Stacked interconnect layers and vertical memory pillars increase capacity while addressing manufacturing complexity in 3D memory structures.
A fuse and anti-fuse OTP cell enables direct programming-error correction while simplifying layout and reducing area.
Dynamic latches above a 3D non-volatile memory array add latch capacity for concurrent sub-block programming, reducing operations and latency.
Successful re-reads identify a baseline offset for NAND memory reads, reducing repeated attempts, cell wear, time, and power.
Paired p-type transistors use Schottky barrier junctions and trapped avalanche hot electrons to hold data nonvolatilely in CMOS-compatible memory.