Substrate stop position setting device, substrate stop position setting method, and component mounting system

Abstract

This substrate stop position setting device is used in a component mounting machine having: a mounting head; a head movement device that moves the mounting head in an X direction and a Y direction, which are horizontal directions; a substrate conveyance device that conveys a substrate in the X direction and positions the substrate; and a control device that controls the substrate conveyance device so that the substrate is conveyed to a stop position and positioned, and controls the mounting head and the head movement device so that a component supplied by a component supply device is collected by the mounting head and mounted at a mounting position of the substrate. The substrate stop position setting device acquires the mounting position and a mounting condition of a component with respect to the substrate, and sets the stop position of the substrate so that the mounting position of the component falls within an area satisfying the acquired mounting condition of the component among a plurality of areas to which different mounting conditions are assigned in the movable area of the mounting head.

Description

Substrate Stop Position Setting Device, Substrate Stop Position Setting Method, and Component Mounting System

[0001] This specification discloses a substrate stop position setting device, a substrate stop position setting method, and a component mounting system.

[0002] Conventionally, in a component mounting method of a component mounting device that executes a component mounting process of taking out components from a component supply unit and mounting them on a substrate by a mounting head movable along the X-axis and Y-axis, an alignment jig substrate is imaged to calculate the amount of displacement of the mounting head for each observation point, and based on the amount of displacement for each observation point, a correction amount in the XY direction of the head unit is calculated for each observation point to execute the component mounting process (see, for example, Patent Document 1). Also, in the component mounting method, when the substrate includes a high-precision area where higher-precision component mounting is required compared to other areas in a part of it, an area corresponding to the high-precision area of the alignment jig substrate is imaged as an imaging area, and the movement amount of the head unit is calculated for each observation point in the imaging area.

[0003] Japanese Patent Application Laid-Open No. 2023-135468

[0004] However, in the method of imaging the alignment jig substrate and calculating the correction amount for each observation point, although the more observation points there are, the more components can be mounted with high mounting accuracy, the processing time becomes longer. Therefore, when mounting components so as to satisfy the mounting conditions required for the substrate, it is desirable to have a simpler process.

[0005] The main object of the present disclosure is to mount components so as to satisfy the mounting conditions required for the substrate by a simple process.

[0006] The present disclosure has adopted the following means to achieve the above main object.

[0007] The substrate stop position setting device of this disclosure is used in a component mounting machine having a mounting head capable of picking up components, a head moving device for moving the mounting head in the horizontal X and Y directions, a substrate transport device for transporting and positioning the substrate in the X direction, and a control device that controls the substrate transport device so that the substrate is transported to a stop position and positioned, and controls the mounting head and the head moving device so that components supplied by a component supply device are picked up by the mounting head and mounted on the mounting position on the substrate. The substrate stop position setting device sets the stop position of the substrate and acquires the mounting position and mounting conditions of the components on the substrate, and sets the stop position of the substrate so that the mounting position of the components falls within an area that satisfies the acquired mounting conditions of the components, among a plurality of areas in the movable area of ​​the mounting head to which different mounting conditions are assigned.

[0008] In the substrate stop position setting device of this disclosure, by setting the stop position of the substrate, the mounting head can mount components in an area of ​​its movable area that satisfies the required mounting conditions for the substrate. As a result, components can be mounted to satisfy the required mounting conditions for the substrate with a simple process.

[0009] This is a schematic diagram of the component mounting system. This is a schematic diagram of the component mounting machine. This is a schematic diagram of the substrate transport device. This is a block diagram showing the electrical connection relationship between the component mounting machine and the control device. This is a flowchart showing an example of the substrate stop position setting process. This is an explanatory diagram showing an example of the mounting position and mounting accuracy of components P1 to P4. This is an explanatory diagram showing the substrate stop position when mounting components P1 to P4 on the substrate S. This is a flowchart showing the substrate stop position setting process according to another embodiment. This is an explanatory diagram showing an example of the mounting position, mounting accuracy and load accuracy of components P1 to P4.

[0010] Next, the forms for implementing this disclosure will be described with reference to the drawings.

[0011] Figure 1 is a schematic diagram of the component mounting system 1. Figure 2 is a schematic diagram of the component mounting machine 10. Figure 3 is a schematic diagram of the substrate transport device 20. Figure 4 is a block diagram showing the electrical connection relationship between the component mounting machine 10 and the management device 60. In Figures 1, 2, and 3, the left-right direction is the X direction, the front-back direction is the Y direction, and the up-down direction is the Z direction.

[0012] The component mounting system 1 produces a substrate S on which multiple components P are mounted. As shown in Figure 1, it comprises multiple component mounting machines 10 arranged in the transport direction of the substrate S (left-right direction, X direction) and a management device 60 that manages the entire system.

[0013] The component mounting machine 10 takes components P supplied from a feeder F and mounts them onto a substrate S. As shown in Figure 2, it comprises a housing 11, a base 12, a substrate transport device 20, a mounting head 30, a head moving device 40, and a mounting control device 50 (see Figure 4). The substrate transport device 20, the mounting head 30, and the head moving device 40 are housed in the housing 11. A feeder stand (not shown) is installed at the front of the base 12, and the feeder F is detachably mounted to the feeder stand so that it is aligned left to right (X direction) through an opening formed in front of the housing 11.

[0014] The substrate transport device 20 is a belt conveyor device that transports substrates S by placing them on a conveyor belt 22. As shown in Figure 3, the substrate transport device 20 comprises a pair of side frames 21 that extend in the left-right direction (X direction) and are arranged at a predetermined distance from each other in the front-back direction (Y direction), a conveyor belt 22 stretched over a pair of rollers provided at both the left and right ends of the pair of side frames 21, a belt drive device 23 (see Figure 4) that drives the conveyor belt 22 in a circular motion, a substrate detection sensor 24 (see Figures 4 and 5), and a clamping device 25.

[0015] The clamping device 25 clamps the substrate S on the conveyor belt 22 at any position in the X direction. As shown in Figure 3, the clamping device 25 includes a pair of substrate holding plates 26 provided at the upper ends of a pair of side frames 21, a pair of clampers 27, and a lifting device 29 that raises and lowers the pair of clampers 27 using a support plate 28 driven by a motor (not shown). The support plate 28 is provided with a plurality of backup pins to support the back surface of the substrate S when the substrate S is clamped.

[0016] A pair of clampers 27 are supported on corresponding side frames 21 so as to be able to move up and down. Each clamper 27 has a projection 27a that protrudes downward from its lower end surface. The pair of clampers 27 are pushed up when the support plate 28 is raised by the lifting device 29, causing the upper surface of the support plate 28 to come into contact with the projection 27a. The clamping device 25 pushes up the substrate S with the clampers 27 at any position on the conveyor belt 22, causing the substrate S to abut against the substrate holding plate 26 and clamp it.

[0017] The substrate detection sensor 24 detects substrates S being transported onto the conveyor belt 22, and is configured as a transmissive optical sensor comprising a light-emitting unit and a light-receiving unit, which are provided at the entrance of the substrate transport path and opposite each other across the substrate transport path.

[0018] The mounting head 30 includes one or more suction nozzles 31 that receive negative pressure from a negative pressure source (not shown) to attract parts, a Z-axis actuator 32 (see Figure 4) that raises and lowers the suction nozzles 31, and a θ-axis actuator 33 (see Figure 4) that rotates the suction nozzles 31 around their axis.

[0019] As shown in Figure 2, the head moving device 40 moves the mounting head 30 horizontally (XY direction). The head moving device 40 includes an X-axis slider 41, a Y-axis slider 42, an X-axis actuator 43 (see Figure 4), and a Y-axis actuator 44 (see Figure 4).

[0020] The Y-axis slider 42 extends in the left-right direction (X direction) and is attached to a pair of left and right Y-axis guide rails 46 installed on the upper part of the housing 11 so as to extend in the front-rear direction (Y direction). The Y-axis actuator 44 is fixed to the upper part of the housing 11 and is attached to the center of the Y-axis slider 42 in the X direction to move the Y-axis slider 42 back and forth (Y direction). In this embodiment, a linear motor is used as the Y-axis actuator 44, but an electric ball screw mechanism may also be used.

[0021] The X-axis slider 41 is mounted on a pair of upper and lower X-axis guide rails 45 that are installed in front of the Y-axis slider 42 so as to extend in the left-right direction (X direction). The X-axis actuator 43 is provided between the X-axis slider 41 and the Y-axis slider 42 and moves the X-axis slider 41 left and right. In this embodiment, a linear motor is used as the X-axis actuator 43, but an electric ball screw mechanism may also be used.

[0022] The mounting head 30 is attached to the X-axis slider 41. The head movement device 40 can move the mounting head 30 forward, backward, left, and right (XY directions) by driving and controlling the X-axis actuator 43 and the Y-axis actuator 44. The head movement device 40 also includes an X-axis position sensor 47 for detecting the position of the mounting head 30 in the X direction and a Y-axis position sensor 48 for detecting the position of the mounting head 30 in the Y direction.

[0023] The component mounting machine 10 also includes a mark camera 51 and a parts camera 52. The mark camera 51 is used to confirm the stopping position of the substrate S by imaging a reference mark attached to the substrate S from above, and to confirm the mounting position of the components P mounted on the substrate S by imaging the components P from above. The parts camera 52 is used to check for any suction errors or measure the amount of suction misalignment by imaging the suction nozzle 31 from below after the suction operation.

[0024] The mounting control device 50 is composed of a well-known CPU, ROM, RAM, etc. The mounting control device 50 receives position signals from the X-axis position sensor 47 and the Y-axis position sensor 48, and image signals from the mark camera 51 and the parts camera 52. The mounting control device 50 also outputs drive signals to the substrate transport device 20, the mounting head 30, the head moving device 40, the mark camera 51, the parts camera 52, etc.

[0025] The mounting control device 50 (CPU) executes a mounting process to mount components onto the substrate S. First, the mounting control device 50 transports (loads) the substrate S to a preset substrate stopping position using the belt drive device 23 of the substrate transport device 20, and then clamps the substrate S with the clamp device 25. Loading the substrate S is performed, for example, by setting the distance between the entrance of the substrate transport path of the substrate transport device 20 and the substrate stopping position as the target transport amount of the substrate S, and when the substrate S is detected by the substrate detection sensor 24 installed at the entrance of the substrate transport path, the belt drive device 23 is controlled so that the substrate S is transported by the set target transport amount. Details of the substrate stopping position will be described later.

[0026] Next, the mounting control device 50 moves the mounting head 30 above the component supply position of the feeder F using the head moving device 40. Then, the mounting control device 50 lowers the suction nozzle 31 using the Z-axis actuator 32 to pick up the component P with the suction nozzle 31. Next, the mounting control device 50 moves the component P picked up by the suction nozzle 31 above the part camera 52 using the head moving device 40 and takes an image of the component P with the part camera 52. The mounting control device 50 processes the image of the component P to measure the amount of suction displacement of the component P and corrects the mounting position of the component P on the substrate S. Then, the mounting control device 50 moves the component P picked up by the suction nozzle 31 above the corrected mounting position using the head moving device 40, and lowers the suction nozzle 31 using the Z-axis actuator 32 to mount the component P on the substrate S. The mounting control device 50 repeats this mounting process until the required number of components P are mounted, and then releases the clamp on the substrate S using the substrate transport device 20 and discharges the substrate S to the next stage.

[0027] The management device 60 is a general-purpose computer and, as shown in Figure 4, comprises a CPU 61, ROM 62, RAM 63, and a storage unit 64 such as a hard disk drive or solid-state drive. An input device 65 such as a keyboard or mouse and a display device 66 are connected to the management device 60. The storage unit 64 stores production schedules, job information, status information, etc. This information is managed for each component mounting machine 10. Here, the production schedule is a schedule that defines which components to mount on which substrate S in what order, and how many substrates S (products) to be manufactured in that manner, for each component mounting machine 10. Job information is information about the mounting process (job) that each component mounting machine 10 should execute. This job information includes the type of substrate S to be produced, the number and type of components P to be mounted, the mounting position of each component P, and the arrangement of feeders F (components) for each job. Status information is information that indicates the operating status of each component mounting machine 10. This status information includes statuses such as "in production," "changing setup," and "anomaly occurring."

[0028] The management device 60 is connected to the mounting control device 50 so as to be able to communicate with it and exchanges various information with each component mounting machine 10. The management device 60 receives the operating status from each component mounting machine 10 and updates the status information to the latest information.

[0029] Next, the operation of the component mounting system 1 configured in this way will be described. In particular, the operation of setting the stopping position (board stopping position) of the board S to be transported by the board transport device 20 will be described. Figure 5 is a flowchart showing an example of the board stopping position setting process executed by the CPU 61 of the management device 60. This process is performed for each component mounting machine 10 prior to the execution of a job (mounting process) in the component mounting machine 10.

[0030] When the board stop position setting process is executed, the CPU 61 of the management device 60 first sets up multiple mountable areas to which the mounting accuracy of the mounting head 30 is assigned (S100). This process is performed, for example, by dividing the area in which the mounting head 30 can mount components P (the area on the board transport device 20 to which the head moving device 40 can move the mounting head 30) into multiple areas in the X direction, and assigning the mounting accuracy of the mounting head 30 to each area. The division into multiple areas may be performed by an operator operating the input device 65, or it may be performed automatically. The assignment of mounting accuracy can be performed, for example, by the following procedure. That is, the CPU 61 has the component mounting machine 10 mount multiple components P on the board S at multiple different positions, and measures the position of the mounting head 30 (head position) and the amount of positional deviation of the mounted component P when each component P is mounted. The head position can be measured using the X-axis position sensor 47 and the Y-axis position sensor 48. Furthermore, the amount of misalignment can be measured by capturing an image of the mounted component P with the mark camera 51, recognizing the component P from the captured image, and calculating the difference from the reference position (original mounting position). Next, the CPU 61 acquires multiple sets of the head position and the amount of misalignment of the component P from the component mounting machine 10, aggregates the amount of misalignment of the component P for each area, and calculates the variation in the amount of misalignment for each area, for example, 3σ (σ is the standard deviation). Then, the CPU 61 assigns a mounting accuracy to each area such that the smaller the variation in the amount of misalignment (3σ), the higher the accuracy. As described above, the Y-axis slider 42 is a suspended slider that extends in the X direction and is attached to the Y-axis actuator 44 at its center in the X direction. It is thought that the further the mounting head 30, which is a heavy object, moves from the center of the Y-axis slider 42 in the X direction, the greater the deformation of the Y-axis slider 42, and the lower the mounting accuracy of the mounting head 30. Therefore, in this embodiment, the area where the mounting head 30 is located near the center in the X direction relative to the Y-axis slider 42 is designated as a high-precision mounting area with relatively high mounting accuracy, while the area where the mounting head 30 is located near the end in the X direction relative to the Y-axis slider 42 is designated as a low-precision mounting area with relatively low mounting accuracy.Furthermore, the process in S100 may be performed before the shipment of the component mounting system 1. Also, since the deformation of the Y-axis slider 42 tends to increase with prolonged use, the process in S100 may be performed when the cumulative usage time reaches a predetermined time.

[0031] Next, the CPU 61 acquires the mounting position and required mounting accuracy of the components P (components to be mounted) that the component mounting machine 10 should mount (S110). Figure 6 is an explanatory diagram showing an example of the mounting position and mounting accuracy of components P1 to P4. Then, the CPU 61 determines whether or not there are any components among the acquired components that require high mounting accuracy (S120). Components that require high mounting accuracy include, for example, components P1, P2, and P4 in Figure 6. If the CPU 61 determines that there are no components that require high mounting accuracy, it sets the initial position to the board stop position (S130) and terminates the board stop position setting process.

[0032] On the other hand, if the CPU 61 determines that there are components to be mounted that require high-precision mounting accuracy, it determines whether the distribution width in the X direction of the mounting positions of all the relevant components (for example, components P1, P2, and P4) is less than or equal to the width D in the X direction of the high-precision mounting area (S140). The distribution width in the X direction of the mounting positions can be obtained by calculating the distance between the mounting position on the one end in the X direction and the mounting position on the other end in the X direction of the mounting positions (x, y) of the components to be mounted that require high-precision mounting accuracy. For example, the distribution width in the X direction of the mounting positions of components P1, P2, and P4 shown in Figure 6 can be obtained by calculating the distance between the mounting position x2 of component P2, which is mounted on the one end in the X direction, and the mounting position x4 of component P4, which is mounted on the other end in the X direction. When the CPU 61 determines that the distribution width in the X direction of the mounting positions of all components requiring high mounting accuracy is less than or equal to the width D in the X direction of the high-precision mounting area, it sets the board stop position so that the mounting positions of all components requiring high mounting accuracy fall within the high-precision mounting area (S150), and then terminates the board stop position setting process.

[0033] On the other hand, if the CPU 61 determines that the distribution width in the X direction of the mounting positions of all components to be mounted that require high-precision mounting accuracy is not less than or equal to the width D in the X direction of the high-precision mounting area, it groups the components to be mounted that require high-precision mounting accuracy in units of the width D in the X direction of the high-precision mounting area (S160). The grouping is done by dividing the mounting positions of all components to be mounted that require high-precision mounting accuracy from the position at the one end in the X direction to the position at the other end by the width D in the X direction of the high-precision mounting area, and grouping them by section. For example, this is done by dividing components P1, P2, and P4 shown in Figure 6 into a group of components P1 and P2 and a group of component P4. Then, the CPU 61 sets the board stop position so that the mounting positions of the components to be mounted that belong to one group fall within the high-precision mounting area (S170), and assigns the mounting of the components to be mounted that belong to other groups to other component mounting machines 10 (S180), and ends the board stop position setting process. In this case, by executing this board stop position setting process in another component mounting machine 10, all components to be mounted that require high mounting accuracy can be mounted within the high-precision mounting area.

[0034] Figure 7 is an explanatory diagram showing the stopping positions of the substrate when components P1 to P4 are mounted on the substrate S. As shown in the figure, the distribution width in the X direction of components P1, P2, and P4, which require high-precision mounting accuracy (the distance in the X direction between the mounting position of component P2 and the mounting position of component P4), is larger than the width D in the X direction of the high-precision mounting area. For this reason, the mounting of components P1 and P2 and the mounting of component P4 are performed by different component mounting machines 10A and 10B, respectively. Specifically, in component mounting machine 10A, the stopping position of the substrate is set so that the mounting positions of components P1 and P2 fall within the high-precision mounting area, and components P1 and P2 are mounted on the substrate S stopped at that stopping position. Similarly, in component mounting machine 10B, the stopping position of the substrate is set so that the mounting position of component P4 falls within the high-precision mounting area, and component P4 is mounted on the substrate S stopped at that stopping position. In this way, the required mounting accuracy of components P1, P2, and P4 can be easily met simply by changing the stopping position of the substrate S. Furthermore, the mounting of component P3, which does not require high-precision mounting accuracy, may be performed within the low-precision mounting area or within the high-precision mounting area.

[0035] Here, the correspondence between the main elements of this embodiment and the main elements of the present disclosure will be explained. Specifically, the mounting head 30 of this embodiment is an example of a mounting head of the present disclosure, the head moving device 40 is an example of a head moving device, the substrate transport device 20 is an example of a substrate transport device, the mounting control device 50 is an example of a control device, and the management device 60 is an example of a substrate stop position setting device.

[0036] It goes without saying that this disclosure is not limited in any way to the embodiments described above, and can be implemented in various forms as long as they fall within the technical scope of this disclosure.

[0037] For example, in the embodiment described above, the CPU 61 sets the substrate stop position so that the mounting position of component P falls within an area that satisfies the required mounting accuracy of component P among a plurality of mountable areas to which different mounting accuracy is assigned. However, the CPU 61 may also set the substrate stop position so that the mounting position of component P falls within an area that satisfies the required indentation load accuracy (load accuracy) of component P among a plurality of mountable areas. Figure 8 is a flowchart showing the substrate stop position setting process according to another embodiment. Note that steps in the substrate stop position setting process in Figure 8 that are the same as those in Figure 5 are given the same numbers, and their explanations are omitted as they would be redundant.

[0038] In the substrate stop position setting process according to another embodiment, the CPU 61 sets a plurality of mountable areas in S100, and then obtains the mounting position of the component to be mounted, the required mounting accuracy, and the required load accuracy (S110B). Figure 9 is an explanatory diagram showing an example of the mounting position, mounting accuracy, and load accuracy of components P1 to P4. The load accuracy is the allowable range of the pressing load when the mounting head 30 mounts the component P to the substrate S. Next, the CPU 61 determines whether or not there is a component to be mounted that requires high mounting accuracy (S120), and whether or not there is a component to be mounted that requires high load accuracy (S120B). Components to be mounted that require high mounting accuracy include, for example, components P1, P2, and P4 shown in Figure 9, and components to be mounted that require high load accuracy include, for example, components P1 and P3 shown in Figure 9. If the CPU 61 determines that there are no components to be mounted that require high-precision mounting accuracy or high-precision load accuracy, it sets the initial position to the board stop position (S130) and terminates the board stop position setting process. On the other hand, if the CPU 61 determines that there are components to be mounted that require high-precision mounting accuracy or that there are components to be mounted that require high-precision load accuracy, it executes the processes S140 to S180 described above to set the board stop position so that the mounting position of the corresponding components falls within the high-precision mounting area, and terminates the board stop position setting process. As a result, as shown in Figure 7, in the component mounting machine 10A, the board stop position is set so that the mounting positions of components P1, P2, and P3 fall within the high-precision mounting area, and components P1, P2, and P3 are mounted on the board S stopped at the board stop position. In the component mounting machine 10B, the board stop position is set so that the mounting position of component P4 falls within the high-precision mounting area, and component P4 is mounted on the board S stopped at the board stop position. Therefore, by simply changing the stopping position of the substrate S, the required mounting accuracy for components P1, P2, and P4, and the required load accuracy for components P1 and P3 can be easily met.

[0039] In the embodiment described above, one of two types of precision, high precision and low precision, is assigned to each of the multiple mountable areas, but one of three or more types of precision may be assigned to each. In this case, the CPU 61 should set the board stopping position so that the mounting position of the component P falls within an area of ​​the multiple mountable areas that is assigned a precision equal to or greater than the required mounting precision or required load precision of the component P. For example, if the multiple mountable areas include a high-precision mountable area, a medium-precision mountable area, and a low-precision mountable area, and the required mounting precision of the component P is medium precision, the board stopping position should be set so that the mounting position of the component P falls within either the high-precision mountable area or the medium-precision mountable area. If the required mounting precision of the component P is high precision, the board stopping position should be set so that the mounting position of the component P falls within the high-precision mountable area, and if the required mounting precision of the component P is low precision, the board stopping position should be set so that the mounting position of the component P falls within either the high-precision mountable area, the medium-precision mountable area, or the low-precision mountable area.

[0040] As described above, the substrate stop position setting device of this disclosure allows the mounting head to mount components in an area of ​​its movable area that satisfies the required mounting conditions for the substrate by setting the stop position of the substrate. As a result, components can be mounted in a manner that satisfies the required mounting conditions for the substrate through a simple process.

[0041] In the substrate stop position setting device of this disclosure, the mounting accuracy of the component may be obtained as a mounting condition, and the stop position of the substrate may be set so that the mounting position of the component falls within the area among the plurality of areas that satisfies the obtained mounting accuracy of the component. In this way, the required mounting accuracy for the substrate can be met by changing the stop position of the substrate.

[0042] Further, in the substrate stop position setting device of the present disclosure, as the mounting condition, the pushing load when mounting the component on the substrate is acquired, and the stop position of the substrate is set so that the mounting position of the component enters an area within the plurality of areas that satisfies the pushing load of the acquired component. By doing so, by changing the stop position of the substrate, the required pushing load for the substrate can be satisfied.

[0043] Further, in the present disclosure, it is not limited to the form of the substrate stop position setting device, and it may be in the form of a substrate stop position setting method or in the form of a component mounting system including a component mounter and a substrate stop position setting device.

[0044] The present disclosure can be used in the manufacturing industry of component mounters and the like.

[0045] 1 Component mounting system, 10 Component mounter, 11 Housing, 12 Base, 20 Substrate transfer device, 21 Side frame, 22 Conveyor belt, 23 Belt drive device, 24 Substrate detection sensor, 25 Clamping device, 26 Substrate pressing plate, 27 Clamper, 27a Protrusion, 28 Support plate, 29 Lifting device, 30 Mounting head, 31 Suction nozzle, 32 Z-axis actuator, 33 θ-axis actuator, 40 Head movement device, 4I X-axis slider, 42 Y-axis slider, 43 X-axis actuator, 44 Y-axis actuator, 45 X-axis guide rail, 46 Y-axis guide rail, 47 X-axis position sensor, 48 Y-axis position sensor, 50 Mounting control device, 51 Mark camera, 52 Parts camera, 60 Management device, 61 CPU, 62 ROM, 63 RAM, 64 Storage unit, 65 Input device, 66 Display device, F Feeder, P, P1, P2, P3, P4 Components, S Substrate.

Claims

1. A substrate stop position setting device used in a component mounting machine having a mounting head capable of picking up components, a head moving device for moving the mounting head in the horizontal X and Y directions, a substrate transport device for transporting and positioning a substrate in the X direction, and a control device that controls the substrate transport device so that the substrate is transported to a stop position and positioned, and controls the mounting head and the head moving device so that components supplied by a component supply device are picked up by the mounting head and mounted on the mounting position on the substrate, the substrate stop position setting device for setting the stop position of the substrate, the substrate stop position setting device that acquires the mounting position and mounting conditions of the component on the substrate, and sets the stop position of the substrate so that the mounting position of the component falls within an area that satisfies the acquired mounting conditions of the component, among a plurality of areas in the movable area of ​​the mounting head to which different mounting conditions are assigned.

2. A substrate stop position setting device according to claim 1, wherein the device acquires the mounting accuracy of the component as a mounting condition, and sets the stop position of the substrate so that the mounting position of the component falls within an area among the plurality of areas that satisfies the acquired mounting accuracy of the component.

3. A substrate stop position setting device according to claim 1 or 2, wherein the device acquires the pressing load when mounting the component onto the substrate as a mounting condition, and sets the stop position of the substrate so that the mounting position of the component falls within the area among the plurality of areas that satisfies the acquired pressing load of the component.

4. A method for setting the stopping position of a substrate, used in a component mounting machine having a mounting head capable of picking up components, a head moving device for moving the mounting head in the horizontal X and Y directions, a substrate transport device for transporting and positioning a substrate in the X direction, and a control device that controls the substrate transport device so that the substrate is transported to a stopping position and positioned, and controls the mounting head and the head moving device so that components supplied by a component supply device are picked up by the mounting head and mounted on the mounting position on the substrate, the method for setting the stopping position of the substrate, wherein a plurality of areas are set with different mounting conditions assigned to the movable area of ​​the mounting head, the mounting position and mounting conditions of the component on the substrate are obtained, and the stopping position of the substrate is set so that the mounting position of the component falls within the area among the plurality of areas that satisfies the obtained mounting conditions of the component.

5. A component mounting machine comprising: a mounting head capable of picking up components; a head moving device for moving the mounting head in the horizontal X and Y directions; a substrate transport device for transporting and positioning a substrate in the X direction; a control device that controls the substrate transport device so that the substrate is transported to a stop position and positioned, and controls the mounting head and the head moving device so that components supplied by a component supply device are picked up by the mounting head and mounted on the mounting position on the substrate; and a substrate stop position setting device that acquires the mounting position and mounting conditions of the component on the substrate, and sets the stop position of the substrate so that the mounting position of the component falls within an area that satisfies the acquired mounting conditions of the component, among a plurality of areas in the movable area of ​​the mounting head to which different mounting conditions are assigned.

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