A phase change thermal battery and thermoelectric cooler let a fresh food door ice maker freeze water without using freezer air, saving space and energy.
A bottom sensor and temperature-rise rate let the controller lower and later restore the set point to limit tank stacking and short cycling.
A cold accumulator discharge loop buffers compressor cycling to stabilize pressure dew point and cut heat exchanger size in refrigerant dryers.
Unencapsulated PCM is actively conveyed through a heat exchanger to improve heat transport and decouple storage capacity from exchanger size.
Vertical fluid flow separates solid and molten salt regions in a furnace, preventing incomplete melting caused by poor heat conduction.
Segmented pipe layers reduce pressure loss by three times while maintaining compact weight for solar power systems.
Liquid inorganic salt storage uses a controlled gas atmosphere to maintain chemical equilibrium and preserve material stability.
A phase change material stores thermal energy to volatilize liquid in a capillary passage without continuous power input.
Replacing metal fins with polymer hollow fibers increases heat transfer area while reducing total mass and pressure losses in thermal batteries.
Elastic deformation of the porous rubber wick ensures casing adhesion without pore collapse, simplifying manufacturing and reducing costs.
Sealed cavities in solid gallium absorb latent heat to extend cooling duration without significant temperature rise.
A pipe centering device integrates latent heat storage material within a positioning structure to manage thermal energy in fluid circulation systems.
Phase change material in a latent heat accumulator maintains cold water below 25°C, preventing bacterial growth without continuous flushing.
Segmented copper layers sandwich phase change material cavities to dissipate heat from electronic devices.
A polymer film integrates latent heat storage materials to regulate temperature in facade insulation systems.
Vertically offset horizontal pipes accelerate solid phase melting to overcome slow heat transfer rates caused by low thermal conductivity.
Stoichiometric reduction of thin film ferrite spinels resolves the contradiction between high energy capacity and material reactivity loss.
Direct thermal contact between the heating element and memory module reduces conversion losses by eliminating intermediate heat carriers.