Electronic device
By setting the antenna module and multiple radiating layers inside the metal casing, combined with a power divider and dielectric materials, the interference problem of the metal frame on the millimeter-wave antenna is solved, achieving stable signal transmission and reception and bandwidth expansion, meeting the requirements of 5G communication, and realizing the thinning and sealing performance of electronic devices.
Patent Information
- Application Number
- CN202010719953.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-07-23
- Publication Date
- 2026-04-24
- Estimated Expiration
- 2040-07-23
AI Technical Summary
Metal frames or back covers can interfere with the operation of millimeter-wave antennas, affecting the signal stability and communication performance of electronic devices, especially in the 5G band.
An antenna module is installed inside a metal casing. The metal casing has intersecting antenna slots. The antenna module includes multiple radiating layers and a back cavity layer. The signal is fed through a power divider. The combination of dielectric material and the stepped inner wall design of the metal casing ensures normal signal transmission and reception and bandwidth expansion.
It achieves stable signal transmission and reception in environments with metal frames or back covers, meets the bandwidth requirements of 5G communication, provides a good communication experience, and realizes the thinness and lightness of electronic devices and sealing performance.