Parallel optical flow and image readout cuts high-frame-rate processing load while preserving clear grayscale capture for real-time motion analysis.
Alternating transistor and diode trench regions clamp voltage, reduce hole injection, and limit stacking fault growth in SiC power devices.
Continuous high-molecular-weight hole transport layers cut electron recombination and improve electrode adhesion under prolonged high illuminance.
Segmented lifetime regions with different lattice defect densities cut reverse recovery loss while keeping low forward voltage and suppressing snapback.
A p-type InGaN island depletes 2DEG in a GaN/AlGaN diode, cutting access resistance and capacitance for faster rectification.
Row-selectable photodiodes switch between imaging and series or parallel harvesting to generate higher voltage without extra boost circuitry.
Alternating vacuum circuit breakers with a bypass switch blocks AC backfeed during outages and keeps UPS transfer fast and stable.
Mirror-symmetrical drift and floating well regions spread current and heat to improve ESD/EOS breakdown while keeping ON-resistance low.
A 2DEG resistor is integrated inside the HEMT layout to enable precise high-side current sensing while saving chip area and process cost.
A surrounding trench Schottky diode suppresses parasitic pn bipolar operation in a vertical MOSFET, cutting turn-on loss and forward degradation.
A tuned drift-layer lifetime and recombination region soften body diode recovery, cutting snappiness and switching losses in power transistors.
Localized bias electrodes at biasing-region edges suppress charge pockets, boosting demodulation speed and contrast with low power use.
A vertical TFET cell uses a wraparound gate and raised drain contact on isolation features to cut leakage, contact resistance, and active area.