Mechanical hand position calibration device

Abstract

The present application belongs to the field of semiconductor manufacturing, and particularly relates to a mechanical hand position calibration device, which comprises a calibration seat, the top end of the calibration seat is fixedly connected with a support table, four sets of limiting plates are supported by four sets of support rods, and the wafer is supported for pickup, infrared rays are emitted by infrared lamps in one set of limiting plates, and the infrared rays are received by infrared sensors outside the pressing plate, thereby playing a role in calibrating the position of the mechanical hand, a first servo motor, a first electric sliding block and a second electric sliding block are cooperated with each other, thereby playing a role in controlling the orientation of the mechanical hand, four sets of vacuum suction cups are used to vacuum adsorb the top surface of the wafer, thereby playing a role in vacuum pickup and transfer of the wafer, the output end of a second servo motor is rotated, thereby driving the screw rod and the cooperating ring plate screw nut pair to rotate, thereby pulling the four sets of vacuum suction cups to slide along the inner wall of the suction cup frame, and thereby playing an effect of adjusting the adsorption position of the four sets of vacuum suction cups.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing, specifically a robotic arm position calibration device. Background Technology

[0002] A robotic arm is an automated operating device that can mimic some of the movements of a human hand and arm, grasping and handling objects according to a fixed program. It can replace manual labor in heavy work, thereby realizing the mechanization and automation of production.

[0003] A robotic arm is mainly composed of three parts: a drive mechanism, an execution mechanism, and a control system. The shape and structure of the robotic arm are defined according to the shape, size, material, and gravity requirements of the object being grasped, and various expected tasks are completed through programming.

[0004] Currently, the semiconductor wafer manufacturing process relies on robotic arms to achieve automated production. However, due to prolonged operation and various environmental factors, the robotic arms may gradually shift their working origin, resulting in misalignment during operation. This makes it impossible for the robotic arms to accurately position and hold the wafers, affecting the production accuracy of the wafers.

[0005] Therefore, the present invention provides a robot arm position calibration device. Summary of the Invention

[0006] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0007] The technical solution adopted by this invention to solve its technical problem is as follows: A robotic arm position calibration device includes a calibration base; a support platform is fixedly connected to the top of the calibration base; a support rod is fixedly connected to the top of the support platform, and four sets of support rods are provided; a limiting plate is fixedly connected to the top of each of the four sets of support rods, and four sets of limiting plates are provided; a wafer is placed on each of the four sets of limiting plates; an infrared lamp is installed inside one of the limiting plates; a transmission mechanism is provided outside the calibration base, and the transmission mechanism is used for vacuum pickup of the wafer; an infrared sensor is provided on the transmission mechanism, and the infrared lamp corresponds to the infrared sensor; thereby achieving the effect of calibrating the position of the robotic arm. If the transmission mechanism does not drive the infrared light emitted by the infrared lamp corresponding to the infrared sensor for a long time, an alarm will be issued to warn the robotic arm of position deviation, reducing the possibility of robotic arm deviation.

[0008] Preferably, the transmission mechanism includes a power distribution box, a first servo motor, a support frame, a first electric slider, a first sliding frame, a second electric slider, a second sliding frame, and a pickup component; the power distribution box is correspondingly arranged with the calibration base; the first servo motor is fixedly connected inside the power distribution box; the support frame is fixedly connected to the output end of the first servo motor; the first electric slider is slidably connected to the inner wall of the support frame; the first sliding frame is fixedly connected to the outer side of the first electric slider away from the support frame; the second electric slider is slidably connected to the inner top wall of the first sliding frame; the second sliding frame is fixedly connected to the outer side of the second electric slider; the pickup component is located at the end of the second sliding frame away from the second electric slider, and the pickup component is used to grip the wafer; the wafer is picked up at the correct position, and the second electric slider drives the second sliding frame to slide on the inner top wall of the first sliding frame, allowing adjustment of the extension length of the robotic arm. By controlling the angle and length, the pickup component is moved, and the wafer is accurately picked up by the pickup component in conjunction with infrared alignment.

[0009] Preferably, the pickup assembly includes a suction cup holder, a vacuum suction cup, an air tube, a vacuum pump, and an expansion structure; the expansion structure is disposed inside the second sliding frame and is used to control the position of the robot arm picking up the wafer; the suction cup holder is disposed below the expansion structure; the vacuum suction cup is slidably connected to the inner wall of the suction cup holder, and four sets of vacuum suction cups are provided; the air tube is fixed to the top of the vacuum suction cup; the vacuum pump is fixed to the top of the second sliding frame, and the vacuum pump and the vacuum suction cup are connected through the air tube; the expansion structure is used to control the position of the four sets of vacuum suction cups, thereby achieving the effect of accurately picking up and transferring wafers of different sizes.

[0010] Preferably, the expansion structure includes a second servo motor, a lead screw, a mating ring plate, and a connecting rod; the second servo motor is fixed inside the second sliding frame; the lead screw is fixed to the output end of the second servo motor; the mating ring plate is connected to the lead screw and nut pair; one end of the connecting rod is hinged inside the mating ring plate, and the other end of the connecting rod is hinged inside the vacuum chuck; thus, the position of the four sets of vacuum chucks can be adjusted to accommodate wafers of different sizes and shapes.

[0011] Preferably, a support plate is fixedly connected to the outside of the suction cup holder; the infrared sensor is installed outside the support plate; a calibration slot is opened inside the calibration seat, and the calibration slot corresponds to the support plate; a pressure sensor is fixedly connected inside the calibration seat; when the infrared spotlight and infrared sensor malfunction, it can easily cause misalignment when the robot picks up the wafer. Therefore, the support plate is fixed to the outside of the suction cup holder and corresponds to the position of the calibration slot opened in the calibration seat. As the robot moves, the support plate is inserted into the calibration slot of the calibration seat to achieve the position calibration of the robot. If the support plate is inserted into the calibration slot of the calibration seat for a long time without pressing to trigger the pressure sensor, an alarm will be triggered indicating that the position of the picked-up wafer has shifted, thereby achieving the position calibration of the robot.

[0012] Preferably, the calibration base has a sliding rod internally connected; a limiting slider is internally connected to the calibration base, and the limiting slider is fixed to one end of the sliding rod; an elastic element is sleeved on the outside of the sliding rod, and one end of the elastic element is fixed to the inner wall of the calibration base; thereby reducing the possibility of the first pressure sensor being falsely triggered.

[0013] Preferably, a second pressure sensor is sleeved on the outside of the support plate; an alarm is fixed to the top of the support frame, and the alarm is connected to the signal of the second pressure sensor; by using the second pressure sensor sleeved on the outside of the support plate, when the support plate is inserted into the calibration slot of the calibration seat, if the outside of the second pressure sensor touches or presses against the wall of the calibration seat, the second pressure sensor will send a signal to the alarm to stop the operation of the equipment and reduce the occurrence of quality problems in wafer processing.

[0014] Preferably, an electric cylinder is fixedly connected inside the second sliding frame; a fixed plate is fixedly connected to the output end of the electric cylinder; a support plate is fixedly connected to the outside of the fixed plate, and the support plate is fixedly connected to two sets; after the four sets of vacuum suction cups adsorb the top surface of the wafer, the output end of the electric cylinder retracts, driving the fixed plate to move upward, and the two sets of support plates support the bottom end of the wafer for auxiliary support. Together with the four sets of vacuum suction cups to hold the wafer, it plays a role in preventing the wafer from falling off, and the two sets of support plates can be inserted into the gap between the four sets of limiting plates.

[0015] Preferably, an anti-slip pad is fixed to the top of the tray; multiple sets of anti-slip pads are provided; the anti-slip pads are elliptical in shape; multiple sets of anti-slip pads are fixed to the top of the tray, and the multiple sets of anti-slip pads are in contact with the bottom of the wafer, which plays a role in anti-slip auxiliary positioning of the wafer.

[0016] Preferably, a support plate is fixedly connected to the top of the fixed plate; a stop plate is slidably connected to the inner wall of the support plate; a second elastic element is sleeved on the outside of the stop plate; and a contact plate is installed inside the support plate. This serves to limit the position of the support plate. The contact plate is connected to the alarm signal. If the support plate is positioned too far forward, it will compress the second elastic element and cause it to contract. When the stop plate is compressed and contracts, it touches the contact plate, which then sends a signal to the alarm to sound an alarm, thereby alerting the system that the support plate has shifted.

[0017] The beneficial effects of this invention are as follows:

[0018] 1. The robotic arm position calibration device of the present invention comprises four sets of support rods supporting four sets of limiting plates to facilitate wafer pickup. Infrared rays emitted by infrared lamps within one set of limiting plates correspond to infrared sensors on the outside of the support plates, thereby calibrating the position of the robotic arm. A first servo motor, a first electric slider, and a second electric slider work together to control the orientation of the robotic arm. Four sets of vacuum suction cups vacuum-adhere to the top surface of the wafer, enabling vacuum pickup and transfer of the wafer. The rotation of the output end of the second servo motor drives the lead screw and the matching ring plate lead screw nut pair to rotate, thereby pulling the inner wall of the sliding suction cup frame of the four sets of vacuum suction cups to adjust their suction position. The support plates move with the robotic arm, adhering to a first pressure sensor to monitor the positional deviation of the robotic arm.

[0019] 2. The robotic arm position calibration device of the present invention uses a first elastic element to compress the support slide rod, which reduces the possibility of accidental triggering when an external object is pressed against the slide rod. A second pressure sensor is sleeved on the outside of the support plate. If the second pressure sensor touches the outer wall of the calibration seat when the robotic arm moves, it sends a signal to trigger an alarm, thereby responding to the misalignment of the robotic arm. Two sets of support plates support the bottom of the wafer, reducing the risk of the wafer falling and being damaged when the four sets of vacuum suction cups detach. Multiple sets of anti-slip pads are fixed to the top of the support plates and adhere to the bottom of the wafer, providing an anti-slip effect. Attached Figure Description

[0020] The invention will now be further described with reference to the accompanying drawings.

[0021] Figure 1 This is a perspective view of the present invention;

[0022] Figure 2 This is a schematic diagram of the material holder structure in this invention;

[0023] Figure 3 This is a partial structural cross-sectional view of the material holder in this invention;

[0024] Figure 4This is a schematic diagram of the distribution box in this invention;

[0025] Figure 5 This is a schematic diagram of the structure of the second sliding frame in this invention;

[0026] Figure 6 This is a schematic diagram of the suction cup holder in this invention;

[0027] Figure 7 This is a schematic diagram of the tray structure in this invention.

[0028] In the diagram: 1. Calibration stand; 11. Support platform; 12. Support rod; 13. Limiting plate; 14. Wafer; 15. Infrared spotlight; 16. Infrared sensor; 2. Power distribution box; 21. Servo motor No. 1; 22. Support frame; 23. Electric slider No. 1; 24. Sliding frame No. 1; 25. Electric slider No. 2; 26. Sliding frame No. 2; 3. Suction cup frame; 31. Vacuum suction cup; 32. Air tube; 33. Vacuum pump; 4. Servo motor No. 2; 41. Lead screw; 42. Matching ring plate; 43. Connecting rod; 5. Support plate; 51. Pressure sensor No. 1; 6. Slide rod; 61. Limiting slider; 62. Elastic element No. 1; 7. Pressure sensor No. 2; 71. Alarm; 8. Electric cylinder; 81. Fixing plate; 82. Support plate; 9. Anti-slip pad; 91. Support plate; 92. Abutment plate; 93. Elastic element No. 2; 94. Electrical connector. Detailed Implementation

[0029] To make the technical means, creative features, objectives and effects of this invention easier to understand, the invention will be further described below in conjunction with specific embodiments.

[0030] Example 1

[0031] like Figures 1 to 6As shown in the embodiment of the present invention, a robotic arm position calibration device includes a calibration base 1; a support platform 11 is fixedly connected to the top of the calibration base 1; a support rod 12 is fixedly connected to the top of the support platform 11, and four sets of support rods 12 are provided; a limiting plate 13 is fixedly connected to the top of the four sets of support rods 12, and four sets of limiting plates 13 are provided; the limiting plate 13 is square in shape and has one end protruding; a wafer 14 is placed on the four sets of limiting plates 13; an infrared spotlight 15 is installed inside one set of limiting plates 13; a transmission mechanism is provided outside the calibration base 1, which is used for vacuum pickup of the wafer 14; an infrared sensor 16 is provided on the transmission mechanism, and the infrared spotlight 15 corresponds to the infrared sensor 16; currently, in the process of manufacturing semiconductor wafers 14, it is necessary to rely on robotic arms to achieve automated production, but due to the long-term operation of the robotic arms, wear and deformation are easily generated. This can lead to misalignment of the robotic arm during operation, which can severely affect the production progress of the wafer 14. Therefore, the specific implementation of this invention is as follows: the calibration base 1 is used as the base for placing the wafer 14. The wafer 14 is placed above the support platform 11 and on the limiting plates 13 on the four sets of support rods 12. The top of the limiting plates 13 is convex, which serves to limit the circumference of the wafer 14. The robotic arm's transmission mechanism vacuum picks up the wafer 14. During the process of the transmission mechanism picking up the wafer 14, the infrared spotlight 15 works and emits infrared rays. When the transmission mechanism moves to the position above the wafer 14, the infrared sensor 16 receives the infrared rays emitted by the infrared spotlight 15, thereby achieving the effect of calibrating the position of the robotic arm. If the transmission mechanism does not drive the infrared sensor 16 to correspond to the infrared rays emitted by the infrared spotlight 15 for a long time, an alarm will be issued to warn the robotic arm of positional deviation, thereby reducing the possibility of robotic arm deviation.

[0032] like Figure 1 , Figure 4 and Figure 5As shown, the transmission mechanism includes a power distribution box 2, a first servo motor 21, a support frame 22, a first electric slider 23, a first sliding frame 24, a second electric slider 25, a second sliding frame 26, and a pickup assembly. The power distribution box 2 is correspondingly arranged with the calibration base 1. The first servo motor 21 is fixedly connected inside the power distribution box 2. The support frame 22 is fixedly connected to the output end of the first servo motor 21. The first servo motor 21 is used for the orientation rotation adjustment of the robot arm. The first electric slider 23 is slidably connected to the inner wall of the support frame 22. The first sliding frame 24 is fixedly connected to the outer side of the first electric slider 23 away from the support frame 22. The second electric slider 25 is slidably connected to the inner wall of the top of the first sliding frame 24. The second sliding frame 26 is fixedly connected to the second electric slider 25. The outside of block 25; 23 and 25 are used for adjusting the orientation and distance of the robot arm; the picking component is set at the end of the second sliding frame 26 away from the second electric slider 25, and the picking component is used to pick up the wafer 14; when picking up the wafer 14, the power components assembled inside the power distribution box 2 are used to control the first servo motor 21 to rotate the position of the support frame 22, and the first electric slider 23 drives the first sliding frame 24 to slide up and down on the inner wall of the support frame 22 to realize the position of picking up the wafer 14. At the same time, the second electric slider 25 drives the second sliding frame 26 to slide on the inner wall of the top of the first sliding frame 24, which can adjust the extension length of the robot arm. By controlling the angle and length to move the picking component, the picking component is used in conjunction with infrared alignment to accurately pick up the wafer 14.

[0033] The pickup assembly includes a suction cup frame 3, a vacuum suction cup 31, an air tube 32, a vacuum pump 33, and an expansion structure. The expansion structure is located inside the second sliding frame 26 and is used to control the position of the robotic arm picking up the wafer 14. The suction cup frame 3 is located below the expansion structure. The vacuum suction cup 31 is slidably connected to the inner wall of the suction cup frame 3, and four sets of vacuum suction cups 31 are provided. The suction cup frame 3 is used to support and limit the four sets of vacuum suction cups 31. The air tube 32 is fixed to the top of the vacuum suction cup 31. The vacuum pump 33 is fixed to the top of the second sliding frame 26, and the vacuum pump... Vacuum pump 33 is connected to vacuum suction cup 31 via air tube 32. When picking up wafer 14, vacuum pump 33 is fixed to the top of sliding frame 26. After infrared spotlight 15 and infrared sensor 16 are aligned, four sets of vacuum suction cups 31 on the inner wall of suction cup frame 3 adhere to the top surface of wafer 14. Vacuum pump 33 draws a vacuum through air tube 32. The four sets of vacuum suction cups 31 pick up and transfer wafer 14. When picking up wafers 14 of different sizes, the position of the four sets of vacuum suction cups 31 is controlled by expansion structure, thereby achieving the effect of precise picking up and transferring wafers 14 of different sizes.

[0034] The expansion structure includes a second servo motor 4, a lead screw 41, a mating ring plate 42, and a connecting rod 43. The second servo motor 4 is fixed inside the second sliding frame 26. The lead screw 41 is fixed to the output end of the second servo motor 4. The mating ring plate 42 is connected to the lead screw 41 screw nut pair. One end of the connecting rod 43 is hinged inside the mating ring plate 42, and the other end of the connecting rod 43 is hinged inside the vacuum suction cup 31. When picking up wafers 14 of different sizes and shapes, the infrared spotlight 15 and the infrared sensor 16 work together to allow the robot to reach above the wafers 14. As the output end of the second servo motor 4 rotates clockwise, it drives the lead screw 41 and the lead screw nut pair of the mating ring plate 42 to rotate, thereby driving the four sets of vacuum suction cups 31, which are hinged by the four sets of connecting rods 43, to slide on the inner wall of the suction cup frame 3, realizing the position adjustment of the four sets of vacuum suction cups 31 to adapt to the picking up of wafers 14 of different sizes and shapes.

[0035] like Figures 1 to 6 As shown, a support plate 5 is fixedly attached to the outside of the suction cup holder 3; one end of the support plate 5 is rod-shaped, and the other end is square plate-shaped; the infrared sensor 16 is installed outside the support plate 5 and located at the rod-shaped position of the support plate 5; a calibration slot is opened inside the calibration seat 1, and the calibration slot corresponds to the support plate 5; a pressure sensor 51 is fixedly attached inside the calibration seat 1; when the infrared spotlight 15 and the infrared sensor 16 malfunction, it is easy for the robot arm to pick up the wafer 14 in a misaligned manner. Therefore, the support plate 5 is fixed to the outside of the suction cup holder 3 and corresponds to the position of the calibration slot opened in the calibration seat 1. During the movement of the robot arm, the support plate 5 is inserted into the calibration slot of the calibration seat 1 to achieve the position calibration of the robot arm. If the support plate 5 is inserted into the calibration slot of the calibration seat 1 for a long time without pressing to trigger the pressure sensor 51, an alarm will be triggered indicating that the position of the picked-up wafer 14 has shifted, thereby achieving the position calibration of the robot arm.

[0036] like Figures 1 to 3As shown, a slide rod 6 is slidably connected inside the calibration base 1; a limiting slider 61 is slidably connected inside the calibration base 1, and the limiting slider 61 is fixed to one end of the slide rod 6; the limiting slider 61 is used to limit the slide rod 6 from sliding out of the calibration base 1; a first elastic element 62 is sleeved on the outside of the slide rod 6, and one end of the first elastic element 62 is fixed to the inner wall of the calibration base 1; when the first pressure sensor 51 is installed inside the calibration base 1, in order to reduce the possibility of the first pressure sensor 51 being falsely triggered by other objects, a... The slide rod 6 is slidably connected to the inner wall of the calibration seat 1 in conjunction with the limiting slider 61, and is supported by the first elastic element 62 sleeved on the outer wall of the slide rod 6. When the support plate 5 moves and squeezes the slide rod 6 to slide, it also squeezes the first elastic element 62, causing the slide rod 6 to squeeze and trigger the first pressure sensor 51. When other objects squeeze the slide rod 6, the first elastic element 62 is squeezed and subjected to force. If the external force of other objects is not strong, the first pressure sensor 51 will not be triggered, thereby reducing the possibility of the first pressure sensor 51 being falsely triggered.

[0037] like Figures 1 to 6 As shown, a second pressure sensor 7 is sleeved on the outside of the support plate 5; the second pressure sensor 7 is fixed in the square plate position of the support plate 5; an alarm 71 is fixed to the top of the support frame 22, and the alarm 71 is connected to the signal of the second pressure sensor 7; when the support plate 5 is inserted into the calibration slot of the calibration seat 1, in order to improve the position calibration accuracy of the robot, the second pressure sensor 7 is sleeved on the outside of the support plate 5. When the support plate 5 is inserted into the calibration slot of the calibration seat 1, if the outside of the second pressure sensor 7 touches or presses against the wall of the calibration seat 1, the second pressure sensor 7 will send a signal to the alarm 71 to alarm, stop the operation of the equipment, and reduce the quality problems in the wafer 14 processing.

[0038] like Figure 1 , Figures 4 to 6 As shown, an electric cylinder 8 is fixedly connected inside the second sliding frame 26; a fixing plate 81 is fixedly connected to the output end of the electric cylinder 8; the fixing plate 81 is rectangular in shape; a support plate 82 is fixedly connected to the outside of the fixing plate 81, and two sets of support plates 82 are fixedly connected; when the four sets of vacuum suction cups 31 vacuum suction the top surface of the wafer 14, in order to reduce the possibility of the wafer 14 falling off and being damaged due to long-term adsorption wear of the four sets of vacuum suction cups 31 or other factors, after the four sets of vacuum suction cups 31 adsorb the top surface of the wafer 14, the output end of the electric cylinder 8 retracts, driving the fixing plate 81 to move upward, and the two sets of support plates 82 support the bottom end of the wafer 14 for auxiliary support, which, together with the four sets of vacuum suction cups 31, clamps the wafer 14, thereby achieving the effect of preventing the wafer 14 from falling off, and the two sets of support plates 82 can be inserted into the gap between the four sets of limiting plates 13.

[0039] An anti-slip pad 9 is fixed to the top of the tray 82; multiple sets of the anti-slip pad 9 are provided; the anti-slip pad 9 is elliptical in shape; when the robot arm picks up the wafer 14, it is easy to vibrate, which may cause the wafer 14 to fall off. Therefore, multiple sets of anti-slip pads 9 are fixed to the top of the tray 82, and multiple sets of anti-slip pads 9 are attached to the bottom of the wafer 14 to play a role in anti-slip auxiliary limiting of the wafer 14.

[0040] Example 2

[0041] like Figure 7 As shown in the comparative embodiment one, another embodiment of the present invention is as follows: a support plate 91 is fixedly connected to the top of the fixed plate 81; a stop plate 92 is slidably connected to the inner wall of the support plate 91; a second elastic element 93 is sleeved on the outside of the stop plate 92; a contact piece 94 is installed inside the support plate 91; when supporting the bottom of the wafer 14, the support plate 91 is fixed to the top of the fixed plate 81, and the movable stop plate 92 is pressed against the outer wall of a set of limiting plates 13, which serves to limit the supporting position of the support plate 82. The contact piece 94 is connected to the alarm 71. If the supporting position of the support plate 82 is too far forward, it will squeeze the second elastic element 93 to contract. When the stop plate 92 is squeezed and contracted and touches the contact piece 94, the contact piece 94 sends a signal to the alarm 71 to sound an alarm, thereby warning that the supporting position of the support plate 82 has shifted.

[0042] During the manufacturing process of semiconductor wafer 14, calibration base 1 serves as the base for placing wafer 14. Wafer 14 is placed above support platform 11 and positioned on limiting plates 13 on four sets of support rods 12. The top of the limiting plates 13 is protruding, serving to limit the circumference of wafer 14. A robotic arm's transmission mechanism vacuum-picks wafer 14. During this process, infrared spotlights 15 emit infrared light. When the transmission mechanism moves above wafer 14, infrared sensors 16 receive the infrared light emitted by the infrared spotlights 15, thus calibrating the position of the robotic arm. If the transmission mechanism does not activate infrared sensors 16 to receive the infrared light emitted by the infrared spotlights 15 for an extended period, then... An alarm will be issued to warn of any positional deviation of the robotic arm, reducing the likelihood of such deviation. Power components are installed inside the distribution box 2 to control the rotation of the first servo motor 21, which rotates the support frame 22. This, in conjunction with the first electric slider 23, drives the first sliding frame 24 to slide up and down on the inner wall of the support frame 22, achieving the desired position for picking up the wafer 14. Simultaneously, the second electric slider 25 drives the second sliding frame 26 to slide on the inner wall at the top of the first sliding frame 24, adjusting the extension length of the robotic arm. By controlling the angle and length, the picking component is moved. The picking component, in conjunction with infrared alignment, precisely picks up the wafer 14. A vacuum pump 33 is fixed to the top of the second sliding frame 26. After alignment with the infrared spotlight 15 and infrared sensor 16, four sets of vacuum pumps on the inner wall of the suction cup holder 3... The suction cups 31 adhere to the top surface of the wafer 14. The vacuum pump 33 evacuates the vacuum through the air pipe 32. The four sets of vacuum suction cups 31 pick up and transfer the wafer 14. When picking up wafers 14 of different sizes, the position of the four sets of vacuum suction cups 31 is controlled by the expansion structure, thereby achieving the effect of precise picking up and transferring wafers 14 of different sizes. The infrared spotlight 15 and infrared sensor 16 work together to enable the robot arm to reach above the wafer 14. As the output end of the second servo motor 4 rotates clockwise, it drives the lead screw 41 and the lead screw nut pair of the mating ring plate 42 to rotate, thereby driving the four sets of vacuum suction cups 31, which are hinged by the four sets of connecting rods 43, to slide on the inner wall of the suction cup frame 3, realizing the position adjustment of the four sets of vacuum suction cups 31 to adapt to the picking up of wafers 14 of different sizes and shapes. The support plate 5 is fixed to the outside of the suction cup frame 3 and corresponds to the calibration slot of the calibration seat 1. As the robot moves, the support plate 5 is inserted into the calibration slot of the calibration seat 1 to calibrate the position of the robot. If the support plate 5 is inserted into the calibration slot of the calibration seat 1 for a long time without pressing and triggering the first pressure sensor 51, an alarm will sound indicating that the position of the picked-up wafer 14 has shifted, thus calibrating the position of the robot. The slide rod 6 is slidably connected to the inner wall of the calibration seat 1 in conjunction with the limiting slider 61, and is supported by the first elastic element 62 sleeved on the outer wall of the slide rod 6. When the support plate 5 moves and presses the slide rod 6 to slide, it also presses and forces the first elastic element 62, causing the slide rod 6 to press and trigger the first pressure sensor 51.When other objects press against the slide bar 6, the first elastic element 62 is compressed and subjected to force. If the external force of the other objects is not strong, the first pressure sensor 51 will not be triggered, thus reducing the possibility of the first pressure sensor 51 being falsely triggered. The second pressure sensor 7 is sleeved on the outside of the support plate 5. When the support plate 5 is inserted into the calibration slot of the calibration seat 1, if the outside of the second pressure sensor 7 touches or presses against the wall of the calibration seat 1, the second pressure sensor 7 will send a signal to the alarm 71 to stop the operation of the equipment and reduce the occurrence of quality problems in the processing of the wafer 14. After the four sets of vacuum chucks 31 adsorb the top surface of the wafer 14, the output end of the electric cylinder 8 retracts, driving the fixing plate 81 to move upward. The two sets of support plates 82 support the bottom of the wafer 14, which works in conjunction with the four sets of vacuum chucks 31. The wafer 14 is clamped to prevent it from detaching. Two sets of support plates 82 can be inserted into the gaps between four sets of limiting plates 13. Multiple sets of anti-slip pads 9 are fixed to the top of the support plates 82 and adhere to the bottom of the wafer 14, providing anti-slip and auxiliary positioning. A support plate 91 is fixed to the top of the fixing plate 81, and a movable abutment 92 presses against the outer wall of one set of limiting plates 13, limiting the position of the support plates 82. The contact plate 94 is connected to the alarm 71. If the support plate 82 is positioned too far forward, it will compress the second elastic element 93. When the abutment 92 is compressed and contacts the contact plate 94, the contact plate 94 sends a signal to the alarm 71, thus alerting the system that the support plate 82 has shifted.

[0043] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A robotic arm position calibration device, characterized in that: The system includes a calibration base (1); a support platform (11) is fixed to the top of the calibration base (1); a support rod (12) is fixed to the top of the support platform (11), and four sets of support rods (12) are provided; a limiting plate (13) is fixed to the top of each of the four sets of support rods (12), and four sets of limiting plates (13) are provided; a wafer (14) is placed on each of the four sets of limiting plates (13); an infrared lamp (15) is installed inside each of the limiting plates (13); a transmission mechanism is provided on the outside of the calibration base (1), which is used to vacuum pick up the wafer (14); an infrared sensor (16) is provided on the transmission mechanism, and the infrared lamp (15) corresponds to the infrared sensor (16); The transmission mechanism includes a power distribution box (2), a first servo motor (21), a support frame (22), a first electric slider (23), a first sliding frame (24), a second electric slider (25), a second sliding frame (26), and a pickup assembly; the power distribution box (2) is correspondingly set with the calibration base (1); the first servo motor (21) is fixed inside the power distribution box (2); the support frame (22) is fixed to the output end of the first servo motor (21); the first electric slider (23) is fixed inside the power distribution box (2); the support frame (24) is fixed to the output end of the first servo motor (25); the first electric slider (26) is fixed to the output end of the first servo motor (26); the first electric slider (27) is fixed to the output end of the first servo motor (21 ... 3) The first sliding frame (24) is slidably connected to the inner wall of the support frame (22); the first sliding frame (24) is fixed to the outside of the first electric slider (23) away from the support frame (22); the second electric slider (25) is slidably connected to the inner wall of the top of the first sliding frame (24); the second sliding frame (26) is fixed to the outside of the second electric slider (25); the picking component is located at the end of the second sliding frame (26) away from the second electric slider (25), and the picking component is used to pick up the wafer (14); The picking assembly includes a suction cup frame (3), a vacuum suction cup (31), an air tube (32), a vacuum pump (33), and an expansion structure; the expansion structure is located inside the second sliding frame (26) and is used to control the position of the robot arm picking up the wafer (14); the suction cup frame (3) is located below the expansion structure; the vacuum suction cup (31) is slidably connected to the inner wall of the suction cup frame (3), and there are four sets of vacuum suction cups (31); the air tube (32) is fixed to the top of the vacuum suction cup (31); the vacuum pump (33) is fixed to the top of the second sliding frame (26), and the vacuum pump (33) and the vacuum suction cup (31) are connected through the air tube (32); The expansion structure includes a second servo motor (4), a lead screw (41), a mating ring plate (42), and a connecting rod (43); the second servo motor (4) is fixed inside the second sliding frame (26); the lead screw (41) is fixed to the output end of the second servo motor (4); the mating ring plate (42) is connected to the lead screw nut pair of the lead screw (41); one end of the connecting rod (43) is hinged inside the mating ring plate (42), and the other end of the connecting rod (43) is hinged inside the vacuum suction cup (31).

2. The robotic arm position calibration device according to claim 1, characterized in that: The suction cup holder (3) is fixedly connected to the outside of the support plate (5); the infrared sensor (16) is installed on the outside of the support plate (5); the calibration seat (1) has a calibration slot inside, and the calibration slot corresponds to the support plate (5); a pressure sensor (51) is fixedly connected inside the calibration seat (1).

3. The robotic arm position calibration device according to claim 1, characterized in that: The calibration seat (1) is internally slidably connected to a slide rod (6); the calibration seat (1) is internally slidably connected to a limit slider (61), and the limit slider (61) is fixed to one end of the slide rod (6); a first elastic element (62) is sleeved on the outside of the slide rod (6), and one end of the first elastic element (62) is fixed to the inner wall of the calibration seat (1).

4. The robotic arm position calibration device according to claim 2, characterized in that: The pressure plate (5) is fitted with a second pressure sensor (7); the top of the support frame (22) is fixed with an alarm (71), and the alarm (71) is connected to the signal of the second pressure sensor (7).

5. The robotic arm position calibration device according to claim 1, characterized in that: An electric cylinder (8) is fixedly connected inside the second sliding frame (26); a fixing plate (81) is fixedly connected to the output end of the electric cylinder (8); a support plate (82) is fixedly connected to the outside of the fixing plate (81), and two sets of support plates (82) are fixedly connected.

6. The robotic arm position calibration device according to claim 5, characterized in that: The top of the tray (82) is fixed with an anti-slip pad (9); multiple sets of the anti-slip pad (9) are provided; the anti-slip pad (9) is elliptical in shape.

7. The robotic arm position calibration device according to claim 5, characterized in that: The top of the fixed plate (81) is fixedly connected to a support plate (91); the inner wall of the support plate (91) is slidably connected to a stop plate (92); a second elastic element (93) is sleeved on the outside of the stop plate (92); and a contact piece (94) is installed inside the support plate (91).

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