Camera device and optical apparatus

Abstract

The present embodiment relates to a camera device comprising: a base; a first carrier disposed on the base; a second carrier disposed between the first carrier and the base; a third carrier disposed between the second carrier and the base; a first magnet and a first coil for moving the first carrier in the optical axis direction; a second magnet and a third magnet disposed on the third carrier; a second coil, which is disposed on the base and interacts with the second magnet; and a third coil, which is disposed on the second carrier and interacts with the third magnet.

Description

Camera devices and optical instruments

[0001] This embodiment relates to a camera device and an optical device.

[0002] A camera device is a device that captures a subject as a photo or video, and is installed in optical devices such as smartphones, drones, vehicles, etc.

[0003] The camera device is equipped with an image stabilization function that prevents focus from shaking due to the user's hand shake.

[0004] However, conventionally, the lens shift method, which corrects camera shake by moving the lens, has been primarily used. However, in the case of the lens shift method, stabilization performance can vary depending on the size or design of the lens, and the image stabilization effect depends on the characteristics of the lens. In other words, to perfectly correct camera shake, the lens must have an appropriate design and size, and there is a problem where certain lenses lack sufficient stabilization performance.

[0005] (Patent Document 1) KR 10-2015-0118005 A

[0006] The present embodiment aims to provide a camera device that provides image stabilization using a module tilt method, which can provide the same performance in all lenses regardless of the size or design of the lens.

[0007] Furthermore, we aim to provide a camera device in which the distance between the magnet and the coil for y-axis tilt driving is maintained even when x-axis tilt driving is performed, and the distance between the magnet and the coil for x-axis tilt driving is maintained even when y-axis tilt driving is performed.

[0008] A camera device according to the present embodiment may include: a base; a first carrier disposed on the base; a second carrier disposed between the first carrier and the base; a third carrier disposed between the second carrier and the base; a first magnet and a first coil that move the first carrier in the direction of the optical axis; a second magnet and a third magnet disposed on the third carrier; a second coil disposed on the base and interacting with the second magnet; and a third coil disposed on the second carrier and interacting with the third magnet.

[0009] When current is applied to the second coil, the second magnet tilts together with the third carrier, and when the third carrier tilts, the second carrier and the third coil tilt together with the third carrier, so that the distance between the third magnet and the third coil can be maintained at a constant.

[0010] When current is applied to the third coil, the third coil tilts together with the second carrier through interaction with the third magnet, and when the second carrier tilts, the first carrier can tilt together with the second carrier.

[0011] The camera device may include a lens coupled to the first carrier; a first substrate in which at least a portion moves integrally with the second carrier; and an image sensor disposed on the first substrate.

[0012] The first carrier includes a first side on which the first magnet is placed and a second side opposite to the first side, and when viewed from above, the distance between the optical axis of the lens and the first side of the first carrier may be greater than the distance between the optical axis of the lens and the second side of the first carrier.

[0013] When the first magnet and the first coil interact, the lens moves relative to the image sensor, when the second magnet and the second coil interact, the lens and the image sensor move together, and when the third magnet and the third coil interact, the lens and the image sensor can move together.

[0014] The camera device comprises a first attractive member disposed on the base; and a second attractive member disposed on the lower surface of the first substrate and overlapping with the first attractive member in the direction of the optical axis, wherein the first attractive member and the second attractive member may exert an attractive force on each other.

[0015] The camera device includes a second substrate disposed on the outer surface of the second carrier and electrically connected to the first substrate, and the first coil and the third coil may be disposed on the second substrate.

[0016] The first substrate includes a body portion disposed on the lower surface of the second carrier and an extension portion that is bent and extended from the body portion, and the extension portion of the first substrate can be coupled with the second substrate.

[0017] The camera device may include a first ball disposed between the first carrier and the second carrier; a second ball disposed between the base and the third carrier; and a third ball disposed between the second carrier and the third carrier.

[0018] The second ball includes two second balls spaced apart from each other, and the third ball includes two third balls spaced apart from each other, and the intersection point of a virtual straight line connecting the centers of the two second balls and a virtual straight line connecting the centers of the two third balls may meet the optical axis.

[0019] The first magnet is disposed on the first carrier, the first coil is disposed on the second carrier, and the first coil and the third coil may be disposed on opposite sides of the first carrier.

[0020] The camera device includes a stopper member coupled to the upper surface of the second carrier, and the first carrier can come into contact with the stopper member when it moves to the maximum upward side in the direction of the optical axis.

[0021] A camera device according to the present embodiment comprises: a base; a first carrier disposed on the base; a second carrier disposed between the first carrier and the base; a third carrier disposed between the second carrier and the base; a lens coupled to the first carrier; an image sensor that moves together with the second carrier; a first magnet and a first coil that move the lens in the direction of the optical axis; a second magnet and a second coil that tilt the lens and the image sensor around a first axis perpendicular to the optical axis; and a third magnet and a third coil that tilt the lens and the image sensor around a second axis perpendicular to both the optical axis and the first axis, wherein the third coil may be disposed on the second carrier.

[0022] An optical device according to the present embodiment may include a main body; a camera device disposed on the main body; and a display disposed on the main body and outputting one or more of a video and an image captured by the camera device.

[0023] Through this embodiment, a module tilt type image stabilization function can be provided that can provide the same performance in all lenses regardless of the size or design of the lens.

[0024] Furthermore, even when x-axis tilt driving is performed, the distance between the magnet and the coil for y-axis tilt driving is maintained, and since the distance between the magnet and the coil for x-axis tilt driving is maintained even when y-axis tilt driving is performed, the phenomenon in which the Lorentz force for y-axis tilt driving is reduced by x-axis tilt driving or the Lorentz force for x-axis tilt driving is reduced by y-axis tilt driving can be prevented.

[0025] FIG. 1 is a conceptual diagram of a camera device according to the present embodiment.

[0026] FIG. 2 is a perspective view of a camera device according to the present embodiment.

[0027] Figure 3 is a cross-sectional view taken from AA in Figure 2.

[0028] Figure 4 is a cross-sectional view taken from BB of Figure 2.

[0029] FIG. 5 is a cross-sectional view of a camera device according to the present embodiment, cut perpendicular to the optical axis and viewed from above.

[0030] FIG. 6 is a top view of a part of the configuration of a camera device according to the present embodiment.

[0031] FIG. 7 is an exploded view of a camera device according to the present embodiment.

[0032] FIG. 8 is a perspective view of FIG. 2 with the lens and cover omitted.

[0033] FIG. 9 is a perspective view with the stopper member and AF carrier omitted from FIG. 8.

[0034] FIG. 10 is a perspective view with the OIS-y carrier and related configuration omitted from FIG. 9.

[0035] FIG. 11 is a perspective view of FIG. 10 with the OIS-x carrier and related configuration omitted.

[0036] FIG. 12 is a bottom perspective view of a camera device according to the present embodiment.

[0037] FIG. 13 is a bottom perspective view with the base and cover omitted from FIG. 12.

[0038] FIG. 14 is a perspective view of FIG. 13 with the OIS-x carrier and related configuration omitted.

[0039] FIG. 15 is a perspective view of FIG. 14 with the OIS-y carrier and related configuration omitted.

[0040] FIG. 16 is a perspective view illustrating the driving unit and related configuration of a camera device according to the present embodiment.

[0041] FIG. 17 is a cross-sectional view illustrating the AF drive of a camera device according to the present embodiment.

[0042] FIG. 18 is a perspective view for explaining the OIS driving of a camera device according to the present embodiment.

[0043] FIG. 19 is a diagram illustrating OIS-y driving, that is, tilt driving centered on the y-axis, in a camera device according to the present embodiment.

[0044] FIG. 20 is a diagram illustrating tilt driving when OIS-x driving and OIS-y driving are performed simultaneously in a camera device according to the present embodiment.

[0045] FIG. 21 is a perspective view of an optical device according to the present embodiment.

[0046] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings.

[0047] However, the technical concept of the present invention is not limited to some of the described embodiments but can be implemented in various different forms, and within the scope of the technical concept of the present invention, one or more of the components among the embodiments may be selectively combined or substituted.

[0048] In addition, terms used in the embodiments of the present invention (including technical and scientific terms) may be interpreted in a meaning that is generally understood by those skilled in the art to which the present invention belongs, unless explicitly and specifically defined otherwise. Terms that are commonly used, such as terms defined in advance, may be interpreted in consideration of their meaning in the context of the relevant technology.

[0049] Furthermore, the terms used in the embodiments of the present invention are for the purpose of describing the embodiments and are not intended to limit the present invention.

[0050] In this specification, the singular form may include the plural form unless specifically stated otherwise in the text, and when described as "at least one of A and B and C (or more than one)," it may include one or more of all combinations that can be formed from A, B, and C.

[0051] In addition, terms such as first, second, A, B, (a), (b), etc., may be used when describing the components of the embodiments of the present invention. These terms are used merely to distinguish the components from other components and are not intended to limit the essence, order, or sequence of the components.

[0052] And, where it is stated that a component is 'connected', 'combined', or 'connected' to another component, this may include not only cases where the component is directly 'connected', 'combined', or 'connected' to the other component, but also cases where it is 'connected', 'combined', or 'connected' due to another component located between the component and the other component.

[0053] Furthermore, when described as being formed or placed "above" or "below" each component, "above" or "below" includes not only cases where two components are in direct contact with each other, but also cases where one or more other components are formed or placed between the two components. Additionally, when expressed as "above" or "below," it may include the meaning of a downward direction as well as an upward direction relative to a single component.

[0054] As used below, the 'Optical Axis Direction' is defined as the optical axis direction of the lens and / or image sensor coupled to the lens driving device.

[0055] As used below, the 'vertical direction' may be a direction parallel to or the same as the optical axis. The vertical direction may correspond to the 'z-axis direction'. As used below, the 'horizontal direction' may be a direction perpendicular to the vertical direction. That is, the horizontal direction may be a direction perpendicular to the optical axis. Therefore, the horizontal direction may include the 'x-axis direction' and the 'y-axis direction'.

[0056] In the following, one of the 'x-axis direction', 'y-axis direction', and 'z-axis direction' may be referred to as the 'first direction', another as the 'second direction', and the other as the 'third direction'.

[0057] As used below, the 'Auto Focus (AF) function' is defined as a function that automatically focuses on a subject by adjusting the distance to the image sensor through the movement of the lens along the optical axis according to the distance to the subject, so that a sharp image of the subject can be obtained on the image sensor. Additionally, 'Closed-loop Auto Focus (CLAF) control' is defined as real-time feedback control of the lens position by detecting the distance between the image sensor and the lens to improve the accuracy of focus adjustment.

[0058] The 'optical image stabilization (OIS) function' used below is defined as a function that moves or tilts one or more of the lens and image sensor in a direction perpendicular to the optical axis to offset hand shake in order to prevent the phenomenon of an image or video shaking caused by the user's hand shake. Additionally, 'closed-loop auto focus (CLAF) control' is defined as real-time feedback control to improve the accuracy of hand stabilization.

[0059] In the following, one of the “AF carrier (210)”, “OIS-x carrier (220)”, and “OIS-y carrier (230)” may be referred to as the “first carrier”, another as the “second carrier”, and the other as the “third carrier”.

[0060] In the following, one of the “AF drive unit (300)”, “OIS-x drive unit (400)”, and “OIS-y drive unit (500)” may be referred to as the “first drive unit”, another as the “second drive unit”, and the other as the “third drive unit”.

[0061] In the following, one of “AF magnet (310)”, “OIS-x magnet (410)”, and “OIS-y magnet (510)” may be referred to as “first magnet”, another as “second magnet”, and the other as “third magnet”.

[0062] In the following, one of the “AF coil (320)”, “OIS-x coil (420)”, and “OIS-y coil (520)” may be referred to as the “first coil”, another as the “second coil”, and the other as the “third coil”.

[0063] In the following, one of the “AF sensor (330),” “OIS-x sensor (430)” and “OIS-y sensor (530)” may be referred to as the “first sensor,” the other as the “second sensor,” and the other as the “third sensor.”

[0064] In the following, one of the “AF guide ball (610)”, “OIS-x guide ball (620)”, and “OIS-y guide ball (630)” may be referred to as the “first ball”, another as the “second ball”, and the other as the “third ball”.

[0065] In the following description, one of the "sensor substrate (710)", "internal coil substrate (720)", and "external coil substrate (730)" may be referred to as the "first substrate", another as the "second substrate", and the other as the "third substrate".

[0066] In the following, one of the “lower manpower member (810)” and the “upper manpower member (820)” may be referred to as the “first manpower member” and the other as the “second manpower member”.

[0067]

[0068] The configuration of the camera device according to the present embodiment will be described below with reference to the drawings.

[0069] FIG. 1 is a conceptual diagram of a camera device according to the present embodiment. FIG. 2 is a perspective view of a camera device according to the present embodiment. FIG. 3 is a cross-sectional view taken from AA in FIG. 2. FIG. 4 is a cross-sectional view taken from BB in FIG. 2. FIG. 5 is a cross-sectional view taken from above, cut perpendicular to the optical axis, of the camera device according to the present embodiment. FIG. 6 is a top view of a part of the configuration of the camera device according to the present embodiment. FIG. 7 is an exploded perspective view of the camera device according to the present embodiment. FIG. 8 is a perspective view of FIG. 2 with the lens and cover omitted. FIG. 9 is a perspective view of FIG. 8 with the stopper member and AF carrier omitted. FIG. 10 is a perspective view of FIG. 9 with the OIS-y carrier and related configuration omitted. FIG. 11 is a perspective view of FIG. 10 with the OIS-x carrier and related configuration omitted. FIG. 12 is a bottom perspective view of the camera device according to the present embodiment. FIG. 13 is a bottom perspective view with the base and cover omitted from FIG. 12. FIG. 14 is a perspective view with the OIS-x carrier and related components omitted from FIG. 13. FIG. 15 is a perspective view with the OIS-y carrier and related components omitted from FIG. 14. FIG. 16 is a perspective view illustrating the driving unit and related components of a camera device according to the present embodiment.

[0070] The camera device (10A) may include a camera module. The camera device (10A) may include a lens driving device. The camera device (10A) may include a voice coil motor. The camera device (10A) may include an actuator. The camera device (10A) may include an AF module. The camera device (10A) may include an OIS module.

[0071] A camera device (10A) may include a lens (10). The lens (10) may be placed on an AF carrier (210). The lens (10) may be coupled to the AF carrier (210). The lens (10) may be fixed to the AF carrier (210). The lens (10) may be attached to the AF carrier (210) with adhesive. The lens (10) may be placed on an image sensor (20). The lens (10) may be placed on the image sensor (20). The lens (10) may include a plurality of lenses. The lens (10) may include five or six lenses. The lens (10) may include seven or more lenses. The lens (10) may be coupled to a lens barrel. At this time, the lens barrel may be coupled to the AF carrier (210). The lens barrel may be screw-coupled to the AF carrier (210). Alternatively, the lens barrel may be joined to the AF carrier (210) by an adhesive without screws. The lens (10) may move integrally with the AF carrier (210).

[0072] The camera device (10A) may include an image sensor (20). Light passing through the lens (10) may be incident on the image sensor (20) to form an image. Light passing through the lens (10) and a filter may be incident on the image sensor (20) to form an image. The image sensor (20) may be placed on a sensor substrate (710). The image sensor (20) may be placed on the sensor substrate (710). The image sensor (20) may be coupled to the sensor substrate (710). The image sensor (20) may be fixed to the sensor substrate (710). The image sensor (20) may be soldered to the sensor substrate (710). The image sensor (20) may be mounted on the sensor substrate (710). The image sensor (20) may be electrically connected to the sensor substrate (710). For example, the image sensor (20) can be attached to the sensor substrate (710) by surface mounting technology (SMT). As a variation, the image sensor (20) can be attached to the sensor substrate (710) by flip chip technology. The image sensor (20) can be placed on the body portion (711) of the sensor substrate (710). The image sensor (20) can be placed on the upper surface of the body portion (711) of the sensor substrate (710).

[0073] The image sensor (20) can be positioned so that its optical axis aligns with that of the lens (10). That is, the optical axis of the image sensor (20) and the optical axis of the lens (10) can be aligned. The image sensor (20) can convert light incident on the effective image area of ​​the image sensor (20) into an electrical signal. The image sensor (20) may include any one of a CCD (charge coupled device), a MOS (metal oxide semiconductor), a CPD, and a CID.

[0074] The camera device (10A) may include a filter. The filter may serve to block light of a specific frequency band from passing through the lens (10) from entering the image sensor (20). The filter may be positioned perpendicular to the optical axis. The filter may be positioned between the lens (10) and the image sensor (20). The filter may be positioned on the sensor base. Alternatively, the filter may be positioned on the OIS-y carrier (230). The filter may include an infrared filter. The infrared filter may block light in the infrared region from entering the image sensor (20). The filter may include an infrared reflection filter. The filter may include an infrared absorption filter.

[0075] The camera device (10A) may include a sensor base. A filter may be fixed to the sensor base. An image sensor (20) may be fixed to the sensor base. The sensor base may be placed on a sensor substrate (710). The sensor base may be placed on the body portion (711) of the sensor substrate (710). The sensor base may be placed on the upper surface of the body portion (711) of the sensor substrate (710).

[0076] The camera device (10A) may include a fixed part (100). The fixed part (100) may be fixed relatively when the movable part moves. The fixed part (100) may support the movable part. The fixed part (100) may accommodate the movable part.

[0077] The camera device (10A) may include a base (110). The fixed part (100) may include a base (110). The base (110) may form the lower exterior of the camera device (10A). The base (110) may be coupled with a cover (120). The base (110) may be coupled with a side plate (122) of the cover (120). The base (110) may support an AF carrier (210). The base (110) may support an OIS-y carrier (230). The base (110) may support an OIS-x carrier (220).

[0078] The base (110) may include a bottom plate. The base (110) may include side plates. The base (110) may include a plurality of side plates. The base (110) may include a side plate extending upward from the bottom plate. The base (110) may include four side plates. The base (110) may include a bottom plate, a first side plate and a second side plate positioned opposite each other, and a third side plate and a fourth side plate positioned opposite each other.

[0079] The camera device (10A) may include a cover (120). The fixed part (100) may include a cover (120). The cover (120) may be placed on the base (110). The cover (120) may be placed on the base (110). The cover (120) may be coupled to the base (110). The cover (120) may be fixed to the base (110). The cover (120) may accommodate an AF carrier (210) inside. The cover (120) may accommodate an OIS-y carrier (230) inside. The cover (120) may accommodate an OIS-x carrier (220) inside. The cover (120) may be a shield member. The cover (120) may be a shield can.

[0080] The cover (120) may include a top plate (121). The top plate (121) may include a hole through which light passes.

[0081] The cover (120) may include a side plate (122). The side plate (122) may extend from the top plate (121). The side plate (122) may be placed on the base (110). The side plate (122) may be placed on a stepped portion that protrudes from the lower end of the outer surface of the base (110). The side plate (122) may include a plurality of side plates. The side plate (122) may include four side plates. The side plate (122) may include a first side plate and a second side plate placed opposite each other, and a third side plate and a fourth side plate placed opposite each other.

[0082] The camera device (10A) may include a moving part. The moving part may move relative to the fixed part (100). The moving part may be movably positioned on the fixed part (100). The moving part may be moved by a driving part. The moving part may include an AF moving part. The moving part may include an OIS moving part. The moving part may include an OIS-x moving part. The moving part may include an OIS-y moving part.

[0083] The camera device (10A) may include an AF carrier (210) that moves during AF operation. The AF carrier (210) may include a lens. That is, during AF operation, the image sensor is relatively fixed and only the lens can move.

[0084] The camera device (10A) may include an AF carrier (210). The AF carrier (210) may be placed on a base (110). The AF carrier (210) may be placed on an OIS-y carrier (230). The AF carrier (210) may be placed on an OIS-x carrier (220). The AF carrier (210) may be placed on a sensor substrate (710). The AF carrier (210) may be placed on the base (110). The AF carrier (210) may be placed on the OIS-y carrier (230). The AF carrier (210) may be placed on the OIS-x carrier (220). The AF carrier (210) may be placed on the sensor substrate (710). The AF carrier (210) may be placed within the base (110). The AF carrier (210) can be placed within the cover (120). The AF carrier (210) can be placed within the OIS-y carrier (230). The AF carrier (210) can be placed within the OIS-x carrier (220).

[0085] The AF carrier (210) may include a first side on which the AF magnet (310) is positioned and a second side opposite to the first side. When viewed from above, the distance between the lens (10) and the first side of the AF carrier (210) (see D1 in FIG. 6) may be greater than the distance between the lens (10) and the second side of the AF carrier (210) (see D2 in FIG. 6). When viewed from above, the shortest distance between the lens (10) and the first side of the AF carrier (210) may be greater than the shortest distance between the lens (10) and the second side of the AF carrier (210). When viewed from above, the distance between the optical axis of the lens (10) and the first side of the AF carrier (210) may be greater than the distance between the optical axis of the lens (10) and the second side of the AF carrier (210).

[0086] The AF coil (320) and the OIS-y coil (520) can be positioned opposite each other with respect to the AF carrier (210).

[0087] The camera device (10A) may include an OIS-x carrier (220). The OIS-x carrier (220) may be positioned between the AF carrier (210) and the base (110). The OIS-x carrier (220) may be positioned between the OIS-y carrier (230) and the base (110). The OIS-x carrier (220) may be positioned on the base (110). The OIS-x carrier (220) may be positioned on the base (110). The OIS-x carrier (220) may be positioned within the base (110). The OIS-x carrier (220) may be positioned within the cover (120). The OIS-x carrier (220) may be positioned on the OIS-y carrier (230). The OIS-x carrier (220) can be placed on the OIS-y carrier (230). The OIS-x carrier (220) can be placed within the OIS-y carrier (230).

[0088] The camera device (10A) may include an OIS-y carrier (230). The OIS-y carrier (230) may be positioned between the AF carrier (210) and the base (110). The OIS-y carrier (230) may be positioned between the OIS-x carrier (220) and the base (110). The OIS-y carrier (230) may be positioned on the base (110). The OIS-y carrier (230) may be positioned on the base (110). The OIS-y carrier (230) may be positioned within the base (110). The OIS-y carrier (230) may be positioned within the cover (120). The image sensor (20) may move together with the OIS-y carrier (230).

[0089] The camera device (10A) may include a stopper member (240). The stopper member (240) may be placed on the OIS-y carrier (230). The stopper member (240) may be placed on the OIS-y carrier (230). The stopper member (240) may be fixed to the OIS-y carrier (230). The stopper member (240) may be coupled to the OIS-y carrier (230). The stopper member (240) may be bonded to the OIS-y carrier (230) with adhesive. The stopper member (240) may be placed on the upper surface of the OIS-y carrier (230). The stopper member (240) may overlap with the AF carrier (210) in the direction of the optical axis. When the AF carrier (210) moves upward in the direction of the optical axis, the AF carrier (210) may come into contact with the stopper member (240). When the AF carrier (210) moves upward in the direction of the optical axis to the maximum extent, it may come into contact with the stopper member (240). That is, the distance of movement of the AF carrier (210) upward in the direction of the optical axis may be limited by the stopper member (240).

[0090] The camera device (10A) may include a driving unit. The driving unit may move the moving unit relative to the fixed unit (100). The driving unit may move the moving unit through electromagnetic interaction force. The driving unit may include a magnet and a coil.

[0091] The camera device (10A) may include an AF drive unit (300). The AF drive unit (300) can move the AF carrier (210) relative to the fixed part (100). The AF drive unit (300) can move the AF carrier (210) relative to the base (110). The AF drive unit (300) can move the AF carrier (210) relative to the OIS-x carrier (220). The AF drive unit (300) can move the AF carrier (210) relative to the OIS-y carrier (230). The AF drive unit (300) can move the AF carrier (210) in the direction of the optical axis. The AF drive unit (300) can move the lens (10) in the direction of the optical axis. The AF drive unit (300) can move the AF carrier (210) through electromagnetic interaction force. The AF drive unit (300) may include a magnet and a coil. The AF drive unit (300) may include a drive magnet and a drive coil. The AF drive units (300) may overlap each other in the x-axis direction. The AF magnet (310) and the AF coil (320) can move the AF carrier (210) in the optical axis direction.

[0092] The camera device (10A) may include an AF magnet (310). The AF drive unit (300) may include an AF magnet (310). The AF magnet (310) may be an "AF magnet". The AF magnet (310) may be placed on an AF carrier (210). The AF magnet (310) may be coupled to the AF carrier (210). The AF magnet (310) may be fixed to the AF carrier (210). The AF magnet (310) may be attached to the AF carrier (210) with adhesive. The AF magnet (310) may move integrally with the AF carrier (210). The AF magnet (310) may be placed between the AF carrier (210) and the AF coil (320). The AF magnet (310) may be placed on a base (110). The AF magnet (310) can be placed inside the cover (120).

[0093] The AF magnet (310) may be a permanent magnet. The AF magnet (310) may be a 4-pole magnet. The AF magnet (310) may be a 4-pole magnetized magnet that is magnetized with 4 poles. The AF magnet (310) may include a first magnet part including a N pole and a S pole, a second magnet part including a S pole and a N pole, and a neutral part between the first magnet part and the second magnet part. The surface of the AF magnet (310) facing the AF coil (320) may include a N pole and a S pole.

[0094] The AF magnet (310) can be positioned opposite the AF coil (320). The AF magnet (310) can face the AF coil (320). The AF magnet (310) can be positioned corresponding to the AF coil (320). The AF magnet (310) can be positioned at a location corresponding to the AF coil (320). The AF magnet (310) can interact with the AF coil (320). The AF magnet (310) can have electromagnetic interaction with the AF coil (320). The AF magnet (310) can be superimposed with the AF coil (320) in a direction perpendicular to the optical axis. The AF magnet (310) can be superimposed with the AF coil (320) in the x-axis direction.

[0095] The AF magnet (310) can move. The AF magnet (310) can move in the direction of the optical axis. The AF magnet (310) can move upward in the direction of the optical axis. The AF magnet (310) can move downward in the direction of the optical axis. When current is applied to the AF coil (320), the AF magnet (310) can move. The AF magnet (310) can move through interaction with the AF coil (320). The AF magnet (310) can move together with the AF carrier (210). The AF magnet (310) can move together with the lens (10). Even when the AF magnet (310) moves, the distance between the AF magnet (310) and the AF coil (320) in a direction perpendicular to the optical axis can be maintained at a constant level. Even when the AF magnet (310) moves, the distance between the AF magnet (310) and the AF coil (320) in the y-axis direction can be maintained at a constant level.

[0096] The camera device (10A) may include an AF coil (320). The AF drive unit (300) may include an AF coil (320). The AF coil (320) may be placed on an internal coil substrate (720). The AF coil (320) may be coupled to the internal coil substrate (720). The AF coil (320) may be fixed to the internal coil substrate (720). The AF coil (320) may be soldered to the internal coil substrate (720). The AF coil (320) may be placed on an OIS-y carrier (230). The AF coil (320) may be coupled to the OIS-y carrier (230). The AF coil (320) may be fixed to the OIS-y carrier (230). The AF coil (320) may be bonded to the OIS-y carrier (230). The AF coil (320) can move integrally with the OIS-y carrier (230). The AF coil (320) can be placed between the AF carrier (210) and the side plate (122) of the cover (120). The AF coil (320) can be placed between the AF magnet (310) and the side plate (122) of the cover (120). The AF coil (320) can be placed on the base (110). The AF coil (320) can be placed inside the cover (120).

[0097] The AF coil (320) may be formed in a ring shape. The AF coil (320) may include a first part facing the N pole of the AF magnet (310) and a second part facing the S pole of the AF magnet (310). The first part and the second part of the AF coil (320) may overlap in the direction of the optical axis. The second part of the AF coil (320) may be placed on top of the first part.

[0098] Current can be applied to the AF coil (320). When current is applied to the AF coil (320), an electromagnetic field can be formed around the AF coil (320). Forward current can be applied to the AF coil (320). Reverse current can be applied to the AF coil (320). The AF coil (320) can move the AF magnet (310). The AF coil (320) can be relatively fixed when the AF magnet (310) moves.

[0099] The camera device (10A) may include an AF sensor (330). The AF drive unit (300) may include an AF sensor (330). The AF sensor (330) may be placed on an internal coil substrate (720). The AF sensor (330) may be coupled to the internal coil substrate (720). The AF sensor (330) may be fixed to the internal coil substrate (720). The AF sensor (330) may be soldered to the internal coil substrate (720). The AF sensor (330) may be placed on an OIS-y carrier (230). The AF sensor (330) may be coupled to the OIS-y carrier (230). The AF sensor (330) may be fixed to the OIS-y carrier (230). The AF sensor (330) may move integrally with the OIS-y carrier (230). The AF sensor (330) may be placed inside the AF coil (320). As a variation, the AF sensor (330) may be placed outside the AF coil (320). The AF sensor (330) may be placed on the base (110). The AF sensor (330) may be placed inside the cover (120).

[0100] The AF sensor (330) may include a Hall sensor. The AF sensor (330) may detect the AF magnet (310). The AF sensor (330) may detect the magnetic force of the AF magnet (310). The AF sensor (330) may detect the movement or position of the AF carrier (210). The AF sensor (330) may detect the movement or position of the lens. The AF sensor (330) may be positioned at a location corresponding to the AF magnet (310). The AF sensor (330) may overlap with the AF magnet (310) in a direction perpendicular to the optical axis. The AF sensor (330) may overlap with the AF magnet (310) in the x-axis direction. The AF sensor (330) may overlap with the neutral portion of the AF magnet (310) in the x-axis direction.

[0101] The camera device (10A) may include an AF driver IC. The AF driving unit (300) may include an AF driver IC. The AF driver IC may be placed on an internal coil substrate (720). The AF driver IC may be coupled to the internal coil substrate (720). The AF driver IC may be fixed to the internal coil substrate (720). The AF driver IC may be soldered to the internal coil substrate (720). The AF driver IC may be placed on an OIS-y carrier (230). The AF driver IC may be coupled to the OIS-y carrier (230). The AF driver IC may be fixed to the OIS-y carrier (230). The AF driver IC may move integrally with the OIS-y carrier (230). The AF driver IC may be placed on a base (110). The AF driver IC can be placed inside the cover (120).

[0102] The AF driver IC can supply current to the AF coil (320). The AF driver IC can be electrically connected to the AF coil (320). The AF driver IC can be electrically connected to the AF sensor (330).

[0103] The camera device (10A) may include an OIS driving unit. The OIS driving unit can move the OIS moving unit relative to the fixed unit (100). The OIS driving unit can move the OIS moving unit in a direction perpendicular to the optical axis. The OIS driving unit can tilt the OIS moving unit. The OIS driving unit can move the OIS moving unit through electromagnetic interaction force. The OIS driving unit may include a magnet and a coil.

[0104] The camera device (10A) may include an OIS-x drive unit (400). The OIS-x drive unit (400) can move the OIS-x carrier (220) relative to the fixed part (100). The OIS-x drive unit (400) can move the OIS-y carrier (230) in the yaw direction. The OIS-x drive unit (400) can move the AF carrier (210) in the yaw direction. The OIS-x drive unit (400) can move the image sensor (20) and the lens (10) in the yaw direction. The OIS-x drive unit (400) can tilt the image sensor (20) and the lens (10) together around the x-axis. The OIS-x drive unit (400) may include a magnet and a coil. The OIS-x drive unit (400) may include a drive magnet and a drive coil. The OIS-x driving unit (400) can overlap each other in the y-axis direction. The OIS-x magnet (410) and the OIS-x coil (420) can tilt the lens (10) and the image sensor (20) around a first axis perpendicular to the optical axis. At this time, the first axis may be the x-axis.

[0105] The camera device (10A) may include an OIS-x magnet (410). The OIS-x drive unit (400) may include an OIS-x magnet (410). The OIS-x magnet (410) may be an "OIS-yaw magnet". The OIS-x magnet (410) may be placed on an OIS-x carrier (220). The OIS-x magnet (410) may be coupled to the OIS-x carrier (220). The OIS-x magnet (410) may be fixed to the OIS-x carrier (220). The OIS-x magnet (410) may be bonded to the OIS-x carrier (220) with adhesive. The OIS-x magnet (410) may move integrally with the OIS-x carrier (220). The OIS-x magnet (410) can move integrally with the image sensor (20). The OIS-x magnet (410) can move integrally with the lens (10). The OIS-x magnet (410) can be positioned between the OIS-x carrier (220) and the OIS-x coil (420). The OIS-x magnet (410) can be positioned between the OIS-y carrier (230) and the OIS-x coil (420). The OIS-x magnet (410) can be positioned between the AF carrier (210) and the OIS-x coil (420). The OIS-x magnet (410) can be positioned on the base (110). The OIS-x magnet (410) can be positioned inside the cover (120).

[0106] The OIS-x magnet (410) may be a permanent magnet. The OIS-x magnet (410) may be a 4-pole magnet. The OIS-x magnet (410) may be a 4-pole magnetized magnet. The OIS-x magnet (410) may include a first magnet part including an N pole and a S pole, a second magnet part including an S pole and an N pole, and a neutral part between the first magnet part and the second magnet part. The surface of the OIS-x magnet (410) facing the OIS-x coil (420) may include an N pole and a S pole.

[0107] The OIS-x magnet (410) can be positioned opposite the OIS-x coil (420). The OIS-x magnet (410) can be positioned to correspond to the OIS-x coil (420). The OIS-x magnet (410) can be positioned at a location corresponding to the OIS-x coil (420). The OIS-x magnet (410) can be positioned at a location corresponding to the OIS-x coil (420). The OIS-x magnet (410) can interact with the OIS-x coil (420). The OIS-x magnet (410) can have electromagnetic interaction with the OIS-x coil (420). The OIS-x magnet (410) can be superimposed on the OIS-x coil (420) in the y-axis direction.

[0108] The OIS-x magnet (410) can move. The OIS-x magnet (410) can move in the yaw direction. The OIS-x magnet (410) can move to one side in the yaw direction. The OIS-x magnet (410) can move to the other side in the yaw direction. When current is applied to the OIS-x coil (420), the OIS-x magnet (410) can move. The OIS-x magnet (410) can move through interaction with the OIS-x coil (420). The OIS-x magnet (410) can move together with the OIS-x carrier (220). The OIS-x magnet (410) can move together with the OIS-y carrier (230). The OIS-x magnet (410) can move together with the AF carrier (210). The OIS-x magnet (410) can move together with the image sensor (20). The OIS-x magnet (410) can move together with the lens (10).

[0109] The camera device (10A) may include an OIS-x coil (420). The OIS-x drive unit (400) may include an OIS-x coil (420). The OIS-x coil (420) may be placed on an external coil substrate (730). The OIS-x coil (420) may be coupled to the external coil substrate (730). The OIS-x coil (420) may be fixed to the external coil substrate (730). The OIS-x coil (420) may be soldered to the external coil substrate (730). The OIS-x coil (420) may be placed on a base (110). The OIS-x coil (420) may be coupled to the base (110). The OIS-x coil (420) may be fixed to the base (110). The OIS-x coil (420) can be bonded to the base (110) with adhesive. The OIS-x coil (420) can be placed on the base (110). The OIS-x coil (420) can be placed inside the cover (120).

[0110] The OIS-x coil (420) may be formed in a ring shape. The OIS-x coil (420) may include a first part facing the N pole of the OIS-x magnet (410) and a second part facing the S pole of the OIS-x magnet (410). The first part and the second part of the OIS-x coil (420) may overlap in the direction of the optical axis.

[0111] Current can be applied to the OIS-x coil (420). When current is applied to the OIS-x coil (420), an electromagnetic field can be formed around the OIS-x coil (420). Forward current can be applied to the OIS-x coil (420). Reverse current can be applied to the OIS-x coil (420). The OIS-x coil (420) can move the OIS-x magnet (410). The OIS-x coil (420) can be relatively fixed when the OIS-x magnet (410) moves.

[0112] When current is applied to the OIS-x coil (420), the OIS-x magnet (410) can be tilted together with the OIS-x carrier (220). When the OIS-x carrier (220) is tilted, the OIS-y carrier (230) and the OIS-y coil (520) are tilted together with the OIS-x carrier (220), so that the distance between the OIS-y magnet (510) and the OIS-y coil (520) can be maintained at a constant level.

[0113] The camera device (10A) may include an OIS-x sensor (430). The OIS-x driving unit (400) may include an OIS-x sensor (430). The OIS-x sensor (430) may be placed on an external coil substrate (730). The OIS-x sensor (430) may be coupled to the external coil substrate (730). The OIS-x sensor (430) may be fixed to the external coil substrate (730). The OIS-x sensor (430) may be soldered to the external coil substrate (730). The OIS-x sensor (430) may be placed on a base (110). The OIS-x sensor (430) may be coupled to the base (110). The OIS-x sensor (430) may be fixed to the base (110). The OIS-x sensor (430) may be placed within the OIS-x coil (420). As a variation, the OIS-x sensor (430) may be placed outside the OIS-x coil (420). The OIS-x sensor (430) may be placed on the base (110). The OIS-x sensor (430) may be placed within the cover (120).

[0114] The OIS-x sensor (430) may include a Hall sensor. The OIS-x sensor (430) may detect the OIS-x magnet (410). The OIS-x sensor (430) may detect the magnetic force of the OIS-x magnet (410). The OIS-x sensor (430) may detect the movement or position of the OIS-x carrier (220). The OIS-x sensor (430) may detect the movement or position of the OIS-y carrier (230). The OIS-x sensor (430) may detect the movement or position of the AF carrier (210). The OIS-x sensor (430) may detect the movement or position of the image sensor (20). The OIS-x sensor (430) may detect the movement or position of the lens (10). The OIS-x sensor (430) can be placed at a position corresponding to the OIS-x magnet (410). The OIS-x sensor (430) can overlap with the OIS-x magnet (410) in the y-axis direction.

[0115] The camera device (10A) may include an OIS-y drive unit (500). The OIS-y drive unit (500) can move the OIS-y carrier (230) relative to the fixed part (100). The OIS-y drive unit (500) can move the OIS-y carrier (230) in the pitch direction. The OIS-y drive unit (500) can move the AF carrier (210) in the pitch direction. The OIS-y drive unit (500) can move the image sensor (20) and the lens (10) in the pitch direction. The pitch drive unit (540) can tilt the image sensor (20) and the lens (10) together around the y-axis. The OIS-y drive unit (500) can move the OIS-y carrier (230) through electromagnetic interaction force. The OIS-y driving unit (500) may include a magnet and a coil. The OIS-y driving unit (500) may include a driving magnet and a driving coil. The OIS-y driving units (500) may overlap each other in the x-axis direction. The OIS-y magnet (510) and the OIS-y coil (520) can tilt the lens (10) and the image sensor (20) around a second axis perpendicular to both the optical axis and the first axis. At this time, the first axis may be the x-axis and the second axis may be the y-axis.

[0116] The camera device (10A) may include an OIS-y magnet (510). The OIS-y drive unit (500) may include an OIS-y magnet (510). The OIS-y magnet (510) may be an "OIS-pitch magnet". The OIS-y magnet (510) may be placed on an OIS-x carrier (220). The OIS-y magnet (510) may be coupled to the OIS-x carrier (220). The OIS-y magnet (510) may be fixed to the OIS-x carrier (220). The OIS-y magnet (510) may be bonded to the OIS-x carrier (220) with adhesive. The OIS-y magnet (510) may move integrally with the OIS-x carrier (220). The OIS-y magnet (510) can move integrally with the image sensor (20). The OIS-y magnet (510) can move integrally with the lens (10). The OIS-y magnet (510) can be placed between the OIS-x carrier (220) and the OIS-y coil (520). The OIS-y magnet (510) can be placed between the base (110) and the OIS-y coil (520). The OIS-y magnet (510) can be placed on the base (110). The OIS-y magnet (510) can be placed inside the cover (120).

[0117] The OIS-y magnet (510) may be a permanent magnet. The OIS-y magnet (510) may be a 4-pole magnet. The OIS-y magnet (510) may be a 4-pole magnetized magnet. The OIS-y magnet (510) may include a first magnet part including an N pole and a S pole, a second magnet part including an S pole and an N pole, and a neutral part between the first magnet part and the second magnet part. The surface of the OIS-y magnet (510) facing the OIS-y coil (520) may include an N pole and a S pole.

[0118] The OIS-y magnet (510) can be positioned opposite the OIS-y coil (520). The OIS-y magnet (510) can face the OIS-y coil (520). The OIS-y magnet (510) can be positioned corresponding to the OIS-y coil (520). The OIS-y magnet (510) can be positioned at a location corresponding to the OIS-y coil (520). The OIS-y magnet (510) can interact with the OIS-y coil (520). The OIS-y magnet (510) can have electromagnetic interaction with the OIS-y coil (520). The OIS-y magnet (510) can overlap with the OIS-y coil (520) in the direction of the optical axis.

[0119] The camera device (10A) may include an OIS-y coil (520). The OIS-y driving unit (500) may include an OIS-y coil (520). The OIS-y coil (520) may be placed on an internal coil substrate (720). The OIS-y coil (520) may be coupled to the internal coil substrate (720). The OIS-y coil (520) may be fixed to the internal coil substrate (720). The OIS-y coil (520) may be soldered to the internal coil substrate (720). The OIS-y coil (520) may be placed on an OIS-y carrier (230). The OIS-y coil (520) may be coupled to the OIS-y carrier (230). The OIS-y coil (520) may be fixed to the OIS-y carrier (230). The OIS-y coil (520) can be bonded to the OIS-y carrier (230) with adhesive. The OIS-y coil (520) can be placed on the base (110). The OIS-y coil (520) can be placed inside the cover (120).

[0120] The OIS-y coil (520) may be formed in a ring shape. The OIS-y coil (520) may include a first part facing the N pole of the OIS-y magnet (510) and a second part facing the S pole of the OIS-y magnet (510). The first part and the second part of the OIS-y coil (520) may overlap in the direction of the optical axis.

[0121] Current can be applied to the OIS-y coil (520). When current is applied to the OIS-y coil (520), an electromagnetic field can be formed around the OIS-y coil (520). Forward current can be applied to the OIS-y coil (520). Reverse current can be applied to the OIS-y coil (520).

[0122] When current is applied to the OIS-y coil (520), the OIS-y coil (520) can be tilted together with the OIS-y carrier (230) through interaction with the OIS-y magnet (510). When the OIS-y carrier (230) is tilted, the AF carrier (210) can be tilted together with the OIS-y carrier (230).

[0123] The OIS-y coil (520) can move. The OIS-y coil (520) can move in the pitch direction. The OIS-y coil (520) can move to one side in the pitch direction. The OIS-y coil (520) can move to the other side in the pitch direction. When current is applied to the OIS-y coil (520), the OIS-y coil (520) can move through interaction with the OIS-y magnet (510). The OIS-y coil (520) can move through interaction with the OIS-y magnet (510). The OIS-y magnet (510) can move together with the OIS-y carrier (230). The OIS-y magnet (510) can move together with the AF carrier (210). The OIS-y magnet (510) can move together with the image sensor (20). The OIS-y magnet (510) can move together with the lens (10).

[0124] The camera device (10A) may include an OIS-y sensor (530). The OIS-y driving unit (500) may include an OIS-y sensor (530). The OIS-y sensor (530) may be placed on an internal coil substrate (720). The OIS-y sensor (530) may be coupled to the internal coil substrate (720). The OIS-y sensor (530) may be fixed to the internal coil substrate (720). The OIS-y sensor (530) may be soldered to the internal coil substrate (720). The OIS-y sensor (530) may be placed on an OIS-y carrier (230). The OIS-y sensor (530) may be coupled to the OIS-y carrier (230). The OIS-y sensor (530) may be fixed to the OIS-y carrier (230). The OIS-y sensor (530) may be placed within the OIS-y coil (520). As a variation, the OIS-y sensor (530) may be placed outside the OIS-y coil (520). The OIS-y sensor (530) may be placed on the base (110). The OIS-y sensor (530) may be placed within the cover (120).

[0125] The OIS-y sensor (530) may include a Hall sensor. The OIS-y sensor (530) may detect the OIS-y magnet (510). The OIS-y sensor (530) may detect the magnetic force of the OIS-y magnet (510). The OIS-y sensor (530) may detect the movement or position of the OIS-y coil (520). The OIS-y sensor (530) may detect the movement or position of the OIS-x carrier (220). The OIS-y sensor (530) may detect the movement or position of the OIS-y carrier (230). The OIS-y sensor (530) may detect the movement or position of the AF carrier (210). The OIS-y sensor (530) may detect the movement or position of the image sensor (20). The OIS-y sensor (530) can detect the movement or position of the lens (10). The OIS-y sensor (530) can be placed at a position corresponding to the OIS-y magnet (510). The OIS-y sensor (530) can be superimposed on the OIS-y magnet (510) in the x-axis direction.

[0126] The camera device (10A) may include an OIS driver IC. The OIS driver IC may apply current to the OIS coil. The OIS driver IC may apply current to the OIS-x coil (420) and the OIS-y coil (520). The OIS driver IC may be electrically connected to the OIS-x coil (420) and the OIS-y coil (520).

[0127] When the AF magnet (310) and the AF coil (320) interact, the lens (10) can move relative to the image sensor (20). When the OIS-x magnet (410) and the OIS-x coil (420) interact, the lens (10) and the image sensor (20) can move together. When the OIS-y magnet (510) and the OIS-y coil (520) interact, the lens (10) and the image sensor (20) can move together.

[0128] The camera device (10A) may include a guide member. The guide member may guide the movement of the movable part. The guide member may guide the movement of the movable part in a specific direction relative to the fixed part (100). The guide member may include a ball.

[0129] The camera device (10A) may include an AF guide ball (610). The AF guide ball (610) may be placed in the AF carrier (210). The AF guide ball (610) may be placed in a groove of the AF carrier (210). The AF guide ball (610) may be placed in the OIS-y carrier (230). The AF guide ball (610) may be placed in a groove of the OIS-y carrier (230). The AF guide ball (610) may be placed between the AF carrier (210) and the OIS-y carrier (230). The AF guide ball (610) may be placed between the groove of the AF carrier (210) and the groove of the OIS-y carrier (230). The AF guide ball (610) may be in contact with the AF carrier (210) and the OIS-y carrier (230). The AF guide ball (610) can be in direct contact with the AF carrier (210) and the OIS-y carrier (230). The AF guide ball (610) can connect the AF carrier (210) and the OIS-y carrier (230). The AF guide ball (610) can directly connect the AF carrier (210) and the OIS-y carrier (230).

[0130] The AF guide ball (610) can move in a rolling motion along the optical axis. The AF guide ball (610) can move in a rolling motion along the optical axis within the groove of the AF carrier (210). The AF guide ball (610) can move in a rolling motion along the optical axis within the groove of the OIS-y carrier (230). The AF guide ball (610) can guide the movement of the AF carrier (210) along the optical axis. The AF guide ball (610) can guide the AF carrier (210) to move along the optical axis relative to the OIS-y carrier (230).

[0131] The AF guide ball (610) may be formed in a spherical shape. As a variation, the AF guide ball (610) may be formed in a cylindrical shape. The AF guide ball (610) may include a curved surface. The AF guide ball (610) may include a plurality of balls. The AF guide ball (610) may include six balls. The AF guide ball (610) may include first to sixth balls. The AF guide ball (610) may include three balls disposed on one side of the AF magnet (310) and three balls disposed on the other side of the AF magnet (310).

[0132] The camera device (10A) may include an OIS-x guide ball (620). The OIS-x guide ball (620) may be placed on the OIS-x carrier (220). The OIS-x guide ball (620) may be placed in a groove of the OIS-x carrier (220). The OIS-x guide ball (620) may be placed on the base (110). The OIS-x guide ball (620) may be placed in a groove of the base (110). The OIS-x guide ball (620) may be placed between the OIS-x carrier (220) and the base (110). The OIS-x guide ball (620) may be placed between the groove of the OIS-x carrier (220) and the groove of the base (110). The OIS-x guide ball (620) may be in contact with the OIS-x carrier (220) and the base (110). The OIS-x guide ball (620) can be in direct contact with the OIS-x carrier (220) and the base (110). The OIS-x guide ball (620) can connect the OIS-x carrier (220) and the base (110). The OIS-x guide ball (620) can directly connect the OIS-x carrier (220) and the base (110).

[0133] The OIS-x guide ball (620) can guide the movement of the OIS-x carrier (220) in the yaw direction. The OIS-x guide ball (620) can guide the OIS-x carrier (220) to move in the yaw direction relative to the base (110). The OIS-x guide ball (620) can guide the movement of the OIS-x carrier (220) in the yaw direction. The OIS-x guide ball (620) can guide the movement of the image sensor (20) in the yaw direction. The OIS-x guide ball (620) can guide the movement of the OIS-y carrier (230) in the yaw direction. The OIS-x guide ball (620) can guide the movement of the AF carrier (210) in the yaw direction. The OIS-x guide ball (620) can guide the movement of the lens (10) in the yaw direction.

[0134] The OIS-x guide ball (620) may be formed in a spherical shape. As a variation, the OIS-x guide ball (620) may be formed in a cylindrical shape. The OIS-x guide ball (620) may include a curved surface. The OIS-x guide ball (620) may include a plurality of balls. The OIS-x guide ball (620) may include two balls. The OIS-x guide ball (620) may include a first and a second ball. The OIS-x guide ball (620) may include a plurality of balls arranged on a first axis. In this case, the first axis may be a central axis in the yaw direction. The first axis may be the x-axis.

[0135] The camera device (10A) may include an OIS-y guide ball (630). The OIS-y guide ball (630) may be placed on the OIS-x carrier (220). The OIS-y guide ball (630) may be placed in a groove of the OIS-x carrier (220). The OIS-y guide ball (630) may be placed on the OIS-y carrier (230). The OIS-y guide ball (630) may be placed in a groove of the OIS-y carrier (230). The OIS-y guide ball (630) may be placed between the OIS-x carrier (220) and the OIS-y carrier (230). The OIS-y guide ball (630) may be placed between the groove of the OIS-x carrier (220) and the groove of the OIS-y carrier (230). The OIS-y guide ball (630) can be in contact with the OIS-x carrier (220) and the OIS-y carrier (230). The OIS-y guide ball (630) can be in direct contact with the OIS-x carrier (220) and the OIS-y carrier (230). The OIS-y guide ball (630) can connect the OIS-x carrier (220) and the OIS-y carrier (230). The OIS-y guide ball (630) can directly connect the OIS-x carrier (220) and the OIS-y carrier (230).

[0136] The OIS-y guide ball (630) can guide the movement of the OIS-y carrier (230) in the pitch direction. The OIS-y guide ball (630) can guide the OIS-y carrier (230) to move in the pitch direction relative to the OIS-x carrier (220). The OIS-y guide ball (630) can guide the movement of the OIS-y carrier (230) in the pitch direction. The OIS-y guide ball (630) can guide the movement of the image sensor (20) in the pitch direction. The OIS-y guide ball (630) can guide the movement of the AF carrier (210) in the pitch direction. The OIS-y guide ball (630) can guide the movement of the lens (10) in the pitch direction.

[0137] The OIS-y guide ball (630) may be formed in a spherical shape. As a variation, the OIS-y guide ball (630) may be formed in a cylindrical shape. The OIS-y guide ball (630) may include a curved surface. The OIS-y guide ball (630) may include a plurality of balls. The OIS-y guide ball (630) may include two balls. The OIS-y guide ball (630) may include a first and a second ball. The OIS-y guide ball (630) may include a plurality of balls arranged on a second axis. In this case, the second axis may be a central axis in the pitch direction. The second axis may be the y-axis.

[0138] At least one of the OIS-x guide ball (620) and the OIS-y guide ball (630) may be formed integrally with the OIS-x carrier (220). Alternatively, the OIS-x guide ball (620) may be formed integrally with the base (110). The OIS-y guide ball (630) may be formed integrally with the OIS-y carrier (230).

[0139] The OIS-x guide ball (620) may include two OIS-x guide balls (620) spaced apart from each other. The OIS-y guide ball (630) may include two OIS-y guide balls (630) spaced apart from each other. The intersection point of a virtual straight line connecting the centers of the two OIS-x guide balls (620) (see A in FIG. 6) and a virtual straight line connecting the centers of the two OIS-y guide balls (630) (see B in FIG. 6) may meet the optical axis (OA).

[0140] The camera device (10A) may include a sensor substrate (710). The sensor substrate (710) may be placed on a base (110). The sensor substrate (710) may be placed on an OIS-y carrier (230). The sensor substrate (710) may movably support an image sensor (20). The sensor substrate (710) may supply power to the image sensor (20). The sensor substrate (710) may movably support the image sensor (20) relative to the base (110) through a folded portion. The sensor substrate (710) may be an FPCB. At least a portion of the sensor substrate (710) may move integrally with the OIS-y carrier (230).

[0141] The sensor substrate (710) may include a body portion (711). An image sensor (20) may be disposed in the body portion (711). The body portion (711) may be disposed perpendicular to the optical axis. The body portion (711) may be disposed on the OIS-y carrier (230). The body portion (711) may be disposed on the lower surface of the OIS-y carrier (230). The body portion (711) may be an inner portion.

[0142] The sensor substrate (710) may include an extension portion (712). The extension portion (712) may be bent from the body portion (711). The extension portion (712) may be bent and extended from the body portion (711). The extension portion (712) of the sensor substrate (710) may be coupled with an internal coil substrate (720).

[0143] The sensor substrate (710) may include an outer portion (713). The outer portion (713) may protrude outward. A connector for connection with the outside may be disposed on the outer portion (713). The connector may be connected to the outside. A connector may be disposed on the outer portion (713).

[0144] The sensor substrate (710) may include a connecting portion (714). The connecting portion (714) may be positioned between the base (110) and the OIS-y carrier (230). The connecting portion (714) may be positioned between the OIS-x carrier (220) and the OIS-y carrier (230). The connecting portion (714) may include a bent shape so that the sensor substrate (710) movably supports the image sensor (20). The connecting portion (714) may be formed so that the sensor substrate (710) does not interfere with the base (110) when the image sensor (20) moves. The connecting portion (714) of the sensor substrate (710) may be positioned so that the image sensor (20) is movably positioned relative to the base (110). The connecting portion (714) may extend from the body portion (711). The connecting portion (714) may extend outward from the body portion (711). The connecting portion (714) may connect the body portion (711) and the outer portion (713). The connecting portion (714) may be bent multiple times. The connecting portion (714) may include a bent portion. A stiffener that maintains the shape may be disposed in at least one part of the connecting portion (714). The stiffener may be disposed in a part of the connecting portion (714) of the sensor substrate (710).

[0145] The camera device (10A) may include an internal coil substrate (720). The internal coil substrate (720) may be placed on the OIS-y carrier (230). The internal coil substrate (720) may be placed on the outer surface of the OIS-y carrier (230). The internal coil substrate (720) may be electrically connected to the sensor substrate (710). An AF coil (320) may be placed on the internal coil substrate (720). An OIS-y coil (520) may be placed on the internal coil substrate (720).

[0146] The camera device (10A) may include an external coil board (730). The fixed part (100) may include an external coil board (730). The external coil board (730) may be placed on a base (110). The external coil board (730) may include a circuit board. The external coil board (730) may include a flexible printed circuit board. The external coil board (730) may include a flexible printed circuit board (FPCB). The external coil board (730) may be electrically connected to the outside. The external coil board (730) may supply current to the coil, the sensor, the driver IC, and the gyro sensor.

[0147] The camera device (10A) may include a lower force member (810). The lower force member (810) may include a magnet. The lower force member (810) may be placed on a base (110). A force may be applied to the lower force member (810) toward the upper force member (820). The lower force member (810) may be pressed toward the upper force member (820).

[0148] The camera device (10A) may include an upper attractive member (820). The upper attractive member (820) may include a metal member. The upper attractive member (820) may include a magnetic material. The upper attractive member (820) may be placed on the lower surface of the sensor substrate (710). The upper attractive member (820) may overlap with the lower attractive member (810) in the direction of the optical axis. The lower attractive member (810) and the upper attractive member (820) may exert an attractive force on each other. An attractive force may be exerted on the upper attractive member (820) toward the lower attractive member (810). The upper attractive member (820) may be pressed toward the lower attractive member (810).

[0149] As a variation, the lower attractive member (810) may be formed of a metal member and the upper attractive member (820) may be formed of a magnet. Alternatively, both the lower attractive member (810) and the upper attractive member (820) may be formed of magnets. In this case, different polarities may be arranged to face each other so that an attractive force is generated between the lower attractive member (810) and the upper attractive member (820).

[0150]

[0151] The auto focus (AF) operation of the camera device according to the present embodiment is described below.

[0152] FIG. 17 is a cross-sectional view illustrating the AF drive of a camera device according to the present embodiment.

[0153] The moving part may be positioned at an initial position where no current is applied to the AF coil (320), separated from both the top plate (121) of the cover (120) and the base (110). At this time, the moving part may include an AF carrier (210). Furthermore, the moving part may include an AF carrier (210), a lens (10), and an AF magnet (310).

[0154] When current is applied to the AF coil (320), the moving part (see A in FIG. 17) can move upward or downward along the optical axis (see B in FIG. 17).

[0155] When a forward current is applied to the AF coil (320), the AF magnet (310) can move upward in the optical axis direction due to the electromagnetic interaction between the AF coil (320) and the AF magnet (310). At this time, the AF carrier (210) can move upward in the optical axis direction together with the AF magnet (310). Furthermore, the lens (10) can move upward in the optical axis direction together with the AF carrier (210). Accordingly, the distance between the lens (10) and the image sensor (20) changes, and the focus of the image formed on the image sensor (20) through the lens (10) can be adjusted.

[0156] When a reverse current is applied to the AF coil (320), the AF magnet (310) can move downward in the optical axis direction due to the electromagnetic interaction between the AF coil (320) and the AF magnet (310). At this time, the AF carrier (210) can move downward in the optical axis direction together with the AF magnet (310). Furthermore, the lens (10) can move downward in the optical axis direction together with the AF carrier (210). Accordingly, the distance between the lens (10) and the image sensor (20) changes, and the focus of the image formed on the image sensor (20) through the lens (10) can be adjusted.

[0157] Meanwhile, during the movement of the AF magnet (310), the AF sensor (330) can detect the strength of the magnetic field of the AF magnet (310) to detect the amount of movement or position of the lens (10) in the optical axis direction. The amount of movement or position of the lens (10) in the optical axis direction detected by the AF sensor (330) can be used for autofocus feedback control.

[0158]

[0159] The following describes the operation of optical image stabilization (OIS) of the camera device according to the present embodiment.

[0160] FIG. 18 is a perspective view illustrating OIS driving of a camera device according to the present embodiment. FIG. 19 is a diagram illustrating OIS-y driving, that is, tilt driving centered on the y-axis, of a camera device according to the present embodiment. FIG. 20 is a diagram illustrating tilt driving when OIS-x driving and OIS-y driving are performed simultaneously in a camera device according to the present embodiment.

[0161] First, we will explain the x-axis tilt drive (refer to Tx in FIG. 18) which tilts around the x-axis. The x-axis tilt drive can be a yaw direction drive.

[0162] The moving part may be placed in an initial position when no current is applied to the OIS-x coil (420). At this time, the moving part may include an OIS-x carrier (220), an OIS-y carrier (230), and an AF carrier (210). Furthermore, the moving part may include an OIS-x carrier (220), an OIS-y carrier (230), an AF carrier (210), a lens (10), an image sensor (20), an OIS-x magnet (410), an OIS-y magnet (510), an OIS-y coil (520), an AF magnet (310), and an AF coil (320).

[0163] When current is applied to the OIS-x coil (420), the moving part can be tilted in a rotational direction around the x-axis, that is, in the yaw direction.

[0164] When current is applied to the OIS-x coil (420), the OIS-x magnet (410) can be tilted in the yaw direction due to the electromagnetic interaction between the OIS-x coil (420) and the OIS-x magnet (410). That is, it can be tilted around the x-axis. At this time, the image sensor (20) and the lens (10) can also be tilted in the yaw direction along with the OIS-x magnet (410). More specifically, when a forward current is applied to the OIS-x coil (420), the OIS-x magnet (410), the image sensor (20), and the lens (10) can be tilted in one direction of the yaw. Additionally, when a reverse current is applied to the OIS-x coil (420), the OIS-x magnet (410), the image sensor (20), and the lens (10) can be tilted in the other direction of the yaw.

[0165] Meanwhile, the OIS-x sensor (430) can detect the magnetic field strength of the OIS-x magnet (410) to detect the amount of movement or position of the OIS-x magnet (410). The amount of movement or position detected by the OIS-x sensor (430) can be used for yaw direction hand shake correction feedback control.

[0166] Below, a y-axis tilt drive that tilts around the y-axis (refer to Ty in FIG. 18) will be described. The y-axis tilt drive may be a pitch direction drive.

[0167] The moving part may be placed in an initial position when no current is applied to the OIS-y coil (520). At this time, the moving part may include an OIS-y carrier (230) and an AF carrier (210). Furthermore, the moving part may include an OIS-y carrier (230), an AF carrier (210), a lens (10), an image sensor (20), an OIS-y coil (520), an AF magnet (310), and an AF coil (320).

[0168] When current is applied to the OIS-y coil (520), the moving part can be tilted in the direction of rotation around the y-axis, that is, in the pitch direction.

[0169] When current is applied to the OIS-y coil (520), the OIS-y magnet (510) can be tilted in the pitch direction due to the electromagnetic interaction between the OIS-y coil (520) and the OIS-y magnet (510). That is, it can be tilted around the y-axis. At this time, the image sensor (20) and the lens (10) can also be tilted in the pitch direction along with the OIS-y magnet (510). More specifically, when a forward current is applied to the OIS-y coil (520), the OIS-y magnet (510), the image sensor (20), and the lens (10) can be tilted in one direction along the pitch. Additionally, when a reverse current is applied to the OIS-y coil (520), the OIS-y magnet (510), the image sensor (20), and the lens (10) can be tilted in the other direction along the pitch.

[0170] Meanwhile, the OIS-y sensor (530) can detect the magnetic field strength of the OIS-y magnet (510) to detect the amount of movement or position of the OIS-y magnet (510). The amount of movement or position detected by the OIS-y sensor (530) can be used for pitch direction hand shake correction feedback control.

[0171] In this embodiment, even when the moving part moves in a rotational direction centered on the y-axis, the distance between the OIS-x magnet (410) and the OIS-x coil (420) can be maintained at a constant level. In other words, even when the OIS-y coil (520) moves upward (see A in FIG. 19) due to the interaction between the OIS-y magnet (510) and the OIS-y coil (520) as shown in FIG. 19, the distance between the OIS-x magnet (410) and the OIS-x coil (420) can be maintained at a constant level.

[0172] Meanwhile, in this embodiment, driving in a rotational direction centered on the x-axis and driving in a rotational direction centered on the y-axis can be performed simultaneously. At this time, the moving part can be tilted with respect to a virtual axis that is perpendicular to the optical axis, forms a 45-degree angle with the x-axis, and forms a 45-degree angle with the y-axis. More specifically, as shown in FIG. 20, when the OIS-y coil (520) moves upward due to the interaction between the OIS-y magnet (510) and the OIS-y coil (520) and the OIS-x magnet (410) moves upward due to the interaction between the OIS-x magnet (410) and the OIS-x coil (420) (see FIG. 20 B), the moving part can be tilted with respect to a virtual axis that is perpendicular to the optical axis, forms a 45-degree angle with the x-axis, and forms a 45-degree angle with the y-axis.

[0173]

[0174] Hereinafter, an optical device according to the present embodiment will be described with reference to the drawings.

[0175] FIG. 21 is a perspective view of an optical device according to the present embodiment.

[0176] The optical device (1) may include one or more of a mobile phone, mobile phone, portable terminal, mobile terminal, smartphone, smart pad, portable smart device, digital camera, laptop computer, digital broadcasting terminal, PDA (Personal Digital Assistants), PMP (Portable Multimedia Player), and navigation. The optical device (1) may include any device for capturing images or photographs.

[0177] The optical device (1) may include a main body (2). The optical device (1) may include a camera device (10A). The camera device (10A) may be placed on the main body (2). The camera device (10A) may photograph a subject. The optical device (1) may include a display. The display may be placed on the main body (2). The display may output one or more of the images and video captured by the camera device (10A). The display may be placed on a first surface of the main body (2). The camera device (10A) may be placed on one or more of the first surface of the main body (2) and a second surface opposite the first surface. As shown in FIG. 21, the camera device (10A) may have a triple camera positioned vertically. Alternatively, as a variation, the camera device may have a triple camera positioned horizontally.

[0178] The optical device (1) or camera device (10A) can be applied to a robot or vehicle.

[0179]

[0180] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

Claims

1. Bass; A first carrier disposed on the above base; A second carrier disposed between the first carrier and the base; A third carrier positioned between the second carrier and the base; A first magnet and a first coil that move the first carrier in the direction of the optical axis; A second magnet and a third magnet disposed on the third carrier above; A second coil disposed on the base and interacting with the second magnet; and A camera device comprising a third coil disposed on the second carrier and interacting with the third magnet.

2. In Paragraph 1, When current is applied to the second coil, the second magnet tilts together with the third carrier, and A camera device in which, when the third carrier is tilted, the second carrier and the third coil are tilted together with the third carrier, so that the distance between the third magnet and the third coil is maintained at a constant.

3. In Paragraph 1, When current is applied to the third coil, the third coil tilts together with the second carrier through interaction with the third magnet, and A camera device in which, when the second carrier is tilted, the first carrier is tilted together with the second carrier.

4. In Paragraph 1, A lens coupled to the first carrier above; A first substrate in which at least a portion moves integrally with the second carrier; and A camera device comprising an image sensor disposed on the first substrate.

5. In Paragraph 4, The first carrier includes a first side on which the first magnet is disposed and a second side opposite to the first side, and A camera device in which, when viewed from above, the distance between the optical axis of the lens and the first side of the first carrier is greater than the distance between the optical axis of the lens and the second side of the first carrier.

6. In Paragraph 4, When the first magnet and the first coil interact, the lens moves relative to the image sensor, and When the second magnet and the second coil interact, the lens and the image sensor move together, and A camera device in which the lens and the image sensor move together when the third magnet and the third coil interact.

7. In Paragraph 4, A first manpower member disposed on the above base; and It includes a second attractive member disposed on the lower surface of the first substrate and overlapping with the first attractive member in the direction of the optical axis, The above-mentioned first force member and the above-mentioned second force member are a camera device in which mutual force acts.

8. In Paragraph 4, It includes a second substrate disposed on the outer surface of the second carrier and electrically connected to the first substrate, The first coil and the third coil are a camera device disposed on the second substrate.

9. In Paragraph 8, The first substrate comprises a body portion disposed on the lower surface of the second carrier and an extension portion that is bent and extended from the body portion. The extension of the first substrate is a camera device coupled with the second substrate.

10. In Paragraph 1, A first ball disposed between the first carrier and the second carrier; A second ball disposed between the base and the third carrier; and A camera device comprising a third ball disposed between the second carrier and the third carrier.

Images