Resin composition, laminate and multilayer printed wiring board

Abstract

The present invention relates to a resin composition, a laminate and a multilayer printed wiring board. The present invention relates to a resin composition comprising (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group and a thermoplastic resin.

Description

[0001] This application is a divisional application. The filing date of the parent application is July 18, 2017. The international application number is PCT / JP2017 / 025977. The application number entering the Chinese national phase is 201780044507.9. The name of the invention is resin composition, laminated board and multilayer printed circuit board. Technical Field

[0002] The present invention relates to a resin composition, a laminate and a multilayer printed wiring board. Background Art

[0003] In mobile communication devices represented by mobile phones, network infrastructure equipment such as base station devices, servers, routers, and electronic devices such as large computers, the high-speed and large-capacity signals used are being promoted year by year. As a result, the printed circuit boards mounted on these electronic devices need to cope with high frequencies, requiring substrate materials with low relative dielectric constants and low dielectric loss tangents that can reduce transmission losses. In recent years, as an application for processing such high-frequency signals, in addition to the above-mentioned electronic devices, the practical application and practical plans of new systems for processing high-frequency wireless signals are also being promoted in the ITS field (related to automobiles and transportation systems) and indoor short-range communication fields. It is predicted that in the future, low transmission loss substrate materials will be further required for printed circuit boards mounted on these devices.

[0004] In addition, due to recent environmental issues, there is a growing demand for mounting electronic components using lead-free solder and flame retardancy based on halogen-free, and therefore printed wiring board materials are required to have higher heat resistance and flame retardancy than before.

[0005] In the past, polyphenylene ether (PPE) resins were used as heat-resistant thermoplastic polymers showing excellent high-frequency characteristics in printed circuit boards requiring low transmission loss. As applications of polyphenylene ether resins, methods such as the combined use of polyphenylene ether and thermosetting resins have been proposed, and specifically, a resin composition containing polyphenylene ether and epoxy resin (for example, see Patent Document 1); a resin composition using polyphenylene ether in combination with a cyanate resin having a relatively low relative dielectric constant even among thermosetting resins (for example, see Patent Document 2), etc. have been disclosed.

[0006] In addition, the present inventors proposed a resin composition based on polyphenylene ether resin and polybutadiene resin, and semi-IPNed the resin composition in the manufacturing stage (stage A), thereby improving compatibility, heat resistance, thermal expansion characteristics, adhesion to conductors, etc. (for example, refer to patent document 3).

[0007] In addition, maleimide compounds are also being studied as materials for printed circuit boards. For example, Patent Document 4 discloses a resin composition characterized by comprising: a maleimide compound having at least two maleimide skeletons, an aromatic diamine compound having at least two amino groups and an aromatic ring structure, a catalyst having a basic group and a phenolic hydroxyl group that promotes the reaction between the maleimide compound and the aromatic diamine compound, and silicon dioxide.

[0008] Prior art literature

[0009] Patent Literature

[0010] Patent Document 1: Japanese Patent Application Laid-Open No. 58-69046

[0011] Patent Document 2: Japanese Patent Publication No. 61-18937

[0012] Patent Document 3: Japanese Patent Application Publication No. 2008-95061

[0013] Patent Document 4: Japanese Patent Application Publication No. 2012-255059 Summary of the invention

[0014] Problems to be solved by the invention

[0015] However, printed wiring board substrate materials used in high-frequency bands in recent years are required to have various properties such as a low thermal expansion coefficient in addition to high-frequency characteristics and high adhesion to conductors.

[0016] In view of such a situation, the object of the present invention is to provide: a resin composition having excellent high-frequency characteristics (low relative dielectric constant, low dielectric loss tangent) and also having low thermal expansion characteristics and adhesion to conductors at a high level; and a laminate and a multilayer printed wiring board manufactured using the resin composition and having good appearance and handleability.

[0017] Means for solving problems

[0018] The present inventors have conducted intensive studies to solve the above-mentioned problems and, as a result, have found that the above-mentioned problems can be solved by using a compound having a specific structure and a resin composition containing a thermoplastic resin, thereby completing the present invention.

[0019] That is, the present invention includes the following technical solutions.

[0020] [1] A resin composition comprising (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

[0021] [2] The resin composition according to [1], wherein the hydrocarbon group has 8 to 100 carbon atoms.

[0022] [3] The resin composition according to [1] or [2], wherein the hydrocarbon group is a group represented by the following formula (II).

[0023] [Chemistry 1]

[0024]

[0025] [In formula (II), R2 and R3 each independently represent an alkylene group having 4 to 50 carbon atoms, R4 represents an alkyl group having 4 to 50 carbon atoms, and R5 represents an alkyl group having 2 to 50 carbon atoms.]

[0026] [4] The resin composition according to any one of [1] to [3], wherein the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group further has a divalent group having at least two imide bonds.

[0027] [5] The resin composition according to [4], wherein the divalent group having at least two imide bonds is a group represented by the following formula (I).

[0028] [Chemistry 2]

[0029]

[0030] [In formula (I), R1 represents a tetravalent organic group.]

[0031] [6] The resin composition according to any one of [1] to [5], further comprising (B) an aromatic maleimide compound having a structure in which a maleimide group is bonded to an aromatic ring.

[0032] [7] The resin composition according to [6], wherein the (B) aromatic maleimide compound is a compound represented by the following formula (VI).

[0033] [Chemistry 3]

[0034]

[0035] [In formula (VI), A4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X), and A5 represents a residue represented by the following formula (XI).]

[0036] [Chemistry 4]

[0037]

[0038] [In formula (VII), R 10 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom.]

[0039] [Chemistry 5]

[0040]

[0041] [In formula (VIII), R 11 and R 12 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a single bond, or a residue represented by the following formula (VIII-1).]

[0042] [Chemistry 6]

[0043]

[0044] [In formula (VIII-1), R 13 and R 14 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group, or a single bond.]

[0045] [Chemistry 7]

[0046]

[0047] [In formula (IX), i is an integer of 1 to 10.]

[0048] [Chemistry 8]

[0049]

[0050] [In formula (X), R 15 and R 16 Each independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and j is an integer of 1 to 8.]

[0051] [Chemistry 9]

[0052]

[0053] [In formula (XI), R 17 and R 18 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom, and A8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2).]

[0054] [Chemistry 10]

[0055]

[0056] [In formula (XI-1), R 19 and R 20 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an m-phenylene diisopropylidene group, a p-phenylene diisopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group, or a single bond.]

[0057] [Chemistry 11]

[0058]

[0059] [In formula (XI-2), R 21 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 10 and A 11 It represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group, or a single bond.]

[0060] [8] The resin composition according to any one of [1] to [7], wherein the weight average molecular weight of the maleimide compound (A) having a saturated or unsaturated divalent hydrocarbon group is 500 to 10,000.

[0061] [9] A laminate comprising a resin layer and a conductor layer, wherein the resin layer comprises a cured product of the resin composition according to any one of [1] to [8].

[0062]

[10] A multilayer printed wiring board comprising a resin layer and a circuit layer, wherein the resin layer comprises a cured product of the resin composition according to any one of [1] to [8].

[0063] Effects of the Invention

[0064] According to the present invention, there can be provided: a resin composition having excellent high-frequency characteristics (low relative dielectric constant, low dielectric loss tangent), low thermal expansion characteristics at a high level, and adhesion to a conductor; and a laminate and a multilayer printed wiring board manufactured using the resin composition.

[0065] In addition, in conventional resin films, when a reinforcing substrate is not incorporated into a resin composition, there is a tendency that the handling property of the resin film is deteriorated and the strength cannot be fully maintained. In contrast, the resin film produced using the resin composition of the present invention has excellent appearance and handling property (stickiness, cracking, powdering, etc.) even if it does not have a reinforcing substrate.

[0066] The laminated board and the multilayer printed wiring board of the present invention are formed using the resin composition of the present invention and therefore have excellent dielectric properties with low relative dielectric constant and dielectric loss tangent in a high frequency region. BRIEF DESCRIPTION OF THE DRAWINGS

[0067] Figure 1 It is a schematic diagram showing the manufacturing process of the multilayer printed wiring board of this embodiment.

[0068] Figure 2 It is a schematic diagram showing the manufacturing process of the inner layer circuit board.

[0069] Figure 3 It is a schematic diagram showing the manufacturing process of the multilayer printed wiring board of this embodiment.

[0070] Explanation of symbols

[0071] 11, 21...inner layer circuit substrate, 12, 22...resin film, 12a, 22a...resin layer, 13, 23...metal foil, 13a, 23a...metal layer, 14, 24...antenna circuit layer, 15...via hole, 41...core substrate, 42...prepreg, 43...through hole. DETAILED DESCRIPTION

[0072] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings as needed. However, the present invention is not limited to the following embodiments.

[0073] <Definition>

[0074] In this specification, the high frequency region refers to the region of 0.3 GHz to 300 GHz, and in particular, refers to 3 GHz to 300 GHz. In this specification, the numerical range indicated by "~" indicates a range that includes the numerical values ​​recorded before and after "~" as the minimum and maximum values, respectively. For the numerical ranges recorded in stages in this specification, the upper limit or lower limit of the numerical range of a certain stage can be replaced by the upper limit or lower limit of the numerical range of other stages. For the numerical ranges recorded in this specification, the upper limit or lower limit of the numerical range can also be replaced by the values ​​shown in the embodiments. The so-called "A or B" may include either A and B, or both.

[0075] [Resin composition]

[0076] The resin composition of the present embodiment contains (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group, and a thermoplastic resin.

[0077] <(A) Maleimide compound having a saturated or unsaturated divalent hydrocarbon group>

[0078] The maleimide compound having a saturated or unsaturated divalent hydrocarbon group of the present embodiment is sometimes referred to as component (A). Component (A) is a compound having (a) a maleimide group and (c) a saturated or unsaturated divalent hydrocarbon group. (a) The maleimide group is sometimes referred to as structure (a), and (c) the saturated or unsaturated divalent hydrocarbon group is sometimes referred to as structure (c). By using component (A), a resin composition having high frequency characteristics and high adhesion to a conductor can be obtained.

[0079] The component (A) may further have (b) a divalent group having at least two imide bonds in addition to the structures (a) and (c). The divalent group (b) having at least two imide bonds may be referred to as the structure (b).

[0080] The (a) maleimide group is not particularly limited and is a common maleimide group. The (a) maleimide group may be bonded to an aromatic ring or an aliphatic chain. From the viewpoint of dielectric properties, it is preferably bonded to a long-chain aliphatic chain (e.g., a saturated hydrocarbon group having 8 to 100 carbon atoms). By making the (A) component have a structure in which the (a) maleimide group is bonded to a long-chain aliphatic chain, the high-frequency properties of the resin composition can be further improved.

[0081] The structure (b) is not particularly limited, and examples thereof include a group represented by the following formula (I).

[0082] [Chemistry 12]

[0083]

[0084] In formula (I), R1 represents a tetravalent organic group. R1 is not particularly limited as long as it is a tetravalent organic group, and may be, for example, a hydrocarbon group having 1 to 100 carbon atoms, a hydrocarbon group having 2 to 50 carbon atoms, or a hydrocarbon group having 4 to 30 carbon atoms from the viewpoint of handling properties.

[0085] R1 may be a substituted or unsubstituted siloxane moiety. Examples of the siloxane moiety include structures derived from dimethylsiloxane, methylphenylsiloxane, diphenylsiloxane, and the like.

[0086] When R1 is substituted, examples of the substituent include an alkyl group, an alkenyl group, an alkynyl group, a hydroxyl group, an alkoxy group, a mercapto group, a cycloalkyl group, a substituted cycloalkyl group, a heterocyclic group, a substituted heterocyclic group, an aryl group, a substituted aryl group, a heteroaryl group, a substituted heteroaryl group, an aryloxy group, a substituted aryloxy group, a halogen atom, a haloalkyl group, a cyano group, a nitro group, a nitroso group, an amino group, an amide group, -C(O)H, -NR x C(O)-N(R x )2. -OC(O)-N(R x)2, acyl, oxyacyl, carboxyl, carbamate, sulfonamide, etc. Here, R x These substituents can be selected from one or more types depending on the purpose, application, etc.

[0087] R1 is preferably, for example, a tetravalent residue of an acid anhydride having two or more acid anhydride rings in one molecule, that is, a tetravalent group obtained by removing two acid anhydride groups (—C(═O)OC(═O)—) from an acid anhydride. Examples of the acid anhydride include compounds described below.

[0088] From the viewpoint of mechanical strength, R1 is preferably aromatic, and more preferably a group obtained by removing two anhydride groups from pyromellitic anhydride. That is, structure (b) is more preferably a group represented by the following formula (III).

[0089] [Chemistry 13]

[0090]

[0091] From the viewpoint of fluidity and circuit embedding, it is preferred that a plurality of structures (b) exist in component (A). In this case, the structures (b) may be the same or different. The number of structures (b) in component (A) is preferably 2 to 40, more preferably 2 to 20, and even more preferably 2 to 10.

[0092] From the viewpoint of dielectric properties, the structure (b) may be a group represented by the following formula (IV) or the following formula (V).

[0093] [Chemistry 14]

[0094]

[0095] [Chemistry 15]

[0096]

[0097] The structure (c) is not particularly limited and may be any of a linear, branched, or cyclic structure. From the viewpoint of high-frequency characteristics, the structure (c) is preferably an aliphatic hydrocarbon group. In addition, the carbon number of the saturated or unsaturated divalent hydrocarbon group may be 8 to 100, or 10 to 70 or 15 to 50. The hydrocarbon group may have a branch. The structure (c) is preferably an alkylene group having a carbon number of 8 to 100 and may have a branch, more preferably an alkylene group having a carbon number of 10 to 70 and may have a branch, and further preferably an alkylene group having a carbon number of 15 to 50 and may have a branch. When the structure (c) is an alkylene group having a carbon number of 8 or more and may have a branch, it is easy to make the molecular structure three-dimensional, increase the free volume of the polymer, and easily reduce the density. That is, since the dielectric constant can be reduced, it becomes easy to improve the high-frequency characteristics of the resin composition. Furthermore, by providing the component (A) with the structure (c), the flexibility of the resin composition of the present embodiment is improved, and the handling properties (stickiness, cracking, powdering, etc.) and strength of a resin film produced from the resin composition can be improved.

[0098] As structure (c), for example, alkylene groups such as nonanediyl, decanediyl, undecanediyl, dodecanediyl, tetradecanediyl, hexadecanediyl, octadecanediyl, and nonadecandiyl; arylene groups such as benzylene, phenylene, and naphthylene; arylene alkylene groups such as phenylenemethylene, phenyleneethylene, benzylpropylene, naphthylenemethylene, and naphthyleneethylene; arylene dialkylene groups such as phenylenedimethylene and phenylenediethylene; and the like.

[0099] From the viewpoints of high-frequency characteristics, low thermal expansion characteristics, adhesion to a conductor, heat resistance, and low hygroscopicity, the structure (c) is particularly preferably a group represented by the following formula (II).

[0100] [Chemistry 16]

[0101]

[0102] In formula (II), R2 and R3 each independently represent an alkylene group having 4 to 50 carbon atoms. From the viewpoint of further improving flexibility and easiness of synthesis, R2 and R3 each independently represent preferably an alkylene group having 5 to 25 carbon atoms, more preferably an alkylene group having 6 to 10 carbon atoms, and still more preferably an alkylene group having 7 to 10 carbon atoms.

[0103] In formula (II), R4 represents an alkyl group having 4 to 50 carbon atoms. From the viewpoint of further improvement in flexibility and ease of synthesis, R4 is preferably an alkyl group having 5 to 25 carbon atoms, more preferably an alkyl group having 6 to 10 carbon atoms, and still more preferably an alkyl group having 7 to 10 carbon atoms.

[0104] In formula (II), R5 represents an alkyl group having 2 to 50 carbon atoms. From the viewpoint of further improvement in flexibility and ease of synthesis, R5 is preferably an alkyl group having 3 to 25 carbon atoms, more preferably an alkyl group having 4 to 10 carbon atoms, and still more preferably an alkyl group having 5 to 8 carbon atoms.

[0105] From the viewpoint of fluidity and circuit embedding, multiple structures (c) may be present in component (A). In this case, the structures (c) may be the same or different. For example, preferably, there are 2 to 40 structures (c) in component (A), more preferably there are 2 to 20 structures (c), and further preferably there are 2 to 10 structures (c).

[0106] The content of the component (A) in the resin composition is not particularly limited. From the viewpoint of heat resistance, the content of the component (A) is preferably 2 to 98% by mass, more preferably 10 to 50% by mass, and even more preferably 10 to 30% by mass relative to the total mass of the resin composition (solid content).

[0107] The molecular weight of component (A) is not particularly limited. From the viewpoint of handling properties, fluidity, and circuit embedding properties, the weight average molecular weight (Mw) of component (A) is preferably 500 to 10,000, more preferably 1,000 to 9,000, further preferably 1,500 to 9,000, further preferably 1,500 to 7,000, and particularly preferably 1,700 to 5,000.

[0108] The Mw of the component (A) can be measured by gel permeation chromatography (GPC).

[0109] In addition, the measurement conditions of GPC are as follows.

[0110] Pump: L-6200 model [manufactured by Hitachi High-Technologies Co., Ltd.]

[0111] Detector: L-3300 RI [manufactured by Hitachi High-Technologies Co., Ltd.]

[0112] Column oven: L-655A-52 [manufactured by Hitachi High-Technologies Co., Ltd.]

[0113] Guard column and chromatography column: TSK Guardcolumn HHR-L + TSKgel G4000HHR + TSKgel G2000HHR [all manufactured by Tosoh Corporation, trade name]

[0114] Column size: 6.0×40mm (guard column), 7.8×300mm (chromatographic column)

[0115] Eluent: Tetrahydrofuran

[0116] Sample concentration: 30mg / 5mL

[0117] Injection volume: 20 μL

[0118] Flow rate: 1.00mL / min

[0119] Measurement temperature: 40℃

[0120] The method for producing the component (A) is not limited. The component (A) can be produced, for example, by reacting an acid anhydride with a diamine to synthesize an amine-terminated compound, and then reacting the amine-terminated compound with an excess of maleic anhydride.

[0121] As an acid anhydride, for example, pyromellitic anhydride, maleic anhydride, succinic anhydride, 3,3',4,4'-benzophenone tetracarboxylic dianhydride, 3,3',4,4'-biphenyl tetracarboxylic dianhydride, 3,3',4,4'-diphenyl sulfone tetracarboxylic dianhydride, etc. can be listed. These acid anhydrides can be used alone or in combination of two or more depending on the purpose, use, etc. It should be noted that, as mentioned above, as R1 of the above formula (I), a 4-valent organic group derived from the acid anhydride listed above can be used. From the viewpoint of better dielectric properties, the acid anhydride is preferably pyromellitic anhydride.

[0122] Examples of the diamine include dimer diamine, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, 4,4'-diamino-3,3'-dihydroxybiphenyl, 1,3-bis[2-(4-aminophenyl)-2-propyl]benzene, 1,4-bis[2-(4-aminophenyl)-2-propyl]benzene, polyoxyalkylene diamine, and [3,4-bis(1-aminoheptyl)-6-hexyl-5-(1-octenyl)]cyclohexene. These diamines may be used alone or in combination of two or more depending on the purpose and application.

[0123] As the component (A), for example, there may be mentioned a compound represented by the following formula (XIII).

[0124] [Chemistry 17]

[0125]

[0126] In the formula, R and Q each independently represent a divalent organic group. R can be the same group as in the above structure (c), and Q can be the same group as in the above R1. In addition, n represents an integer of 1 to 10.

[0127] As component (A), commercially available compounds may also be used. Examples of commercially available compounds include products manufactured by Designer Molecules Inc., specifically, BMI-1500, BMI-1700, BMI-3000, BMI-5000, BMI-9000 (all trade names), etc. From the perspective of obtaining better high-frequency characteristics, BMI-3000 is more preferably used as component (A).

[0128] <(B) Aromatic maleimide compound>

[0129] In the resin composition of the present embodiment, (B) aromatic maleimide compound may be contained. Sometimes (B) aromatic maleimide compound of the present embodiment is referred to as (B) component. (B) component is a maleimide compound different from (A) component. It should be noted that the compound equivalent to both (A) component and (B) component is set to belong to (A) component, when containing more than 2 kinds of compounds equivalent to both (A) component and (B) component, then one of them is set to belong to (A) component and another compound is belonged to (B) component. By using (B) component, resin composition becomes a composition with excellent low thermal expansion characteristics. That is, the resin composition of the present embodiment is used in combination with (A) component and (B) component, so as to maintain good dielectric properties and further improve low thermal expansion characteristics, etc. This is presumably because the cured product obtained from the resin composition containing the components (A) and (B) contains a polymer having a structural unit containing the component (A) having low dielectric properties and a structural unit containing the component (B) having low thermal expansion.

[0130] That is, the thermal expansion coefficient of the component (B) is preferably lower than that of the component (A). As the component (B) having a thermal expansion coefficient lower than that of the component (A), for example, a maleimide-containing compound having a molecular weight lower than that of the component (A), a maleimide-containing compound having more aromatic rings than the component (A), a maleimide-containing compound having a shorter main chain than the component (A), etc. can be cited.

[0131] The content of the component (B) in the resin composition is not particularly limited. From the viewpoint of low thermal expansion and dielectric properties, the content of the component (B) is preferably 1 to 95% by mass, more preferably 1 to 50% by mass, and further preferably 1.5 to 30% by mass relative to the total mass of the resin composition (solid content).

[0132] The mixing ratio of the component (A) to the component (B) in the resin composition is not particularly limited. From the viewpoint of dielectric properties and low thermal expansion coefficient, the mass ratio (B) / (A) of the component (A) to the component (B) is preferably 0.01 to 3, more preferably 0.03 to 2, further preferably 0.05 to 1, and particularly preferably 0.05 to 0.5.

[0133] (B) component is not particularly limited as long as it has an aromatic ring. Aromatic ring is rigid and has low thermal expansion, so by using (B) component having an aromatic ring, the thermal expansion coefficient of the resin composition can be reduced. The maleimide group can be bonded to the aromatic ring or to an aliphatic chain, and from the viewpoint of low thermal expansion, it is preferably bonded to the aromatic ring. In addition, (B) component is also preferably a polymaleimide compound containing more than two maleimide groups.

[0134] Specific examples of the component (B) include 1,2-dimaleimide ethane, 1,3-dimaleimide propane, bis(4-maleimide phenyl) methane, bis(3-ethyl-4-maleimide phenyl) methane, bis(3-ethyl-5-methyl-4-maleimide phenyl) methane, 2,7-dimaleimide fluorene, N,N'-(1,3-phenylene) bismaleimide, N,N'-(1,3-(4-methylphenylene)) bismaleimide, bis(4-maleimide phenyl) sulfone, bis(4-maleimide phenyl) sulfone, Ether, bis(4-maleimidephenyl) ether, 1,3-bis(3-maleimidephenoxy)benzene, 1,3-bis(3-(3-maleimidephenoxy)phenoxy)benzene, bis(4-maleimidephenyl)ketone, 2,2-bis(4-(4-maleimidephenoxy)phenyl)propane, bis(4-(4-maleimidephenoxy)phenyl)sulfone, bis[4-(4-maleimidephenoxy)phenyl]sulfoxide, 4,4'-bis(3-maleimidephenoxy)biphenyl, 1,3-bis(2-(3-maleimidephenyl)propyl)benzene, etc. These may be used alone or in combination of two or more. Among these, bis(3-ethyl-5-methyl-4-maleimidephenyl)methane is preferably used from the viewpoint of further reducing hygroscopicity and thermal expansion coefficient. From the viewpoint of further improving the breaking strength and metal foil peeling strength of the resin film formed from the resin composition, it is preferred to use 2,2-bis(4-(4-maleimidephenoxy)phenyl)propane as the component (B).

[0135] From the viewpoint of moldability, as the component (B), for example, a compound represented by the following formula (VI) is preferred.

[0136] [Chemistry 18]

[0137]

[0138] In formula (VI), A4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X), and A5 represents a residue represented by the following formula (XI). From the viewpoint of low thermal expansion, A4 is preferably a residue represented by the following formula (VII), (VIII) or (IX).

[0139] [Chemistry 19]

[0140]

[0141] In formula (VII), R 10 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom.

[0142] [Chemistry 20]

[0143]

[0144] In formula (VIII), R 11 and R 12 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and A6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a single bond or a residue represented by the following formula (VIII-1).

[0145] [Chemistry 21]

[0146]

[0147] In formula (VIII-1), R 13 and R 14 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and A7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group or a single bond.

[0148] [Chemistry 22]

[0149]

[0150] In the formula (IX), i is an integer of 1-10.

[0151] [Chemistry 23]

[0152]

[0153] In formula (X), R 15 and R 16 Each independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and j is an integer of 1 to 8.

[0154] [Chemistry 24]

[0155]

[0156] In formula (XI), R 17 and R 18 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom, and A8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2).

[0157] [Chemistry 25]

[0158]

[0159] In formula (XI-1), R 19 and R 20 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom, and A9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an m-phenylene diisopropylidene group, a p-phenylene diisopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group or a single bond.

[0160] [Chemistry 26]

[0161]

[0162] In formula (XI-2), R 21 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 10 and A 11 Each independently represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group or a single bond.

[0163] (Diamine compound)

[0164] The resin composition of the present embodiment may further contain a diamine compound. The diamine compound is not particularly limited, and examples thereof include 4,4'-diaminodiphenylmethane, 4,4'-diamino-3,3'-dimethyl-diphenylmethane, 2,2'-dimethyl-4,4'-diaminobiphenyl, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 4,4'-[1,3-phenylenebis(1-methylethylidene)]diphenylamine, 4,4'-[1,4-phenylenebis(1-methylethylidene)]diphenylamine, 1,3-bis[2-(4-aminophenyl)-2-propyl]benzene, etc. These may be used alone or in combination of two or more.

[0165] In addition, from the viewpoint of improving solubility in organic solvents, reaction rate during synthesis, and heat resistance, 1,3-bis[2-(4-aminophenyl)-2-propyl]benzene, 4,4'-diaminodiphenylmethane, or 4,4'-diamino-3,3'-dimethyl-diphenylmethane is preferred. These can be used alone or in combination of two or more depending on the purpose, application, etc.

[0166] (catalyst)

[0167] The resin composition of this embodiment may further contain a catalyst for accelerating the curing of the component (A). The content of the catalyst is not particularly limited, and may be 0.1 to 5% by mass relative to the total mass of the resin composition. As the catalyst, for example, peroxides, azo compounds, etc. may be used.

[0168] Examples of the peroxide include dicumyl peroxide, dibenzoyl peroxide, 2-butylone peroxide, tert-butyl peroxybenzoate, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, bis(tert-butylperoxyisopropyl)benzene, and tert-butyl hydroperoxide. Examples of the azo compound include 2,2'-azobis(2-methylpropionitrile), 2,2'-azobis(2-methylbutyronitrile), and 1,1'-azobis(cyclohexanecarbonitrile).

[0169] (Thermoplastic resin)

[0170] The resin composition of this embodiment contains a thermoplastic resin from the viewpoint of improving the handling properties of the resin film. The type of the thermoplastic resin is not particularly limited, and the molecular weight is also not limited, but from the viewpoint of further improving the compatibility with the (A) component, the number average molecular weight (Mn) is preferably 200 to 60,000.

[0171] From the viewpoint of film formation and moisture absorption resistance, the thermoplastic resin is preferably a thermoplastic elastomer. As the thermoplastic elastomer, for example, styrene elastomers, olefin elastomers, urethane elastomers, polyester elastomers, polyamide elastomers, acrylic elastomers, silicone elastomers, and their derivatives can be cited. The thermoplastic resin can be used alone or in combination of two or more.

[0172] In addition, as the thermoplastic elastomer, a thermoplastic elastomer having a reactive functional group at a molecular end or in a molecular chain can be used. Examples of the reactive functional group include epoxy, hydroxyl, carboxyl, amino, amide, isocyanate, acryloyl, methacryloyl, vinyl, etc. By having these reactive functional groups at the molecular end or in the molecular chain, compatibility is improved, the internal stress generated during the curing of the thermosetting resin composition can be more effectively reduced, and the warping of the substrate can be reduced.

[0173] Among these reactive functional groups, the thermoplastic elastomer preferably has an epoxy group, a hydroxyl group, a carboxyl group, an amino group or an amide group from the viewpoint of adhesion to the metal foil, and more preferably has an epoxy group, a hydroxyl group or an amino group from the viewpoint of heat resistance and insulation reliability.

[0174] The styrene-based elastomer is not particularly limited as long as it is a thermoplastic elastomer having a structural unit derived from a styrene-based compound represented by the following general formula (see the following formula), and may be a thermoplastic elastomer having a structural unit derived from styrene (R a = hydrogen atom, k = 0) thermoplastic elastomer.

[0175] [Chemistry 27]

[0176]

[0177] In the above formula, R a is a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R b is an alkyl group having 1 to 5 carbon atoms. k is an integer of 0 to 5. a and R b Examples of the alkyl group having 1 to 5 carbon atoms represented by R include methyl, ethyl, and n-propyl. a and R b It may be an alkyl group having 1 to 3 carbon atoms or a methyl group. a It may be a hydrogen atom. k may be an integer of 0 to 2, or may be 0 or 1, or may be 0.

[0178] As a styrene-based elastomer, from the perspective of high-frequency characteristics (low relative dielectric constant, low dielectric loss tangent), adhesion to conductors, heat resistance, glass transition temperature and thermal expansion coefficient, it can be at least one selected from hydrogenated styrene-butadiene-styrene block copolymers (SEBS, SBBS), hydrogenated styrene-isoprene-styrene block copolymers (SEPS) and styrene-maleic anhydride copolymers (SMA).

[0179] The hydrogenated products of styrene-butadiene-styrene block copolymers include SEBS in which the hydrogenation rate of carbon-carbon double bonds is usually 90% or more (can be 95% or more), and SBBS in which the carbon-carbon double bonds (see the following left formula) at the 1,2-bonding site in the butadiene block are partially hydrogenated (the hydrogenation rate relative to all carbon-carbon double bonds is about 60 to 85%).

[0180] [Chemistry 28]

[0181]

[0182] In SEBS, from the viewpoint of high frequency characteristics (low relative dielectric constant, low dielectric loss tangent), adhesion to conductors, heat resistance, glass transition temperature and thermal expansion coefficient, the content of structural units from styrene (hereinafter sometimes referred to as styrene content) can be 5-80% by mass, 5-70% by mass, 10-70% by mass, or 10-50% by mass. The melt flow rate (MFR) of SEBS is not particularly limited, and can be 0.1-20 g / 10 min or 0.5-15 g / 10 min under the measurement conditions of 230°C and a load of 2.16 kgf (21.2 N).

[0183] In SBBS, from the viewpoint of high frequency characteristics (low relative dielectric constant, low dielectric loss tangent), adhesion to conductors, heat resistance, glass transition temperature and thermal expansion coefficient, the styrene content can be 40 to 80% by mass, 50 to 75% by mass, or 55 to 75% by mass. The melt flow rate (MFR) of SBBS is not particularly limited, and under the measurement conditions of 190°C and a load of 2.16 kgf (21.2 N), it can be 0.1 to 10 g / 10 min, 0.5 to 10 g / 10 min, or 1 to 6 g / 10 min.

[0184] The hydrogenation rate of the hydrogenated product of styrene-isoprene-styrene block copolymer (SEPS) can be 90% or more, or 95% or more. In SEPS, from the viewpoint of high-frequency characteristics (low relative dielectric constant, low dielectric loss tangent), adhesion to conductors, heat resistance, glass transition temperature and thermal expansion coefficient, the styrene content can be 5-60% by mass, 5-50% by mass, or 10-40% by mass. The melt flow rate (MFR) of SEPS is not particularly limited. Under the measurement conditions of 230°C and a load of 2.16 kgf (21.2 N), it can be 0.1-130 g / 10 min, 10-100 g / 10 min, or 50-90 g / 10 min.

[0185] As olefin-based elastomers, for example, copolymers of α-olefins having 2 to 20 carbon atoms, such as ethylene, propylene, 1-butene, 1-hexene, and 4-methyl-1-pentene; copolymers of α-olefins and non-conjugated dienes having 2 to 20 carbon atoms, such as dicyclopentadiene, 1,4-hexadiene, cyclooctadiene, methylene norbornene, ethylidene norbornene, butadiene, and isoprene; carboxyl-modified butadiene-acrylonitrile rubber obtained by copolymerizing methacrylic acid with a butadiene-acrylonitrile copolymer, and the like.

[0186] Examples of the α-olefin copolymer include ethylene-propylene copolymer (EPR) and ethylene-propylene-diene copolymer (EPDM).

[0187] Examples of the urethane elastomer include urethane elastomers having a hard segment formed of a low molecular weight (short chain) diol and a diisocyanate and a soft segment formed of a high molecular weight (long chain) diol and a diisocyanate.

[0188] As low molecular (short chain) diols, for example, ethylene glycol, propylene glycol, 1,4-butanediol, bisphenol A, etc. can be mentioned. The number average molecular weight of the low molecular (short chain) diol is preferably 48 to 500. As high molecular (long chain) diols, for example, polypropylene glycol, polytetrahydrofuran, poly(1,4-butylene adipate), poly(ethylene-1,4-butylene adipate), polycaprolactone, poly(1,6-hexanediol carbonate), poly(1,6-hexene / neopentyl adipate) (Japanese: ポリ(1,6-へキシレン·ネオペンチレンアジペート)), etc. The number average molecular weight of the high molecular (long chain) diol is preferably 500 to 10,000.

[0189] Examples of the polyester elastomer include polyester elastomers obtained by polycondensation of a dicarboxylic acid or a derivative thereof and a diol compound or a derivative thereof.

[0190] Examples of the dicarboxylic acid include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid, and aliphatic dicarboxylic acids such as adipic acid, sebacic acid, and dodecanedicarboxylic acid. The dicarboxylic acid may be used alone or in combination of two or more.

[0191] Examples of the diol compound include aliphatic diols, alicyclic diols, aromatic diols, etc. The diol compound may be used alone or in combination of two or more.

[0192] As the polyester elastomer, a multi-block copolymer having an aromatic polyester (eg, polybutylene terephthalate) portion as a hard segment component and an aliphatic polyester (eg, polytetramethylene glycol) portion as a soft segment component can be used.

[0193] Examples of the polyamide elastomer include block copolymers having polyamide as a hard segment component and polybutadiene, butadiene-acrylonitrile copolymers, styrene-butadiene copolymers, polyisoprene, ethylene-propylene copolymers, polyethers, polyesters, polybutadiene, polycarbonates, polyacrylates, polymethacrylates, polyurethanes, silicone rubbers, and the like as soft segment components.

[0194] Examples of acrylic elastomers include polymers obtained by polymerizing raw monomers containing acrylic esters as the main component. Examples of acrylic esters include ethyl acrylate, butyl acrylate, methoxyethyl acrylate, ethoxyethyl acrylate, and the like. Specific examples of acrylic elastomers include acrylonitrile-butyl acrylate copolymers, acrylonitrile-butyl acrylate-ethyl acrylate copolymers, and acrylonitrile-butyl acrylate-glycidyl methacrylate copolymers.

[0195] The silicone elastomer is, for example, an organopolysiloxane-based elastomer, and is classified into polydimethylsiloxane-based, polymethylphenylsiloxane-based, polydiphenylsiloxane-based, and the like according to the structure of the skeleton.

[0196] Among these thermoplastic elastomers, from the viewpoint of heat resistance and insulation reliability, styrene-based elastomers, olefin-based elastomers, polyamide-based elastomers and silicone-based elastomers are preferred, from the viewpoint of dielectric properties, styrene-based elastomers and olefin-based elastomers are more preferred, and hydrogenated styrene-based thermoplastic elastomers are further preferred.

[0197] The thermoplastic elastomer may be a modified elastomer. Examples of the modified elastomer include copolymer resins of the above-mentioned elastomers and acid anhydrides.

[0198] As the modified elastomer, for example, a copolymer resin of a styrene-based elastomer and anhydride (hereinafter referred to as elastomer (x)) is preferred. As the elastomer (x), there can be exemplified a modified elastomer containing a structural unit derived from an aromatic vinyl compound and a structural unit derived from maleic anhydride. As the structural unit derived from the aromatic vinyl compound of the elastomer (x), a structural unit represented by the following general formula (C-1) is preferred, and as the structural unit derived from maleic anhydride, a structural unit represented by the following general formula (C-2) is preferred.

[0199] [Chemistry 29]

[0200]

[0201] In the formula, R C1 represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, R C2 Each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms or an aromatic hydrocarbon group having 6 to 20 carbon atoms, and x represents an integer of 0 to 3.

[0202] As R C1 and R C2 Examples of the aliphatic hydrocarbon group having 1 to 5 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, tert-butyl, and n-pentyl. Among them, aliphatic hydrocarbon groups having 1 to 3 carbon atoms are preferred, and methyl and ethyl groups are more preferred, from the viewpoint of adhesion to copper foil and dielectric properties.C2 Examples of the aromatic hydrocarbon group having 6 to 20 carbon atoms include phenyl, naphthyl, anthracenyl, and biphenylyl.

[0203] In the structural unit represented by the general formula (C-1), preferably R C1 A structural unit represented by the following formula (C-1′) wherein x is 0 and is a hydrogen atom.

[0204] [Chemistry 30]

[0205]

[0206] The content ratio [(C-1) / (C-2)] (molar ratio) of the structural unit represented by the general formula (C-1) and the structural unit represented by the general formula (C-2) in the elastomer (x) is preferably 2 to 10, and more preferably 3 to 9. If the content ratio is 2 or more, there is a tendency that the improvement effect of the dielectric properties and heat resistance becomes sufficient, and if it is 10 or less, there is a tendency that the compatibility becomes good. The total content of the structural unit represented by the general formula (C-1) and the structural unit represented by the general formula (C-2) in the elastomer (x) is preferably 50% by mass or more, more preferably 70% by mass or more, further preferably 90% by mass or more, and particularly preferably substantially 100% by mass.

[0207] The weight average molecular weight (Mw) of the elastomer (x) is preferably 5000 to 18000, more preferably 6000 to 17000, further preferably 8000 to 16000, particularly preferably 10000 to 16000, and most preferably 12000 to 16000. It should be noted that the weight average molecular weights in this specification are all values ​​measured by gel permeation chromatography (GPC) using tetrahydrofuran as an eluent (in terms of standard polystyrene).

[0208] The content of the elastomer (x) in the resin composition is preferably 2 to 20 parts by mass, more preferably 3 to 15 parts by mass, and further preferably 4 to 13 parts by mass relative to 100 parts by mass of the solid content in the resin composition. If the content of the elastomer (x) is 2 parts by mass or more, the effect of lowering the relative dielectric constant is sufficiently obtained, and if it is 20 parts by mass or less, the dispersibility of the elastomer (x) is excellent, and the heat resistance and peel strength are excellent.

[0209] In terms of adhesion to metal foil, reactive functional groups at the molecular ends or in the molecular chains of the thermoplastic resin are preferably acid anhydride groups, epoxy groups, hydroxyl groups, carboxyl groups, amino groups, and amide groups, and acid anhydride groups are more preferred from the perspective of dielectric properties.

[0210] As the thermoplastic resin, resin particles may also be used. Examples of the resin particles include fluorine resin particles and other organic fine particles.

[0211] Examples of fluororesin particles include polytetrafluoroethylene (PTFE) fillers, tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) fillers, tetrafluoroethylene-hexafluoropropylene copolymer (FEP) fillers, tetrafluoroethylene-ethylene copolymer (ETFE) fillers, and polychlorotrifluoroethylene (PCTFE) fillers. Among them, PTFE fillers are preferred.

[0212] Other organic particles include, for example, polymethyl methacrylate particles, polycarbonate particles, polystyrene particles, polyacryl styrene particles, silicone particles, acrylic particles, benzoguanamine resin particles, melamine resin particles, polyolefin resin particles, polyester resin particles, polyamide resin particles, polyimide resin particles, etc. From the viewpoint of dielectric properties, polystyrene particles are preferred.

[0213] The amount of the thermoplastic resin is not particularly limited, but is preferably 1 to 70% by mass, more preferably 5 to 60% by mass, further preferably 10 to 50% by mass, and particularly preferably 15 to 45% by mass, based on the total amount of the resin components contained in the resin composition of the present embodiment. By setting the content of the thermoplastic resin within the above range, there is a tendency that the dielectric loss tangent is low, the handling property when formed into a film is excellent, and resin separation of the obtained interlayer insulating layer does not occur.

[0214] (Inorganic filler)

[0215] The resin composition of the present embodiment may further contain an inorganic filler. By optionally containing an appropriate inorganic filler, the low thermal expansion characteristics, high elastic modulus, heat resistance, flame retardancy, etc. of the resin composition can be improved. As the inorganic filler, there is no particular limitation, and examples thereof include: silicon dioxide, aluminum oxide, titanium oxide, mica, beryllium oxide, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, calcined clay, talc, aluminum borate, silicon carbide, etc. These may be used alone or in combination of two or more.

[0216] The shape and particle size of the inorganic filler are not particularly limited. The particle size of the inorganic filler can be, for example, 0.01 to 20 μm, or 0.1 to 10 μm. Here, the particle size refers to the average particle size, which is the particle size at a point equivalent to 50% of the volume when the cumulative frequency distribution curve based on the particle size is obtained by setting the total volume of the particles to 100%. The average particle size can be measured by a particle size distribution measuring device using a laser diffraction scattering method, etc.

[0217] When an inorganic filler is used, its usage is not particularly limited. For example, the content of the inorganic filler is preferably 3 to 75% by volume, more preferably 5 to 70% by volume, based on the total solid content in the resin composition. When the content of the inorganic filler in the resin composition is within the above range, good curability, moldability and chemical resistance are easily obtained.

[0218] When using an inorganic filler, a coupling agent can be used in combination as needed for the purpose of improving the dispersibility of the inorganic filler and the adhesion with the organic component. As a coupling agent, it is not particularly limited, and various silane coupling agents, titanate coupling agents, etc. can be used. These can be used alone or in combination of two or more. In addition, the amount of the coupling agent is not particularly limited, for example, it can be set to 0.1 to 5 parts by mass, or 0.5 to 3 parts by mass relative to 100 parts by mass of the inorganic filler used. If it is within this range, the reduction of various characteristics is small, and it is easy to effectively play the advantages brought by the use of inorganic fillers.

[0219] When a coupling agent is used, a so-called integral mixing method in which the coupling agent is added after the inorganic filler is mixed with the resin composition may be used, but preferably, an inorganic filler is used in which the inorganic filler is surface-treated with a coupling agent in advance in a dry or wet manner. By using this method, the advantages of the inorganic filler can be more effectively demonstrated.

[0220] (Flame Retardant)

[0221] The resin composition of the present embodiment may further contain a flame retardant. The flame retardant is not particularly limited, and a bromine-based flame retardant, a phosphorus-based flame retardant, a metal hydroxide, and the like are preferably used.

[0222] Examples of the brominated flame retardant include brominated epoxy resins, brominated addition-type flame retardants, and brominated reaction-type flame retardants containing an unsaturated double bond group.

[0223] Examples of the phosphorus-based flame retardant include aromatic phosphoric acid esters, phosphonic acid esters, phosphinates, and phosphazene compounds.

[0224] Examples of the metal hydroxide flame retardant include magnesium hydroxide, aluminum hydroxide, etc. These flame retardants may be used alone or in combination of two or more.

[0225] The resin composition of the present embodiment can be obtained by uniformly dispersing and mixing the above-mentioned components, and its preparation means, conditions, etc. are not particularly limited. For example, various components of a specified amount are fully and uniformly stirred and mixed using a mixer, etc., and then kneaded using a mixing roller, an extruder, a kneader, a roller, an extruder, etc., and then the obtained kneaded product is cooled and crushed. It should be noted that there is no particular limitation on the kneading form.

[0226] The relative dielectric constant of the cured product of the resin combination of the present embodiment is not particularly limited, and from the viewpoint of being suitable for use in high frequency bands, the relative dielectric constant at 10GHz is preferably less than 3.6, more preferably less than 3.1, and further preferably less than 3.0. The lower limit of the relative dielectric constant is not particularly limited, and can be, for example, about 1.0. In addition, from the viewpoint of being suitable for use in high frequency bands, the dielectric loss tangent of the cured product of the resin combination of the present embodiment is preferably less than 0.004, more preferably less than 0.003. The lower limit of the relative dielectric constant is not particularly limited, and for example, can be about 0.0001. The relative dielectric constant and dielectric loss tangent can be measured by the method shown in the following examples.

[0227] From the viewpoint of suppressing warpage of the laminate, the thermal expansion coefficient of the cured product of the resin composition of the present embodiment is preferably 10 to 90 ppm / ° C., more preferably 10 to 45 ppm / ° C., and even more preferably 10 to 40 ppm / ° C. The thermal expansion coefficient can be measured in accordance with IPC-TM-650 2.4.24.

[0228] [Resin film]

[0229] In this embodiment, a resin film can be produced using the above-mentioned resin composition. It should be noted that the resin film refers to an uncured or semi-cured film-like resin composition.

[0230] The method for producing the resin film is not limited, and for example, the resin film can be obtained by drying a resin layer formed by coating the resin composition on a supporting substrate. Specifically, the resin composition can be coated on a supporting substrate using a kiss coater, a roll coater, a comma coater, etc., and then dried in a heating drying furnace at a temperature of, for example, 70 to 250° C., preferably 70 to 200° C., for 1 to 30 minutes, preferably 3 to 15 minutes. In this way, a resin film in which the resin composition is in a semi-cured state can be obtained.

[0231] The semi-cured resin film can be thermally cured by further heating the semi-cured resin film in a heating furnace at a temperature of, for example, 170 to 250° C., preferably 185 to 230° C. for 60 to 150 minutes.

[0232] The thickness of the resin film of the present embodiment is not particularly limited, but is preferably 1 to 200 μm, more preferably 2 to 180 μm, and further preferably 3 to 150 μm. By setting the thickness of the resin film to the above range, it is easy to achieve both thinning and good high-frequency characteristics of the printed wiring board obtained using the resin film of the present embodiment.

[0233] The supporting substrate is not particularly limited, and is preferably at least one selected from glass, metal foil and PET film. By providing the resin film with a supporting substrate, there is a tendency that the storage property and the handling property when used to manufacture a printed wiring board become good. That is, the resin film of the present embodiment can adopt the form of a support with a resin layer, and the support with a resin layer has a resin layer and a supporting substrate comprising the resin composition of the present embodiment, and can be peeled off from the supporting substrate when used.

[0234] [Prepreg]

[0235] The prepreg of the present embodiment can be obtained, for example, by applying the resin composition of the present embodiment to a fiber substrate as a reinforcing substrate and drying the applied resin composition. In addition, the prepreg of the present embodiment can be obtained by impregnating the fiber substrate with the resin composition of the present embodiment and drying the impregnated resin composition. Specifically, the fiber substrate to which the resin composition is attached is heated and dried in a drying furnace at a temperature of usually 80 to 200° C. for 1 to 30 minutes, thereby obtaining a prepreg after semi-curing of the resin composition. From the viewpoint of good formability, it is preferred to apply or impregnate in such a manner that the amount of the resin composition attached to the fiber substrate reaches 30 to 90% by mass in terms of the resin content in the dried prepreg.

[0236] The reinforcing substrate of the prepreg is not limited, but a sheet-like fiber substrate is preferred. Examples of the sheet-like fiber substrate include inorganic fibers such as E glass, NE glass, S glass, and Q glass; and organic fibers such as polyimide, polyester, and tetrafluoroethylene. As the sheet-like fiber substrate, a substrate having a shape such as a woven fabric, a nonwoven fabric, or a chopped strand mat can be used.

[0237] [Laminated board]

[0238] According to the present embodiment, a laminate having a resin layer and a conductor layer can be provided, wherein the resin layer includes a cured product of the above-mentioned resin composition. For example, a metal-clad laminate can be produced using the above-mentioned resin film or the above-mentioned prepreg.

[0239] The manufacturing method of the metal-clad laminate is not limited. For example, one or more resin films or prepregs of the present embodiment are stacked, and a metal foil serving as a conductor layer is arranged on at least one side. The metal-clad laminate having a metal foil on at least one side of the resin layer or prepreg serving as an insulating layer is obtained by heating and pressurizing at a temperature of, for example, 170 to 250° C., preferably 185 to 230° C., and a pressure of 0.5 to 5.0 MPa for 60 to 150 minutes. Heating and pressurizing can be performed under conditions of, for example, a vacuum degree of 10 kPa or less, preferably 5 kPa or less, and are preferably performed in a vacuum from the viewpoint of improving efficiency. Heating and pressurizing are preferably performed from 30 minutes from the start to the end of molding.

[0240] [Multilayer printed circuit board]

[0241] According to the present embodiment, a multilayer printed wiring board having a resin layer and a circuit layer can be provided, wherein the resin layer contains a cured product of the above-mentioned resin composition. The upper limit of the number of layers of the circuit layer is not particularly limited, and can be 3 to 20 layers. The multilayer printed wiring board can also be manufactured using, for example, the above-mentioned resin film, prepreg or metal-clad laminate.

[0242] There is no particular limitation on the method for manufacturing a multilayer printed wiring board. For example, first, a resin film is arranged on one or both sides of a core substrate that has been processed for circuit formation, or a resin film is arranged between multiple core substrates, and pressurized and heated lamination is performed, or pressurized and heated compression molding is performed to bond the layers, and then circuit formation is performed by laser drilling, drill drilling, metal plating, metal etching, etc., thereby manufacturing a multilayer printed wiring board. In the case where the resin film has a supporting substrate, the supporting substrate can be peeled off in advance before the resin film is arranged on the core substrate or between the core substrates, or peeled off after the resin layer is attached to the core substrate.

[0243] according to Figure 1 A method for producing a multilayer printed wiring board using the resin film of the present embodiment will be described. Figure 1 The figure schematically shows the manufacturing process of the multilayer printed wiring board of the present embodiment. The manufacturing method of the multilayer printed wiring board of the present embodiment comprises: (a) a process of laminating a resin film on an inner layer circuit substrate to form a resin layer (hereinafter referred to as "process (a)"); (b) a process of heating and pressurizing the resin layer to cure it (hereinafter referred to as "process (b)"); and (c) a process of forming an antenna circuit layer on the cured resin layer (hereinafter referred to as "process (c)").

[0244] like Figure 1 As shown in (a) of FIG. 1 , in step (a), the resin film 12 of this embodiment is stacked on the inner layer circuit board 11 to form a resin layer composed of the resin film 12 .

[0245] The lamination method is not particularly limited, and examples thereof include: a method of laminating using a multi-stage press, a vacuum press, an atmospheric pressure laminator, a laminator for heating and pressurizing under vacuum, etc. A method using a laminator for heating and pressurizing under vacuum is preferred. Thus, even if the inner circuit board 11 has a fine wiring circuit on its surface, the spaces between the circuits can be filled with resin without voids. The lamination conditions are not particularly limited, and it is preferred to perform lamination under reduced pressure or vacuum at a crimping temperature of 70 to 130 °C and a crimping pressure of 1 to 11 kgf / cm 2 Lamination can be batch type (Japanese: バッチ式), and can also be a continuous type using rollers.

[0246] As the inner circuit board 11, there is no particular limitation, and glass epoxy boards, metal boards, polyester boards, polyimide boards, BT resin boards, thermosetting polyphenylene ether boards, etc. can be used. The circuit surface of the surface of the inner circuit board 11 where the resin film to be laminated is located can also be roughened in advance.

[0247] The number of circuit layers of the inner circuit board 11 is not limited. Figure 1 The inner circuit board is set to 6 layers in the [description], but is not limited to this number. For example, in the case of manufacturing a printed circuit board for a millimeter-wave radar, 2 to 20 layers, etc. can be freely selected according to its design. The multilayer printed circuit board of the present embodiment can be applied to the manufacture of millimeter-wave radars. That is, a printed circuit board for a millimeter-wave radar having a resin layer and a circuit layer can be manufactured, wherein the resin layer contains a cured product of the resin film of the present embodiment.

[0248] When the antenna circuit layer 14 described later is formed on the resin layer 12a by etching, a metal foil 13 can be further laminated on the resin film 12 to form a metal layer 13a. Examples of the metal foil include copper, aluminum, nickel, zinc, etc. From the viewpoint of conductivity, copper is preferred. The metal foil can also be an alloy. For example, as a copper alloy, a high-purity copper alloy added with a small amount of beryllium or cadmium can be cited. The thickness of the metal foil is preferably 3 to 200 μm, more preferably 5 to 70 μm.

[0249] As Figure 1 As shown in (b) of [reference], in step (b), the inner circuit board 11 and the resin layer 12a laminated in step (a) are heated and pressurized to be thermally cured. The conditions are not particularly limited, and are preferably in the range of a temperature of 100 °C to 250 °C, a pressure of 0.2 to 10 MPa, and a time of 30 to 120 minutes, more preferably 150 °C to 220 °C.

[0250] As Figure 1As shown in (c) of , in step (c), an antenna circuit layer 14 is formed on the resin layer 12a. The method for forming the antenna circuit layer 14 is not particularly limited. For example, it can be formed by an etching method such as a subtractive method, a semi-additive method, or the like.

[0251] The subtractive method is as follows: A resist layer (Japanese: etching resist layer) having a shape corresponding to the desired pattern shape is formed on the metal layer 13a. Through subsequent development processing, the metal layer in the portion where the resist has been removed is dissolved and removed with a chemical solution, thereby forming the desired circuit. As the chemical solution, for example, a copper chloride solution, an iron chloride solution, or the like can be used.

[0252] The semi-additive method is as follows: A metal film is formed on the surface of the resin layer 12a by electroless plating. A plating resist layer having a shape corresponding to the desired pattern is formed on the metal film. Then, after forming a metal layer by electroplating, the unnecessary electroless plating layer is removed with a chemical solution or the like, thereby forming the desired circuit layer.

[0253] In addition, holes such as via holes 15 can be formed on the resin layer 12a as needed. The method for forming the holes is not limited, and NC drilling, carbon dioxide gas laser, UV laser, YAG laser, plasma, etc. can be applied.

[0254] Here, the inner layer circuit board 11 can also be manufactured through Figure 2 the steps (p) to (r) shown in . Figure 2 FIG. is a diagram schematically showing the manufacturing process of the inner layer circuit board. That is, the manufacturing method of the multilayer printed wiring board of the present embodiment may include steps (p), (q), (r), (a), (b), and (c). Hereinafter, steps (p) to (r) will be described.

[0255] First, as Figure 2 shown in (p) of , in step (p), the core substrate 41 and the prepreg 42 are laminated. As the core substrate, for example, a glass epoxy substrate, a metal substrate, a polyester substrate, a polyimide substrate, a BT resin substrate, a thermosetting polyphenylene ether substrate, etc. can be used. As the prepreg, for example, "GWA-900G", "GWA-910G", "GHA-679G", "GHA-679G(S)", "GZA-71G", "GEA-75G" (all are trade names) manufactured by Hitachi Chemical Co., Ltd. can be used.

[0256] Then, as Figure 2As shown in (q), in step (q), the laminate of the core substrate 41 and the prepreg 42 obtained in step (p) is heated and pressurized. The heating temperature is not particularly limited, and is preferably 120 to 230°C, and more preferably 150 to 210°C. In addition, the pressurizing pressure is not particularly limited, but is preferably 1 to 5 MPa, and more preferably 2 to 4 MPa. The heating time is not particularly limited, but is preferably 30 to 120 minutes. In this way, an inner layer circuit substrate having excellent dielectric properties, mechanical properties under high temperature and humidity, and electrical connection reliability can be obtained.

[0257] Furthermore, if Figure 2 As shown in (r), in step (r), a through hole (Japanese: スルーホール) 43 is formed on the inner layer circuit substrate as needed. The method for forming the through hole 43 is not particularly limited and can be the same as the step of forming the antenna circuit layer described above, or a known method can be used.

[0258] The multilayer printed wiring board of the present embodiment can be manufactured through the above steps. In addition, the printed wiring board manufactured through the above steps can be used as an inner layer circuit board and the steps (a) to (c) can be further repeated.

[0259] Figure 3 To schematically illustrate the Figure 1 The multilayer printed wiring board manufactured by the process shown is a diagram of the manufacturing process of a multilayer printed wiring board used as an inner layer circuit substrate. Figure 3 (a) and Figure 1 Corresponding to (a), Figure 3 (b) and Figure 1 Corresponding to (b), Figure 3 (c) and Figure 1 corresponds to (c).

[0260] Specifically, Figure 3 (a) is a step of laminating the resin film 22 on the inner layer circuit board 21 to form the resin layer 22a, and laminating the metal foil 23 on the resin film 22 to form the metal layer 23a as needed. Figure 3 (b) is a step of heating and pressurizing the resin layer 22a to cure it. Figure 3 (c) is a step of forming the antenna circuit layer 24 on the cured resin layer.

[0261] exist Figure 1 and Figure 3In the embodiment, the number of resin layers stacked on the inner circuit substrate is set to 1 or 2 for the purpose of forming an antenna circuit pattern, but it is not limited thereto and may be set to 3 or more layers according to the antenna circuit design. By setting the antenna circuit layer to multiple layers, it becomes easy to design an antenna having wide-band characteristics and an antenna with little angle change in the antenna radiation pattern in the used frequency band (no beam tilt (Japanese: ビームチルトレス)).

[0262] In the method for manufacturing a multilayer printed wiring board of this embodiment, a resin film containing components (A) and (B) is used to form a resin layer, so that a laminated body without an adhesive layer other than a layer having excellent high-frequency characteristics can be produced. This can simplify the process and further improve the high-frequency characteristics.

[0263] The resin composition, resin film, prepreg, laminate, and multilayer printed wiring board of the present embodiment described above can be suitably used in electronic devices that process high-frequency signals of 1 GHz or more, and particularly can be suitably used in electronic devices that process high-frequency signals of 10 GHz or more.

[0264] The preferred embodiments of the present invention have been described above, but these embodiments are for illustration of the present invention and are not intended to limit the scope of the present invention to these embodiments. The present invention can be implemented in various ways different from the above embodiments without departing from the gist of the present invention.

[0265] Example

[0266] Hereinafter, the present invention will be described in more detail based on Examples and Comparative Examples. However, the present invention is not limited to the following Examples.

[0267] [Preparation of resin composition]

[0268] Various resin compositions were prepared according to the following procedures. Tables 1 and 2 show the amounts (parts by mass) of the raw materials used in preparing the resin compositions of Examples 1 to 10 and Comparative Examples 1 and 2.

[0269] In a 300 mL four-necked flask equipped with a thermometer, a reflux condenser and a stirrer, the components shown in Table 1 or 2 were placed, stirred at 25°C for 1 hour, and then filtered through a #200 nylon mesh (pore size 75 μm) to obtain a resin composition.

[0270] In addition, the abbreviations of each material in Tables 1 and 2 are as follows.

[0271] (1) BMI-3000 [Mw: about 3000, manufactured by Designer Molecules Inc., trade name]

[0272] (2) BMI-5000 [Mw: about 5000, manufactured by Designer Molecules Inc., trade name]

[0273] (3) BMI-1000 [Bis(4-maleimidophenyl)methane, manufactured by Yamato Chemical Industry Co., Ltd., trade name]

[0274] (4) BMI-4000 [2,2-bis(4-(4-maleimidophenoxy)phenyl)propane, manufactured by Yamato Chemical Industry Co., Ltd., trade name]

[0275] (5) Diphenylamine M [4,4'-[1,3-phenylenebis(1-methylethylidene)]diphenylamine, manufactured by Mitsui Chemicals, Inc., trade name]

[0276] (6) H1041 [a hydrogenated product of a styrene-butadiene copolymer having a Mn of less than 60,000, styrene content: 30%, Mn: 58,000, manufactured by Asahi Kasei Corporation, trade name “Tuftec H1041”]

[0277] (7) M1913 [carboxylic acid-modified hydrogenated styrene-butadiene copolymer resin, manufactured by Asahi Kasei Corporation, trade name “Tuftec M1913”]

[0278] (8) MP-10 [amine-modified styrene-based thermoplastic elastomer, manufactured by Asahi Kasei Corporation, trade name “Tuftec MP-10”]

[0279] (9) EF-80 [maleic acid-modified styrene elastomer, manufactured by Cray Valley Technology USA, styrene content = 89% by mass, trade name “SMA EF-80”]

[0280] (10) S202A [Polyphenylene ether polymer composed of 2,6-dimethylphenol, manufactured by Asahi Kasei Corporation, trade name “Zylon S202A”]

[0281] (11) Ricon 130MA8 [weight average molecular weight 5400, number of maleic anhydride groups in one molecule 2, manufactured by Cray Valley, trade name]

[0282] (12) PTFE filler [manufactured by Asahi Glass Co., Ltd., trade name “Fluon L170J”]

[0283] (13) Styrene microparticles [(manufactured by Sekisui Chemicals Co., Ltd., cross-linked polystyrene SBX, average particle size 1.0 μm]

[0284] (14) Perbutyl P [α,α'-bis(tert-butylperoxy)diisopropylbenzene, manufactured by NOF Corporation, trade name]

[0285] (15) Silica slurry [spherical fused silica, surface treatment: phenylaminosilane coupling agent (1 mass% / total solid content in slurry), dispersion medium: methyl isobutyl ketone (MIBK), solid content concentration: 70 mass%, average particle size: 0.5 μm, density: 2.2 g / cm 3 , manufactured by Admatechs Co., Ltd.]

[0286] [Table 1]

[0287]

[0288] [Table 2]

[0289]

[0290] The estimated structure of the compound (BMI-3000, BMI-5000) used as the component (A) is represented by the following formula (XII-3).

[0291] [Chemistry 31]

[0292]

[0293] [Production of a resin film having a semi-cured resin layer]

[0294] The resin compositions obtained in the examples and comparative examples were coated on a 38 μm thick PET film (G2-38, manufactured by Teijin Limited) as a supporting substrate using a comma coater (drying temperature: 130° C.) to prepare a semi-cured resin film with a PET film having a semi-cured resin layer. The thickness of the semi-cured resin film (resin layer) was 50 μm.

[0295] [Evaluation of resin film]

[0296] The appearance and handling properties of the semi-cured resin films of Examples 1 to 10 and Comparative Examples 1 and 2 were evaluated. The results are shown in Tables 3 and 4.

[0297] The appearance was evaluated visually according to the following criteria.

[0298] ○: The surface of the semi-cured resin film has no unevenness, streaks, or the like.

[0299] ×: The surface of the semi-cured resin film has unevenness, streaks, etc., and the surface smoothness is poor.

[0300] The handling properties were evaluated visually and by touch according to the following criteria.

[0301] (1) Whether the surface is sticky (tack) at 25°C.

[0302] (2) Check whether the resin cracks or drops powder when cutting with a cutting knife.

[0303] ○: None of the above (1) and (2).

[0304] ×: Any of the above (1) and (2) is present.

[0305] [Multilayer printed circuit board]

[0306] A multilayer printed wiring board was produced by the following procedure using the semi-cured resin film with PET film described above.

[0307] A glass cloth-based epoxy resin copper-clad laminate with a circuit pattern is used as an inner layer circuit substrate. A semi-cured resin film with the PET film peeled off is placed on both sides thereof, and a 12μm thick electrolytic copper foil (manufactured by Nippon Electrolysis Co., Ltd., trade name "YGP-12") is arranged on it. A cover plate (Japanese: mirror plate) is placed on it, and heating and pressure molding are performed under the pressing conditions of 200°C / 3.0MPa / 70 minutes to make a 4-layer printed circuit board.

[0308] Then, the outermost copper foil of the produced four-layer printed wiring board was etched to evaluate the circuit embedding property (multilayer moldability). The multilayer moldability was evaluated by visual inspection according to the following criteria.

[0309] ○: There are no gaps or white spots in the circuit.

[0310] ×: There are gaps and white space.

[0311] [Metal-coated cured resin film on both sides]

[0312] After two sheets of resin films are overlapped after the PET film is peeled off from the above-mentioned semi-cured resin film with PET film, low-smoothness copper foil (M-side Rz: 3 μm, manufactured by Furukawa Electric Co., Ltd., trade name "F3-WS") with a thickness of 18 μm is arranged on both sides in a manner so that their roughened surfaces (M-sides) are in contact, and a cover plate is placed thereon. Heating and pressure molding are performed under pressing conditions of 200°C / 3.0 MPa / 70 minutes to produce a double-sided metal-coated cured resin film (thickness: 0.1 mm).

[0313] The double-sided metal-clad cured resin film was evaluated for handling properties (bending resistance), dielectric properties, copper foil peel strength, solder heat resistance, and thermal expansion properties. The evaluation results are shown in Tables 3 and 4. The property evaluation method of the double-sided metal-clad cured resin film is as follows.

[0314] [Bending resistance]

[0315] The outer copper foil coated with the metal cured resin film on both sides was etched and then folded 180 degrees, and the folding resistance was evaluated according to the following criteria.

[0316] ○: No breakage or cracking occurred during bending.

[0317] ×: Cracks or splits occur during bending.

[0318] [Dielectric properties]

[0319] Regarding the relative dielectric constant and dielectric loss tangent as dielectric properties, the outer copper foil with metal cured resin film on both sides was etched and cut into pieces with a length of 60 mm, a width of 2 mm, and a thickness of about 1 mm. This was used as a test piece and measured by the cavity resonator perturbation method. The measuring instrument used was the vector network analyzer E8364B manufactured by Agilent Technologies, the cavity resonator used was the CP129 (10 GHz band resonator) and CP137 (20 GHz band resonator) manufactured by Kanto Electronics Application Development Co., Ltd., and the measurement program used was CPMA-V2. The conditions were set to a frequency of 10 GHz and a measurement temperature of 25°C.

[0320] [Coefficient of Thermal Expansion (CTE)]

[0321] Regarding the thermal expansion coefficient (in the thickness direction), the copper foil coated with the metal cured resin film on both sides was etched and cut into 5 mm squares. The test pieces were used as test pieces and measured using a thermomechanical analyzer TMA (manufactured by TA Instruments, Q400) (temperature range: 30 to 150° C., load: 5 g) based on the IPC standard (IPC-TM-650 2.4.24).

[0322] [Copper foil peel strength]

[0323] The copper foil peel strength was measured in accordance with the copper-clad laminate test standard JIS-C-6481. The measurement temperature was set at 25°C.

[0324] [Solder heat resistance]

[0325] Regarding solder heat resistance, the copper foil on one side of the two sides covered with metal cured resin film was etched and cut into 50 mm squares, which were used as test pieces. After the test pieces were treated for a specified time (1, 3, and 5 hours) in the normal state and the pressure cooker test (PCT) device (conditions: 121°C, 2.2 atmospheres), the obtained product was floated on the molten solder at 288°C for 20 seconds, and the appearance of each cured resin film with different treatment time was visually evaluated according to the following criteria. For the same treatment time, 3 test pieces were evaluated, and the number of pieces with "○" in the following criteria is shown in Tables 3 and 4. It should be noted that in Tables 3 and 4, the test pieces treated for 1 hour are marked as PCT-1h, the test pieces treated for 3 hours are marked as PCT-3h, and the test pieces treated for 5 hours are marked as PCT-5h.

[0326] ◯: No expansion or white spots were observed inside the film or between the film and the copper foil.

[0327] ×: Swelling or generation of white spots was observed inside the film and between the film and the copper foil.

[0328] [Table 3]

[0329]

[0330] [Table 4]

[0331]

[0332] From the results shown in Table 3, it is clear that the semi-cured resin films of Examples 1 to 10 have excellent high-frequency characteristics, adhesion, and solder heat resistance.

[0333] In addition, when the components (A) and (B) are used in combination (Examples 9 and 10), a lower thermal expansion coefficient can be achieved compared to the case where the component (A) is used alone (Examples 1 to 8).

[0334] Industrial Applicability

[0335] The resin composition of the present invention exhibits various properties required for a printed wiring board and excellent high-frequency properties, and is therefore useful as a member or component of a printed wiring board used in various electronic devices such as electronic devices that process high-frequency signals of 1 GHz or more or 10 GHz or more, mobile communication devices and their base station devices, servers, routers and other network-related electronic devices, and mainframe computers.

Claims

1. A resin composition comprising (A) a maleimide compound having a saturated or unsaturated divalent hydrocarbon group, a thermoplastic resin and an inorganic filler, The blending amount of the thermoplastic resin is 5 mass % to 70 mass % based on the total amount of the resin components contained in the resin composition. The hydrocarbon group is a group represented by the following formula (II): In formula (II), R2 and R3 each independently represent an alkylene group having 4 to 50 carbon atoms, R4 represents an alkyl group having 4 to 50 carbon atoms, and R5 represents an alkyl group having 2 to 50 carbon atoms.

2. The resin composition according to claim 1, wherein The hydrocarbon group has 8 to 100 carbon atoms.

3. The resin composition according to claim 1 or 2, wherein The (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group further has a divalent group having at least two imide bonds.

4. The resin composition according to claim 3, wherein The divalent group having at least two imide bonds is a group represented by the following formula (I): In formula (I), R1 represents a tetravalent organic group.

5. The resin composition according to claim 1 or 2, wherein The invention further contains (B) an aromatic maleimide compound having a structure in which a maleimide group is bonded to an aromatic ring.

6. The resin composition according to claim 5, wherein The (B) aromatic maleimide compound is a compound represented by the following formula (VI): In formula (VI), A4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X), and A5 represents a residue represented by the following formula (XI). In formula (VII), R 10 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, In formula (VIII), R 11 and R 12 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a single bond, or a residue represented by the following formula (VIII-1), In formula (VIII-1), R 13 and R 14 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group, or a single bond, In formula (IX), i is an integer from 1 to 10, In formula (X), R 15 and R 16 Each independently represents a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, j is an integer of 1 to 8, In formula (XI), R 17 and R 18 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom, A8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a thioether group, a sulfonyl group, a carbonyl group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2), In formula (XI-1), R 19 and R 20 each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m-phenylene diisopropylidene group, a p-phenylene diisopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group, or a single bond, In formula (XI-2), R 21 Each independently represents a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and A 10 and A 11 Each independently represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a thioether group, a sulfonyl group, a carbonyl group or a single bond.

7. The resin composition according to claim 1 or 2, wherein The weight average molecular weight of the (A) maleimide compound having a saturated or unsaturated divalent hydrocarbon group is 500 to 10,000. 8 . A laminate comprising a resin layer and a conductor layer, wherein the resin layer comprises a cured product of the resin composition according to claim 1 . 9 . A multilayer printed wiring board comprising a resin layer and a circuit layer, wherein the resin layer comprises a cured product of the resin composition according to claim 1 .

10. An uncured or semi-cured resin film of the resin composition according to any one of claims 1 to 7. 11 . A prepreg obtained by semi-curing the resin composition according to claim 1 .

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