Magnetostrictive Device Manufacture/Assembly TRIZ Cases
- MTJ Passivation and ULK Dielectric Layout for Compact MRAM
ALD or HDP passivation around MTJs enables ULK dielectric integration that cuts MRAM chip area and improves temperature stability.
- Composite Substrate Support Member for Flexible PCB Bonding
A composite substrate integrates a support member between substrates to reinforce the drive interconnect during flexible circuit bonding.
- Piezoelectric Actuator with Multi-Directional Polarization for Inkjet Efficiency
Segmented polarization directions in the piezoelectric layer reduce driving voltage requirements while maintaining jetting pressure.