Thin-film packaging structure and display device

一种薄膜封装、显示装置的技术，应用在有机半导体器件、电气元件、电固体器件等方向，能够解决IJPInk铺展性差、填充效果差等问题，达到填充效果好、铺展性好的效果

CN105789257AInactive Publication Date: 2016-07-20BOE TECH GRP CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Publication Date
2016-07-20
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses a thin-film packaging structure and a display device, and belongs to the technical field of packaging of display devices. The thin-film packaging structure comprises a plurality of film layers, wherein the plurality of film layers coat the outer side of a to-be-packaged device and include alternately stacked inorganic layers and organic layers; in the plurality of film layers, the film layers at the inner sides and the outer sides of the plurality of film layers all are inorganic layers; in the plurality of film layers, an auxiliary spreading layer is formed between the first inorganic layer and the first organic layer; the hydrophilic-hydrophobic property of the auxiliary spreading layer is the same as that of the first organic layer; the first inorganic layer is the film layer, in contact with the to-be-packaged device, in the plurality of film layers; and the first organic layer is the organic layer in contact with the first inorganic layer. According to the thin-film packaging structure, the problem of relatively poor filling effects of the organic layers on cracks and defects in the inorganic layers is solved; improvement of the filling effects of the organic layers on the cracks and defects in the inorganic layers is achieved; and the thin-film packaging structure is suitable for packaging of the display device.
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Description

technical field

[0001] The invention relates to the technical field of display device packaging, in particular to a thin film packaging structure and a display device. Background technique

[0002] Organic Light-Emitting Diode (English: Organic Light-Emitting Diode; abbreviation: OLED) devices have the advantages of active light emission, high brightness, full viewing angle, fast response speed, and flexible display, and are widely used in the display industry. However, water, oxygen and other components in the air have a great impact on the service life of OLED devices. Therefore, OLED devices can usually be packaged with a thin-film packaging structure to isolate OLED devices from water, oxygen and other components in the air, thereby prolonging the life of OLED devices. The service life of the OLED device, wherein, when the OLED device is packaged, the OLED device may be referred to as a device to be packaged.

[0003] In the prior art, the thin film encapsulation struct...

Examples

Embodiment Construction

[0039] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments . Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0040] Please refer to figure 1 , which shows an application scene diagram of a thin film encapsulation structure 00 provided by an embodiment of the present invention, see figure 1 , the thin film encapsulation structure 00 includes: a plurality of film layers coated on the outside of the device to be encapsulated 01, the plurality of film layers include: alternately stacked inorganic layers 001 and organic layers 002, and among the plura...