention treatment on the outer surface of the copper foil layer, wherein each device of the thin layer forming apparatus comprises a plating tank, a plating roller positioned in the center below the plating tank and guiding a copper foil, which is a cathode and passes through continuously, to be arranged in a "V" shape, and positive electrodes installed diagonally on both sides so as to be parallel to the copper foil proceeding in a "V" shape in both directions relative to the plating roller within the plating tank.

[0005] In a preferred embodiment of the present invention, the silver foil forming device comprises: a silver foil plating tank containing a silver plating solution through which a silver foil target strip to be plated passes as the continuously supplied copper foil layer; a silver foil negative current energizing roller for guiding the silver foil target strip entering the silver foil plating tank and applying a (-) current to the silver foil target strip; a silver foil squeeze roller for removing the plating solution of the silver foil strip coming out of the silver foil plating tank; a silver foil positive electrode spaced apart from the silver foil target strip and the silver foil strip at a predetermined distance; a silver foil positive electrode application line connected to the silver foil positive electrode and applying a positive current; a silver foil positive electrode connection part to which the upper part of the silver foil positive electrode application line is fixed; and a silver foil plating solution nozzle device for spraying the silver plating solution between the silver foil target strip and the silver foil strip that continuously pass with the silver foil positive electrode.

[0006] In a preferred embodiment of the present invention, the nickel foil forming apparatus comprises: a nickel plating tank in which a nickel foil target strip to be plated passes through the interior and a nickel plating solution is contained, wherein the nickel foil forming apparatus is a copper foil body including the copper foil layer that is continuously supplied; a nickel negative current-carrying roller for guiding the nickel foil target strip entering the nickel plating tank and applying a (-) current to the nickel foil target strip; a nickel squeeze roller for removing the plating solution of the nickel foil strip coming out of the nickel plating tank; a nickel positive electrode spaced apart from the nickel foil target strip and the nickel foil strip at a predetermined distance; a nickel positive current application line connected to the nickel positive electrode and applying a positive current; a nickel positive connection part to which the upper part of the nickel positive current application line is fixed; and a nickel plating solution nozzle device for spraying the nickel plating solution between the nickel foil target strip and the nickel foil strip that pass continuously with the nickel positive electrode.

[0007] In a preferred embodiment of the present invention, the anti-corrosion device comprises a chrome foil forming device that forms a chrome foil layer outwardly to the copper foil layer passing through the thin layer forming device, and the chrome foil forming device comprises: a chrome plating tank in which a chrome foil strip to be plated passes through the interior and a chrome plating solution is contained, wherein the chrome foil forming device is a copper foil body including the copper foil layer that is continuously supplied and the chrome foil layer is a copper foil body; a chrome negative current energizing roller for guiding the chrome foil strip entering the chrome plating tank and applying a (-) current to the chrome foil strip; and a chrome positive electrode spaced apart from the chrome foil strip at a predetermined distance, thereby providing a multilayer copper foil manufacturing device.

[0008] In a preferred embodiment of the present invention, an air drying device for drying a copper foil that has passed through a chrome foil forming device by spraying air; and a washing device for washing a copper foil that has passed through each of the silver foil forming device, the nickel foil forming device, and the chrome foil forming device, wherein the washing device comprises: a washing tank containing washing water; and a washing roller for guiding a copper foil that has passed through a washing tank.

[0009] In a preferred embodiment of the present invention, the plating target band passing around the plating roller under the plating tank of each of the silver foil forming device and the nickel foil forming device forms a negative electrode and is formed as a large-area V-shaped negative electrode band that extends upward on both sides of the plating roller and is arranged in a V-shape structure and forms a large area, and the positive electrode corresponding to the large-area V-shaped negative electrode band is formed as a double-sided large-area V-shaped positive electrode group consisting of a plurality of positive electrode plates that are spaced apart at a predetermined interval on both sides of the large-area V-shaped negative electrode band, form a large area, are arranged in a V-shape structure, and are composed of a plurality of positive electrode plates. A multilayer copper foil manufacturing device is provided.

[0010] In a preferred embodiment of the present invention, a multilayer copper foil manufacturing apparatus is provided, characterized by comprising: a plurality of positive electrode application lines connected to individual positive electrodes of a double-sided large-area V-shaped positive electrode group; a positive electrode installation part in which the plurality of positive electrode application lines are installed; and a positive electrode power line connected to the positive electrode application lines.

[0011] In a preferred embodiment of the present invention, a multilayer copper foil manufacturing apparatus is provided, comprising an anode application line that applies a positive current connected to a positive electrode plate located within a plating tank of the silver foil forming apparatus and the nickel foil forming apparatus, wherein the anode application line comprises: a positive electrode coupling part coupled to the positive electrode plate; an electrode lateral extension line extending laterally from the positive electrode coupling part and the positive electrode plate and forming a plate shape; an electrode plate parallel line in a plate shape inclined upward parallel to the positive electrode plate from the outside of the electrode lateral extension line; a connection directional line in a plate shape extending from the upper part of the electrode plate parallel line toward a positive electrode installation part in the upper center of the plating tank; and a connection coupling part to which a positive current application positive power line is connected on the upper side of the connection directional line.

[0012] In a preferred embodiment of the present invention, a multilayer copper foil manufacturing apparatus is provided, comprising a plating solution nozzle device for spraying a plating solution onto a copper foil passing through a plating tank of a silver foil forming apparatus and a nickel foil forming apparatus, wherein the plating solution nozzle device comprises: a plating solution pipe nozzle having a pipe shape arranged along the transverse direction of a copper foil passing continuously and spraying a plating solution from a plurality of nozzles; a plating solution supply pipe connected to one side of the plating solution pipe nozzle and supplying a plating solution; and a plating solution pump for supplying a plating solution to the plating solution supply pipe.

[0013] In a preferred embodiment of the present invention, the apparatus comprises: a power supply unit that applies power to a roller motor that operates one or more rollers and applies power to a positive electrode and a negative electrode; and a copper foil control unit that controls the application of power to a roller motor that operates one or more rollers and the application of power to a positive electrode and a negative electrode, wherein the copper foil control unit comprises: a roller operating module that transmits a control signal to the power supply unit for applying power to a roller motor that operates one or more rollers; a negative power supply module that transmits a control signal to the power supply unit for applying negative power to the copper foil forming roller side of a copper foil forming device and to the copper foil side passing through a silver foil forming device, a nickel foil forming device, and a chrome foil forming device; and a positive power supply module that transmits a control signal to the power supply unit for applying positive power to the positive electrode of a copper foil forming device, a silver foil forming device, a nickel foil forming device, and a chrome foil forming device. The present invention provides a multilayer copper foil manufacturing apparatus characterized by including a plating solution supply module that transmits an operation signal to each supply pump to supply the copper foil electrolyte of the copper foil forming apparatus, the silver foil plating solution of the silver foil forming apparatus, the nickel plating solution of the nickel foil forming apparatus, and the chrome plating solution of the chrome foil forming apparatus.

[0014] In a preferred embodiment of the present invention, a copper foil manufacturing apparatus is provided, comprising: an inline measuring device positioned on a copper foil layer moving path wound by the winding roller and measuring the thickness of the copper foil layer; and a plating solution control valve installed on a plating solution supply line that receives control information from the plating solution supply module and supplies the plating solution from a plating solution pump to a plating solution pipe porous nozzle, wherein the plating solution control valve controls the flow rate of the plating solution supplied to the plating solution pipe porous nozzle.

[0015] In a preferred embodiment of the present invention, a multilayer copper foil manufacturing apparatus is provided, characterized by comprising any one of the following: a copper foil forming apparatus that continuously forms a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell and a surrounding positive electrode; a silver foil forming apparatus that includes a winding roller for winding a copper foil body including a copper foil layer continuously supplied from the copper foil forming apparatus, is located between the copper foil forming apparatus and the winding roller and forms a silver foil layer outwardly toward the copper foil layer; a nickel foil forming apparatus that is located between the copper foil forming apparatus and the winding roller and forms a nickel foil layer outwardly toward the copper foil layer; and a chrome foil forming apparatus that is located between the copper foil forming apparatus and the winding roller and forms a chrome foil layer outwardly toward the copper foil layer.

[0016] In a preferred embodiment of the present invention, a copper foil is provided having one or more metal layers formed on the surface of a copper foil layer formed by a copper foil forming device, wherein the copper foil comprises: a copper foil layer; a silver foil layer formed on both sides of the copper foil layer; a nickel foil layer formed on both outer surfaces of the silver foil layer; and a chrome foil layer formed on both outer surfaces of the nickel foil layer.

[0017] In a preferred embodiment of the present invention, the copper foil layer is formed with a thickness of 4.5 μm to 10 μm, the silver foil layer is formed with a thickness of 0.5 μm to 1 μm, the nickel foil layer is formed with a thickness of 0.5 μm to 1 μm, and the chromium foil layer is formed with a thickness of 0.5 μm to 1 μm, thereby providing a copper foil.

[0018] In a preferred embodiment of the present invention, a method for manufacturing a multilayer copper foil including a copper foil layer continuously supplied from a copper foil forming device that continuously forms a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell and a surrounding positive electrode, wherein the copper foil forming device comprises: a copper foil forming step of forming a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell containing a copper foil electrolyte and a surrounding positive electrode; a thin layer forming step in which the copper foil continuously supplied from the copper foil forming device by the copper foil forming step passes through the interior of a plating tank of a metal foil forming device and forms a metal foil layer by plating on the surface of the copper foil passing through the interior of a plating tank containing a plating solution; and a rust prevention step in which the copper foil continuously supplied from the metal foil forming device by the thin layer forming step passes through the interior of a rust prevention plating tank of a rust prevention device and forms a rust prevention layer by plating on the surface of the copper foil. The present invention provides a method for manufacturing a multilayer copper foil, characterized by including a copper foil winding step in which a copper foil formed by the above-mentioned anti-corrosion step is continuously supplied and wound onto a winding roller.

[0019] In a preferred embodiment of the present invention, prior to the copper foil forming step, the method comprises: an electrolyte and plating solution input step of introducing a copper foil electrolyte into a copper foil electrolytic cell of a copper foil forming device and introducing a plating solution into a silver foil plating tank of a silver foil forming device, a nickel plating tank of a nickel foil forming device, and a chrome plating tank of a chrome foil forming device, respectively; and a roller driving step of operating a roller to continuously move a copper foil and wind it onto a winding roller, wherein the thin layer forming step comprises: a silver foil forming step in which a copper foil continuously supplied from a copper foil forming device by the copper foil forming step passes inside a silver foil plating tank of a silver foil forming device, and a silver foil layer is formed by plating on the surface of the copper foil passing inside the silver foil plating tank containing a silver foil plating solution. The present invention provides a method for manufacturing a multilayer copper foil, comprising one or more steps including: a nickel foil forming step in which a copper foil having a silver foil layer formed thereon, which is continuously supplied from a silver foil forming device by the silver foil forming step, passes through the interior of a nickel foil plating tank of a nickel foil forming device, and forms a nickel foil layer by plating on the surface of the copper foil passing through the interior of a nickel foil plating tank containing a nickel foil plating solution; wherein the anti-corrosion step is formed as an anti-corrosion layer as a chrome foil layer, and comprises a chrome foil forming step in which the copper foil passes through the interior of a chrome foil plating tank of a chrome foil forming device that forms a chrome foil layer, and is plated on the surface of the copper foil with a chrome plating solution.

[0020] In a preferred embodiment of the present invention, the copper foil forming step comprises a copper foil terminal power application step in which a negative power supply of a power supply unit is applied to the copper foil forming roller side of a copper foil forming device and a positive power supply of a power supply unit is applied to the positive electrode side of a copper foil forming device, thereby providing a method for manufacturing a multilayer copper foil.

[0021] In a preferred embodiment of the present invention, the silver foil forming step comprises: a silver foil terminal power application step in which a negative power supply of a power supply unit is applied to the silver foil negative electrode current roller side of the silver foil forming device and a positive power supply of a power supply unit is applied to the silver foil positive electrode side of the silver foil forming device; and a silver foil plated copper foil squeezing step in which a silver foil plating solution is removed by passing a silver foil squeezing roller over a copper foil in which a silver foil layer is formed on both sides of a copper foil layer by the silver foil forming device, and further comprises a silver foil formed copper foil washing step in which, after the silver foil forming step, the copper foil in which the silver foil layer is formed is washed by passing through a washing tank of a washing device.

[0022] In a preferred embodiment of the present invention, the nickel foil forming step comprises: a nickel foil terminal power application step in which a negative power supply of a power supply unit is applied to the nickel negative electrode current roller side of a nickel foil forming device and a positive power supply of a power supply unit is applied to the nickel positive electrode side of a nickel foil forming device; and a nickel foil plating copper foil squeezing step in which a nickel foil layer is formed on both sides of a copper foil in which a nickel foil layer is formed by the nickel foil forming device, and a nickel foil forming copper foil washing step in which the nickel foil layer is formed on the copper foil is washed by passing through a nickel squeeze roller, and further comprises, after the nickel foil forming step, a nickel foil forming copper foil washing step in which the copper foil with the nickel foil layer is washed by passing through a washing tank of a washing device.

[0023] In a preferred embodiment of the present invention, the chrome foil forming step comprises a chrome foil terminal power application step in which a negative power supply unit is applied to the chrome negative electrode current roller side of the chrome foil forming device and a positive power supply unit is applied to the chrome positive electrode side of the chrome foil forming device, and further comprises a copper foil surface drying step in which, after the chrome foil forming step, the copper foil having a chrome foil layer formed by the chrome foil forming device passes through an air drying device to dry both sides. A method for manufacturing a multilayer copper foil is provided.

[0024] The present invention, configured as described above, has the effect of providing wear resistance and corrosion resistance through copper foil surface treatment. Another effect of the present invention is that while the outer surface improves corrosion resistance and wear resistance, the inner layer provides a multilayer structure for enhanced signal stability. Furthermore, another effect of the present invention is that by allowing a single series of manufacturing processes to be carried out together when producing a multilayer copper foil, the process is simplified and high-quality copper foil is provided without the need to move to multiple manufacturing sites.

[0025] FIG. 1 is an overall manufacturing configuration diagram of a multilayer copper foil manufacturing apparatus according to the present invention. FIG. 2 is a detailed configuration diagram of a silver foil forming apparatus among the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 3 is a detailed configuration diagram of a nickel foil forming apparatus among the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 4 is a detailed configuration diagram of a chrome foil forming apparatus among the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 5 is a detailed configuration diagram of a washing apparatus among the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 6 is an illustrative diagram for explaining the arrangement state of copper foils, which are the positive and negative electrodes of the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 7 is a detailed illustrative diagram of a positive electrode plate and a plating solution nozzle apparatus among the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 8 is an illustrative diagram for explaining a cross-section of a copper foil manufactured by the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 9 is a control configuration diagram of the multilayer copper foil manufacturing apparatus according to the present invention. FIG. 10 is a flowchart of a method for manufacturing a multilayer copper foil according to the present invention.

[0026] The following is a detailed description with reference to the attached drawings.

[0027] That is, the multilayer copper foil manufacturing apparatus and the method of manufacturing the same according to the present invention comprises, as shown in the attached FIGS. 1 to 10, a copper foil forming apparatus (1) that continuously forms a copper foil by means of a copper foil forming roller (3) of a negative electrode located within a copper foil electrolytic cell (2) and a surrounding positive electrode, and a winding roller (5) for winding a copper foil body including a copper foil layer continuously supplied from the copper foil forming apparatus (1). As shown in FIG. 1, the copper foil forming apparatus (1) and the winding roller (5) are located on both sides of the copper foil manufacturing apparatus, and the copper foil manufactured in the copper foil forming apparatus (1) is wound onto the winding roller (5). Furthermore, various multilayer configurations are provided between the copper foil forming apparatus (1) and the winding roller (5) to further form a multilayer metal layer on the surface of the copper foil, thereby providing wear resistance and corrosion resistance. Accordingly, the configurations of the copper foil forming device (1) and the winding roller (5) utilize well-known technical configurations, and a detailed technical description thereof is omitted. As shown in FIG. 1, the basic copper foil forming device (1) is provided with a copper foil electrolytic cell (2) containing a copper foil electrolyte. A copper foil forming roller (3), which is a negative electrode, is positioned in the center within the copper foil electrolytic cell (2). A positive electrode is spaced apart from the copper foil forming roller (3) by a predetermined distance, and while the copper foil forming roller (3) is rotating, power is applied to the positive and negative electrodes to form a copper foil layer on the copper foil forming roller (3). The copper foil layer is then separated from the copper foil forming roller (3) and continuously moved in the direction of the winding roller (5).

[0028] The copper foil layer produced in this way is generally made to have a thickness of 4.5 to 10 μm, and the thickness of the copper foil layer can be determined by the rotational speed of the copper foil forming roller (3), the concentration and temperature of the copper foil electrolyte, and the intensity of the current applied to the positive and negative electrodes, respectively, and this series of copper foil layer forming techniques can be carried out by applying known techniques.

[0029] The copper foil layer prepared in this manner forms a copper foil body by further forming various metal layers through a subsequent plating process, and the copper foil body is wound onto a final winding roller (5). As an additional process, a process of forming a silver foil layer on the copper foil layer, a process of forming a nickel foil layer in addition thereto, and a process of forming a chrome foil layer in addition thereto can be further performed. That is, the multilayer copper foil manufacturing device is equipped with a metal foil forming device such as a silver foil forming device (20) and a nickel foil forming device (30), and an anti-corrosion device such as a chrome foil forming device (40), in addition to the copper foil forming device (1). As the copper foil formed in the copper foil forming device (1) passes through this series of processes, it is wound onto a final winding roller (5), and during the process therebetween, a metal foil layer including a silver foil layer and a nickel foil layer is formed on the outer surface of the copper foil to further reinforce the copper foil, and an anti-corrosion layer such as a chrome foil layer is added to improve the copper foil characteristics. Accordingly, the entire metal foil formed with multiple layers is named a copper foil body, and the term copper foil body refers to a structure in which another layer is additionally formed on the outer surface of the copper foil layer (110) based on the copper foil layer (110) as a basic base. Accordingly, the copper foil body may be a copper foil layer (110) formed as a single layer by a copper foil forming device (1), or a copper foil body may be formed by adding a metal foil layer such as silver, nickel, chromium, cobalt, or tin to such a copper foil layer. That is, a metal foil in which a silver foil layer (120) is formed on the surface of the copper foil layer (110) by a silver foil forming device (20) may be called a copper foil body. In addition, a structure in which a nickel foil layer (130) is formed on both sides of the copper foil layer (110) or on the surface of the silver foil layer (120) by a nickel foil forming device (30) may also be called a copper foil body. Furthermore, a state in which a chrome foil layer (140) is formed on the outer side of the copper foil, silver foil layer (120) or nickel foil layer (130) by a chrome foil forming device (40) can also be called a copper foil. In this way, the copper foil refers to a metal foil formed by forming a copper foil layer (110) at its center and additionally adding one or more layers among the silver foil layer (120), nickel foil layer (130), and chrome foil layer (140).Accordingly, we will provide a detailed description of the configurations for manufacturing such copper foil.

[0030] Overall, in the multilayer copper foil manufacturing apparatus according to the present invention, a copper foil forming apparatus and a winding roller are provided, and a thin layer forming apparatus is provided that includes at least one of the following devices: a silver foil forming apparatus located between the copper foil forming apparatus and the winding roller, which forms a silver foil layer outwardly toward a copper foil layer passing through the interior of a silver foil plating bath; and a nickel foil forming apparatus located between the copper foil forming apparatus and the winding roller, which forms a nickel foil layer outwardly toward a copper foil layer passing through a nickel plating bath. Additionally, a rust prevention device is provided located between the copper foil forming apparatus and the winding roller, which performs rust prevention treatment outwardly toward a copper foil layer. Furthermore, the main technical feature of each device of the thin layer forming apparatus is that it includes a plating bath; a plating roller located in the center below the plating bath and guiding a copper foil, which is a negative electrode passing through continuously, to be arranged in a "V" shape; and positive electrodes installed diagonally on both sides so as to be parallel to the copper foil that proceeds in a "V" shape in both directions relative to the plating roller within the plating bath.

[0031] First, the silver foil forming device (20) is positioned between the copper foil forming device (1) and the winding roller (5) as shown in FIGS. 1 and 2, and forms a silver foil layer (120) outwardly on the copper foil layer. The silver foil forming device (20) is provided with a silver foil plating tank (22) containing a silver plating solution, through which a silver foil target strip (21), which is to be plated, passes as a continuously supplied copper foil layer. The silver foil target strip (21) passes around the silver foil plating roller (221) located inside the silver foil plating tank (22), and a silver foil positive electrode (25) is positioned at a predetermined distance from the silver foil target strip (21). Then, a silver foil negative current roller (23) is positioned to guide the silver foil target strip (21) entering the silver foil plating tank (22) and to apply a (-) current to the silver foil target strip (21). Since a negative current is applied to this silver foil negative current roller (23) and the silver foil negative current roller (23) and the silver foil target strip (21) are in electrical contact, a negative current is ultimately applied to the silver foil target strip (21). In addition, by applying a positive power source together to the silver foil positive electrode (25), a copper foil body is provided as a silver foil strip (211) on which a silver foil layer (120) is formed on the surface of the silver foil target strip (21), which is a copper foil layer (110) that passes through continuously.

[0032] As such, the copper foil, which is a silver foil strip (211) with a silver foil layer (120) formed on both sides of the copper foil layer (110), is in a state where the silver foil plating solution is applied, and the copper foil passes through a silver foil squeeze roller (24) to remove the plating solution from the silver foil strip (211) coming out of the silver foil plating tank (22). Accordingly, the silver foil plating solution is removed from the copper foil by the silver foil squeeze roller (24). In addition, as the copper foil passes between two rollers and is pressed, the silver foil plating solution is removed, and the thickness of the copper foil may be adjusted to the distance between the two rollers. Furthermore, a sensor that senses the thickness of the copper foil including the silver foil layer is provided before and after this silver foil squeeze roller (24), so that it can detect and determine whether the copper foil has been formed to a set thickness. And as a copper foil body that passes continuously by a silver foil plating roller (221) inside a silver foil plating tank (22), a silver foil target strip (21) prior to silver foil plating and a silver foil plated strip (211) are provided, and a silver foil positive electrode (25) is provided that is spaced apart at a predetermined distance from the silver foil target strip (21) and the silver foil plated strip (211). Generally, as shown in FIGS. 1 and 2, with respect to the silver foil plating roller (221) below the center of the silver foil plating tank (22), the silver foil target strip (21) and the silver foil strip (211) are arranged in a V-shape on both upward sides, respectively, and a silver foil positive electrode (25) plate is positioned on both sides spaced apart from the copper foil body that is the silver foil target strip (21) and the silver foil strip (211). Accordingly, as an example of the silver foil positive electrode (25), as shown in FIG. 2, a total of four silver foil positive electrodes (25), two on each of the two copper foil bodies, are arranged in a V-shape centered around the silver foil plating roller (221). Then, a silver foil positive electrode application line (26) is provided to apply a positive current connected to the silver foil positive electrode (25), and a silver foil positive electrode connection part (27) is provided to fix the upper part of the silver foil positive electrode application line (26). Thus, the positive power of the power supply unit (85) is applied to this silver foil positive electrode application line (26).The silver foil forming device (20) provided in this manner allows silver foil plating to be performed as a copper foil passes through it continuously, and the concentration of the silver foil plating solution in the silver foil plating tank (22) may gradually decrease over time. Therefore, the concentration of the silver foil plating solution in the silver foil plating tank (22) must be maintained to some extent. To this end, the silver foil plating solution can be introduced into the silver foil plating tank (22) continuously or at time intervals. In particular, in order to form a silver foil layer (120) on a copper foil with a predetermined thickness, for example, a thickness of 0.5㎛ to 1㎛, a configuration is required to ensure that the silver foil layer is formed more effectively. To this end, the device includes a silver foil plating solution nozzle device (28) that sprays the silver plating solution between the silver foil positive electrode (25), the silver foil target band (21) that passes through continuously, and the silver foil band (211). The nozzles of the silver foil plating solution nozzle device (28) can be provided on both sides so that the silver foil plating solution is sprayed onto the silver foil target strip (21), silver foil strip (211), etc. on both sides. Thus, a silver foil layer (120) of greater thickness can be formed.

[0033] As shown in FIGS. 1 and 3, the nickel foil forming device (30) is positioned between the copper foil forming device (1) and the winding roller (5) and forms a nickel foil layer (130) outwardly facing the copper foil layer. The nickel foil forming device (30) is a copper foil body including a copper foil layer that is continuously supplied, and is equipped with a nickel plating tank (32) containing a nickel plating solution through which a nickel foil target strip (31) to be plated passes. The nickel foil target strip (31) passes around the nickel foil plating roller (321) located inside the nickel foil plating tank (32), and a nickel foil positive electrode (35) is positioned at a predetermined distance from the nickel foil target strip (31). A nickel negative electrode current-carrying roller (33) is positioned to guide the nickel foil target strip (31) entering the nickel plating tank (32) and to apply a (-) current to the nickel foil target strip (31). A negative current is applied to the nickel foil negative electrode current roller (33), and since the nickel foil negative electrode current roller (33) and the nickel foil target strip (31) are in electrical contact, a negative current is applied to the nickel foil target strip (31). In addition, by applying a positive power source to the nickel foil positive electrode (35), a copper foil is provided as a nickel foil strip (311) in which a nickel foil layer (130) is formed on the surface of the nickel foil target strip (31), which is a copper foil including a copper foil layer (110) that passes through continuously.

[0034] As such, the copper foil, which is a nickel foil strip (311) with a silver foil layer (120) and a nickel foil layer (130) formed on both sides of the copper foil layer (110), is in a state where the nickel foil plating solution is applied, and the copper foil passes through a nickel squeeze roller (34) to remove the plating solution from the nickel foil strip (311) coming out of the nickel plating tank (32). Accordingly, the nickel plating solution is removed from the copper foil by the nickel foil squeeze roller (34). In addition, as the copper foil passes between two rollers and is pressed by the nickel foil squeeze roller (34), the nickel foil plating solution is removed, and the thickness of the copper foil may be adjusted to the distance between the two rollers. Furthermore, a sensor that senses the thickness of the copper foil including the nickel foil layer may be provided before and after the nickel foil squeeze roller (34) to detect and determine whether the copper foil has been formed to a set thickness. And as a copper foil body that passes continuously by a nickel foil plating roller (321) inside a nickel foil plating tank (32), a nickel foil target strip (31) prior to nickel foil plating and a nickel foil plated strip (311) are provided, and a nickel positive electrode (35) is provided at a predetermined distance from them. Generally, as shown in FIGS. 1 and 3, the nickel foil target strip (31) and the nickel foil strip (311) are arranged in a V-shape on both sides upward relative to the nickel foil plating roller (321) located below the center of the nickel foil plating tank (32), and the nickel foil positive electrode (35) plates are positioned on both sides spaced apart from the copper foil bodies that are the nickel foil target strip (31) and the nickel foil strip (311). Accordingly, as an example of the nickel foil positive electrode (35), as shown in FIG. 3, a total of four nickel foil positive electrodes (35), two on each side of the copper foil body, are arranged in a V-shape centered on the nickel foil plating roller (321). Then, a nickel anode application line (36) is provided that is connected to the nickel positive electrode (35) to apply a positive current, and a nickel anode connection part (37) is provided to which the upper part of the nickel anode application line (36) is fixed. Thus, a positive power supply from the power supply part (85) is applied to this nickel foil anode application line (36).The nickel foil forming device (30) provided in this manner allows nickel foil plating to be performed as a copper foil passes through it continuously, and the concentration of the nickel foil plating solution in the nickel foil plating tank (32) may gradually decrease over time. Therefore, the concentration of the nickel foil plating solution in the nickel foil plating tank (32) must be maintained to some extent. To this end, the nickel foil plating solution can be introduced into the nickel foil plating tank (32) continuously or in time cycles. In particular, in order to form a nickel foil layer (130) on the copper foil with a certain thickness, for example, a thickness of 0.5㎛ to 1㎛, a configuration is required to ensure that the nickel foil layer is formed more effectively. Accordingly, the device includes a nickel plating solution nozzle device (38) that sprays the nickel plating solution between the nickel positive electrode (35), the nickel foil target band (31) that passes through it continuously, and the nickel foil band (311). The nozzles of the nickel foil plating solution nozzle device (38) can be provided on both sides so that the nickel foil plating solution is sprayed onto the nickel foil target strip (31), nickel foil strip (311), etc. on both sides. Thus, a nickel foil layer (130) of greater thickness can be formed.

[0035] As shown in FIGS. 1 and 4, the chrome foil forming device (40) is located between the copper foil forming device (1) and the winding roller (5) and forms a chrome foil layer (140) outwardly over the copper foil layer. That is, the anti-corrosion device includes a chrome foil forming device (40) that forms a chrome foil layer outwardly over the copper foil layer passing through the foil forming device, and this chrome foil forming device (40) is provided with a chrome plating tank (42) containing a chrome plating solution, through which a chrome foil strip (41), which is a copper foil body including a copper foil layer that is continuously supplied, passes through. The chrome foil strip (41) passes around the chrome foil plating roller (421) located inside the chrome foil plating tank (42), and a chrome foil positive electrode (45) is positioned at a predetermined distance from the chrome foil strip (41). A chrome negative current roller (43) is provided to guide a chrome foil strip (41) entering the chrome plating tank (42) and to apply a negative current to the chrome foil strip (41), which is located on one side of the chrome plating tank (42). Additionally, a chrome positive electrode (45) is provided that is spaced apart from the chrome foil strip (41) at a predetermined distance inside the chrome plating tank (42). Since a negative current is applied to the chrome foil negative current roller (43) and the chrome foil negative current roller (43) and the chrome foil strip (41) are in electrical contact, a negative current is applied to the chrome foil strip (41). Furthermore, by applying a positive power source to the chrome foil positive electrode (45) together, a chrome foil layer (140) is formed on the surface of the chrome foil strip (41), which is a copper foil that passes through continuously, thereby forming a copper foil. In order to determine whether the copper foil is formed with a set thickness including the chrome foil layer (140) for the copper foil generated in this way, a sensor for sensing the thickness of the copper foil is provided to detect and determine whether the copper foil is formed with a set thickness.

[0036] As described above, the copper foil is formed by first forming a single layer of copper foil (110) by a copper foil forming device (1), and then the copper foil of the single copper foil layer (110) passes through a silver foil forming device (20) in the next stage to form a copper foil in which a silver foil layer (120) is formed on both sides of the copper foil layer (110). Afterward, it passes through a nickel foil forming device (30) in the next stage to form a copper foil in which a nickel foil layer (130) is formed again on both outer surfaces in a state consisting of 'silver foil layer (120) - copper foil layer (110) - silver foil layer (120)'. Thus, the copper foil is formed with a layer composition of 'nickel foil layer (130) - silver foil layer (120) - copper foil layer (110) - silver foil layer (120) - nickel foil layer (130)'.

[0037] Next, the copper foil that has passed through the chrome foil forming device (40) forms a new chrome foil layer (140) on both outer surfaces, thereby forming a copper foil with a layer composition of ‘chrome foil layer (140) - nickel foil layer (130) - silver foil layer (120) - copper foil layer (110) - silver foil layer (120) - nickel foil layer (130) - chrome foil layer (140)’. Basically, the copper foil forms a copper foil layer (110) with a thick central thickness, and forms silver foil layers (120) on both sides thereof, and such copper foil layer (110) and silver foil layer (120) enable relatively fast signal transmission and reception. In addition, compared to the copper foil layer (110), the silver foil layer (120) is harder, allowing for the formation of a robust copper foil. Furthermore, the addition of the nickel foil layer (130) further enhances wear resistance and also adds corrosion resistance. Furthermore, since corrosion resistance is further enhanced by the chrome foil layer (140) on the outer surface, the entire copper foil layer not only withstands wear well but also has enhanced corrosion resistance, so damage to the copper foil can be prevented even when exposed to various chemicals when applied to various electrical components. At the same time, it has the advantage of maintaining excellent electrical conductivity through the internal copper foil layer and silver foil layer. In addition, while using this copper foil layer (110) as a base, other silver foil layer (120), nickel foil layer (130), and chrome foil layer (140) can be manufactured to form a single-layer structure in a series of sequences, and furthermore, while using the copper foil layer (110) as a basic base layer, one or more layers among other silver foil layer (120), nickel foil layer (130), and chrome foil layer (140) can be formed on the surface of the copper foil layer. In the copper foil manufacturing apparatus prepared in this manner, an air drying apparatus (6) is provided to dry the copper foil that has passed through the chrome foil forming apparatus (40) as shown in FIG. 1, in a state where the copper foil layer (110), silver foil layer (120), nickel foil layer (130), and chrome foil layer (140) are formed. This air drying apparatus (6) can remove foreign substances or moisture from the surface of the copper foil by air by forming air nozzles on one or both sides of the copper foil that passes through continuously.In addition, it further includes a washing device (50) for washing a copper foil that is positioned between each of the silver foil forming device (20), nickel foil forming device (30), and chrome foil forming device (40). That is, a washing device (50) may be provided between each of the silver foil forming device (20), nickel foil forming device (30), and chrome foil forming device (40) in FIGS. 1 to 3, etc. Such a washing device (50) includes a washing tank (51) in which washing water is contained, and a washing roller (52) for guiding a copper foil that is positioned inside the washing tank (51). Thus, the plating solution from the previous stage is washed, and thereby, a desired plating layer can be formed without mixing with other solutions during the next plating stage.

[0038] A copper foil is manufactured by the multilayer copper foil manufacturing apparatus according to the present invention, wherein a silver foil layer (120), a nickel foil layer (130), and a chrome foil layer (140) are formed on both sides of a copper foil layer (110). The copper foil manufactured in this way has a copper foil layer (110) as the base layer and a silver foil layer (120) added thereto, thereby enabling more stable signal transmission and reception. In particular, a nickel foil layer (130) and a chrome foil layer (140) are formed on the outer surface to improve wear resistance and corrosion resistance. To this end, it is preferable that the silver foil layer (120), the nickel foil layer (130), and the chrome foil layer (140) have a thickness greater than a predetermined thickness (e.g., a thickness of about 0.5 μm to 1 μm). In order to achieve such a thick plating, the plating process in each plating tank is configured to last longer. In particular, this plating process is achieved by forming positive electrodes, negative electrodes, etc., within a plating tank and forming respective plating layers on a copper foil that is the negative electrode. Accordingly, by providing these positive and negative electrodes in an inclined shape, the plating process can be carried out for a longer period of time, thereby forming a plating layer of a desired thickness. As a configuration for this purpose, as illustrated in FIGS. 2, FIGS. 3, FIGS. 6, etc., the plating target band passing around the plating roller under the plating tanks of the silver foil forming device (20) and the nickel foil forming device (30) forms a negative electrode and is composed of a large-area V-shaped negative electrode band (61) that extends upward on both sides of the plating roller, is arranged in a V-shaped structure, and forms a large area. And the positive electrode corresponding to the large-area V-shaped negative electrode band (61) is formed by a double-sided large-area V-shaped positive electrode group (62) consisting of a plurality of positive electrode plates, which are spaced apart at a predetermined interval on both sides of the large-area V-shaped negative electrode band (61), form a large area, and are arranged in a V-shaped structure. In this way, the positive electrode and the negative electrode, which is a copper foil, are arranged in a V-shaped inclined state so that plating can be performed for a longer period of time and formed with a thicker thickness.In the silver foil forming device (20) and nickel foil forming device (30) provided in this manner, each positive electrode (25) (35) forms a large area as shown in FIG. 7, covering the entire front surface of the copper foil that passes through continuously. At the same time, as previously explained, large-area positive electrodes (25) (35) are arranged on each side of the negative electrodes of the copper foil on both sides to form a double-sided large-area V-shaped positive electrode group (62). A configuration is provided to supply positive power to this double-sided large-area V-shaped positive electrode group (62). That is, as shown in FIG. 7, a plurality of positive electrode application lines (63) connected to the individual positive electrodes of the double-sided large-area V-shaped positive electrode group (62) are provided. A positive electrode power supply configuration is formed by including a positive electrode installation part (64) where these plurality of positive electrode application lines (63) are installed, and a positive electrode power line (65) connected to the positive electrode application line (63). This positive electrode application line (63) is configured to apply a positive current by being connected to a positive electrode plate located in the plating tank of the silver foil forming device (20) and the nickel foil forming device (30). As shown in FIG. 7, a positive electrode coupling part (631) coupled to the positive electrode plate and an electrode lateral extension line (632) extending laterally from the positive electrode coupling part (631) and the positive electrode plate and forming a plate shape are provided. That is, an extension line is formed laterally for the positive electrode forming a large area. Then, an electrode plate parallel line (633) in the shape of a plate inclined upward parallel to the positive electrode plate is formed outside the electrode lateral extension line (632) so as not to get caught on other components such as copper foil. Then, a plate-shaped connection-direction line (634) is formed extending from the upper part of the electrode plate parallel line (633) toward the anode installation part (64) in the upper center of the plating tank, and a plurality of such connection-direction lines (634) are provided so that circuits from each positive electrode converge to the central part. A connection coupling part (635) is included, to which a positive current application positive power line (65) is connected above the connection-direction line (634). This connection coupling part (635) is located at the upper center of each silver foil plating tank (22) or nickel plating tank (32).

[0039] Next, a configuration is provided to spray plating solution onto copper foils that pass continuously over a wide area in a silver foil forming device (20) or a nickel foil forming device (30), thereby allowing each plating layer to be plated with a thicker thickness. For this purpose, a plating solution nozzle device (70) sprays plating solution onto copper foils passing through the plating tanks of the silver foil forming device (20) and the nickel foil forming device (30), as shown in the example of FIG. 7. This plating solution nozzle device (70) is arranged along the transverse direction of the copper foils passing continuously and forms a pipe shape, and a plating solution pipe nozzle (71) is arranged to spray plating solution from a plurality of formed nozzles. A plating solution supply pipe (72) is provided connected to one side of the plating solution pipe nozzle (71) to supply plating solution, and a plating solution pump (73) is provided to supply plating solution to the plating solution supply pipe (72), and the plating solution from the plating solution tank is supplied to the plating solution pipe nozzle (71).

[0040] Next, as a control configuration, it includes a power supply unit (85) that supplies power to a roller motor (86) that operates one or more rollers and supplies power to a positive electrode and a negative electrode, and a copper foil control unit (80) that controls power supply to a roller motor (86) that operates one or more rollers and supplies power to a positive electrode and a negative electrode. Each roller is operated by this copper foil control unit (80), and power from the power supply unit (85) is supplied to the positive electrode and the negative electrode, etc. This copper foil control unit (80) is equipped with a roller operation module (81) that transmits a control signal to the power supply unit (85) to supply power to a roller motor (86) that operates one or more rollers. This roller operating module (81) can rotate the rollers that require driving, including the winding roller (5), the copper foil forming roller (3), the silver foil forming device (20), the nickel foil forming device (30), the chrome foil forming device (40), and the washing device (50), according to the situation. To this end, the roller operating module (81) operates the respective roller motors (86) that drive each roller, and controls each roller motor to rotate according to the predetermined number of rotations of each roller. And the copper foil control unit (80) is equipped with a negative power supply application module (82) that transmits a control signal to the power supply unit (85) to apply a negative power supply to the copper foil forming roller (3) side of the copper foil forming device (1) and to the copper foil body side passing through the silver foil forming device (20), nickel foil forming device (30), and chrome foil forming device (40), and a positive power supply application module (83) that transmits a control signal to the power supply unit (85) to apply a positive power supply to the positive electrode of the copper foil forming device (1), silver foil forming device (20), nickel foil forming device (30), and chrome foil forming device (40).

[0041] The copper foil forming roller (3) generates a negative power source to form a copper foil on its surface, and as this copper foil continues to form a negative power source until it reaches the winding roller (5), the copper foil of the copper component continues to form a negative power source. In addition, a configuration is added to the silver foil forming device (20), the nickel foil forming device (30), the chrome foil forming device (40), etc., to apply a negative power source to this copper foil. In particular, as shown in FIGS. 1 to 3, a negative power source is applied to the silver foil negative current roller (23) that guides the copper foil to the silver foil plating tank (22) of the silver foil forming device (20), the nickel negative current roller (33) that guides the copper foil to the nickel foil plating tank (32) of the nickel foil forming device (30), and the chrome negative current roller (43) that guides the copper foil to the chrome plating tank (42) of the chrome foil forming device (40), etc., so as to form a constant negative potential on the copper foil during each plating reaction. In addition, a positive power supply is applied to a positive electrode formed of a round arc that is spaced apart from the copper foil forming roller (3) in the copper foil forming device (1), and a positive power supply is applied to positive electrodes such as the silver foil positive electrode (25) of the silver foil forming device (20), the nickel positive electrode (35) of the nickel foil forming device (30), and the chrome positive electrode (45) of the chrome foil forming device (40). Next, the copper foil control unit (80) includes a plating solution supply module (84) that transmits an operation signal to each supply pump (plating solution pump (73), etc.) to supply the copper foil electrolyte of the copper foil forming device (1), the silver foil plating solution of the silver foil forming device (20), the nickel plating solution of the nickel foil forming device (30), and the chrome plating solution of the chrome foil forming device (40). Generally, a copper foil electrolyte is supplied to the copper foil electrolytic cell (2) of the copper foil forming device (1), and this copper foil electrolyte is provided as a copper foil electrolyte used in known copper foil manufacturing technology, and a specific technical description of this copper foil electrolyte is omitted.And the silver plating solution, nickel plating solution, chrome plating solution, etc. are supplied to the silver plating tank (22) of the silver foil forming device (20), the nickel plating tank (32) of the nickel foil forming device (30), and the chrome plating tank (42) of the chrome foil forming device (40), respectively, and these plating solutions and supply means are implemented by applying known plating technology, and a detailed technical description of them is omitted.

[0042] In addition, as illustrated in FIGS. 1, 6, 9, etc., an inline measuring device (87) is provided to measure the thickness of the copper foil layer, which is located on the moving path of the copper foil layer wound by the winding roller (5). This measuring device is a sensor that measures the thickness of the continuously moving copper foil layer, and the technology for sensing the thickness of the copper foil can be a generally used measuring sensor technology. The thickness information of the copper foil layer sensed in this way is transmitted to the copper foil control unit (80), and accordingly, the plating solution supply module (84) transmits a control signal to the plating solution pump (73) and the plating solution control valve (88) described later. That is, it includes a plating solution control valve (88) installed on the plating solution supply line that receives the control information from the plating solution supply module (84) and supplies the plating solution from the plating solution pump (73) to the plating solution pipe porous nozzle (71). Thus, the plating solution pumped from the plating solution pump (73) supplies the plating solution at the plating solution control valve (88) according to the sensed thickness of the copper foil layer. Accordingly, the plating solution supply flow rate supplied to the plating solution pipe porous nozzle (71) is controlled by the plating solution control valve (88). In this way, the concentration of the plating solution in the silver foil plating tank (22), nickel plating tank (32), etc., can be controlled according to the plating solution sprayed from the plating solution pipe porous nozzle (71).

[0043] Then, under the control of the copper foil control unit (80), continuous spraying is performed to adjust the concentration of the plating solution in each plating bath and to form a thick plating layer. As a copper foil formed by such a multilayer copper foil manufacturing device and the copper foil manufacturing method described later, a copper foil having one or more metal layers formed on the surface of the copper foil layer formed by the copper foil forming device (1) first. That is, as shown in FIG. 8, this copper foil is basically a first-stage copper foil in which a copper foil layer (110) is formed by the copper foil forming device (1) and the copper foil forming step (S20). This copper foil layer (110) has a thickness of 4.5 μm to 10 μm. With respect to this copper foil layer (110), a silver foil layer (120) is formed on both sides of the copper foil layer (110) by the silver foil forming device (20) and the silver foil forming step (S30) to form a second-stage copper foil. This silver foil layer (120) has a thickness of 0.5 μm to 1 μm. Then, as a third step, by means of a nickel foil forming device (30) and a nickel foil forming step (S40), a nickel foil layer (130) is formed on both outer surfaces of the silver foil layer (120) formed on both sides of the copper foil layer (110) to form a copper foil. This nickel foil layer (140) has a thickness of 0.5 μm to 1 μm. Furthermore, as shown in the example of the right cross-sectional drawing of FIG. 8, as a fourth step, by means of a chrome foil forming device (40) and a chrome foil forming step (S70), a chrome foil layer (140) is formed on both outer surfaces of the nickel foil layer (130) to form a copper foil. This chrome foil layer (140) has a thickness of 0.5 μm to 1 μm.

[0044] We will now examine a method for manufacturing a multilayer copper foil according to the present invention.

[0045] That is, according to the copper foil manufacturing method, a copper foil is continuously formed by a copper foil forming roller (3) of the negative electrode located within the copper foil electrolytic cell (2) and a surrounding positive electrode, and a copper foil layer continuously supplied from the copper foil forming device (1) is supplied, and a multilayer copper foil body including the copper foil layer is created by proceeding with the subsequent gold foil plating process multiple times. In this manufacturing method, prior to the copper foil forming step (S20), as a preparation process, an electrolyte and plating solution injection step (S11) is performed in which a copper foil electrolyte is injected into the copper foil electrolytic cell (2) of the copper foil forming device (1), and a plating solution is injected into the silver foil plating tank (22) of the silver foil forming device (20), the nickel plating tank (32) of the nickel foil forming device (30), and the chrome plating tank (42) of the chrome foil forming device (40). These electrolytes and plating solutions are carried out by determining the concentration or amount of injection, etc., according to the specifications being implemented. Then, a roller driving step (S12) is performed to operate the rollers in order to continuously move the copper foil and wind it onto the winding roller (5). Thus, the copper foil, having formed a copper foil layer and a plurality of subsequent metal layers, can be continuously moved and gathered onto the final winding roller (5). Once this preparation process is completed, a process for creating copper foil is performed. First, in the copper foil forming device (1), a copper foil forming step (S20) is performed in which a copper foil is formed by a negative electrode copper foil forming roller (3) located within a copper foil electrolytic cell (2) containing copper foil electrolyte and a surrounding positive electrode. This copper foil forming step (S20) includes a copper foil terminal power application step (S21) in which a negative power supply of the power supply unit (85) is applied to the copper foil forming roller (3) side of the copper foil forming device (1), and a positive power supply of the power supply unit (85) is applied to the positive electrode side of the copper foil forming device (1). In this way, while the copper foil forming roller (3) of the copper foil forming device (1) is rotating, a negative power supply is applied to the copper foil forming roller (3) which is the negative electrode, and a positive power supply is applied to the surrounding positive electrode, thereby forming a copper foil on the surface of the copper foil forming roller (3) which is the negative electrode, as shown in the left diagram of FIG. 8. Approximately 4.Electrolytic conditions are set and carried out to form a copper foil layer (110) with a thickness of 5 to 10 μm. The copper foil formed in this way is separated from the copper foil forming roller (3) and continuously supplied to the next step. Next, the copper foil continuously supplied from the copper foil forming device in the copper foil forming step passes through the inside of the plating tank of the metal foil forming device, and a thin layer forming step is performed to form a metal foil layer by plating on the surface of the copper foil passing through the inside of the plating tank containing the plating solution. This metal foil layer may include a silver foil layer, a nickel foil layer, etc. Accordingly, the copper foil continuously supplied from the copper foil forming device (1) in the copper foil forming step (S20) passes through the inside of the silver foil plating tank (22) of the silver foil forming device (20), and a silver foil forming step (S30) is performed to form a silver foil layer by plating on the surface of the copper foil passing through the inside of the silver foil plating tank (22) containing the silver foil plating solution. Thus, a silver foil layer (120) is formed on each outer surface of both sides of the copper foil layer (110). This silver foil forming step (S30) performs a silver foil terminal power application step (S31) in which a negative power supply from the power supply unit (85) is applied to the silver foil negative electrode current roller (23) side of the silver foil forming device (20), and a positive power supply from the power supply unit (85) is applied to the silver foil positive electrode (25) side of the silver foil forming device (20). That is, under the control of the copper foil control unit (80), an application signal is transmitted from the negative power supply module (82) to the power supply unit (85) side, and accordingly, a negative power supply is applied from the power supply unit (85) to the silver foil negative electrode current roller (23) side, and a positive power supply is applied from the power supply unit (85) to the silver foil positive electrode (25) by the positive power supply module (83). Accordingly, as shown in the second drawing of FIG. 8, a silver foil layer (120) is formed on each side of the copper foil layer (110) to provide a copper foil body. The silver foil layer (120) formed in this way is formed with a thickness of approximately 0.5 to 1 μm.The copper foil formed in this way is continuously discharged, and a silver foil plating copper foil squeezing step (S32) is performed on the copper foil on which a silver foil layer (120) is formed on both sides of the copper foil layer (110) by the silver foil forming device (20) to remove the silver foil plating solution by passing it through a silver foil squeezing roller (24). Then, after the silver foil forming step (S30), a silver foil forming copper foil washing step (S40) is further performed in which the copper foil on which the silver foil layer (120) is formed passes through a washing tank of a washing device to wash it, thereby removing the previous plating solution. Next, a copper foil with a silver foil layer formed thereon, which is continuously supplied from the silver foil forming device (20) by the silver foil forming step (S30), passes through the inside of the nickel foil plating tank (32) of the nickel foil forming device (30), and a nickel foil forming step (S50) is performed to form a nickel foil layer by plating on the surface of the copper foil passing through the inside of the nickel foil plating tank (32) containing the nickel foil plating solution. That is, the nickel foil forming step (S50) performs a nickel foil terminal power application step (S51) in which a negative power supply of the power supply unit (85) is applied to the nickel negative electrode current roller (33) side of the nickel foil forming device (30), and a positive power supply of the power supply unit (85) is applied to the nickel positive electrode (35) side of the nickel foil forming device (30). Under the control of the copper foil control unit (80), an application signal is transmitted from the negative power supply module (82) to the power supply unit (85), and accordingly, negative power is applied from the power supply unit (85) to the nickel negative electrode current roller (33), and positive power is applied from the power supply unit (85) to the nickel positive electrode (35) by the positive power supply module (83). Accordingly, as shown in the third drawing of FIG. 8, a copper foil is provided having a nickel foil layer (130) formed on the outer surface of the silver foil layer (120) formed on both sides of the copper foil layer (110). The nickel foil layer (130) formed in this way is formed with a thickness of approximately 0.5 to 1 μm. Then, a nickel foil plating copper foil squeezing step (S52) is performed to remove the nickel plating solution by passing the nickel squeezing roller (34) over the copper foil on which the silver foil layer (120) is formed by the nickel foil forming device (30) and the nickel foil layer (130) is formed on both sides of the copper foil.

[0046] After the nickel foil formation step (S50), a nickel foil-formed copper foil washing step (S60) is further performed, in which the copper foil having the nickel foil layer (130) formed thereon passes through the washing tank of a washing device and is washed. Next, a rust prevention step is performed in which the copper foil continuously supplied from the metal foil forming device by the foil layer formation step passes through the rust prevention plating tank of a rust prevention device and forms a rust prevention layer on the surface of the copper foil by plating. The rust prevention step may be a chrome foil formation step in which the copper foil passes through the chrome foil plating tank of a chrome foil forming device and is plated with a chrome plating solution on the surface of the copper foil, thereby forming a rust prevention layer as a chrome foil layer. That is, a copper foil with a nickel foil layer formed thereon, which is continuously supplied from the nickel foil forming device (30) by the nickel foil forming step (S50), passes through the inside of the chrome foil plating tank (42) of the chrome foil forming device (40), and a chrome foil forming step (S70) is performed to form a chrome foil layer by plating on the surface of the copper foil passing through the inside of the chrome foil plating tank (42) containing the chrome foil plating solution. The chrome foil forming step (S70) performs a chrome foil terminal power application step (S71) in which a negative power supply of the power supply unit (85) is applied to the side of the chrome negative electrode current roller (43) of the chrome foil forming device (40), and a positive power supply of the power supply unit (85) is applied to the side of the chrome positive electrode (45) of the chrome foil forming device (40). That is, by the control of the copper foil control unit (80), an application signal is transmitted from the negative power supply module (82) to the power supply unit (85), and accordingly, negative power is applied from the power supply unit (85) to the chrome negative electrode current roller (43), and positive power is applied from the power supply unit (85) to the chrome positive electrode (45) by the positive power supply module (83). Accordingly, as shown in the drawing at the right end of FIG. 8, a copper foil is provided having a chrome foil layer (140) formed on the outer surface of the silver foil layer (120) and the nickel foil layer (130) on both sides of the copper foil layer (110). The chrome foil layer (140) formed in this way is formed with a thickness of approximately 0.5 to 1 μm.

[0047] After the chrome foil forming step (S70), a copper foil on which a chrome foil layer (140) is formed by a chrome foil forming device (40) is further subjected to a copper foil surface drying step (S80) in which both sides are dried by passing through an air drying device (6) to remove foreign substances and moisture from the copper foil, and subsequently, only the copper foil is wound during the winding process. That is, a copper foil winding step (S90) is performed in which the copper foil on which the chrome foil layer formed by the chrome foil forming step (S70) is continuously supplied and wound onto a winding roller (5), thereby manufacturing a copper foil that forms a multi-layer metal layer including the copper foil layer. In the copper foil manufacturing device and manufacturing method according to the present invention, the copper foil layer formation process by the copper foil forming device and subsequent post-processing processes such as a silver foil forming process, a nickel foil forming process, and a chrome foil forming process are included, and thus the problems of strength and corrosion, which are disadvantages of copper foil, are resolved. If it is susceptible to corrosion and has low strength, it may be difficult to use as a negative current collector for all-solid-state applications due to its vulnerability to heat and acid. Furthermore, when using the copper foil produced in this manner for secondary batteries, it can be applied by forming a copper foil layer using a copper foil electrolyte and subsequently adding one or more metal foil layers among a silver foil layer, a nickel foil layer, and a chrome foil layer to provide corrosion resistance. Additionally, when using the copper foil for PCB or FCCL products, after producing the copper foil layer, it can be applied by forming it into two or more layers among a silver foil layer, a nickel foil layer, and a chrome foil layer as an additional surface treatment process; thus, it can be equipped to improve electrical conductivity and simultaneously provide wear resistance and corrosion resistance.

[0048] In addition, by first forming a copper foil layer (110) using the copper foil manufacturing apparatus and manufacturing method according to the present invention, a silver foil layer of Ag, a nickel foil layer of Ni, a chromium foil layer of Cr, etc. can be formed using an immersion plating bath, and additionally, a plating process to form a cobalt foil layer of Co, a tin foil layer of Sn, etc. may be additionally performed. Thus, by surface treating both sides of the copper foil using electro- and chemical plating, tensile strength and conductivity required for an all-solid current collector can be secured by using a plating method that has functions such as heat resistance and rust prevention. Such a copper foil layer can be formed with a thickness of 4.5 to 10 μm, and Ag, Ni, and Cr layers can each be formed with a thickness of 0.5 to 1 μm. Thus, impact strength, conductivity, and resistance to corrosion by acid are maximized. In the plating solution nozzle device (70) provided for this purpose, the porous nozzle of the plating solution maintains a uniform ion concentration in the plating bath, where the concentration has decreased due to the ions escaping after plating. Furthermore, rather than simply supplying plating ions into the plating bath, a new plating layer is formed on the anode (positive electrode) constituting the (+) electrode and the copper foil surface constituting the (-) electrode (copper foil), thereby forming a uniform layer structure. Regarding such copper foil, as a method for controlling the plating thickness of copper, silver, nickel, and chrome foil layers, the factors determining the plating thickness in each electrolytic plating process include the amount of positive and negative plating current and plating time, and it can also be controlled by the concentration of the plating solution. Therefore, to match the plating thickness, the plating time is adjusted by controlling the copper foil transfer speed. In this regard, when controlling the plating thickness, if the thickness of each plating layer is thin, it becomes vulnerable to external damage, and pinholes or other plating defects may occur when manufacturing substrates. Conversely, if the thickness is too thick, unnecessary thickness can increase costs and affect product weight reduction; therefore, each plating layer is formed to a predetermined thickness.

[0049] Although embodiments of the present invention have been described in detail above, this is merely an example to enable a person skilled in the art to easily practice the present invention; therefore, the technical concept of the present invention should not be interpreted restrictively based on the description of the above embodiments.

[0050] In addition to manufacturing copper foil by providing an anode plate and a cathode roller of an electrolytic cell containing copper foil electrolyte, by forming a multilayer metal layer on the copper foil, electrical conductivity is improved and corrosion resistance and wear resistance are provided, making it industrially usable.

Claims

1. A copper foil forming device that continuously forms a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell and a surrounding positive electrode, and It includes a winding roller for winding a copper foil including a copper foil layer continuously supplied from the copper foil forming device, and A thin layer forming device comprising at least one of the following: a silver foil forming device positioned between the copper foil forming device and the winding roller and forming a silver foil layer outwardly toward a copper foil layer passing through the interior of a silver foil plating bath; and a nickel foil forming device positioned between the copper foil forming device and the winding roller and forming a nickel foil layer outwardly toward a copper foil layer passing through the interior of a nickel plating bath; and A rust prevention device is provided that is positioned between the copper foil forming device and the winding roller and performs rust prevention treatment on the outer surface of the copper foil layer. A multilayer copper foil manufacturing apparatus characterized in that each device of the above-described thin layer forming apparatus comprises a plating tank, a plating roller located in the center below the plating tank and guiding a copper foil, which is a cathode passing continuously, to be arranged in a "V" shape, and positive electrodes installed diagonally on both sides so as to be parallel to the copper foil proceeding in a "V" shape in both directions relative to the plating roller within the plating tank.

2. In Paragraph 1, The above foil forming device is, As the copper foil layer supplied continuously, a silver foil target strip to be plated passes through the interior, and a silver foil plating tank containing a silver plating solution; A silver foil negative current-carrying roller for guiding a silver foil target strip entering the silver foil plating tank and applying a (-) current to the silver foil target strip; A silver foil squeeze roller for removing the plating solution of the silver foil strip coming out of the above silver foil plating tank; The above-mentioned silver foil target strip, a silver foil positive electrode spaced apart from the silver foil strip at a predetermined distance; A silver foil positive electrode application line connected to the above silver foil positive electrode to apply a positive current; A silver foil anode connection part to which the upper part of the above silver foil anode application line is fixed; and A multilayer copper foil manufacturing apparatus characterized by including a silver foil target band passing continuously with the above-mentioned silver foil positive electrode, and a silver foil plating solution nozzle device for spraying a silver plating solution between the silver foil bands.

3. In Paragraph 1, The above nickel foil forming device is, A copper foil body including the copper foil layer that is continuously supplied, wherein a nickel foil target strip to be plated passes through the interior and a nickel plating tank containing a nickel plating solution; A nickel negative current-carrying roller for guiding a nickel foil target strip entering the nickel plating bath and applying a (-) current to the nickel foil target strip; A nickel squeeze roller for removing the plating solution of the nickel foil strip from the above nickel plating bath; The above nickel foil target strip, a nickel positive electrode spaced apart from the nickel foil strip at a predetermined distance; A nickel anode application line connected to the above nickel positive electrode to apply a positive current; A nickel anode connection part to which the upper part of the above nickel anode application line is fixed; and A multilayer copper foil manufacturing apparatus characterized by including a nickel foil target band passing continuously with the above nickel positive electrode, and a nickel plating solution nozzle device for spraying a nickel plating solution between the nickel foil bands.

4. In Paragraph 1, The above anti-corrosion device includes a chrome foil forming device that forms a chrome foil layer outwardly toward the copper foil layer passing through the above thin layer forming device, and The above chrome foil forming device is, A copper foil body including the copper foil layer that is continuously supplied, wherein a chrome plating tank containing a chrome plating solution has a chrome foil strip to be plated passing through its interior; A chrome negative current-carrying roller for guiding a chrome foil strip entering the chrome plating bath and applying a (-) current to the chrome foil strip; and A multilayer copper foil manufacturing apparatus characterized by including a chrome positive electrode spaced apart from the above-mentioned chrome foil strip at a predetermined interval.

5. In Paragraph 1, An air drying device that dries a copper foil that has passed through the above-mentioned anti-corrosion device by spraying air; and It further includes a washing device for washing a copper foil that is positioned and passes between each of the above-mentioned silver foil forming device, nickel foil forming device, and rust prevention device, and The above washing device is, A wash tank containing wash water; and A multilayer copper foil manufacturing apparatus characterized by including a washing roller located inside the washing tank to guide a passing copper foil.

6. In Paragraph 1, The plating target band passing around the plating roller under the plating tank of each of the above-mentioned silver foil forming device and nickel foil forming device forms a negative electrode and is composed of a large-area V-shaped negative electrode band that extends upward on both sides of the plating roller, is arranged in a V-shaped structure, and forms a large area. A multilayer copper foil manufacturing apparatus characterized in that the positive electrode corresponding to the above-mentioned large-area V-shaped negative electrode band is formed by a double-sided large-area V-shaped positive electrode group consisting of a plurality of positive electrode plates, which are spaced apart at a predetermined interval on both sides of the large-area V-shaped negative electrode band, form a large area, and are arranged in a V-shaped structure.

7. In Paragraph 6, Multiple positive electrode application lines connected to individual positive electrodes of the above-mentioned double-sided large-area V-shaped positive electrode group; An anode installation section in which a plurality of the above-mentioned anode application lines are installed; and A multilayer copper foil manufacturing apparatus characterized by including a positive power line connected to the above positive power line.

8. In Paragraph 7, It includes an anode application line that applies a positive current connected to a positive electrode plate located within the plating tank of the silver foil forming device and the nickel foil forming device. The above positive electrode application line is, Positive electrode coupling part combined with a positive electrode plate; An electrode lateral extension line extending laterally from the above positive electrode coupling portion and positive electrode plate and forming a plate-like shape; An electrode plate parallel line in the shape of a plate inclined upward and parallel to the positive electrode plate at the outer side of the above electrode lateral extension line; A plate-shaped connection-oriented line extending from the upper part of the electrode plate parallel line toward the anode installation part at the upper center of the plating tank; and A multilayer copper foil manufacturing apparatus characterized by including a connection coupling portion in which a positive power line for applying positive current is connected above the above connection-oriented line.

9. In Paragraph 1, It includes a plating solution nozzle device that sprays a plating solution onto a copper foil passing through the plating tank of the silver foil forming device and the nickel foil forming device, and The above plating solution nozzle device is, A plating solution pipe nozzle forming a pipe shape arranged along the transverse direction of a continuously passing copper foil and spraying a plating solution from a plurality of formed nozzles; A plating solution supply pipe connected to one side of the above-mentioned plating solution pipe nozzle and supplying the plating solution; and A multilayer copper foil manufacturing apparatus characterized by including a plating solution pump that supplies a plating solution to the plating solution supply pipe.

10. In Paragraph 1, A power supply unit that applies power to a roller motor that operates one or more rollers and applies power to a positive electrode and a negative electrode; and It includes a copper foil control unit that controls power supply to a roller motor operating one or more rollers and power supply to a positive electrode and a negative electrode, The copper foil control unit above is, A roller operating module that transmits a control signal to a power supply unit to supply power to a roller motor that operates one or more rollers; A negative power application module that transmits a control signal to the power supply side for applying a negative power to the copper foil forming roller side of the copper foil forming device, and to the copper foil body side passing through the silver foil forming device, the nickel foil forming device, and the anti-corrosion device; A positive power supply application module that transmits a control signal to the power supply side for applying positive power to the positive electrodes of a copper foil forming device, a silver foil forming device, a nickel foil forming device, and a rust prevention device; and A multilayer copper foil manufacturing apparatus characterized by including a plating solution supply module that transmits an operation signal to each supply pump to supply the copper foil electrolyte of a copper foil forming apparatus, the silver foil plating solution of a silver foil forming apparatus, the nickel plating solution of a nickel foil forming apparatus, and the plating solution of a rust prevention apparatus.

11. In Paragraph 10, An inline measuring device positioned on the movement path of the copper foil layer wound by the above-mentioned winding roller and measuring the thickness of the copper foil layer, and It includes a plating solution control valve installed on a plating solution supply line that receives control information from the plating solution supply module and supplies plating solution from a plating solution pump to a plating solution pipe porous nozzle, and A copper foil manufacturing apparatus characterized by controlling the flow rate of the plating solution supplied to the plating solution pipe porous nozzle by the above-mentioned plating solution control valve.

12. A copper foil forming device that continuously forms a copper foil by means of a copper foil forming roller of a negative electrode located within a copper foil electrolytic cell and a surrounding positive electrode; It includes a winding roller for winding a copper foil including a copper foil layer continuously supplied from the copper foil forming device, and A silver foil forming device positioned between the copper foil forming device and the winding roller, and forming a silver foil layer outwardly toward the copper foil layer; A nickel foil forming device positioned between the copper foil forming device and the winding roller, and forming a nickel foil layer outwardly toward the copper foil layer; and It includes a chrome foil forming device positioned between the copper foil forming device and the winding roller, and forming a chrome foil layer outwardly facing the copper foil layer. A multilayer copper foil manufacturing apparatus characterized by the above-mentioned silver foil forming device and nickel foil forming device comprising: a plating tank; a plating roller located in the center below the plating tank and guiding a copper foil, which is a cathode passing continuously, to be arranged in a "V" shape; and positive electrodes installed diagonally on both sides so as to be parallel to the copper foil proceeding in a "V" shape in both directions relative to the plating roller within the plating tank.

13. A copper foil having one or more metal layers formed on the surface of a copper foil layer formed by a copper foil forming device, wherein The copper foil above is, Copper foil layer; Silver foil layers formed on both sides of the copper foil layer; A nickel foil layer formed on both outer surfaces of the silver foil layer; and A copper foil characterized by including a chrome foil layer formed on both outer surfaces of the nickel foil layer.

14. In Paragraph 13, The copper foil layer has a thickness of 4.5㎛ to 10㎛, and The above silver foil layer is formed with a thickness of 0.5㎛ to 1㎛, and The above nickel thin layer is formed with a thickness of 0.5㎛ to 1㎛, and A copper foil characterized in that the chrome foil layer has a thickness of 0.5㎛ to 1㎛.

15. A method for manufacturing a multilayer copper foil, comprising a copper foil body including a copper foil layer continuously supplied from a copper foil forming device that continuously forms a copper foil by means of a copper foil forming roller of a cathode located within a copper foil electrolytic cell and a surrounding positive electrode, wherein A copper foil forming device, comprising: a copper foil forming step of forming a copper foil by means of a copper foil forming roller of a negative electrode and a surrounding positive electrode located within a copper foil electrolytic cell containing a copper foil electrolyte; A thin layer formation step in which a copper foil continuously supplied from a copper foil forming device by the above copper foil forming step passes through the inside of a plating tank of a metal foil forming device, and a metal foil layer is formed by plating on the surface of the copper foil passing through the inside of a plating tank containing a plating solution; A corrosion prevention step in which a copper foil continuously supplied from a metal foil forming device by the above thin layer forming step passes through the interior of a corrosion prevention plating tank of a corrosion prevention device and forms a corrosion prevention layer on the surface of the copper foil by plating; and A method for manufacturing a multilayer copper foil characterized by including a copper foil winding step in which a copper foil formed by the above-mentioned anti-corrosion step is continuously supplied and wound onto a winding roller.

16. In Paragraph 15, Prior to the copper foil forming step, an electrolyte and plating solution injection step of injecting a copper foil electrolyte into the copper foil electrolytic cell of the copper foil forming device and injecting respective plating solutions into the silver foil plating tank of the silver foil forming device, the nickel plating tank of the nickel foil forming device, and the chrome plating tank of the chrome foil forming device; and It includes a roller driving step for operating a roller to continuously move the copper foil and wind it onto a winding roller, and The above thin layer formation step is, A silver foil forming step in which a copper foil continuously supplied from a copper foil forming device by the above copper foil forming step passes through the interior of a silver foil plating tank of a silver foil forming device, and a silver foil layer is formed by plating on the surface of the copper foil passing through the interior of a silver foil plating tank containing a silver foil plating solution; and A nickel foil forming step comprising one or more steps, wherein a copper foil having a silver foil layer formed thereon, which is continuously supplied from a silver foil forming device by the above silver foil forming step, passes through the interior of a nickel foil plating tank of a nickel foil forming device, and a nickel foil layer is formed by plating on the surface of the copper foil passing through the interior of a nickel foil plating tank containing a nickel foil plating solution; A method for manufacturing a multilayer copper foil, characterized in that the above-mentioned anti-corrosion step forms an anti-corrosion layer as a chrome foil layer, and comprises a chrome foil forming step in which a copper foil passes through the chrome foil plating tank of a chrome foil forming device that forms the chrome foil layer and is plated on the surface of the copper foil with a chrome plating solution.

17. In Paragraph 15, The above copper foil forming step is, A method for manufacturing a multilayer copper foil, characterized by including a step of applying power to a copper foil terminal, wherein a negative power supply of a power supply unit is applied to the copper foil forming roller side of a copper foil forming device, and a positive power supply of a power supply unit is applied to the positive electrode side of a copper foil forming device.

18. In Paragraph 16, The above foil forming step is, A silver foil terminal power application step of applying a negative power supply from a power supply unit to the silver foil negative electrode current-carrying roller side of the silver foil forming device and applying a positive power supply from a power supply unit to the silver foil positive electrode side of the silver foil forming device; and It includes a silver foil-plated copper foil squeezing step in which the silver foil plating solution is removed by passing the copper foil, on which a silver foil layer is formed on both sides of the copper foil layer by the above-mentioned silver foil forming device, through a silver foil squeezing roller. A method for manufacturing a multilayer copper foil, characterized by further including, after the silver foil formation step, a silver foil-formed copper foil washing step in which the copper foil with the silver foil layer formed thereon passes through a washing tank of a washing device and is washed.

19. In Paragraph 16, The above nickel foil forming step is, A nickel foil terminal power application step of applying a negative power supply from a power supply unit to the nickel negative electrode current-carrying roller side of a nickel foil forming device and applying a positive power supply from a power supply unit to the nickel positive electrode side of a nickel foil forming device; and It includes a nickel foil-plated copper foil squeezing step in which the nickel plating solution is removed by passing a nickel squeeze roller over a copper foil on which a nickel foil layer is formed on both sides of a copper foil on which a silver foil layer is formed by the nickel foil forming device above. A method for manufacturing a multilayer copper foil, characterized by further including a nickel foil-forming copper foil washing step after the nickel foil forming step, wherein the copper foil with the nickel foil layer formed thereon is washed by passing it through a washing tank of a washing device.

20. In Paragraph 16, The above chrome foil forming step is, It includes a chrome foil terminal power application step of applying a negative power supply from a power supply unit to the chrome negative electrode current roller side of the chrome foil forming device and applying a positive power supply from a power supply unit to the chrome positive electrode side of the chrome foil forming device, A method for manufacturing a multilayer copper foil, characterized by further including a copper foil surface drying step in which, after the chrome foil forming step, the copper foil having a chrome foil layer formed by a chrome foil forming device passes through an air drying device to dry both sides.

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