Edge micro server AI computing module system installation method and device, and storage medium

Abstract

The application relates to an edge micro server AI computing module system installation method and device and a storage medium. In the application, a hardware communication link between an AI computing module and a COME module in an edge micro server is established, and the edge micro server is connected with a PXE server; the PXE server provides an operating system for the COME module, and a to-be-installed system of the AI computing module is placed in a specified directory of the operating system; the COME module is powered on and started by the PXE server; the COME module after starting creates a simulated boot disk for storing the to-be-installed system by using the to-be-installed system in the specified directory; the simulated boot disk is connected to the AI computing module through the hardware communication link; after the simulated boot disk is created, the AI computing module is powered on and started by the simulated boot disk, and installation of the to-be-installed system in the AI computing module is realized.

Description

Technical Field

[0001] This invention relates to the field of edge microserver AI computing module system installation, and more particularly to edge microserver AI computing module system installation methods, apparatus and storage media. Background Technology

[0002] With the rapid development of 5G and the Internet of Things, holographic intersections, vehicle-road collaboration, and autonomous driving are becoming increasingly popular, and their business processing relies on edge microservers.

[0003] One form of edge microserver comprises a COME module with a low-power x86 CPU at its core and an independently operating AI computing module. The COME module is a computer module based on the COM Express open industry standard library, primarily responsible for management and data communication functions. The AI ​​computing module is mainly used for data computation. Together, these two modules form a compact edge microserver with separate management and computing capabilities. Typically, the COME module uses a general-purpose x86 architecture, while the AI ​​computing module uses an ARM architecture. Depending on the computing power, multiple AI computing modules may exist. Due to differences in architecture leading to different system installations, the current system installation scheme connects each module to the network. PXE network installation is configured in the BIOS of the COME module and also in the U-Boot of the AI ​​computing module. U-Boot is a bootloader primarily used for embedded systems, supporting various computer system architectures including PPC, ARM, AVR32, MIPS, and x86. PXE (Preboot Execution Environment) provides a mechanism for booting a computer using a network interface. When installing on the same edge microserver via PXE, if the AI ​​computing module has a network interface, multiple network cables are needed, and each AI computing module must be installed individually. If the AI ​​computing module does not have an exposed network interface, it can only be installed via a USB drive connected to its USB port. Installing each AI computing module individually using a USB drive is inconvenient, requires significant manual intervention, and is prone to omissions or incorrect installations. Summary of the Invention

[0004] To solve the above-mentioned technical problems, or at least partially solve them, the present invention provides an installation method, apparatus and storage medium for an edge microserver AI computing module system.

[0005] In a first aspect, the present invention provides an installation method for an edge microserver AI computing module system, comprising: establishing a hardware communication link between the AI ​​computing module and the COME module in the edge microserver, wherein the edge microserver is network-connected to a PXE server; wherein the PXE server provides an operating system for the COME module, and places the system to be installed for the AI ​​computing module in a specified directory of the operating system;

[0006] The control unit first powers on the COME module, and then the COME module is booted by the PXE server. After booting, the COME module creates a simulated boot disk in the specified directory where the system to be installed is located. The simulated boot disk is connected to the AI ​​computing module via a hardware communication link.

[0007] Once the simulated boot disk has been created, the AI ​​computing module is powered on. After power-on, the AI ​​computing module is booted by the simulated boot disk and the system to be installed is installed from the simulated boot disk.

[0008] Furthermore, an operating system for the COME module is pre-made, which includes drivers for various types of simulated boot disks, so that the COME module can simulate the corresponding simulated boot disk based on the drivers. A specified directory for storing the AI ​​computing module's system to be installed is configured in the operating system. The operating system is then deployed to the PXE server.

[0009] Furthermore, during the installation of the AI ​​computing module system, the type of hardware communication link between the AI ​​computing module and the COME module in the edge microserver is collected, and the corresponding driver is selected according to the type of hardware communication link to simulate a boot disk adapted to the hardware communication link.

[0010] Furthermore, during the installation of the AI ​​computing module system, the BIOS of the COME module is configured to prioritize booting from the PEX server, and the Uboot of the AI ​​computing module is configured to prioritize booting from the device connected to the hardware communication link between the AI ​​computing module and the COME module.

[0011] Furthermore, after the COME module successfully creates the simulated boot disk, it generates power-on control information that directly or indirectly controls the power-on of the AI ​​computing module. The power-on circuit of the edge microserver directly or indirectly controls the power-on of the AI ​​computing module according to the power-on control information.

[0012] Furthermore, the process of creating a simulated boot disk by the COME module is configured as the boot entry of the operating system of the COME module. The operating system boot completion signal is used as the power-on control information, and the power-on circuit is directly or indirectly controlled to power on the AI ​​computing module according to the operating system boot completion signal.

[0013] Secondly, the present invention provides an edge microserver AI computing module system installation device based on an edge microserver AI computing module system installation method, comprising:

[0014] At least one COME module;

[0015] At least one AI computing module;

[0016] A hardware communication link connecting the AI ​​computing module and the COME module;

[0017] First, power on the COME module, and then control the power-on circuit to power on the AI ​​computing module based on the completion of the COME module's simulation boot disk creation; and,

[0018] A PXE server connected to the external interface of the COME module; wherein the PXE server deploys the operating system of the COME module;

[0019] The power-on circuit controls the COME module to power on. When the COME module starts using the operating system provided by the PXE server, it simulates the creation of a simulated boot disk that is compatible with the hardware communication link and contains the system to be installed, triggering the power-on circuit to control the AI ​​computing module to power on. After power-on, the AI ​​computing module uses the simulated boot disk to boot and execute the installation of the system to be installed.

[0020] Furthermore, the hardware communication link includes an interface extender that connects multiple AI computing modules to a single COME module.

[0021] Furthermore, the power-on circuit includes a power-on controller, which is electrically connected to the power supply and pg pin of the power supply. The power-on controller responds to the powergood signal output by the power supply pg pin and controls the power supply pin of the power supply to supply power to the COME module. After the COME module creates the simulation boot disk, it directly or indirectly provides power-on control information to the power-on controller through the BMC. The power-on controller responds to the power-on control information and controls the power supply pin of the power supply to power on the AI ​​computing module.

[0022] Thirdly, the present invention provides a storage medium for implementing an edge microserver AI computing module system installation method, wherein the storage medium stores a computer program, and the computer program, when executed by a processor, implements the edge microserver AI computing module system installation method.

[0023] The technical solutions provided in the embodiments of the present invention have the following advantages compared with the prior art:

[0024] This invention establishes communication between the COME module and the AI ​​computing module via a hardware communication link. The COME module's external interface connects to a PXE server, which hosts the COME module's operating system. The COME module's operating system stores the system to be installed on the AI ​​computing module in a designated directory. The COME module's operating system is configured with drivers for various types of simulated boot disks. Based on these drivers, the specified directory containing the system to be installed is created as a simulated boot disk. After the simulated boot disk is created, the AI ​​computing module is powered on and booted from the simulated boot disk to install the system. This enables system installation on AI computing modules in edge microservers that lack a network interface.

[0025] This invention pre-installs drivers for various types of simulated boot disks in the operating system of the COME module; it can select the appropriate driver based on the hardware communication link type between the COME module and the AI ​​computing module in the edge microserver, and create a simulated boot disk adapted to the hardware communication link based on the driver. It can adapt to system installations of AI computing modules connected to the COME module with different hardware communication links. Attached Figure Description

[0026] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 A flowchart illustrating an installation method for an edge microserver AI computing module system provided in this embodiment of the invention;

[0029] Figure 2 This is a flowchart illustrating how the COME module automatically creates a corresponding simulated boot disk based on the hardware communication link type, as provided in this embodiment of the invention.

[0030] Figure 3 A flowchart illustrating the type of simulated boot disk pre-configured according to the hardware communication link type, provided for embodiments of the present invention;

[0031] Figure 4 This is a schematic diagram of an installation device for an edge microserver AI computing module system provided in an embodiment of the present invention;

[0032] Figure 5 A schematic diagram of the power-on circuit provided in an embodiment of the present invention;

[0033] Figure 6 This is a schematic diagram of another edge microserver AI computing module system installation device provided in an embodiment of the present invention. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0036] Example 1

[0037] This invention provides an installation method for an edge microserver AI computing module system, applicable to an edge server configured with a COME module and an AI computing module. The installation method requires:

[0038] A hardware communication link is established between AI computing modules and COME modules in an edge microserver. As an optimization of this hardware communication link, an interface extender is configured within it, connecting multiple AI computing modules to a single COME module. For example, a feasible hardware communication link could be a USB link, configured with a USB expansion module. This USB expansion module connects multiple AI computing modules to the COME module, enabling the simulated boot disk created by the COME module to connect to multiple AI computing modules, supporting system installation across multiple AI computing modules.

[0039] A PXE server connected to the network-connected edge microserver is provided. This PXE server can connect to the external interface of the COME module, and it provides an operating system for the COME module. The operating system for the COME module is pre-made and deployed on the PXE server. This operating system configures drivers for various types of simulated boot disks, enabling the COME module to simulate the corresponding simulated boot disks based on these drivers. A designated directory for storing the system to be installed on the AI ​​computing module is configured within this operating system.

[0040] First, the COME module is powered on, and then a power-on circuit is used to control the power-on of the AI ​​computing module based on the completion of the COME module's simulated boot disk creation. The power-on circuit includes a power-on controller; one feasible power-on controller uses a CPLD and is electrically connected to the power supply and PG pins. The power-on controller controls two MOSFET switches via pin drives. One MOSFET switch is located between the power supply pin and the COME module's power-on pin. The power-on controller responds to the powergood signal output from the power supply PG pin by closing this MOSFET switch, allowing the power supply pin to supply power to the COME module. The other MOSFET switch is located between the power supply pin and the AI ​​computing module's power supply bus. The AI ​​computing module's power supply bus supplies power to all AI computing modules corresponding to the COME module through a branch connected to the power supply bus. The power-on controller responds to power-on control information indicating the completion of simulated boot disk creation by closing this MOSFET switch, allowing the power supply pin to supply power to the COME module.

[0041] See Figure 1 As shown, during the installation of the AI ​​computing module system, the BIOS of the COME module is pre-configured to allow the COME module to be booted by the PEX server first, and the Uboot of the AI ​​computing module is configured to allow the AI ​​computing module to be booted by the device connected to the hardware communication link between the AI ​​computing module and the COME module first.

[0042] When the edge microserver is powered on, the power-on circuit of the edge microserver controls the COME module to power on first, and the COME module is then booted up by the PXE server.

[0043] During the startup process, the COME module creates a simulated boot disk in the specified directory where the system to be installed is located; wherein, the simulated boot disk is connected to the AI ​​computing module via a hardware communication link.

[0044] In the specific implementation process, please refer to Figure 2As shown, to ensure that the created simulated boot disk is compatible with the hardware communication link, before creating the simulated boot disk, the COME module collects the type of the hardware communication link between the AI ​​computing module and the COME module in the edge microserver through the BMC of the edge microserver. When creating the simulated boot disk, the COME module directly selects the corresponding driver according to the type of the hardware communication link, and simulates a simulated boot disk compatible with the hardware communication link based on the selected driver. If the collected hardware communication link type is a USB link, a feasible simulated boot disk type is a USB flash drive. The COME module simulates a USB flash drive based on the USB gadget driver configured in the operating system, enabling the USB link to provide communication between the AI ​​computing module and the simulated boot disk.

[0045] Or, see Figure 3 As shown, the type of hardware communication link between the AI ​​computing module and the COME module in the edge server is collected in advance through the BMC of the edge server. The operating system of the COME module is pre-configured on the PXE server according to the type of hardware communication link, so that the operating system knows the type of the simulated boot disk created when it starts. After the COME module starts through the operating system provided by the PXE server, it directly creates the corresponding simulated boot disk according to the pre-configured simulated boot disk type.

[0046] Under the condition that the simulated boot disk creation is completed, the power-on circuit controls the AI ​​computing module corresponding to the COME module to power on. In specific implementation, after the COME module successfully creates the simulated boot disk, it generates power-on control information that directly or indirectly controls the power-on of the AI ​​computing module. The power-on circuit of the edge microserver directly or indirectly controls the AI ​​computing module to power on based on this power-on control information. The process of creating the simulated boot disk for the COME module is configured as a startup item in the COME module's operating system. During the startup process, after all startup items are executed, the COME module's operating system generates an operating system startup completion signal. This operating system startup completion signal is used as the power-on control information, and the power-on circuit directly or indirectly controls the AI ​​computing module to power on based on this signal.

[0047] Specifically, the power-on controller directly powers on the AI ​​computing module based on the power-on control information: the power-on controller is directly connected to the COME module via GPIO, and the COME module directly transmits power-on control information to the power-on controller. The power-on controller configures a flag bit in a register. The initial value of the flag bit is 0. When the flag bit is 0, the power-on controller controls the MOSFET switch connected between the AI ​​computing module and the power-on pin to open. When the flag bit is 1, the power-on controller controls the MOSFET connected between the AI ​​computing module and the power-on pin to close. The flag bit in the register of the power-on controller is set to 1 in response to the power-on control information.

[0048] The AI ​​computing module is powered on directly based on the power-on control information: The power-on controller is connected to the BMC via GPIO. The power-on controller has a flag bit configured in the register. The initial value of the flag bit is 0. When the flag bit is 0, the power-on controller controls the MOSFET switch connected between the AI ​​computing module and the power-on pin to open. When the flag bit is 1, the power-on controller controls the MOSFET connected between the AI ​​computing module and the power-on pin to close. The BMC is connected to the COME module. The COME module transmits power-on control information to the BMC. In response to the power-on control information, the BMC uses GPIO to rewrite the flag bit in the register of the power-on controller to 1.

[0049] After power-on, the AI ​​computing module is booted up by the simulated boot disk and the system to be installed is installed in the simulated boot disk.

[0050] Example 2

[0051] See Figure 4 As shown, an edge microserver AI computing module system installation device based on an edge microserver AI computing module system installation method includes:

[0052] At least one COME module;

[0053] At least one AI computing module;

[0054] A hardware communication link connecting the AI ​​computing module and the COME module;

[0055] First, power on the COME module, and then control the power-on circuit to power on the AI ​​computing module based on the completion of the COME module's simulation boot disk creation; and,

[0056] A PXE server connected to the external interface of the COME module; wherein the PXE server deploys the operating system of the COME module;

[0057] The power-on circuit controls the COME module to power on. When the COME module starts using the operating system provided by the PXE server, it simulates the creation of a simulated boot disk that is compatible with the hardware communication link and contains the system to be installed, triggering the power-on circuit to control the AI ​​computing module to power on. After power-on, the AI ​​computing module uses the simulated boot disk to boot and execute the installation of the system to be installed.

[0058] As an optimization of Example 2, see [link / reference] Figure 4 As shown, the hardware communication link includes an interface extender, which connects multiple AI computing modules to a single COME module. This enables multiple AI computing modules to connect to a single COME module, and the simulated boot disk created by the COME module supports system installation of multiple AI computing modules.

[0059] See Figure 5 As shown, the power-on circuit includes a power-on controller. One feasible power-on controller uses a CPLD and is electrically connected to the power supply pin and the PG pin. The power-on controller controls two field-effect transistor (FET) switches via pin drive. One FET switch is located between the power supply pin and the power-on pin of the COME module. The power-on controller responds to the powergood signal output from the PG pin of the power supply and controls the FET switch to close and conduct, so that the power supply pin of the power supply supplies power to the COME module. The other FET switch is located between the power supply pin of the power supply and the power supply bus of the AI ​​computing module. The power supply bus of the AI ​​computing module supplies power to all AI computing modules corresponding to the COME module through a branch connected to the power supply bus. The power-on controller responds to the power-on control information indicating that the simulation boot disk creation is complete and controls the FET switch to conduct, so that the power supply pin of the power supply supplies power to the COME module.

[0060] See Figure 4 As shown, the power-on controller is connected to the BMC via GPIO. The power-on controller has a flag bit configured in the register. The initial value of the flag bit is 0. When the flag bit is 0, the power-on controller controls the MOSFET switch connected between the AI ​​computing module and the power-on pin to open. When the flag bit is 1, the power-on controller controls the MOSFET connected between the AI ​​computing module and the power-on pin to close. The BMC is connected to the COME module. The COME module transmits power-on control information to the BMC. In response to the power-on control information, the BMC uses GPIO to rewrite the flag bit in the register of the power-on controller to 1.

[0061] See Figure 6 As shown, the power-on controller is directly connected to the COME module via GPIO. The COME module directly transmits power-on control information to the power-on controller. The power-on controller configures a flag bit in a register. The initial value of the flag bit is 0. When the flag bit is 0, the power-on controller controls the MOSFET switch connected between the AI ​​computing module and the power-on pin to open. When the flag bit is 1, the power-on controller controls the MOSFET connected between the AI ​​computing module and the power-on pin to close. The flag bit in the register of the power-on controller is set to 1 in response to the power-on control information.

[0062] Example 3

[0063] This invention provides a storage medium for implementing an edge microserver AI computing module system installation method. The storage medium stores a computer program, which, when executed by a processor, implements the edge microserver AI computing module system installation method.

[0064] In the embodiments provided by this invention, it should be understood that the disclosed structures and methods can be implemented in other ways. For example, the structural embodiments described above are merely illustrative. For instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection through some interfaces, structures, or units, and may be electrical, mechanical, or other forms.

[0065] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0066] Furthermore, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0067] The above description is merely a specific embodiment of the present invention, enabling those skilled in the art to understand or implement the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A method for installing an edge microserver AI computing module system, characterized in that, include: An operating system for the COME module is pre-made, which includes pre-installed drivers for various types of simulated boot disks, enabling the COME module to simulate corresponding simulated boot disks based on the drivers. A specified directory for storing the AI ​​computing module's system to be installed is configured in the operating system. The operating system is then deployed to a PXE server. Establish a hardware communication link between the AI ​​computing module and the COME module in the edge microserver. Configure an interface extender in the hardware communication link. The interface extender connects multiple AI computing modules to a COME module. In the edge microserver, the COME module is network-connected to the PXE server; the PXE server provides the operating system for the COME module and places the system to be installed for the AI ​​computing module in a specified directory of the operating system. When installing the AI ​​computing module system, configure the BIOS of the COME module to prioritize booting the COME module from the PEX server, and configure the Uboot of the AI ​​computing module to prioritize booting the AI ​​computing module from the device connected by the hardware communication link between the AI ​​computing module and the COME module. The control unit first powers on the COME module, and then the COME module is booted by the PXE server. After booting, the COME module creates a simulated boot disk in the specified directory where the system to be installed is located. The simulated boot disk is connected to the AI ​​computing module via a hardware communication link. Under the condition that the simulated boot disk is created, the AI ​​computing module is powered on. After being powered on, the AI ​​computing module is booted by the simulated boot disk and the system to be installed in the simulated boot disk is installed. After the COME module successfully creates the simulated boot disk, it generates power-on control information that directly or indirectly controls the power-on of the AI ​​computing module. The power-on circuit of the edge microserver directly or indirectly controls the power-on of the AI ​​computing module according to the power-on control information.

2. The installation method of the edge microserver AI computing module system according to claim 1, characterized in that, During the installation of the AI ​​computing module system, the type of hardware communication link between the AI ​​computing module and the COME module in the edge microserver is collected. Based on the type of hardware communication link, the corresponding driver is selected to simulate a boot disk adapted to the hardware communication link.

3. The installation method of the edge microserver AI computing module system according to claim 1, characterized in that, The process of creating a simulated boot disk for the COME module is configured as the boot entry of the operating system of the COME module. The operating system boot completion signal is used as the power-on control information, and the power-on circuit is directly or indirectly controlled to power on the AI ​​computing module according to the operating system boot completion signal.

4. An edge microserver AI computing module system installation device based on the edge microserver AI computing module system installation method according to any one of claims 1-3, characterized in that, include: At least one COME module; At least one AI computing module; A hardware communication link connecting the AI ​​computing module and the COME module; First, power on the COME module, and then control the power-on circuit to power on the AI ​​computing module based on the condition that the COME module has completed creating a simulated boot disk. and, A PXE server connected to the external interface of the COME module; wherein the PXE server deploys the operating system of the COME module; The power-on circuit controls the COME module to power on. When the COME module starts using the operating system provided by the PXE server, it simulates the creation of a simulated boot disk that is compatible with the hardware communication link and contains the system to be installed, triggering the power-on circuit to control the AI ​​computing module to power on. After power-on, the AI ​​computing module uses the simulated boot disk to boot and execute the installation of the system to be installed.

5. The edge microserver AI computing module system installation device according to claim 4, characterized in that, The hardware communication link includes an interface extender, which connects multiple AI computing modules to a COME module.

6. The edge microserver AI computing module system installation device according to claim 4, characterized in that, The power-on circuit includes a power-on controller, which is electrically connected to the power supply and pg pin of the power supply. The power-on controller responds to the powergood signal output by the pg pin of the power supply and controls the power supply pin of the power supply to supply power to the COME module. After the COME module creates the simulation boot disk, it directly or indirectly provides power-on control information to the power-on controller through the BMC. The power-on controller responds to the power-on control information and controls the power supply pin of the power supply to power on the AI ​​computing module.

7. A storage medium for implementing an edge microserver AI computing module system installation method, wherein the storage medium stores a computer program, characterized in that, When the computer program is executed by the processor, it implements the edge microserver AI computing module system installation method as described in any one of claims 1-3.

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