Optically Investigating Flaws/Contamination TRIZ Cases

An optical detection mechanism identifies oily residue accumulation on reflective surfaces to prevent corrosion and maintain heat transfer efficiency.

A secondary battery inspection apparatus captures lateral, top, and bottom images simultaneously using a tray system and synchronized lighting units.

Hardware processor generates ideal initial white reference data by complementing first scan with second scan results.

A thickness estimating apparatus predicts wafer layer dimensions using pixel data from captured images processed by a trained machine learning model.

A portable inspection tool uses dark-field illumination to capture high-contrast images of gas turbine combustion chamber surfaces.

A cylindrical housing with a conical mirror reflects a single laser diode beam into a uniform ring of light, eliminating alignment issues from multiple diodes.

A light beam measures transparent container wall thickness by analyzing reflected beams from internal and external faces at distributed inspection points.

A beam steering assembly compensates for illumination beam misalignment by calculating offset parameters and actuating motors to reduce system jitter.

Stationary camera captures parison mouth end images to resolve high-speed inspection precision trade-offs.

Empty glass packaging exposed to water vapor forms a corrosion zone visualized by microscopy, resolving long test durations in pharmaceutical production.

Pressurized gas containers with plane parallel plates filter unwanted wavelengths from plasma radiation, extending source lifetime by reducing thermal stress.

A rotational wafer stage directs light through the substrate while a sensor monitors transmitted characteristics to detect structural defects.

A planar illumination unit emits light in varying directions to capture container images for foreign body and defect analysis.

An EUV inspection system uses a point source and aperture to direct illumination for defect detection.

Hybrid aligned nematic liquid crystal modulation enables accurate defect detection by varying transmittance and reflectance at low driving voltages.

A pulse splitting optical path divides a single laser pulse into multiple sub-pulses to enable high-speed scattered light detection.

Microscope assembly scans rolling element surfaces to generate digital images for automated defect identification.

A wafer inspection method converts scanning haze values into color images to standardize texture analysis.

A blank washer inspection process applies test particles to blanks and compares post-wash particle presence against a size threshold.

An automated inspection system uses a rail-mounted device to transmit video data wirelessly, reducing maintenance downtime.

A catoptric objective seals the outermost mirror opening with a refractive element to prevent contamination without adding gas purge complexity.

A light tester uses multiple inspection patterns with dynamic thresholds to detect pinholes in cans.

Segmented illumination device provides dedicated light sources for multiple observation areas on moving containers.

Multi-focal imaging system captures concatenated images to analyze microstructure geometry and surface roughness.

An exposure evaluation device estimates focal position using varied illumination and detection conditions on patterned substrates.

Reflected optical imaging quantifies distortion in shaped vehicle glass, replacing subjective human assessment with automated precision.

Transmission laser ultrasonics inspect semiconductor packages, eliminating radiation costs and surface damage risks.

A phosphor-based light source emits inspection light with spectral peaks between 600 and 750 nm to detect foreign matter.

Phase-shifting interferometry maps substrate topography to detect surface defects using reflected light fringe patterns.

Integrated lighting fixtures monitor temperature, humidity, and contamination while providing augmented reality visualization to resolve space constraints.

Movable weights reposition along the hull to balance the inspection device, eliminating the need to drain transformer oil.

Automated image analysis replaces manual visual checks, reducing inspection time and eliminating human error in turbine maintenance.

A visual inspection device uses a camera and lighting system to capture images of rolling bearing surfaces.

A confocal inspection system generates in-focus images by inhibiting out-of-focus light at multiple focal planes within a vertical semiconductor stack.

Rotating the workpiece holder instead of the sensor simplifies metrology systems by eliminating complex rotary stages while combining multi-side surface data.

A rotatable bearing stage moves display panels between loading and inspection zones on a single platform.

A touch display interface detects operator gestures to control movable elements in semiconductor inspection equipment.

Transparent body reflects light from damaged areas to reveal wear regardless of ambient lighting.

A phase contrast optical method uses a phase mask to detect phase shifts in illumination radiation.

A thermal radiation pattern generator converts visible laser patterns into infrared emission for surface inspection.

Segmented shield parts create a detour path that attenuates ambient light, preventing erroneous pinhole detection in high-brightness inspection systems.

A pattern generator produces sequential light-dark patterns with shifted phases to capture surface inclinations via deflectometry.

Multi-angle imaging captures container features from distinct perspectives to determine precise rotational orientation.

Internal scattering agents create virtual diffuse light sources, eliminating shadows and reducing inspection unit size.

Machine learning detects anomalies in reference intensity data before polishing, preventing measurement errors and reducing manual verification time.

Oblique incident light scatters off wafer backside defects to capture emitted signals, forming a 3D map that resolves the inability to analyze defect height.

A photodetector captures composite images of a photomask to enable high-resolution defect detection.

Optical vision systems replace contact probes to eliminate mechanical wear and calibration delays during high-speed fastener inspection.

Lateral image alignment on the area sensor camera reduces data output time by half, enabling higher shutter speeds and improved inspection accuracy.

An automated specimen integrity monitor detects defects like hemolysis and lipemia before analysis, preventing inaccurate results from improper processing.