Die chuck having vapor chamber

Abstract

According to an aspect of the present invention, a die chuck having a vapor chamber may comprise: a mobile chuck on which a plurality of dies sawn from a wafer are seated; and a chuck base on which the mobile chuck is seated. The mobile chuck may have a plurality of vacuum suction holes formed in one surface thereof so that the dies are vacuum-suctioned and fixed, and may include a vapor chamber for diffusing and transferring heat generated from the dies disposed on the one surface to the chuck base or diffusing and transferring heat generated from the chuck base to the dies disposed on the one surface.

Description

Die chuck equipped with a vapor chamber

[0001] The present invention relates to a die chuck equipped with a vapor chamber, and more specifically, to a die chuck equipped with a vapor chamber capable of rapidly and accurately testing a die with a sawn wafer at the die level.

[0002] Conventionally, products were manufactured through a packaging process following a dicing operation that separated wafers into individual dies.

[0003] Therefore, product manufacturing was performed after testing the wafer at the wafer level prior to the sawing operation for separating the wafer into die units.

[0004] However, recently, the method of manufacturing products by dicing wafers and stacking the separated individual dies is mainly being used.

[0005] Conventionally, products were manufactured by performing a burn-in test on the entire wafer to inspect for defects, separating them into individual units, and undergoing a packaging process. However, as semiconductor chip products become more sophisticated, the number of chips included within a package increases, leading to an increase in cases where the entire semiconductor package becomes defective if a defect occurs in some of the chips included in the package.

[0006] Therefore, there is a need for a device that performs testing at the die level rather than the wafer level. However, since a single wafer is separated into multiple dies, there was a problem in that testing each of the multiple dies individually required a significant amount of time.

[0007] Meanwhile, as high-performance semiconductor chips generate more heat during operation, and since test results can vary depending on the degree of heat generation, temperature control is crucial during testing.

[0008] However, even in conventional wafer testing, there was a problem where the wafer temperature was not maintained uniformly because heat dissipation was efficient in areas close to the cooling channel but not in areas far away, making it difficult to test wafers of high-performance semiconductor chips.

[0009] Therefore, it is necessary to derive a structure that allows the temperature of each die to be uniformly and effectively controlled even during die level testing.

[0010] The present invention aims to solve the above-mentioned problems, and the objective of the present invention is to provide a die chuck equipped with a vapor chamber that can test multiple dies at the die level in a shorter time and can uniformly and effectively control the temperature of each die during die level testing.

[0011] The problems of the present invention are not limited to those mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the description below.

[0012] According to one aspect of the present invention, a die chuck equipped with a vapor chamber is provided, comprising: a mobile chuck on which a plurality of dies on which wafers are sawn are seated; and a chuck base on which the mobile chuck is seated. The mobile chuck has a plurality of vacuum adsorption holes formed on one surface to vacuum adsorb and fix the dies, and a vapor chamber that diffuses and transfers heat generated from the die disposed on the one surface to the chuck base or diffuses and transfers heat generated from the chuck base to the die disposed on the one surface.

[0013] It may include a temperature control unit that controls the temperature of the mobile chuck.

[0014] The temperature control unit may include: a cooling channel provided in the chuck base and through which a refrigerant flows to dissipate heat diffused from the vapor chamber; and a heater provided in the chuck base or the mobile chuck to heat a die mounted on the mobile chuck.

[0015] A sensor for measuring the temperature of the mobile chuck heated by the above die may be provided.

[0016] The above temperature control unit can control the output of the heater to be reduced when the heat generation amount of the die increases, so that the temperature of the die is maintained at a constant level.

[0017] The above vapor chamber may include: a first plate forming one surface; a second plate coupled to the first plate to form a chamber between the first plate and the first surface; a plurality of rigid columns provided within the chamber, with one end coupled to the first plate and the other end coupled to the second plate to support the first plate and the second plate; and a wick provided within the chamber through which an operating liquid flows.

[0018] The above wick forms an operating column connecting the first plate and the second plate within the chamber, and the operating column may be formed to wrap around the outer circumference of the rigid column.

[0019] The above wick forms an operating column connecting the first plate and the second plate within the chamber, and the operating column may be formed spaced apart from the rigid column.

[0020] When the mobile chuck is seated on the chuck base, the lower surface of the vapor chamber can be formed to make surface contact with the upper surface of the chuck base.

[0021] According to the above configuration, the die chuck equipped with a vapor chamber according to the present invention has the effect of increasing the yield of the final produced package by allowing testing to be performed at the die level rather than the wafer level.

[0022] In addition, since multiple dies can be tested simultaneously rather than individually, the time required for testing is reduced, resulting in a reduction in process time.

[0023] In addition, since the dies can be placed on the mobile chuck and moved and tested on a unit-by-unit basis, there is no need to reposition each die according to the transfer of the chamber, which has the effect of further reducing the time required for testing.

[0024] In addition, the inclusion of a vapor chamber allows for faster, more uniform, and more effective temperature control of each die during die level testing.

[0025] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0026] FIG. 1 is a drawing illustrating a die chuck equipped with a vapor chamber applied to a die level test system according to one embodiment of the present invention.

[0027] FIG. 2 is a drawing illustrating an example of a die level test system according to an embodiment of the present invention.

[0028] FIG. 3 is a drawing illustrating an example of a film body used in a die level test system according to one embodiment of the present invention.

[0029] FIG. 4 is a drawing showing a film body being introduced into a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0030] FIG. 5 is a drawing illustrating the lowered transfer section of a sorter chamber module in a die level test system according to an embodiment of the present invention.

[0031] FIG. 6 is a drawing showing a film body placed on the transfer portion of a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0032] Figure 7 is a drawing showing the film body placed on the transfer part illustrated in Figure 6 from a different angle.

[0033] FIG. 8 is a drawing illustrating a mobile chuck being seated on a first chuck base of a sorter chamber module and a film body being seated on a second chuck base in a die level test system according to one embodiment of the present invention.

[0034] FIG. 9 is a drawing illustrating a picker picking up a die from a film body placed on a second chuck base in a die level test system according to one embodiment of the present invention.

[0035] FIG. 10 is a drawing illustrating the placement of a die picked by a picker on a mobile chuck mounted on a first chuck base in a die level test system according to one embodiment of the present invention.

[0036] FIG. 11 is a drawing illustrating a mobile chuck with a die placed thereon being removed from a sorter chamber module in a die level test system according to one embodiment of the present invention.

[0037] FIG. 12 is a diagram illustrating, in sequence, the process of a picker picking up a die placed on a film body and placing it on a mobile chuck in a die level test system according to one embodiment of the present invention.

[0038] FIG. 13 is a plan view illustrating a mobile chuck with a die placed thereon in a die level test system according to one embodiment of the present invention.

[0039] FIG. 14 is a diagram illustrating the process of a mobile chuck on which a die is placed being removed from a sorter chamber module and transferred to a test chamber module in a die level test system according to one embodiment of the present invention.

[0040] FIG. 15 is a drawing illustrating the process of a mobile chuck with a die placed in it being introduced into a test chamber module and tested in a die level test system according to one embodiment of the present invention.

[0041] FIG. 16 is a drawing illustrating a die chuck equipped with a vapor chamber according to one embodiment of the present invention.

[0042] FIG. 17 is a diagram showing the temperature distribution according to the position of a conventional chuck and a die chuck equipped with a vapor chamber of the present invention when the heat input is 50 W / cm2.

[0043] FIG. 18 is a diagram showing the temperature distribution according to the position of a conventional chuck and a die chuck equipped with a vapor chamber of the present invention when the heat input is 20 W / cm2.

[0044] FIG. 19 is a drawing illustrating a vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention.

[0045] FIG. 20 is an enlarged view of a portion of the vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention.

[0046] FIG. 21 is a drawing illustrating the structure of a vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention and the structure of a vapor chamber without rigid columns.

[0047] FIG. 22 is a drawing illustrating another modified form of the vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention.

[0048] FIG. 23 is an enlarged view of a part of another modified form of the vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention.

[0049] Figure 24 is a drawing illustrating the deformation of a vapor chamber at an internal pressure of 20 bar when a vapor chamber with a structure without rigid columns is applied.

[0050] FIG. 25 is a drawing illustrating the deformation of the vapor chamber at an internal pressure of 20 bar when the vapor chamber of a die chuck equipped with a vapor chamber according to one embodiment of the present invention is applied.

[0051] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components.

[0052] The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention.

[0053] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical concepts of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention.

[0054] In this specification, terms such as “comprising” or “having” are intended to describe the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should not be understood as precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0055] The statement that a component is "in front," "rear," "upper," or "lower" of another component includes, unless there are special circumstances, not only being positioned "in front," "rear," "upper," or "lower" in direct contact with the other component, but also cases where another component is positioned in between. Furthermore, the statement that a component is "connected" to another component includes, unless there are special circumstances, not only being directly connected to each other, but also being indirectly connected to each other.

[0056] Hereinafter, a die level test chuck (1) equipped with a vapor chamber (112) according to one embodiment of the present invention will be described with reference to the drawings.

[0057] FIG. 1 is a perspective view of a die level test chuck (1) equipped with a vapor chamber (112) according to one embodiment of the present invention. Referring to FIG. 1, the die level test chuck (1) equipped with a vapor chamber (112) according to the present embodiment may include a mobile chuck (11) and a chuck base (12).

[0058] For example, the mobile chuck (11) may have a disc shape. However, this is for illustrative purposes only, and the shape of the mobile chuck (11) is not limited thereto. The mobile chuck (11) may be made of a disc-shaped plate (110). In this case, a plurality of alignment patterns (111) may be formed on the plate (110). However, the shape of the plate (110) is not limited thereto.

[0059] The upper surface of the plate (110) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2) that intersects the first direction (DR1). The upper surface of the plate (110) may correspond to the upper surface of the mobile chuck (11).

[0060] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the plane and the back surface of each member. Substantially, the third direction (DR3) may be a direction perpendicular to the plate (110). In this specification, "on a plane" may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same reference numeral in the direction indicated by the first to third direction axes, respectively.

[0061] A plurality of vacuum suction holes (110a) may be formed on the upper surface of the above plate (110). The vacuum suction holes (110a) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110a) can be converted to a vacuum state. Accordingly, a plurality of dies (218), which will be described later, can be suction-fixed on the upper surface of the mobile chuck (11).

[0062] At this time, the die (218) may be formed by sawing and dividing a wafer. That is, a plurality of divided dies (218) are placed on the mobile chuck (11). Additionally, for the convenience of transport, the die (218) may be transported while attached to a film body (220) described later, or placed on the mobile chuck (11) while separated from the film body (220).

[0063] The above vacuum suction holes (110a) may be arranged in multiple numbers in a first direction (DR1) and a second direction (DR2). The vacuum suction holes (110a) may be arranged in multiple rows and multiple columns. The shape of the vacuum suction holes (110a) may be changed to various shapes and sizes as needed. For example, the vacuum suction holes (110a) may have a shape corresponding to a circle. However, they are not limited thereto, and the shape and spacing of the vacuum suction holes (110a) may be changed depending on the area of ​​the die (218), the spacing, etc.

[0064] The alignment pattern (111) may be placed on the upper surface of the plate (110). The alignment pattern (111) may be placed adjacent to each vacuum suction hole (110a) or placed next to a row or column of the vacuum suction hole (110a) on the upper surface of the plate (110).

[0065] As the above alignment pattern (111) is adjacent to the vacuum suction hole (110a), when each die (218) is placed on the vacuum suction hole (110a), the die (218) can be aligned with respect to the above alignment pattern (111), making it easier to arrange the die (218) in an accurate position.

[0066] The above chuck base (12) can be positioned below the mobile chuck (11). The mobile chuck (11) is seated on the upper side of the chuck base (12) and can be separated from the chuck base (12). That is, the mobile chuck (11) is detachably seated on the chuck base (12), and the chuck base (12) supports the mobile chuck (11).

[0067] When the number and arrangement of the above dies (218) are changed, the mobile chuck (11) must be replaced with one having a vacuum suction hole (110a) formed to correspond to the arrangement of the changed dies (218). In this case, the inspection process of the dies (218) can be performed by replacing only the mobile chuck (11) without changing the chuck base (12).

[0068] Accordingly, even if the arrangement shape of the die (218) is changed, the combination form of the die (218) having various arrangement shapes can be inspected quickly and easily. In addition, when it is necessary to transport the die (218) during the test process of the die (218), the die (218) can be transported by transporting the mobile chuck (11) on which each die (218) is mounted, so there is no need to transport multiple dies (218) individually, and the process time can be significantly reduced.

[0069]

[0070] As the mobile chuck (11) is seated on the upper side of the chuck base (12) and comes into direct contact, heat generated from the die (218) can be conducted to the mobile chuck (11) and the chuck base (12).

[0071] The chuck base (12) may include a temperature sensor (121) and a temperature control unit (122). The chuck base (12) can estimate the temperature of the die (218) by measuring the heat conducted from the die (218) through the temperature sensor (121).

[0072] Additionally, the chuck base (12) can cool the die (218) through the control unit (122) or heat the die (218) by generating heat.

[0073] Additionally, the chuck base (12) may be installed in the sorter chamber module (21) or test chamber module (23) described later, or in various other devices and locations other than the sorter chamber module (21) or test chamber module (23), so that the mobile chuck (11) can be placed in the required location.

[0074] At this time, that is, the parts where one or more mobile chucks (11) and one or more chuck bases (12) come into contact with each other can be made to have a common shape, so that inspection of various arrangements and types of dies can be performed simultaneously.

[0075]

[0076] FIG. 2 is a plan view of a die level test system (2) including a chuck (1) for die level testing equipped with a vapor chamber (112) shown in FIG. 1. Referring to FIG. 2, the die level test system (2) may include a sorter chamber module (21), a loader module (22), a test chamber module (23), and a control unit (24).

[0077] The sorter chamber module (21) can place a die (218) on the mobile chuck (11). The loader module (22) can transfer the mobile chuck (11) from the sorter chamber module (21) to the test chamber module (23). The test chamber module (23) can inspect the electrical characteristic state of the die (218) placed on the upper surface of the mobile chuck (11) using a probe tip (234). Additionally, the control unit (24) can control the sorter chamber module (21), the loader module (22), and the test chamber module (23).

[0078] The process of placing the die (218) on the upper surface of the mobile chuck (11) within the sorter chamber module (21), and the process of inspecting the electrical characteristic state of the die (218) within the test chamber module (23) are described in detail below.

[0079] In the description of this embodiment, the loader module (22) is depicted as having the form of a robot arm for convenience of explanation. However, in the present invention, the loader module (22) does not necessarily have to have the form of a robot arm; any structure capable of transporting the film body (220) and mobile chuck (11) into and out of the sorter chamber module (21) and test chamber module (23), or transporting them up, down, left, and right, may be applied. Additionally, the loader module (22) may be provided to transport the film body (220) and mobile chuck (11) from a cassette not shown, or to stack them. Although not shown in the drawings, the loader module (22) may be equipped with a pre-aligner (not shown) that pre-aligns the die (218) placed on the film body (220) described later.

[0080] FIG. 3 is a drawing illustrating a film body (220) supplied into the sorter chamber module (21). A die (218) sawn from a wafer can be brought into the sorter chamber module (21) in a state where it is placed on a thin film (217) as shown in FIG. 3 for ease of transport. Additionally, a thin frame (219) having rigidity is attached to the edge of the film (217) to fix the edge of the film (217) and maintain the tension of the film (217), and can serve as a support point for gripping or supporting during transport.

[0081] Hereinafter, the film (217) on which the die (218) is placed and the frame (219) that fixes the film (217) will be referred to as a film body (220). The film body (220) on which the die (218) is placed is supplied by stacking it in a cassette (not shown) not shown in the drawing, and the loader module (22) can take the film body (220) out of the cassette (not shown) and bring it into the sorter chamber module (21) described later. Alternatively, the film body (220) on which the die (218) has been tested can be brought back into the cassette (not shown) for storage.

[0082] FIGS. 4 to 11 are cross-sectional views illustrating the sorter chamber module (21) of FIG. 2. FIG. 12 is a drawing illustrating the process of transferring a die (218) from the film body (220) to the mobile chuck (11). FIG. 13 is a plan view illustrating the mobile chuck (11) with a plurality of dies (218) arranged thereon.

[0083] As illustrated in FIGS. 2 and FIGS. 4, a die level test system (2) according to one embodiment of the present invention may include a sorter chamber module (21), a test chamber module (23), a loader module (22), and a control unit (24).

[0084] The sorter chamber module (21) is provided with one or more chuck bases (12) on which a mobile chuck (11) is mounted, on which a plurality of dies (218) on which wafers are sawn are mounted, so that each of the dies (218) on which wafers are sawn can be transferred and arranged from a film body (220) on which the plurality of dies (218) on which wafers are sawn are mounted to the mobile chuck (11) mounted on the chuck base (12).

[0085] The test chamber module (23) is provided with one or more chuck bases (12) on which the mobile chuck (11) is seated, and can receive the mobile chuck (11) with the die (218) seated thereon from the sorter chamber module (21) and test the die (218) seated on the mobile chuck (11). The loader module (22) may be provided to take the mobile chuck (11) into and out of the sorter chamber module (21) and the test chamber module (23).

[0086] And, the control unit (24) may be configured to control the sorter chamber module (21), the test chamber module (23), and the loader module (22).

[0087] As illustrated in FIG. 4, the sorter chamber module (21) may include a first chamber (210), an upper base (211), a picker (212), a transfer unit (213), a first lower base (214), a first chuck base (215), and a second chuck base (216).

[0088] The first chamber (210) may form a receiving space (2101) inside. An upper base (211), a picker (212), a transfer unit (213), a first lower base (214), a first chuck base (215), and a second chuck base (216) may be received within the receiving space (2101). An entrance (2102) may be formed on one side of the first chamber (210). The entrance (2102) may connect the outside of the first chamber (210) with the receiving space (2101). Accordingly, the film body (220) and the mobile chuck (11) may be introduced into or withdrawn from the receiving space (2101) through the entrance (2102).

[0089] The upper base (211) is positioned on the upper side of the first chamber (210) so that the picker (212) and the transfer unit (213) may be positioned to face the first chuck base (215) and the second chuck base (216) in the third direction (DR3).

[0090] The picker (212) may be configured to pick up or place a die (218) placed on a film (217). A plurality of dies (218) may be placed on the film (217), and the picker (212) may be configured to pick up at least some or all of the plurality of dies (218) placed on the film (217). That is, the picker (212) may include at least one expandable and adsorbable column (212b) to pick up a plurality of dies (218) one by one or to pick up a plurality or all of them. Each column (212b) may expand in the vertical direction (DR3) and pick up a die (218) one by one.

[0091] The above picker (212) is positioned on the upper base (211) and can face the first chuck base (215) and the second chuck base (216) in a third direction (DR3). The picker (212) can be moved back and forth in the third direction (DR3). As the picker (212) moves back and forth in the third direction (DR3), the distance between the picker (212) and the first chuck base (215), and between the picker (212) and the second chuck base (216) can be varied.

[0092] The above transfer unit (213) may be positioned on the upper base (211). The transfer unit (213) may face the first chuck base (215) and the second chuck base (216) in a third direction (DR3). The transfer unit (213) may be raised and lowered in the third direction (DR3). Accordingly, the distance between the transfer unit (213) and the first chuck base (215), and between the transfer unit (213) and the second chuck base (216) may be variable.

[0093] As shown in FIG. 7, the above transfer unit (213) may include a pair of arms (2131) that extend downward from the upper base (211) and have a fork (2132) formed therein that is bent horizontally at the bottom. At this time, the fork (2132) may be bent and extended toward each other.

[0094] Additionally, the arm (2131) may be provided on the upper base (211) so as to be vertically movable in the third direction (DR3). At this time, the fork (2132) may be bent toward the second direction (DR2) and formed to be parallel to the first direction (DR1).

[0095] Additionally, the spacing between the pair of arms (2131) is wider than the maximum diameter of the frame (219) of the film body (220), and the spacing between the ends of the pair of forks (2132) can be formed to be smaller than the outer diameter of the frame (219) and wider than the diameter of the film (217).

[0096] Returning to FIG. 4, the first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the transfer unit (213).

[0097] The first lower base (214) can face the picker (212) and the transfer unit (213) in the third direction (DR3). Additionally, the first lower base (214) can be moved back and forth in the first direction (DR1).

[0098] Accordingly, the first lower base (214) may be moved to overlap with the picker (212) or the transfer unit (213) in the third direction (DR3), or moved so as not to overlap. The first chuck base (215) may be placed on the first lower base (214). For example, the first chuck base (215) may be placed on the upper surface of the first lower base (214). When the first lower base (214) reciprocates in the first direction (DR1), the first chuck base (215) placed on the first lower base (214) may also reciprocate in the first direction (DR1).

[0099] That is, the first chuck base (215) may be positioned below the picker (212) or below the transfer unit (213) depending on the movement of the first lower base (214).

[0100] The first chuck base (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153).

[0101] The first support member (2151) may be placed on the upper surface of the first lower base (214). The first support member (2151) may be formed in the shape of a column extending in the third direction (DR3).

[0102] The first stage (2152) may be placed on the first support member (2151). The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The upper surface of the first stage (2152) may have a film body (220) or a mobile chuck (11), which will be described later, placed on it.

[0103] A plurality of first lifts (2153) that reciprocate in a third direction (DR3) may be arranged on the edge of the first stage (2152). The first lifts (2153) may be moved reciprocally from the first stage (2152) in the third direction (DR3) and can be raised in the up and down direction. At this time, the width of the second direction (DR2) of the plurality of first lifts (2153) may be narrower than the spacing of the forks (2132).

[0104] The second chuck base (216) may be placed on the first lower base (214). For example, the second chuck base (216) may be placed on the first lower base (214). The first chuck base (215) and the second chuck base (216) may be arranged in a first direction (DR1). As the second chuck base (216) is placed on the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the second chuck base (216) may reciprocate in the first direction (DR1).

[0105] The second chuck base (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a column shape extending in a third direction (DR3). The second support member (2161) may move up and down in the third direction (DR3). The second stage (2162) may be placed on the second support member (2161).

[0106] The upper surface of the second stage (2162) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support the film body (220). Additionally, the width of the second direction (DR2) of the second stage (2162) may be narrower than the spacing of the fork (2132).

[0107] In addition, a sorter aligner (212a) for precisely fine-tuning the position of a plurality of dies (218) arranged on the mobile chuck (11) may be provided in the first chamber (210).

[0108] The first chuck base (215) and the second chuck base (216) may be one of the chuck bases (12) on which the mobile chuck (11) introduced into the first chamber (210) is seated. The chuck base (12) may adsorb and fix the seated mobile chuck (11) by means of vacuum pressure, etc., or it may be provided to cool the mobile chuck (11) or to heat the mobile chuck (11).

[0109] As illustrated in FIG. 4, a film body (220) with a die (218) placed thereon can be brought into the first chamber (210) through the entrance (2102). The film body (220) provided in the receiving space (2101) of the first chamber (210) can be placed on the first chuck base (215).

[0110] The film (217) of the above film body (220) has a predetermined adhesive force through the properties of the material itself or means such as an adhesive, and can fix the die (218) placed on the film (217). Accordingly, it is possible to prevent the die (218) from detaching from the film (217) due to external vibration or impact. In addition, the adhesive force may have a strength adjusted so that the die (218) can be easily separated from the film (217).

[0111] Meanwhile, when the film body (220) is brought into the first chuck base (215), the first lift (2153) may be raised upward and protruded toward the third direction (DR3). The film body (220) may be placed on and seated on the first lift (2153) that has been protruded upward. At this time, the first lift (2153) may support the frame (219) of the film body (220).

[0112] After the film body (220) is placed on the first lift (2153), as shown in FIG. 5, the transfer unit (213) can descend downward from the upper base (211) toward the first lower base (214).

[0113] In this state, as shown in FIG. 6, the first lower base (214) is moved to one side of the first direction (DR1) and moved toward the transfer unit (213), and accordingly, the first chuck base (215), the second chuck base (216), and the film body (220) can also be transferred toward the transfer unit (213).

[0114] Meanwhile, as illustrated in FIGS. 6 and 7, the transfer unit (213) is composed of a pair of arms (2131) and a fork (2132) as described above, and as the film body (220) moves in the first direction (DR1), the film body (220) is drawn between the pair of arms (2131) and above the fork (2132), and in that state, the first lift (2153) can be lowered.

[0115] As the first lift (2153) descends, the film body (220) can be placed on the fork (2132) of the transfer unit (213), as shown in FIG. 7.

[0116] After the film body (220) is placed on the transfer unit (213), as shown in FIG. 8, the first lower base (214) is moved to the other side of the first direction (DR1), and accordingly, the second chuck base (216) is also moved to the first direction (DR1) and placed below the transfer unit (213).

[0117] After the second chuck base (216) is placed below the transfer unit (213), the second support unit (2161) is raised in an upward direction to raise the second stage (2162) upward, thereby supporting the film body (220) supported by the transfer unit (213) on the lower side.

[0118] As illustrated in FIG. 9 and FIG. 12(a), after the second stage (2162) supports the film body (220), the first lower base (214) is moved in the first direction (DR1) direction so that the second chuck base (216), which supports the film body (220), can be positioned on the side directly below the picker (212).

[0119] Additionally, as shown in FIG. 9 and FIG. 12(b), after the second chuck base (216) is positioned directly below the picker (212), the second support member (2161) can be further raised until the die (218) of the film body (220) seated on the second stage (2162) comes into contact with the picker (212).

[0120] And, the picker (212) can pick up the dies (218) on the film body (220) one by one as each column (212b) is extended. That is, the dies (218) to be picked up can be picked up after their position is adjusted so that they are located directly below the picker (212).

[0121] To this end, the first lower base (214) may be configured to be horizontally movable not only in the first direction (DR1) but also in the second direction (DR2). Of course, the present invention is not limited thereto, and the first lower base (214) may be configured to move in the first direction (DR1), and the first support member (2151) or the second stage (2152) and the second support member (2161) or the second stage (2162) may be configured to move in the second direction (DR2).

[0122] This process can be repeated until each of the above dies (218) is picked up by the picker (212).

[0123] Of course, the present invention is not limited thereto, and at least some or all of the dies (218) mounted on the film body (220) can be picked up by adsorption at once. That is, some of the dies (218) mounted on the film body (220) can be picked up at once, or all of them can be picked up at once.

[0124] For example, among the dies (218) mounted on the film body (220), the dies (218) that match the position of the picker (212) are picked up at once, and the dies (218) that do not match the position of the picker (212) can be picked up after the position of the second chuck base (216) or the picker (212) is adjusted, or after the position of the dies (218) is adjusted using the sorter aligner (212a).

[0125] After the picker (212) picks a plurality of dies (218), the second support member (2161) and the second stage (2162) can be lowered as shown in (c) of FIG. 12.

[0126] Meanwhile, as shown in FIG. 8, while the second chuck base (216) supports the film body (220) by transferring it from the transfer unit (213), the mobile chuck (11) can be brought into the first chamber (210) and seated on the first chuck base (215).

[0127] The mobile chuck (11) can be brought onto the first stage (2152) of the first chuck base (215) by means of a loader module (22), etc. After the picker (212) has picked a plurality of dies (218), as shown in FIG. 10 and FIG. 12(d), the first lower base (214) is moved to one side of the first direction (DR1), so that the first stage (2152) with the mobile chuck (11) seated thereon can be positioned directly below the picker (212) that has picked the dies (218).

[0128] And, as illustrated in FIG. 10 and FIG. 12(e), the first support member (2151) can be raised so that the mobile chuck (11) is raised until it comes into contact with the lower side of the die (218) that is adsorbed to the picker (212).

[0129] And as each column of the above picker (212) extends and contracts, the adsorption of the die (218) is stopped so that the die (218) can be placed on the mobile chuck (11).

[0130] At this time, the picker (212) may place the adsorbed multiple dies (218) one by one individually, or may place the multiple dies (218) or all of the adsorbed dies (218) at once.

[0131] When the picker (212) places the die (218), the position where each die (218) is placed may be aligned and placed one by one, or if the position where the die (218) is placed in each column of the picker (212) and the position where the die (218) is placed in the mobile chuck (11) coincide, multiple or all of them may be placed at once. When the die (218) is placed on the upper surface of the mobile chuck (11), the position of each die (218) may be determined based on the alignment pattern (111). Although not shown, the sorter chamber module (21) may further include a vision camera. The vision camera acquires position information of each die (218) and the alignment pattern (111), and based on the position information, can align or correct the relative position between each die (218) and the alignment pattern (111) as shown in FIG. 6. For example, at least one of the vertices of the die (218) can be aligned so as to overlap with the center of the alignment pattern (111). By the alignment pattern (111), the die (218) can be easily arranged on the upper surface of the mobile chuck (11).

[0132] Additionally, the sorter aligner (212a) can finely adjust the position of the die (218) seated on the mobile chuck (11) so that each die (218) is positioned in the correct position.

[0133] The above picker (212) adsorbs a plurality of dies (218) from the film body (220) at once and places them on the mobile chuck (11) in the adsorbed state, thereby maintaining the relative positions between the plurality of dies (218) so that the precision of the arrangement can be improved and subsequent fine precision alignment work can be minimized so that the work speed can be improved.

[0134] Each of the above dies (218) can be arranged to correspond to the arrangement of vacuum suction holes (110a). When the arrangement of the dies (218) is completed, a vacuum pump (not shown) connected to the outside of the mobile chuck (11) can be operated so that each die (218) can be fixed on the upper surface of the mobile chuck (11).

[0135] After the placement of the die (218) on the mobile chuck (11) is completed, the first lift (2153) may be lowered as shown in FIG. 12(f) and FIG. 14, thereby lowering the mobile chuck (11). Afterward, the mobile chuck (11), with the die (218) seated, may be removed from the sorter chamber module (21) by the loader module (22), etc., as shown in FIG. 11, and then moved to the test chamber module (23). At this time, vacuum pressure is applied to the mobile chuck (11) from the outside through the loader module (22), etc., so that the vacuum suction hole (110a) is maintained in a vacuum state, thereby preventing the position of the die (218) from shifting due to shaking or impact occurring during the movement of the mobile chuck (11).

[0136] As illustrated in FIG. 15, the test chamber module (23) may include a second chamber (230), a second lower base (231), a third chuck base (235), a third support (232), a probe card (233), and a probe tip (234).

[0137] The second chamber (230) forms an inspection space (230a) capable of accommodating a second lower base (231), a third support (232), a probe card (233), and a probe tip (234), and an inspection entrance (230b) may be formed on one side. The inspection entrance (230b) may connect the inspection space (230a) to the outside of the test chamber module (23).

[0138] In FIG. 15, for convenience of explanation, the probe tip (234) is depicted as having one, but the probe tip (234) may be provided in multiple numbers as needed. Preferably, the probe tip (234) is provided in a number greater than the number of dies (218) placed on the mobile chuck (11), so that multiple dies (218) placed on the mobile chuck (11) can be inspected at once.

[0139] The mobile chuck (11) on which the die (218) is seated can be brought into or taken out of the inspection space (230a) through the inspection entrance (230b). The second lower base (231) is positioned at the bottom within the inspection space (230a), and the third support member (232) can be positioned on the second lower base (231).

[0140] The third support member (232) can reciprocate in the third direction (DR3), which is the vertical direction, on the second lower base (231). The third chuck base (235) can be placed on the third support member (232). The mobile chuck (11) can be placed on the third chuck base (235) by the loader module (22).

[0141] As the third chuck base (235) and the mobile chuck (11) are in direct contact and the die (218) is in direct contact with the mobile chuck (11), heat generated from the die (218) can be conducted to the mobile chuck (11) and the third chuck base (235).

[0142] The third chuck base (235) may be one of the chuck bases (12) that support the mobile chuck (11). The third chuck base (235) can control the heat of the die (218) by supporting the mobile chuck (11) and cooling or heating the mobile chuck (11).

[0143] The probe card (233) may be positioned above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0144] The probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233). The probe card (233) may be a device that connects the die (218) and a tester (not shown) to inspect the operation of the die (218). After the probe tip (234) connected to the probe card (233) contacts the die (218), it can determine whether the die (218) is defective based on the signal that returns after sending electricity to the die (218).

[0145] When the third support member (232) is raised in an upward direction, the die (218) placed on the upper surface of the mobile chuck (11) can be tested by contacting the probe tip (234).

[0146] After the test is completed, the mobile chuck (11) on which the test-completed die (218) is placed is transferred from the test chamber module (23) to the sorter chamber module (21) by the loader module (22), and the die (218) placed on the mobile chuck (11) can be transferred to the film body (220) in the reverse order of the above-described order.

[0147] Additionally, the film body (220) on which the tested die (218) is placed can be transferred from the sorter chamber module (21) to a cassette (not shown) by the loader module (22) and stored.

[0148]

[0149] Meanwhile, as described above, in order for the test of the die (218) to be performed in the test chamber module (23), the mobile chuck (11) on which the die (218) is placed can be seated on the third chuck base (235).

[0150] Meanwhile, when a test is performed in the test chamber module (23), heat may be generated in the die (218). In order to perform an accurate test, it is necessary to maintain the temperature of the die (218) at a constant level, so it is necessary to cool the die (218).

[0151] The heat generated from the above die (218) can be conducted and discharged from the mobile chuck (11) through the third chuck base (235).

[0152] At this time, for smoother heat transfer, the mobile chuck (11) and the third chuck base (235) must be in close contact.

[0153] However, if the surface contacting the mobile chuck (11) and the third chuck base (235) is worn out due to prolonged use or if there is a problem with flatness due to scratches or thermal deformation during use, the mobile chuck (11) and the third chuck base (235) may not be in close contact, which may hinder heat conduction, and if contaminants are present, resistance to heat conduction may occur.

[0154] In this case, the temperature of the mobile chuck (11) may be formed unevenly depending on the heating deviation between the plurality of dies (218), and this may cause a decrease in heat transfer performance.

[0155] Therefore, it is necessary to rapidly and uniformly diffuse the heat from the surface on which the die (218) of the mobile chuck (11) is positioned into the mobile chuck (11) and transfer it to the third chuck base (235).

[0156] Additionally, in order to uniformly control the temperature of the die (218) to a temperature suitable for testing, it may be necessary to raise the temperature of each die (218) by heating the mobile chuck (11). In this case as well, it is necessary to rapidly and uniformly spread the temperature within the mobile chuck (11) so that heat is transferred to the die (218) placed on one side of the mobile chuck (11).

[0157] A die level test chuck (1) equipped with a vapor chamber (112) according to one embodiment of the present invention may include a mobile chuck (11) and a chuck base (12), as shown in FIG. 16. At this time, a plurality of vacuum adsorption holes (110a) may be formed on one surface of the mobile chuck (11) so that the die (218) is vacuum adsorbed and fixed thereto. Additionally, the mobile chuck (11) may include a vapor chamber (112) that diffuses and transfers heat generated from the die (218) placed on the one surface to the chuck base (12), or diffuses and transfers heat generated from the chuck base (12) to the die (218) placed on the one surface.

[0158] At this time, the chuck base (12) may be the third chuck base (235) of the aforementioned test chamber module (23). Of course, the first chuck base (215) or the second chuck base (216) of the sorter chamber module (21) may also be one of the chuck bases (12).

[0159]

[0160] The above mobile chuck (11) has a die (218) placed on one surface and is configured to adsorb and fix the placed die (218). In this embodiment, it will be explained by using a vacuum to adsorb and fix the die (218).

[0161] One side of the mobile chuck (11) is formed as a flat surface without curvature so that a die (218) is placed thereon, and a plurality of vacuum suction holes (110a) may be formed to suction and fix the placed die (218).

[0162] Additionally, a temperature sensor (121) for measuring temperature may be provided inside the mobile chuck (11). The temperature sensor (121) is provided on the inner side from one surface of the mobile chuck (11) and can indirectly measure the temperature of the die (218) by measuring the temperature of the mobile chuck (11) which is heated by the heat generated by the die (218). In this embodiment, the temperature sensor (121) is described as being located approximately 1.5 mm inward from one surface of the mobile chuck (11). Of course, this is merely one example, and the temperature sensor (121) may be provided on the mobile chuck (11), but it may also be provided on the chuck base (12).

[0163] The above vapor chamber (112) is provided on the other side of the vacuum chuck to diffuse the heat of the mobile chuck (11) through which the heat of the die (218) is conducted. The vapor chamber (112) can rapidly diffuse the heat of the die (218) conducted to the mobile chuck (11) by undergoing a phase change as the working liquid provided inside circulates.

[0164] At this time, the vapor chamber (112) may be formed on the lower side of the mobile chuck (11) that contacts the chuck base (12).

[0165] In addition, a temperature control unit (122) for controlling the temperature of the mobile chuck (11) may be provided.

[0166] The temperature control unit (122) may include a cooling channel (1221) and a heater (1222), as shown in FIG. 16.

[0167] The cooling channel (1221) may be provided in the chuck base (12) to dissipate heat diffused from the vapor chamber (112). The cooling channel (1221) may be provided with a refrigerant flowing inside to dissipate heat diffused and transferred from the vapor chamber (112) to the outside. At this time, the refrigerant may always be operated at a temperature lower than that of the mobile chuck (11).

[0168] That is, the heat diffused by the vapor chamber (112) is dissipated to the outside by the cooling channel (1221). As the heat is evenly diffused and transferred by the vapor chamber (112), the uniformity of the temperature is increased, and the cooling speed can also be improved.

[0169] Additionally, the heater (1222) can heat the mobile chuck (11) to maintain a constant temperature. For example, the die (218) is normally heated to maintain a constant temperature, but when the heat output of the die (218) increases and the temperature rises, the output of the heater (1222) is reduced, and when the heat output of the die (218) decreases and the temperature falls, the output of the heater (1222) is controlled to increase.

[0170] At this time, the heater (1222) may be provided on the chuck base (12) or on the mobile chuck (11). The heater (1222) may be a heating element that generates heat through electricity, or it may be provided to heat the chuck base (12) or the mobile chuck (11) through a heat medium circulating through a flow path.

[0171] FIG. 17 is a diagram showing the temperature distribution according to the position of a conventional die level test chuck and a die level test chuck (1) equipped with a vapor chamber (112) of the present embodiment when the heat input is 50 W / cm2. That is, as shown in FIG. 17 (a), when the heat generated from the die (218) adsorbed at the center of the mobile chuck (11) is 1.25 kW (50 W / cm2), the temperature change over time at a position spaced apart from the center of the mobile chuck (11) is shown by comparing the conventional die level test chuck and the die level test chuck (1) of the present embodiment.

[0172] Figure 17 (b) is a graph showing the temperature change by position over time of a conventional die level test chuck, and Figure 17 (c) is a graph showing the temperature change by position over time of a die level test chuck (1) equipped with a vapor chamber (112) of the present embodiment.

[0173] As shown in FIG. 17, it can be seen that the die level test chuck (1) equipped with the vapor chamber (112) of the present embodiment maintains a lower temperature than a conventional die level test chuck over time.

[0174] FIG. 18 is a diagram illustrating the temperature distribution according to the position of a conventional die level test chuck and a die level test chuck (1) equipped with a vapor chamber (112) of the present invention when the heat input is 20 W / cm2. That is, as shown in FIG. 18 (a), when the heat generated from the die (218) adsorbed at the center of the mobile chuck (11) is 500 W (20 W / cm2), the temperature change over time at a position spaced apart from the center of the mobile chuck (11) is illustrated by comparing the conventional die level test chuck and the die level test chuck (1) of the present embodiment.

[0175] FIG. 18(b) is a graph showing the temperature change by position over time of a conventional die level test chuck, and FIG. 18(c) is a graph showing the temperature change by position over time of a die level test chuck (1) equipped with a vapor chamber (112) of the present embodiment.

[0176] As shown in FIG. 18, the temperature at the central point where heat is generated in a conventional die level test chuck fluctuates by approximately 20 degrees Celsius depending on the heat generation of the die (218), but the die level test chuck (1) equipped with the vapor chamber (112) of the present embodiment shows a temperature at the central point fluctuates by approximately 2 degrees Celsius, so it can be seen that the temperature distribution is maintained uniformly.

[0177] Meanwhile, the above vapor chamber (112) may include a first plate (1121), a second plate (1122), a rigid column (1123), and a wick (1125), as shown in FIGS. 19 and 20.

[0178] The first plate (1121) forms one side of the vapor chamber (112), and the second plate (1122) may be combined with the first plate (1121) to form a chamber (1126) between the first side and the second plate (1122). The chamber (1126) may be sealed to prevent gas or liquid from leaking out and may be formed of a material with excellent thermal conductivity.

[0179] Meanwhile, the above rigid columns (1123) may be provided in multiple numbers within the chamber (1126) such that one end is connected to the first plate (1121) and the other end is connected to the second plate (1122) to support the first plate (1121) and the second plate (1122).

[0180] At this time, the rigid column (1123) may be made of copper or a copper-containing alloy component that has excellent thermal conductivity and some degree of rigidity.

[0181] In addition, a wick (1125) is provided within the chamber (1126). The wick (1125) can serve as a passage for the working liquid within the chamber to flow through.

[0182] At this time, the wick (1125) forms an operating column (1124) connecting the first plate (1121) and the second plate (1122) within the chamber, and the operating column (1124) may be formed to wrap around the outer circumference of the rigid column (1123).

[0183] That is, the operating column (1124) of the wick (1125) is formed around the outer circumference of the rigid column (1123).

[0184] Alternatively, as shown in FIGS. 20 and 23, the operating column (1124) may be formed separately from the rigid column (1123) and spaced apart from the rigid column (1123).

[0185] As shown in FIG. 21 (a), only the operating column (1124) of the wick (1125) may be provided without the rigid column (1123). In this case, if the pressure inside the chamber (1126) rises due to the vapor pressure inside the vapor chamber (112) caused by heating, deformation may occur in the vapor chamber (112). However, as shown in FIG. 19, FIG. 21 (b), and FIG. 22, when the rigid column (1123) is provided, the two ends of the rigid column (1123) are respectively connected to the first plate (1121) and the second plate (1122), thereby preventing deformation of the first plate (1121) or the second plate (1122).

[0186] FIG. 24 is a drawing showing the deformation of a vapor chamber (112) at an internal pressure of 20 bar when a vapor chamber (112) with a structure without a rigid column (1123) is applied, and FIG. 25 is a drawing showing the deformation of a vapor chamber (112) at an internal pressure of 20 bar when a vapor chamber (112) of a die level test chuck (1) equipped with a vapor chamber (112) according to an embodiment of the present invention is applied.

[0187] FIG. 24 shows the deformation of the vapor chamber (112) when the internal pressure is 20 bar when a vapor chamber (112) with a structure without rigid columns (1123) is applied. As shown in FIG. 24, in the case of a vapor chamber (120) without rigid columns (1123), when the internal pressure is about 20 bar, the maximum deformation amount is 4.182 mm or more at the center of the vapor chamber (120), so flatness cannot be maintained. As shown in FIG. 24, the deformation amount in the brightest area (the center and its periphery) is close to or greater than 4.182 mm, showing the largest deformation, while the deformation amount in the dark area (outer edge) is close to 1.000e-30 mm, showing almost no deformation or minimal deformation. Therefore, the mobile chuck (11) located on one side of the vapor chamber (112) may also be deformed or tilted.

[0188] FIG. 25 shows the deformation of a vapor chamber (112) when the internal pressure is 20 bar, when a vapor chamber (112) equipped with a rigid column (1123) according to one embodiment of the present invention is applied. For readability, the drawing is divided into zones I, II, III, and IV according to the degree of deformation.

[0189] As shown in FIG. 25, in the case of a vapor chamber (112) equipped with a rigid column (1123), it can be seen that there is practically no deformation when the internal pressure is 20 bar, with the amount of deformation being 0.001 mm or less. The maximum amount of deformation appears to be up to 9.121e-04 mm in local zone IV. In Zone I, which is the periphery area of ​​the vapor chamber (120), a region with substantially minimal deformation in the range of 1.000e-30mm to 3.000e-04mm appears, and Zone II, which is inside Zone I, shows a tendency for deformation in the range of 3.00e-04mm to 6.384e-04mm, and Zone III, which is distributed inside Zone II, shows an overall low deformation in the range of 7.297e-04mm to 3.648e-04mm in the area excluding Zone IV, which indicates that deformation is suppressed by the rigid column (1123). In Zone III, the part where the shading appears relatively darker shows deformation in the range of 6.384e-04mm to 3.648e-04mm, and the part where the shading appears relatively lighter in Zone III shows deformation in the range of 7.297e-04mm to 6.384e-04mm. In other words, it can be seen that the deformation in the part within Zone III where the amount of deformation is relatively small is suppressed by the rigid column (1123).

[0190] That is, in the case of a vapor chamber (112) with a structure equipped with rigid columns (1123), when the internal pressure is 20 bar, it can be seen that the amount of deformation is 1 μm or less, so there is practically no deformation or very little deformation. At this time, the diameter of the rigid columns (1123) is 7 mm, and the spacing between the rigid columns (1123) may be about 17 mm.

[0191] Therefore, it can be seen that the die level test chuck (1) equipped with the vapor chamber (112) according to the present embodiment has excellent heat release rate as well as uniformity, and is also effective in managing flatness due to the increase in vapor pressure inside the vapor chamber (112).

[0192] Therefore, when the mobile chuck (11) is seated on the chuck base (12), the flatness is maintained so that it can be in close contact with the chuck base (12), allowing the temperature of the mobile chuck (11) to be transferred more quickly and effectively.

[0193]

[0194] Although embodiments of the present invention have been described, the spirit of the present invention is not limited by the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such are also to be considered to fall within the scope of the spirit of the present invention.

Claims

1. A mobile chuck on which multiple dies with sawn wafers are placed; A chuck base on which the above-mentioned mobile chuck is mounted; Includes, The above mobile chuck is, A plurality of vacuum suction holes are formed on one surface so that the above die is vacuum-adsorbed and fixed, and A vapor chamber that diffuses and transfers heat generated from a die disposed on the above-mentioned surface to the chuck base, or diffuses and transfers heat generated from the chuck base to a die disposed on the above-mentioned surface; A die chuck equipped with a vapor chamber, including 2. In Paragraph 1, A die chuck equipped with a vapor chamber, comprising a temperature control unit for controlling the temperature of the mobile chuck.

3. In Paragraph 2, The above temperature control unit is, A cooling channel provided in the above chuck base, through which a refrigerant flows to dissipate heat diffusing from the above vapor chamber; A heater provided on the chuck base or the mobile chuck to heat a die mounted on the mobile chuck; A die chuck equipped with a vapor chamber, including 4. In Paragraph 3, A die chuck equipped with a vapor chamber, equipped with a sensor for measuring the temperature of a mobile chuck heated by the above die.

5. In Paragraph 4, A die chuck equipped with a vapor chamber, wherein the temperature control unit controls the temperature of the die to maintain a constant temperature by reducing the output of the heater when the heat generation amount of the die increases.

6. In Paragraph 1, The above vapor chamber is, A first plate forming one surface; A second plate combined with the first plate to form a chamber between it and the one surface; A plurality of rigid columns provided within the chamber, with one end connected to the first plate and the other end connected to the second plate to support the first plate and the second plate; A wick provided within the chamber through which the working fluid flows; A die chuck equipped with a vapor chamber, comprising 7. In Paragraph 6, The above wick forms an operating column connecting the first plate and the second plate within the chamber, and A die chuck equipped with a vapor chamber, wherein the above-mentioned operating column is formed to surround the outer circumference of the above-mentioned rigid column.

8. In Paragraph 6, The above wick forms an operating column connecting the first plate and the second plate within the chamber, and The above-mentioned operating column is a die chuck equipped with a vapor chamber formed spaced apart from the above-mentioned rigid column.

9. In Paragraph 1, When the mobile chuck is seated on the chuck base, A die chuck equipped with a vapor chamber, wherein the lower surface of the vapor chamber is formed to be in surface contact with the upper surface of the chuck base.

Images