Turret chip mounting head and chip mounting method

Abstract

The invention relates to the technical field of chip mounting, in particular to a turret chip mounting head and a chip mounting method, and the turret chip mounting head comprises a base, a turret mechanism, a lifting mechanism, an adjusting mechanism and a plurality of suction nozzle guide rods. The turret mechanism is arranged on the base; the lifting mechanism is arranged on the base; the adjusting mechanism is arranged on the lifting mechanism; the lifting mechanism can drive the adjusting mechanism to ascend and descend in the first direction. The plurality of suction nozzle guide rods are elastically connected with the turret mechanism; the turret mechanism can drive the plurality of suction nozzle guide rods to synchronously rotate around a first direction; the rotating shaft of the adjusting mechanism can drive the suction nozzle guide rod to rotate after abutting against the suction nozzle guide rod, and the suction nozzle guide rod can rebound to the original position after the adjusting mechanism is separated from the suction nozzle guide rod. In one lifting process of the adjusting mechanism, only one suction nozzle guide rod is subjected to chip mounting, and the other suction nozzle guide rods do not move, so that the risk of interference with external equipment or a substrate is greatly reduced, and the adaptability to various chip mounting technologies is improved.

Description

Technical Field

[0001] The invention relates to the technical field of chip mounting, and in particular to a turret mounting head and a mounting method. Background Art

[0002] The chip mounting head can be installed in the chip mounting machine and is used for chip mounting operations, such as moving a chip to the top of a substrate and then pressing it. After the solder on the substrate cools down, the welding of the finished chip is completed. The chip mounting head mainly plays the role of moving and pressing workpieces.

[0003] There are two types of patch heads: fixed type and turret type. The fixed type can carry one or more workpieces at a time, but the fixed type cannot rotate and needs to be aligned for patching. For example, multiple chips can be patched onto a substrate at the same time to improve the patch efficiency. However, for substrates that only need to attach some chips, or processes where only one chip and one substrate are patched, the existing fixed type patch head is not applicable. This is because the multiple nozzles on the fixed type patch head descend at the same time, but only some chips are patched, and the remaining chips are at risk of interfering with external equipment; if interference is to be avoided, multiple substrates need to be placed at large intervals, which takes up too much space, so the existing fixed type patch head has poor flexibility.

[0004] The turret-type patch head is equipped with a turntable based on the fixed-type patch head, so that the multiple nozzles set on the turntable can rotate in the horizontal or vertical plane. The turret-type patch head can absorb chips of various sizes for patching, but there is also a risk of interference with external equipment, which occupies a large space. In Siemens patch machines, two or four groups of turret-type patch heads are usually installed, one group of patch heads is used for patching, and the other group of patch heads is used to absorb components, and then the functions are exchanged to achieve the purpose of high-speed patching. Since multiple groups of patch heads are required to cooperate with the drive, it also occupies a large space and has poor flexibility. Summary of the invention

[0005] 1. Technical issues to be resolved

[0006] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a turret patch head and a patch method, which solve the technical problem of poor flexibility of the existing patch head.

[0007] (II) Technical solution

[0008] In order to achieve the above object, the turret patch head of the present invention comprises:

[0009] Base;

[0010] A turret mechanism, wherein the turret mechanism is arranged on the base;

[0011] A lifting mechanism, wherein the lifting mechanism is arranged on the base;

[0012] An adjusting mechanism, wherein the adjusting mechanism is arranged on the lifting mechanism; the lifting mechanism can drive the adjusting mechanism to move up and down in a first direction;

[0013] A plurality of nozzle guide rods are elastically connected to the turret mechanism; the turret mechanism can drive the plurality of nozzle guide rods to rotate synchronously around the first direction; after the rotating shaft of the adjusting mechanism abuts against the nozzle guide rod, the nozzle guide rod can be driven to rotate, and after the adjusting mechanism is separated from the nozzle guide rod, the nozzle guide rod can rebound to its original position.

[0014] Optionally, the nozzle guide rod comprises a nozzle, a guide rod, a limiter and an elastic member;

[0015] The guide rod is slidably connected to the turret mechanism; the limiter is provided at the top end of the guide rod, and the suction nozzle is provided at the bottom end;

[0016] The limiting member can be engaged with the rotating shaft of the adjusting mechanism;

[0017] The elastic member is sleeved on the guide rod; one end of the elastic member abuts against the limit member, and the other end abuts against the turret mechanism.

[0018] Optionally, the adjustment mechanism includes an adjuster and a clutch lever;

[0019] The regulator is arranged on the lifting mechanism, and the clutch rod is connected to the rotating shaft of the regulator;

[0020] The clutch rod can be engaged with the limiting member.

[0021] Optionally, a connecting block is provided at the bottom end of the clutch rod, and a clamping block is provided at the bottom end of the connecting block;

[0022] A slot is correspondingly arranged at the top end of the limiting member, and the card block can be inserted into the slot.

[0023] Optionally, a plurality of slots are provided at the top of the limiting member.

[0024] Optionally, the adjustment mechanism is further provided with a hook and a bearing seat;

[0025] The bearing seat is arranged on the lifting mechanism, and the clutch rod is rotatably connected with the bearing seat;

[0026] The hook is connected to the side wall of the bearing seat so that the hook and the clutch rod can be raised and lowered synchronously;

[0027] When the elastic member fails, the hook can abut against the bottom end of the limiting member to move the guide rod to its original position.

[0028] Optionally, the turret mechanism includes a slewing drive, a turntable and a top plate;

[0029] The rotary drive is arranged on the base;

[0030] The rotating shaft of the rotary drive is connected to the rotating disk;

[0031] A plurality of nozzle guide rods are elastically connected to the turntable;

[0032] The top plate is connected to the base, and a plurality of nozzle guide rods abut against the bottom surface of the top plate.

[0033] Optionally, a plurality of opening slots are provided on the top plate;

[0034] The adjusting mechanism can pass through the opening slot and abut against the nozzle guide rod.

[0035] Optionally, the turret patch head further includes a grating ruler;

[0036] The grating ruler is arranged between the base and the lifting mechanism.

[0037] Furthermore, a patch method for a turret patch head is provided, wherein the calibration method for the turret patch head is implemented based on the turret patch head as described above, and the patch method comprises:

[0038] During a chip placement, the lifting mechanism drives the adjusting mechanism to descend, and after the rotating shaft of the adjusting mechanism abuts against the nozzle guide rod, the nozzle guide rod is driven to descend until it descends to a preset position, thereby completing the bonding of the chip and the substrate; at the same time, after the rotating shaft of the adjusting mechanism abuts against the nozzle guide rod, the rotating shaft of the adjusting mechanism can drive the nozzle guide rod to rotate, so as to compensate for the offset angle of the chip;

[0039] The lifting mechanism drives the adjusting mechanism to rise, and at the same time, the adjusting mechanism drives the nozzle guide rod to rotate back to the original position, and the adjusting mechanism is separated from the nozzle guide rod, completing one patch;

[0040] During the second patch, the turret mechanism rotates a preset angle, rotates the next nozzle guide rod to the bottom of the adjustment mechanism, repeats the patch step once, and completes the second patch;

[0041] Repeat the second chip placement step until all the chips on the plurality of nozzle guide rods are completed.

[0042] (III) Beneficial effects

[0043] The beneficial effects of the present invention are:

[0044] The turret mechanism is fixedly arranged, and the lifting mechanism can drive the adjustment mechanism to rise and fall in the first direction. When the lifting mechanism drives the adjustment mechanism to descend, the adjustment mechanism can abut against the nozzle guide rod directly below, and drive the nozzle guide rod to continue to descend, so that the nozzle guide rod completes the patch action. When the lifting mechanism drives the adjustment mechanism to rise, the nozzle guide rod can rebound and rise until it rebounds to its original position, and the adjustment mechanism is separated from the nozzle guide rod, completing a patch. The entire patch process is simple and fast, and after a patch is completed, the adjustment mechanism can be separated from the nozzle guide rod, so that the turret mechanism can be rotated, and the next nozzle guide rod with the chip adsorbed is rotated to the bottom of the adjustment mechanism, so that the adjustment mechanism performs a second patch, which greatly shortens the patch working time and improves the patch efficiency.

[0045] During one lifting and lowering process of the adjustment mechanism, only the chip on one nozzle guide rod is mounted, and the other nozzle guide rods do not move, thus greatly reducing the risk of interference with external equipment or substrates. This allows the turret mounting head to satisfy the mounting process of multiple chips attached to the same substrate, as well as the one-to-one mounting process of chips and substrates. It can also perform the mounting process of chips of various sizes, and has high adaptability to various mounting processes.

[0046] After the adjustment mechanism contacts the nozzle guide rod directly below, the adjustment mechanism can drive the nozzle guide rod to rotate, thereby driving the chip adsorbed by the nozzle guide rod to rotate, so as to compensate for the deflection angle of the chip, thereby improving the welding accuracy of the finished chip. As for the adsorption position of the chip adsorbed by the nozzle guide rod, the size of the chip to be compensated can be detected by an external detection camera after being photographed, and the adjustment mechanism can then make compensation adjustments based on the size to be compensated. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 It is a structural schematic diagram of the turret patch head of the present invention;

[0048] Figure 2 A three-dimensional diagram of a turret patch head of the present invention;

[0049] Figure 3 A top view of the turret patch head of the present invention;

[0050] Figure 4 For continued use Figure 3 Sectional view along line FF;

[0051] Figure 5 for Figure 4 Enlarged view of point A in the middle.

[0052] [Description of Reference Numerals]

[0053] 1: Base;

[0054] 2: turret mechanism; 21: rotary drive; 22: turntable; 23: top plate; 231: opening slot; 24: turret seat;

[0055] 3: Lifting mechanism;

[0056] 4: adjustment mechanism; 41: regulator; 42: clutch rod; 421: connecting block; 422: clamping block; 43: hook; 44: bearing seat;

[0057] 5: nozzle guide rod; 51: nozzle; 52: guide rod; 53: limiter; 531: slot; 54: elastic member;

[0058] 6: Grating ruler. DETAILED DESCRIPTION

[0059] In order to better explain the present invention and facilitate understanding, the present invention is described in detail below through specific implementation modes in conjunction with the accompanying drawings.

[0060] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0061] In addition, in the present invention, descriptions such as "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0062] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; "connection" can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] See also Figures 1 to 3The present invention provides a turret patch head, which includes a base 1, a turret mechanism 2, a lifting mechanism 3, an adjustment mechanism 4 and a plurality of nozzle guide rods 5. The base 1 is an L-shaped base; the turret mechanism 2 is arranged on the base 1; the lifting mechanism 3 is arranged on the base 1; the adjustment mechanism 4 is arranged on the lifting mechanism 3; the lifting mechanism 3 can drive the adjustment mechanism 4 to rise and fall in a first direction, which is the axial direction of the turret mechanism 2, that is, the axial direction of the nozzle guide rod 5; the plurality of nozzle guide rods 5 are elastically connected to the turret mechanism 2; the turret mechanism 2 can drive the plurality of nozzle guide rods 5 to rotate synchronously around the first direction; the rotating shaft of the adjustment mechanism 4 can drive the nozzle guide rod 5 to rotate after abutting against the nozzle guide rod 5, and the nozzle guide rod 5 can rebound to its original position after the adjustment mechanism 4 is separated from the nozzle guide rod 5.

[0064] In order to facilitate a quicker understanding of the technical solution of the present invention, two semi-finished patches are used as examples in this embodiment, namely, a chip and a substrate. The turret patch head needs to patch the multiple adsorbed chips one by one onto multiple array-arranged substrates; of course, in other embodiments, multiple chips can also be patched onto the same substrate; the semi-finished products used for the turret patch head patch are not limited to chips and substrates, but are also applicable to the patch process of semiconductor devices such as single tubes and MOS tubes. In addition, the base 1 can be set on an external moving mechanism to enable the turret patch head to move in two or three dimensions; or, the mechanism for placing the substrate, namely the welding table, moves in two or three dimensions to cooperate with the turret patch head patch.

[0065] The turret mechanism 2 is fixedly arranged, and the lifting mechanism 3 can drive the adjustment mechanism 4 to rise and fall in the first direction. When the lifting mechanism 3 drives the adjustment mechanism 4 to descend, the adjustment mechanism 4 can abut against the suction nozzle guide rod 5 directly below, and drive the suction nozzle guide rod 5 to continue to descend, so that the suction nozzle guide rod 5 completes the patch action. When the lifting mechanism 3 drives the adjustment mechanism 4 to rise, the suction nozzle guide rod 5 can rebound and rise until it rebounds to its original position, and the adjustment mechanism 4 is separated from the suction nozzle guide rod 5 to complete a patch. The entire patch process is simple and fast, and after a patch is completed, the adjustment mechanism 4 can be separated from the suction nozzle guide rod 5, so that the turret mechanism 2 can be rotated, and the next suction nozzle guide rod 5 with the chip adsorbed is rotated to the bottom of the adjustment mechanism 4, so that the adjustment mechanism 4 performs a second patch, which greatly shortens the patch working time and improves the patch efficiency.

[0066] During one lifting process of the adjustment mechanism 4, only one chip on the nozzle guide rod 5 is mounted, and the other nozzle guide rods 5 do not move, thereby greatly reducing the risk of interference with external equipment or substrates. This allows the turret mounting head to satisfy both the mounting process of multiple chips attached to the same substrate and the one-to-one mounting process of chips and substrates, and can also perform the mounting process of chips of various sizes, with high adaptability to various mounting processes.

[0067] After the adjustment mechanism 4 contacts the nozzle guide rod 5 directly below, the adjustment mechanism 4 can drive the nozzle guide rod 5 to rotate, thereby driving the chip adsorbed by the nozzle guide rod 5 to rotate, so as to compensate and adjust the deflection angle of the chip, thereby improving the welding accuracy of the finished chip. As for the adsorption position of the chip adsorbed by the nozzle guide rod 5, the size of the chip to be compensated can be detected after being photographed by an external detection camera, and the adjustment mechanism 4 can then make compensation adjustments based on the size to be compensated.

[0068] like Figure 4 and Figure 5 As shown, the nozzle guide rod 5 includes a nozzle 51, a guide rod 52, a limiter 53 and an elastic member 54; the guide rod 52 is slidably connected to the turret mechanism 2; a limiter 53 is provided at the top of the guide rod 52, and a nozzle 51 is provided at the bottom; the limiter 53 can be engaged with the rotating shaft of the adjustment mechanism 4; the elastic member 54 is sleeved on the guide rod 52; one end of the elastic member 54 abuts against the limiter 53, and the other end abuts against the turret mechanism 2. In this embodiment, the limiter 53 is a limiter plate, and the top and bottom ends of the limiter 53 can abut against the corresponding abutting surfaces to improve the transmission stability and service life of the nozzle guide rod 5. The elastic member 54 is a spring, which can rebound to its original position after the adjustment mechanism 4 is separated from the nozzle guide rod 5. The nozzle 51 is connected to an air pipe, which adsorbs the chip by vacuum adsorption, and the material removal method is gentle. After the limit member 53 is engaged with the rotating shaft of the adjustment mechanism 4, the adjustment mechanism 4 can make compensatory adjustments to the limit member 53, that is, the chip, so that the nozzle guide rod 5 can complete the angle compensation adjustment of the chip during the descending process, thereby improving the welding accuracy of the finished chip without taking up extra working hours, thereby improving the product yield.

[0069] Furthermore, the regulating mechanism 4 includes a regulator 41 and a clutch rod 42; the regulator 41 is arranged on the lifting mechanism 3, and the clutch rod 42 is connected to the rotating shaft of the regulator 41 through a coupling (not shown); the clutch rod 42 can be engaged with the limiter 53. The regulator 41 can be a motor or a motor, and the lifting mechanism 3 can be set as a cylinder, a hydraulic cylinder or an electric push rod and other equipment. In this embodiment, a linear motor (voice coil motor) is selected to drive, and the driving is coordinated by a slider, a slide rail and other structures. The clutch rod 42 rotates back to its original position after each lifting and lowering, and at the same time, the nozzle guide rod 5 is also rotated back to its original position during the rising process, which is convenient for the subsequent high-precision docking of the clutch rod 42 and the nozzle guide rod 5, saving the docking time.

[0070] See again Figure 2 and Figure 5, the bottom end of the clutch rod 42 is provided with a connecting block 421, and the bottom end of the connecting block 421 is provided with a clamping block 422; the top end of the limiting member 53 is correspondingly provided with a clamping groove 531, and the clamping block 422 can be inserted into the clamping groove 531. It should be noted that the elastic member 54 itself is in contact with the limiting member 53 and the turntable 22, so there is a friction force, which can prevent the clutch rod 42 from rotating to a certain extent, and ensure the docking accuracy of the clutch rod 42 and the nozzle guide rod 5. Optionally, chamfers are correspondingly provided on the clamping block 422 and the clamping groove 531, so that the clamping block 422 is easier to slide into the clamping groove 531, so as to achieve rapid docking between the two, and reduce the limit requirements for the elastic member 54, that is, the elasticity requirements.

[0071] Secondly, a plurality of slots 531 are provided at the top of the limiter 53. The number of the blocks 422 can also be multiple, so as to be matched with the plurality of slots 531 in a one-to-one correspondence; or only some of the blocks 422 can be provided to be connected with some of the slots 531, and the remaining vacant slots 531 are reserved, so as to improve the adaptability to multiple types of clutch rods 42. In one embodiment, a pressure sensor is provided at the bottom end of the connection block 421. When the clutch rod 42 is normally connected with the nozzle guide rod 5, the pressure sensor reaches a preset pressure value, and the device operates normally; and when the clutch rod 42 drops to the connecting position with the nozzle guide rod 5 and the two cannot be normally connected, the measured value of the pressure sensor is less than the preset pressure value or the measured value is zero, and the device alarms or performs compensation adjustment at this time. The compensation adjustment can rotate the clutch rod 42 until the measured value of the pressure sensor reaches the preset pressure value, indicating that the two have completed the engagement, thereby reducing the risk of the chip being crushed by the misalignment error of the clutch rod 42 caused by the movement of the turret patch head.

[0072] In addition, the adjustment mechanism 4 is also provided with a hook 43 and a bearing seat 44; the bearing seat 44 is provided on the lifting mechanism 3, and the clutch rod 42 is rotatably connected to the bearing seat 44; the hook 43 is connected to the side wall of the bearing seat 44, so that the hook 43 and the clutch rod 42 can be raised and lowered synchronously; when the elastic member 54 fails, the hook 43 can abut against the bottom end of the limit member 53 to move the guide rod 52 to the original position. Among them, the hook 43 is an L-shaped hook. In the water surface section, the hook 43 is located outside the elastic member 54 and inside the limit member 53, so that the hook 43 can abut against the bottom surface of the limit member 53. Specifically, when the elastic member 54 fails, the nozzle guide rod 5 cannot rise to its original position after being compressed. With the driving of the lifting mechanism 3, the clutch rod 42 and the hook 43 rise synchronously. During the rising process, the hook 43 can abut against the bottom end of the limiter 53, driving the limiter 53 to rise, forcing the nozzle guide rod 5 to return to its original position, effectively avoiding the risk of interference between the nozzle guide rod 5 and the external structure during the subsequent patch process. Optionally, a pressure sensor is set on the hook 43. When the pressure sensor detects pressure, it means that the elastic member 54 on the nozzle guide rod 5 has failed. After multiple nozzle guide rods 5 have completed patching, they are manually checked and replaced.

[0073] Further, the turret mechanism 2 includes a rotary driver 21, a rotary disk 22 and a top disk 23; the rotary driver 21 is arranged on the base 1; the rotary shaft of the rotary driver 21 is connected to the rotary disk 22; a plurality of nozzle guide rods 5 are elastically connected to the rotary disk 22; the top disk 23 is connected to the base 1, and the plurality of nozzle guide rods 5 abut against the bottom surface of the top disk 23. In this embodiment, the rotary driver 21 includes a motor and a reducer; the turret mechanism 2 is further provided with a turret seat 24, which is arranged at the bottom end of the base 1, and the rotary shaft of the rotary driver 21 passes through the interior of the turret seat 24 and is connected to the rotary disk 22; the top disk 23 is arranged on the turret seat 24 to limit the upward stroke of the nozzle guide rod 5. On the premise of using the same elastic member 54, the pressure on the elastic member 54 is different when the installation position of the top plate 23 is different, and the friction force generated at both ends of the elastic member 54 is also different. Therefore, the pressure on the elastic member 54 can be adjusted by setting the installation height of the top plate 23, thereby further preventing the nozzle guide rod 5 from being affected by external factors and deflecting, such as vibration and wear caused by the equipment.

[0074] Secondly, a plurality of opening slots 231 are formed on the top plate 23; the adjusting mechanism 4 can pass through the opening slots 231 and abut against the nozzle guide rods 5. The opening slots 231 allow the connecting block 421 to pass through normally, and the top plate 23 can also limit the ascending stroke of the plurality of nozzle guide rods 5.

[0075] In addition, the turret patch head also includes a grating ruler 6; the grating ruler 6 is arranged between the base 1 and the lifting mechanism 3. The grating ruler 6 can adopt an existing grating ruler, including a ruler and a reading head, the ruler is arranged on the base 1, one end of the reading head is slidably connected to the ruler, and the other end of the reading head is connected to the lifting mechanism 2, so as to realize the rapid and accurate lifting and lowering of the adjustment mechanism 4, and then realize the efficient patch operation of the turret patch head.

[0076] In addition, the present invention also provides a turret patch head and a patch method, the calibration method of the turret patch head is implemented based on the turret patch head as described above, and the patch method includes:

[0077] During a chip placement, the lifting mechanism 3 drives the adjusting mechanism 4 to descend, and after the clutch rod 42 abuts against the nozzle guide rod 5, the nozzle guide rod 5 is driven to descend until it descends to the preset chip placement position, completing the bonding of the chip and the substrate; at the same time, after the rotating shaft of the adjusting mechanism 4 abuts against the nozzle guide rod 5, the rotating shaft of the adjusting mechanism 4 can drive the nozzle guide rod 5 to rotate, so as to compensate for the offset angle of the chip and improve the welding accuracy of the finished chip;

[0078] The lifting mechanism 3 drives the adjusting mechanism 4 to rise, and at the same time, the adjusting mechanism 4 drives the nozzle guide rod 5 to rotate back to the original position, and the adjusting mechanism 4 is separated from the nozzle guide rod 5, and one patch is completed; specifically, the nozzle guide rod 5 rotates back to the original position by the adjusting mechanism 4, but the rising is realized by the elastic member 54;

[0079] During the second patch, the turret mechanism 2 rotates a preset angle, rotates the next nozzle guide rod 5 to the bottom of the adjustment mechanism 4, repeats the patch step once, and completes the second patch;

[0080] Repeat the second chip placement step until all the chips on the multiple nozzle guide rods 5 have been placed.

[0081] Similarly, the material taking process of the turret chip mounting head can be analogous to the chip mounting process, and the chips can also be loaded directly to multiple nozzle guide rods 5 at the same time by an external mechanism.

[0082] The turret mounting head of the present invention not only has the high efficiency of the mounting operation of the traditional turret mounting head, but also has strong adaptability to various mounting processes; at the same time, it can compensate and adjust the offset angle of the chip before mounting, realize high-precision mounting, greatly improve the product yield, and save production costs.

[0083] It should be understood that the above description of the specific embodiments of the present invention is only for illustrating the technical route and features of the present invention, and its purpose is to enable those skilled in the art to understand the content of the present invention and implement it accordingly, but the present invention is not limited to the above specific implementation methods. Any changes or modifications made within the scope of the claims of the present invention should be included in the protection scope of the present invention.

Claims

1. A turret patch head, characterized in that: The turret patch head comprises: Base (1); A turret mechanism (2), wherein the turret mechanism (2) is arranged on the base (1); A lifting mechanism (3), wherein the lifting mechanism (3) is arranged on the base (1); An adjusting mechanism (4), wherein the adjusting mechanism (4) is arranged on the lifting mechanism (3); the lifting mechanism (3) is capable of driving the adjusting mechanism (4) to move up and down in a first direction; A plurality of nozzle guide rods (5) are elastically connected to the turret mechanism (2); the turret mechanism (2) can drive the plurality of nozzle guide rods (5) to rotate synchronously around the first direction; after the rotating shaft of the adjustment mechanism (4) abuts against the nozzle guide rod (5), the nozzle guide rod (5) can be driven to rotate; after the adjustment mechanism (4) is separated from the nozzle guide rod (5), the nozzle guide rod (5) can rebound to its original position.

2. The turret patch head according to claim 1, characterized in that: The suction nozzle guide rod (5) comprises a suction nozzle (51), a guide rod (52), a limiting member (53) and an elastic member (54); The guide rod (52) is slidably connected to the turret mechanism (2); the top end of the guide rod (52) is provided with the limiter (53), and the bottom end is provided with the suction nozzle (51); The limiting member (53) can be engaged with the rotating shaft of the adjusting mechanism (4); The elastic member (54) is sleeved on the guide rod (52); one end of the elastic member (54) abuts against the limit member (53), and the other end abuts against the turret mechanism (2).

3. The turret patch head according to claim 2, characterized in that: The regulating mechanism (4) comprises a regulator (41) and a clutch rod (42); The regulator (41) is arranged on the lifting mechanism (3), and the clutch rod (42) is connected to the rotating shaft of the regulator (41); The clutch rod (42) can be engaged with the limiting member (53).

4. The turret patch head according to claim 3, characterized in that: The bottom end of the clutch rod (42) is provided with a connecting block (421), and the bottom end of the connecting block (421) is provided with a clamping block (422); A slot (531) is correspondingly provided at the top end of the limiting member (53), and the clamping block (422) can be inserted into the slot (531).

5. The turret patch head according to claim 4, characterized in that: A plurality of slots (531) are provided at the top end of the limiting member (53).

6. The turret patch head according to claim 3, characterized in that: The adjustment mechanism (4) is further provided with a hook (43) and a bearing seat (44); The bearing seat (44) is arranged on the lifting mechanism (3), and the clutch rod (42) is rotatably connected to the bearing seat (44); The hook (43) is connected to the side wall of the bearing seat (44) so ​​that the hook (43) and the clutch rod (42) can be raised and lowered synchronously; When the elastic member (54) fails, the hook (43) can abut against the bottom end of the limiting member (53) to move the guide rod (52) to its original position.

7. The turret patch head according to any one of claims 1 to 6, characterized in that: The turret mechanism (2) comprises a rotary drive (21), a rotating disk (22) and a top disk (23); The rotary drive (21) is arranged on the base (1); The rotating shaft of the rotary drive (21) is connected to the rotating disk (22); A plurality of nozzle guide rods (5) are elastically connected to the rotating disk (22); The top plate (23) is connected to the base (1), and a plurality of nozzle guide rods (5) abut against the bottom surface of the top plate (23).

8. The turret patch head according to claim 7, characterized in that: The top plate (23) is provided with a plurality of opening slots (231); The adjustment mechanism (4) can pass through the opening slot (231) and abut against the suction nozzle guide rod (5).

9. The turret patch head according to any one of claims 1 to 6, characterized in that: The turret patch head also includes a grating ruler (6); The grating ruler (6) is arranged between the base (1) and the lifting mechanism (3).

10. A patch method for a turret patch head, wherein the calibration method for the turret patch head is implemented based on the turret patch head according to any one of claims 1 to 9, characterized in that: The patch method comprises: During a chip bonding operation, the lifting mechanism (3) drives the adjusting mechanism (4) to descend, and after the rotating shaft of the adjusting mechanism (4) contacts the suction nozzle guide rod (5), the adjusting mechanism (4) drives the suction nozzle guide rod (5) to descend until it reaches a preset position, thereby completing the bonding of the chip and the substrate; at the same time, after the rotating shaft of the adjusting mechanism (4) contacts the suction nozzle guide rod (5), the rotating shaft of the adjusting mechanism (4) can drive the suction nozzle guide rod (5) to rotate, so as to compensate for the offset angle of the chip; The lifting mechanism (3) drives the adjusting mechanism (4) to rise, and at the same time, the adjusting mechanism (4) drives the nozzle guide rod (5) to rotate back to the original position, and the adjusting mechanism (4) is separated from the nozzle guide rod (5), thus completing one patching operation; During the second patching, the turret mechanism (2) rotates a preset angle, rotates the next nozzle guide rod (5) to the bottom of the adjustment mechanism (4), and repeats the patching steps to complete the second patching; The second chip mounting step is repeated until all the chips on the plurality of nozzle guide rods (5) are mounted.

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