Laser cutting method, device, equipment and storage medium for bridge middle plate

Abstract

The application belongs to the technical field of laser cutting, and discloses a laser cutting method, device, equipment and storage medium for a bridge middle plate. The method comprises the following steps: when a laser cutting instruction is received, a plurality of closed contours of a workpiece to be cut are acquired; feature point sets of the closed contours are determined; a cutting sequence of the plurality of closed contours is randomly determined, and a cutting point of each closed contour is randomly determined from the feature point set to form an initial cutting path; a new cutting path is generated, and a target empty path length of the new cutting path is determined; a difference between the target empty path length and an initial empty path length is determined; an optimal path is determined based on the difference and a preset value; and laser cutting of the workpiece to be cut is completed based on the optimal path. In the above manner, the empty path length of the laser cutting machine during laser cutting can be effectively reduced, and the cutting efficiency of the laser cutting machine can be effectively improved.

Description

Technical Field

[0001] This invention relates to the field of laser cutting technology, and in particular to a laser cutting method, apparatus, equipment, and storage medium for thick plates in bridges. Background Technology

[0002] When a laser cutting machine performs laser cutting on multiple parts of the same medium-thick plate, the laser cutting machine needs to move between the processing contour lines of each part, which will create empty paths. The longer the empty paths are, the lower the processing efficiency of the laser cutting machine will be. Summary of the Invention

[0003] The main objective of this invention is to provide a laser cutting method, apparatus, equipment, and storage medium for medium-thick bridge plates, aiming to solve the technical problem in the prior art where the long empty path generated when the laser cutting machine moves between processing contour lines affects the processing efficiency.

[0004] To achieve the above objectives, the present invention provides a laser cutting method for medium-thick bridge plates, the method comprising the following steps:

[0005] S10. Upon receiving a laser cutting command, the cutting area of ​​the workpiece to be cut is obtained, wherein the cutting area includes multiple closed contours;

[0006] S20. Determine the feature point set for each closed contour;

[0007] S30. Randomly determine the cutting order of the plurality of closed contours, and randomly determine the cutting points of each closed contour from the set of feature points;

[0008] S40. Determine the algorithm parameters, wherein the algorithm parameters include the initial temperature, the number of inner cycles, the number of outer cycles, and the temperature decay coefficient;

[0009] S50. Generate an initial cutting path based on the cutting order and the cutting points, and determine the initial empty path length of the initial cutting path;

[0010] S60. Generate a new cutting path and determine the target empty path length of the new cutting path;

[0011] S70. Determine the difference between the target empty path length and the initial empty path length;

[0012] S80. When it is determined that the difference is greater than or equal to a preset value, a target probability is determined based on the initial temperature, the temperature decay coefficient, and the difference. A comparison value between the target probability and the first random value is determined. Based on the comparison value, it is determined whether the initial cutting path in step S50 needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient, and steps S40-S90 are repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined.

[0013] S90. When it is determined that the difference is less than the preset value and the current number of inner loops is greater than the number of inner loops, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient. After the new cutting path is used as the initial cutting path in step S50, S40-S90 are repeated until the current number of outer loops is greater than the number of outer loops, and then the optimal path is determined.

[0014] S100. Laser cutting of the workpiece to be cut is completed based on the optimal path.

[0015] Optionally, determining the feature point set for each closed contour includes:

[0016] If the closed contour is not circular, generate a set of feature points for the closed contour based on the vertices on the closed contour.

[0017] If the closed contour is a circle, determine the equal division points on the closed contour, and generate the feature point set of the closed contour based on the equal division points.

[0018] Optionally, generating the new cutting path includes:

[0019] Set the probability of path reversal and the probability of change of cutting point;

[0020] When the path reversal probability is greater than the second random value and the cutting point change probability is greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence. The target cutting point of each closed contour is randomly determined from the feature point set, and a new cutting path is generated based on the new cutting sequence and the target cutting point.

[0021] When the path reversal probability is no greater than the second random value and the cutting point change probability is greater than the third random value, target cutting points of each closed contour are randomly determined from the feature point set, and a new cutting path is generated based on the cutting order and the target cutting points.

[0022] When the path reversal probability is greater than the second random value and the cutting point change probability is not greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence, and a new cutting path is generated based on the new cutting sequence and the cutting point.

[0023] Optionally, determining the target probability based on the initial temperature, the temperature decay coefficient, and the difference includes:

[0024] Determine the product of the initial temperature and the temperature decay coefficient;

[0025] Determine the negative ratio of the product to the difference, wherein the negative ratio is the negative of the ratio of the product to the difference;

[0026] The exponential function of the negative ratio is used as the target probability.

[0027] Optionally, determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path according to the comparison value includes:

[0028] When the comparison value is greater than the target probability, the initial cutting path in step S50 needs to be updated according to the new cutting path.

[0029] When the comparison value is less than or equal to the target probability, the initial cutting path in step S50 is retained.

[0030] Optionally, determining the optimal path includes:

[0031] After determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path, the current empty path length of the initial cutting path is determined.

[0032] Determine whether the current empty path length is the shortest empty path in history;

[0033] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0034] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0035] Optionally, determining the optimal path includes:

[0036] After using the new cutting path as the initial cutting path in step S50, determine the current empty path length of the initial cutting path;

[0037] Determine whether the current empty path length is the shortest empty path in history;

[0038] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0039] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0040] Furthermore, to achieve the above objectives, the present invention also proposes a laser cutting device for medium-thick bridge plates, the laser cutting device for medium-thick bridge plates comprising:

[0041] The acquisition module is used to acquire the cutting area of ​​the workpiece to be cut when a laser cutting command is received, wherein the cutting area includes multiple closed contours;

[0042] The determination module is used to determine the feature point set of each closed contour.

[0043] The determining module is used to randomly determine the cutting order of the plurality of closed contours, and to randomly determine the cutting points of each closed contour from the set of feature points.

[0044] The determining module is used to determine algorithm parameters, wherein the algorithm parameters include initial temperature, number of inner loops, number of outer loops, and temperature decay coefficient;

[0045] The determining module is used to generate an initial cutting path based on the cutting order and the cutting points, and to determine the initial empty path length of the initial cutting path;

[0046] A generation module is used to generate a new cutting path and determine the target empty path length of the new cutting path;

[0047] The determining module is used to determine the difference between the target empty path length and the initial empty path length;

[0048] The determining module is configured to, when determining that the difference is greater than or equal to a preset value, determine a target probability based on the initial temperature, the temperature decay coefficient, and the difference; determine a comparison value between the target probability and a first random value; and determine whether the initial cutting path needs to be updated based on the new cutting path and the current inner loop count is greater than the inner loop count, and then update the initial temperature based on the initial temperature and the temperature decay coefficient and repeat the outer loop until the current outer loop count is greater than the outer loop count, and then determine the optimal path.

[0049] The determining module is used to update the initial temperature based on the initial temperature and the temperature decay coefficient when it is determined that the difference is less than a preset value and the current number of inner loops is greater than the number of inner loops. After taking the new cutting path as the initial cutting path, the outer loop is repeatedly executed until the current number of outer loops is greater than the number of outer loops, and then the optimal path is determined.

[0050] The completion module is used to complete the laser cutting of the workpiece to be cut based on the optimal path.

[0051] Furthermore, to achieve the above objectives, the present invention also proposes a laser cutting device for medium-thick bridge plates, the laser cutting device for medium-thick bridge plates comprising: a memory, a processor, and a laser cutting program for medium-thick bridge plates stored in the memory and executable on the processor, the laser cutting program for medium-thick bridge plates being configured to implement the steps of the laser cutting method for medium-thick bridge plates as described above.

[0052] Furthermore, to achieve the above objectives, the present invention also proposes a storage medium storing a laser cutting program for a bridge medium-thick plate, wherein when the laser cutting program for the bridge medium-thick plate is executed by a processor, the steps of the laser cutting method for the bridge medium-thick plate described above are implemented.

[0053] This invention proposes a laser cutting method, apparatus, equipment, and storage medium for medium-thick bridge plates. Upon receiving a laser cutting command, the following steps are taken: First, the cutting area of ​​the workpiece to be cut is acquired, wherein the cutting area includes multiple closed contours. Then, a feature point set for each closed contour is determined. Next, the cutting order of the multiple closed contours is randomly determined, and the cutting points of each closed contour are randomly determined from the feature point set. Then, algorithm parameters are determined, including an initial temperature, the number of inner loops, the number of outer loops, and a temperature decay coefficient. Based on the cutting order and the cutting points, an initial cutting path is generated, and the initial empty path length of the initial cutting path is determined. A new cutting path is generated, and the target empty path length of the new cutting path is determined. The difference between the target empty path length and the initial empty path length is determined. When the difference is greater than or equal to a preset value, the laser cutting method, apparatus, equipment, and storage medium are used to cut the workpiece. The difference determines the target probability. A comparison value is determined between the target probability and a first random value. Based on this comparison value, it is determined whether the initial cutting path needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. If the difference is less than a preset value and the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient. The new cutting path is then used as the initial cutting path, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. Laser cutting of the workpiece is completed based on the optimal path. By determining the optimal path and then controlling the laser cutting machine to cut the workpiece along the optimal path, the empty path length during laser cutting can be effectively reduced, thereby effectively improving the cutting efficiency of the laser cutting machine. Attached Figure Description

[0054] Figure 1 This is a schematic diagram of the structure of a laser cutting device for thick bridge plates in the hardware operating environment of the embodiment of the present invention;

[0055] Figure 2 This is a flowchart illustrating the first embodiment of the laser cutting method for thick bridge plates according to the present invention.

[0056] Figure 3 This is a schematic diagram of the process for cutting the workpiece in the first embodiment of the laser cutting method for thick bridge plates of the present invention.

[0057] Figure 4 This is a flowchart illustrating the second embodiment of the laser cutting method for thick bridge plates according to the present invention.

[0058] Figure 5 This is a structural block diagram of the first embodiment of the laser cutting device for thick bridge plates of the present invention.

[0059] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0060] It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the invention.

[0061] Reference Figure 1 , Figure 1 This is a schematic diagram of the structure of a laser cutting device for thick bridge plates in the hardware operating environment of an embodiment of the present invention.

[0062] like Figure 1 As shown, the laser cutting equipment for the thick plates of the bridge may include: a processor 1001, such as a central processing unit (CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen and an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (such as a Wireless-Fidelity (Wi-Fi) interface). The memory 1005 may be a high-speed random access memory (RAM) or a stable non-volatile memory (NVM), such as a disk drive. The memory 1005 may also optionally be a storage device independent of the aforementioned processor 1001.

[0063] Those skilled in the art will understand that Figure 1 The structure shown does not constitute a limitation on laser cutting equipment for thick plates in bridges, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0064] like Figure 1 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and a laser cutting program for thick plates in bridges.

[0065] exist Figure 1In the laser cutting equipment for medium-thick bridge plates shown, the network interface 1004 is mainly used for data communication with the network server; the user interface 1003 is mainly used for data interaction with the user; the processor 1001 and memory 1005 in the laser cutting equipment for medium-thick bridge plates of the present invention can be set in the laser cutting equipment for medium-thick bridge plates. The laser cutting equipment for medium-thick bridge plates calls the laser cutting program for medium-thick bridge plates stored in the memory 1005 through the processor 1001 and executes the laser cutting method for medium-thick bridge plates provided in the embodiment of the present invention.

[0066] Based on the above hardware structure, an embodiment of the laser cutting method for thick plates in bridges according to the present invention is proposed.

[0067] Reference Figure 2 , Figure 2 This is a schematic flowchart of the first embodiment of a laser cutting method for medium-thick bridge plates according to the present invention.

[0068] In this embodiment, the laser cutting method for the thick plate of the bridge includes the following steps:

[0069] Step S10: Upon receiving a laser cutting command, obtain the cutting area of ​​the workpiece to be cut, wherein the cutting area includes multiple closed contours.

[0070] It should be noted that the executing entity in this embodiment can be a computing service device with data processing, network communication, and program execution functions, such as a mobile phone, tablet computer, or personal computer, or an electronic device capable of performing the above functions or a laser cutting device for medium and thick bridge plates. The following description uses the laser cutting device for medium and thick bridge plates as an example to illustrate this embodiment and the subsequent embodiments.

[0071] It should be noted that a closed contour refers to the contour line on the workpiece to be cut, and closed contours do not intersect each other; a laser cutting machine can cut the workpiece along the closed contour.

[0072] Step S20: Determine the feature point set of each closed contour.

[0073] It should be noted that the feature point set of a closed contour consists of multiple feature points on the closed contour, where the feature point refers to the pre-selected cutting starting point of the closed contour.

[0074] In one embodiment, determining the feature point set of each closed contour includes:

[0075] If the closed contour is not circular, generate a set of feature points for the closed contour based on the vertices on the closed contour.

[0076] If the closed contour is a circle, determine the equal division points on the closed contour, and generate the feature point set of the closed contour based on the equal division points.

[0077] It should be noted that when the closed contour is not circular, all vertices on the closed contour can be regarded as feature points, and then the feature point set of the closed contour can be generated. When the closed contour is circular, the closed contour can be divided into six equal parts, and then six equal division points on the closed contour can be determined. These six equal division points can be regarded as feature points, and then the feature point set of the closed contour can be generated. Alternatively, eight equal division points on the closed contour can be determined. This embodiment does not limit the number of equal division points.

[0078] Step S30: Randomly determine the cutting order of the plurality of closed contours, and randomly determine the cutting points of each closed contour from the set of feature points.

[0079] It should be noted that the cutting point refers to a cutting starting point determined from the feature points of the feature point set. A cutting path can be determined based on the cutting sequence of all closed contours on the workpiece to be cut and the cutting points of all closed contours.

[0080] Step S40: Determine the algorithm parameters, wherein the algorithm parameters include the initial temperature, the number of inner loops, the number of outer loops, and the temperature decay coefficient.

[0081] It should be noted that the inner loop count represents the total number of iterations at a given temperature. The temperature within an inner loop does not change with the increase in the inner loop iteration count. The outer loop count represents the total number of iterations at different temperatures. Each outer loop iteration requires an update to the temperature. The current outer loop temperature is lower than the previous outer loop temperature, meaning that the temperature decreases as the outer loop iteration count increases.

[0082] Step S50: Generate an initial cutting path based on the cutting sequence and the cutting points, and determine the initial empty path length of the initial cutting path.

[0083] It should be noted that the empty path length refers to the total length of the laser cutting machine from the machine origin, along the cutting path, to the cutting points of each closed contour, and back to the machine origin (excluding the length of the laser cutting machine along the closed contour).

[0084] In specific implementations, such as Figure 3 As shown, the multiple closed contours of the workpiece to be cut are P 11 P 12 P 13 P 14 P 21 P 22 P 23 P 24P 31 P 32 P 33 P 41 P 42 P 43 P 44 P 45 P 46 P 51 P 52 P 53 P 54 P 55 P 56 Each cutting point is P 11 P 24 P 31 P 45 P 51 The laser cutting machine starts from the machine tool origin, follows the cutting path along a straight line to the cutting points of each closed contour, and returns to the machine tool origin.

[0085] Step S60: Generate a new cutting path and determine the target path length of the new cutting path.

[0086] In practice, a new cutting path can be generated by adjusting the cutting order of each cutting contour in the initial cutting path, or by adjusting the cutting points of each cutting contour in the initial cutting path, or by simultaneously adjusting both the cutting contour and the cutting points of each cutting contour in the initial cutting path.

[0087] Step S70: Determine the difference between the target empty path length and the initial empty path length.

[0088] Step S80: When it is determined that the difference is greater than or equal to a preset value, a target probability is determined based on the initial temperature, the temperature decay coefficient, and the difference. A comparison value between the target probability and the first random value is determined. Based on the comparison value, it is determined whether the initial cutting path in step S50 needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient. Then, steps S40-S90 are repeated until the current outer loop count is greater than the outer loop count. Finally, the optimal path is determined.

[0089] It should be noted that the preset value can be set to 0, that is, when the difference is greater than or equal to 0, the target probability can be determined based on the initial temperature, the temperature decay coefficient and the difference.

[0090] It should be noted that one inner loop iteration is to continue generating new paths without updating the initial temperature, and repeat steps S60-S70 until the current inner loop count is greater than the inner loop count. One outer loop iteration is to repeat steps S40-S90 after updating the initial temperature. The current inner loop count increases by 1 after each inner loop execution, and the current outer loop count increases by 1 after each outer loop execution. When the current inner loop count is greater than the inner loop count, the outer loop is entered to update the initial temperature, and then steps S40-S90 are repeated until the current outer loop count is greater than the outer loop count.

[0091] In one embodiment, determining the target probability based on the initial temperature, the temperature decay coefficient, and the difference includes:

[0092] Determine the product of the initial temperature and the temperature decay coefficient;

[0093] Determine the negative ratio of the product to the difference, wherein the negative ratio is the negative of the ratio of the product to the difference;

[0094] The exponential function of the negative ratio is used as the target probability.

[0095] In the specific implementation, the initial temperature is represented by T, the temperature decay coefficient is represented by a, and the difference is represented by d. Then the product of the initial temperature and the temperature decay coefficient is aT, and the target probability is exp(-d / aT).

[0096] In one embodiment, determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path according to the comparison value includes:

[0097] When the comparison value is greater than the target probability, the initial cutting path in step S50 needs to be updated according to the new cutting path.

[0098] When the comparison value is less than or equal to the target probability, the initial cutting path in step S50 is retained.

[0099] It should be noted that when the target probability is greater than the first random value, the initial cutting path in step S50 needs to be updated according to the new cutting path before a new round of inner or outer loop can be started; when the target probability is less than or equal to the first random value, a new round of inner or outer loop can be started without updating the initial cutting path in step S50.

[0100] Understandably, when the difference is greater than or equal to the preset value, it is necessary to determine whether the initial cutting path in step S50 needs to be updated when executing the next round of the outer loop.

[0101] Step S90: When it is determined that the difference is less than the preset value and the current number of inner loops is greater than the number of inner loops, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient, and the new cutting path is used as the initial cutting path in step S50. Then, S40-S90 are repeated until the current number of outer loops is greater than the number of outer loops, and the optimal path is determined.

[0102] It should be noted that when the difference is less than the preset value and the current number of inner loops is greater than the number of inner loops, the initial cutting path in step S50 can be directly updated based on the new cutting path.

[0103] It is understandable that the cutting path obtained after executing all inner and outer loops is the optimal cutting path.

[0104] In one embodiment, determining the optimal path includes:

[0105] After determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path, the current empty path length of the initial cutting path is determined.

[0106] Determine whether the current empty path length is the shortest empty path in history;

[0107] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0108] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0109] It should be noted that the length of the empty path corresponding to the new cutting path generated in each inner loop or each outer loop needs to be stored in the path database.

[0110] It is understandable that when determining that the current empty path length is the shortest empty path in history, the current initial cutting path is taken as the optimal path.

[0111] In this embodiment, the current empty path length corresponding to the initial cutting path determined in the last outer loop can be compared with the shortest empty path in history to determine the optimal path, which can quickly determine the optimal path from the initial cutting paths determined after each inner or outer loop.

[0112] In one embodiment, determining the optimal path includes:

[0113] After using the new cutting path as the initial cutting path in step S50, determine the current empty path length of the initial cutting path;

[0114] Determine whether the current empty path length is the shortest empty path in history;

[0115] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0116] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0117] It should be noted that the length of the empty path corresponding to the new cutting path generated in each inner loop or each outer loop needs to be stored in the path database.

[0118] It is understandable that when determining that the current empty path length is the shortest empty path in history, the current initial cutting path is taken as the optimal path.

[0119] In this embodiment, the current empty path length corresponding to the initial cutting path determined in the last outer loop can be compared with the shortest empty path in history to determine the optimal path, which can quickly determine the optimal path from the initial cutting paths determined after each inner or outer loop.

[0120] Step S100: Complete the laser cutting of the workpiece to be cut based on the optimal path.

[0121] In practice, the laser cutting machine can be controlled to perform laser cutting on the workpiece along the optimal path.

[0122] This invention proposes a laser cutting method, apparatus, equipment, and storage medium for medium-thick bridge plates. Upon receiving a laser cutting command, the following steps are taken: First, the cutting area of ​​the workpiece to be cut is acquired, wherein the cutting area includes multiple closed contours. Then, a feature point set for each closed contour is determined. Next, the cutting order of the multiple closed contours is randomly determined, and the cutting points of each closed contour are randomly determined from the feature point set. Then, algorithm parameters are determined, including an initial temperature, the number of inner loops, the number of outer loops, and a temperature decay coefficient. Based on the cutting order and the cutting points, an initial cutting path is generated, and the initial empty path length of the initial cutting path is determined. A new cutting path is generated, and the target empty path length of the new cutting path is determined. The difference between the target empty path length and the initial empty path length is determined. When the difference is greater than or equal to a preset value, the laser cutting method, apparatus, equipment, and storage medium are used to cut the workpiece. The difference determines the target probability. A comparison value is determined between the target probability and a first random value. Based on this comparison value, it is determined whether the initial cutting path needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. If the difference is less than a preset value and the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient. The new cutting path is then used as the initial cutting path, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. Laser cutting of the workpiece is completed based on the optimal path. By determining the optimal path and then controlling the laser cutting machine to cut the workpiece along the optimal path, the empty path length during laser cutting can be effectively reduced, thereby effectively improving the cutting efficiency of the laser cutting machine.

[0123] refer to Figure 4 , Figure 4 This is a schematic flowchart of a second embodiment of a laser cutting method for medium-thick bridge plates according to the present invention.

[0124] Based on the first embodiment described above, the laser cutting method for thick plates in bridges in this embodiment, which generates a new cutting path, includes:

[0125] Step S601: Set the path reversal probability and the cutting point change probability.

[0126] Step S602: When the path reversal probability is greater than the second random value and the cutting point change probability is greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence, and the target cutting point of each closed contour is randomly determined from the feature point set, and a new cutting path is generated based on the new cutting sequence and the target cutting point.

[0127] It should be noted that when the probability of path reversal is greater than the second random value, the cutting order of closed contours in the cutting sequence needs to be updated; when the probability of cutting point change is greater than the third random value, the cutting points of each closed contour need to be updated.

[0128] Step S603: When the path reversal probability is not greater than the second random value and the cutting point change probability is greater than the third random value, randomly determine the target cutting point of each closed contour from the feature point set, and generate a new cutting path based on the cutting order and the target cutting point.

[0129] Step S604: When the path reversal probability is greater than the second random value and the cutting point change probability is not greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence, and a new cutting path is generated based on the new cutting sequence and the cutting point.

[0130] This embodiment sets a path flipping probability and a cutting point change probability. When the path flipping probability is greater than a second random value and the cutting point change probability is greater than a third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are swapped to generate a new cutting sequence. Target cutting points for each closed contour are randomly determined from the feature point set, and a new cutting path is generated based on the new cutting sequence and the target cutting points. When the path flipping probability is not greater than the second random value and the cutting point change probability is greater than the third random value, target cutting points for each closed contour are randomly determined from the feature point set, and a new cutting path is generated based on the cutting sequence and the target cutting points. When the path flipping probability is greater than the second random value and the cutting point change probability is not greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are swapped to generate a new cutting sequence, and a new cutting path is generated based on the new cutting sequence and the cutting points. By using the above method, the cutting order and cutting points of each cutting contour in the initial cutting path can be adjusted according to certain rules to generate a new cutting path, making the new cutting path more regular, and thus making the optimal empty path length corresponding to the generated optimal path closer to the minimum empty path length.

[0131] Furthermore, this embodiment of the invention also proposes a storage medium storing a laser cutting program for a bridge medium-thick plate. When the laser cutting program for the bridge medium-thick plate is executed by a processor, it implements the steps of the laser cutting method for the bridge medium-thick plate described above.

[0132] Reference Figure 5 , Figure 5 This is a structural block diagram of the first embodiment of the laser cutting device for thick bridge plates of the present invention.

[0133] like Figure 5 As shown, the laser cutting device for thick bridge plates proposed in this embodiment of the invention includes:

[0134] The acquisition module 10 is used to acquire the cutting area of ​​the workpiece to be cut when a laser cutting command is received, wherein the cutting area includes multiple closed contours.

[0135] Module 20 is used to determine the feature point set of each closed contour.

[0136] The determining module 20 is used to randomly determine the cutting order of the plurality of closed contours, and to randomly determine the cutting points of each closed contour from the set of feature points.

[0137] The determining module 20 is used to determine algorithm parameters, wherein the algorithm parameters include initial temperature, number of inner loops, number of outer loops, and temperature decay coefficient.

[0138] The determining module 20 is used to generate an initial cutting path based on the cutting order and the cutting points, and to determine the initial empty path length of the initial cutting path.

[0139] The generation module 30 is used to generate a new cutting path and determine the target empty path length of the new cutting path.

[0140] The determining module 20 is used to determine the difference between the target empty path length and the initial empty path length.

[0141] The determining module 20 is configured to, when determining that the difference is greater than or equal to a preset value, determine a target probability based on the initial temperature, the temperature decay coefficient, and the difference; determine a comparison value between the target probability and a first random value; and determine whether the initial cutting path needs to be updated based on the new cutting path and the current inner loop count is greater than the inner loop count, and then, after updating the initial temperature based on the initial temperature and the temperature decay coefficient, repeat the outer loop until the current outer loop count is greater than the outer loop count, and then determine the optimal path.

[0142] The determining module 20 is used to update the initial temperature based on the initial temperature and the temperature decay coefficient when it is determined that the difference is less than a preset value and the current number of inner loops is greater than the number of inner loops, and then repeatedly execute the outer loop after taking the new cutting path as the initial cutting path, until the current number of outer loops is greater than the number of outer loops, and then determine the optimal path.

[0143] The completion module 40 is used to complete the laser cutting of the workpiece to be cut based on the optimal path.

[0144] It should be understood that the above are merely illustrative examples and do not constitute any limitation on the technical solutions of the present invention. In specific applications, those skilled in the art can make settings as needed, and the present invention does not impose any restrictions on this.

[0145] This invention proposes a laser cutting method, apparatus, equipment, and storage medium for medium-thick bridge plates. Upon receiving a laser cutting command, the following steps are taken: First, the cutting area of ​​the workpiece to be cut is acquired, wherein the cutting area includes multiple closed contours. Then, a feature point set for each closed contour is determined. Next, the cutting order of the multiple closed contours is randomly determined, and the cutting points of each closed contour are randomly determined from the feature point set. Then, algorithm parameters are determined, including an initial temperature, the number of inner loops, the number of outer loops, and a temperature decay coefficient. Based on the cutting order and the cutting points, an initial cutting path is generated, and the initial empty path length of the initial cutting path is determined. A new cutting path is generated, and the target empty path length of the new cutting path is determined. The difference between the target empty path length and the initial empty path length is determined. When the difference is greater than or equal to a preset value, the laser cutting method, apparatus, equipment, and storage medium are used to cut the workpiece. The difference determines the target probability. A comparison value is determined between the target probability and a first random value. Based on this comparison value, it is determined whether the initial cutting path needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. If the difference is less than a preset value and the current inner loop count is greater than the inner loop count, the initial temperature is updated based on the initial temperature and the temperature decay coefficient. The new cutting path is then used as the initial cutting path, and the outer loop is repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. Laser cutting of the workpiece is completed based on the optimal path. By determining the optimal path and then controlling the laser cutting machine to cut the workpiece along the optimal path, the empty path length during laser cutting can be effectively reduced, thereby effectively improving the cutting efficiency of the laser cutting machine.

[0146] In one embodiment, the determining module 20 is further configured to:

[0147] If the closed contour is not circular, generate a set of feature points for the closed contour based on the vertices on the closed contour.

[0148] If the closed contour is a circle, determine the equal division points on the closed contour, and generate the feature point set of the closed contour based on the equal division points.

[0149] In one embodiment, the generation module 30 is further configured to:

[0150] Set the probability of path reversal and the probability of change of cutting point;

[0151] When the path reversal probability is greater than the second random value and the cutting point change probability is greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence. The target cutting point of each closed contour is randomly determined from the feature point set, and a new cutting path is generated based on the new cutting sequence and the target cutting point.

[0152] When the path reversal probability is no greater than the second random value and the cutting point change probability is greater than the third random value, target cutting points of each closed contour are randomly determined from the feature point set, and a new cutting path is generated based on the cutting order and the target cutting points.

[0153] When the path reversal probability is greater than the second random value and the cutting point change probability is not greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence, and a new cutting path is generated based on the new cutting sequence and the cutting point.

[0154] In one embodiment, the determining module 20 is further configured to:

[0155] Determine the product of the initial temperature and the temperature decay coefficient;

[0156] Determine the negative ratio of the product to the difference, wherein the negative ratio is the negative of the ratio of the product to the difference;

[0157] The exponential function of the negative ratio is used as the target probability.

[0158] In one embodiment, the determining module 20 is further configured to:

[0159] When the comparison value is greater than the target probability, the initial cutting path in step S50 needs to be updated according to the new cutting path.

[0160] When the comparison value is less than or equal to the target probability, the initial cutting path in step S50 is retained.

[0161] In one embodiment, the determining module 20 is further configured to:

[0162] After determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path, the current empty path length of the initial cutting path is determined.

[0163] Determine whether the current empty path length is the shortest empty path in history;

[0164] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0165] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0166] In one embodiment, the determining module 20 is further configured to:

[0167] After using the new cutting path as the initial cutting path in step S50, determine the current empty path length of the initial cutting path;

[0168] Determine whether the current empty path length is the shortest empty path in history;

[0169] If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path.

[0170] If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

[0171] It should be noted that the workflow described above is merely illustrative and does not limit the scope of protection of this invention. In practical applications, those skilled in the art can select some or all of the workflow to achieve the purpose of this embodiment according to actual needs, and no restrictions are imposed here.

[0172] In addition, for technical details not described in detail in this embodiment, please refer to the laser cutting method for thick bridge plates provided in any embodiment of the present invention, which will not be repeated here.

[0173] Furthermore, it should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0174] The sequence numbers of the above embodiments of the present invention are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0175] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM) / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of the present invention.

[0176] The above are merely preferred embodiments of the present invention and do not limit the scope of the patent. Any equivalent structural or procedural transformations made based on the description and drawings of the present invention, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of the present invention.

Claims

1. A laser cutting method for medium-thick plates in bridges, characterized in that, The laser cutting method for the thick plates of the bridge includes: S10. Upon receiving a laser cutting command, the cutting area of ​​the workpiece to be cut is obtained, wherein the cutting area includes multiple closed contours; S20. Determine the feature point set for each closed contour; S30. Randomly determine the cutting order of the plurality of closed contours, and randomly determine the cutting points of each closed contour from the set of feature points; S40. Determine the algorithm parameters, wherein the algorithm parameters include the initial temperature, the number of inner cycles, the number of outer cycles, and the temperature decay coefficient; S50. Generate an initial cutting path based on the cutting order and the cutting points, and determine the initial empty path length of the initial cutting path; S60. Generate a new cutting path and determine the target empty path length of the new cutting path; S70. Determine the difference between the target empty path length and the initial empty path length; S80. When it is determined that the difference is greater than or equal to a preset value, a target probability is determined based on the initial temperature, the temperature decay coefficient, and the difference. A comparison value between the target probability and the first random value is determined. Based on the comparison value, it is determined whether the initial cutting path in step S50 needs to be updated according to the new cutting path. After the current inner loop count is greater than the inner loop count, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient, and steps S40-S90 are repeated until the current outer loop count is greater than the outer loop count. Then, the optimal path is determined. S90. When it is determined that the difference is less than the preset value and the current number of inner loops is greater than the number of inner loops, the initial temperature in step S40 is updated based on the initial temperature and the temperature decay coefficient. After the new cutting path is used as the initial cutting path in step S50, S40-S90 are repeated until the current number of outer loops is greater than the number of outer loops, and then the optimal path is determined. S100. Laser cutting of the workpiece to be cut is completed based on the optimal path.

2. The method as described in claim 1, characterized in that, The determination of the feature point set for each closed contour includes: If the closed contour is not circular, generate a set of feature points for the closed contour based on the vertices on the closed contour. If the closed contour is a circle, determine the equal division points on the closed contour, and generate the feature point set of the closed contour based on the equal division points.

3. The method as described in claim 1, characterized in that, The generation of the new cutting path includes: Set the probability of path reversal and the probability of change of cutting point; When the path reversal probability is greater than the second random value and the cutting point change probability is greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence. The target cutting point of each closed contour is randomly determined from the feature point set, and a new cutting path is generated based on the new cutting sequence and the target cutting point. When the path reversal probability is no greater than the second random value and the cutting point change probability is greater than the third random value, target cutting points of each closed contour are randomly determined from the feature point set, and a new cutting path is generated based on the cutting order and the target cutting points. When the path reversal probability is greater than the second random value and the cutting point change probability is not greater than the third random value, the positions of the first closed contour and the second closed contour in the cutting sequence are changed to generate a new cutting sequence, and a new cutting path is generated based on the new cutting sequence and the cutting point.

4. The method as described in claim 1, characterized in that, The determination of the target probability based on the initial temperature, the temperature decay coefficient, and the difference includes: Determine the product of the initial temperature and the temperature decay coefficient; Determine the negative ratio of the product to the difference, wherein the negative ratio is the negative of the ratio of the product to the difference; The exponential function of the negative ratio is used as the target probability.

5. The method as described in claim 1, characterized in that, The step of determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path according to the comparison value includes: When the comparison value is greater than the target probability, the initial cutting path in step S50 needs to be updated according to the new cutting path. When the comparison value is less than or equal to the target probability, the initial cutting path in step S50 is retained.

6. The method as described in claim 1, characterized in that, Determining the optimal path includes: After determining whether the initial cutting path in step S50 needs to be updated based on the new cutting path, the current empty path length of the initial cutting path is determined. Determine whether the current empty path length is the shortest empty path in history; If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path. If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

7. The method as described in claim 1, characterized in that, Determining the optimal path includes: After using the new cutting path as the initial cutting path in step S50, determine the current empty path length of the initial cutting path; Determine whether the current empty path length is the shortest empty path in history; If the current empty path length is determined to be the shortest empty path in history, then the initial cutting path is taken as the optimal path. If it is determined that the current empty path length is not the shortest empty path in history, then the target path corresponding to the shortest empty path in history is determined from the path database, and the target path is taken as the optimal path.

8. A laser cutting device for medium-thick bridge plates, characterized in that, The laser cutting device for the thick plate of the bridge includes: The acquisition module is used to acquire the cutting area of ​​the workpiece to be cut when a laser cutting command is received, wherein the cutting area includes multiple closed contours; The determination module is used to determine the feature point set of each closed contour. The determining module is used to randomly determine the cutting order of the plurality of closed contours, and to randomly determine the cutting points of each closed contour from the set of feature points. The determining module is used to determine algorithm parameters, wherein the algorithm parameters include initial temperature, number of inner loops, number of outer loops, and temperature decay coefficient; The determining module is used to generate an initial cutting path based on the cutting order and the cutting points, and to determine the initial empty path length of the initial cutting path; A generation module is used to generate a new cutting path and determine the target empty path length of the new cutting path; The determining module is used to determine the difference between the target empty path length and the initial empty path length; The determining module is configured to, when determining that the difference is greater than or equal to a preset value, determine a target probability based on the initial temperature, the temperature decay coefficient, and the difference; determine a comparison value between the target probability and a first random value; and determine whether the initial cutting path needs to be updated based on the new cutting path and the current inner loop count is greater than the inner loop count, and then update the initial temperature based on the initial temperature and the temperature decay coefficient and repeat the outer loop until the current outer loop count is greater than the outer loop count, and then determine the optimal path. The determining module is used to update the initial temperature based on the initial temperature and the temperature decay coefficient when it is determined that the difference is less than a preset value and the current number of inner loops is greater than the number of inner loops. After taking the new cutting path as the initial cutting path, the outer loop is repeatedly executed until the current number of outer loops is greater than the number of outer loops, and then the optimal path is determined. The completion module is used to complete the laser cutting of the workpiece to be cut based on the optimal path.

9. A laser cutting device for medium-thick bridge plates, characterized in that, The device includes: a memory, a processor, and a laser cutting program for a bridge medium-thick plate stored in the memory and executable on the processor, the laser cutting program for the bridge medium-thick plate being configured to implement the steps of the laser cutting method for a bridge medium-thick plate as described in any one of claims 1 to 7.

10. A storage medium, characterized in that, The storage medium stores a laser cutting program for a bridge medium-thick plate, which, when executed by a processor, implements the steps of the laser cutting method for a bridge medium-thick plate as described in any one of claims 1 to 7.

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