An LED filament
The LED filament's wire-bonded mesh wiring configuration improves resilience and reliability by providing redundant power paths while minimizing complexity and material use, addressing the challenges of damage in existing designs.
WO2026149843A1PCT designated stage Publication Date: 2026-07-16SIGNIFY HOLDING BV
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SIGNIFY HOLDING BV
- Filing Date
- 2025-12-30
- Publication Date
- 2026-07-16
AI Technical Summary
Technical Problem
Existing LED filaments face challenges in reliability and resilience to physical or thermal damage, with additional interconnections for redundancy increasing manufacturing complexity and size.
Method used
An LED filament design featuring wire-bonded LED chips with limited connections to other chips, forming redundant power paths through a mesh wiring arrangement that minimizes additional wiring and complexity.
Benefits of technology
The design enhances resilience and reliability by ensuring redundant power paths without significant material or manufacturing complexity, reducing the impact of individual chip failures.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure EP2025089165_16072026_PF_FP_ABST
Abstract
A mechanism for interconnecting LED chips of an LED filament. Each LED chip comprises one or more LEDs connected between a first node and a second node. For each of a set of one or more LED chips, each of the first and / or second nodes is connected to a first / second node of a respective first LED chip and a first / second node of a respective second other LED chip. The first and second node of each LED chip is connected to no more than one other first node and no more than one other second node.
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