Chip bonding auxiliary track positioning device
By designing a chip bonding auxiliary track positioning device, using auxiliary grooves and an adjustable height auxiliary support base, the problem of vacancy time during the chip bonding process is solved, and the chip bonding efficiency and production efficiency are improved.
CN119673825APending Publication Date: 2025-03-21安徽积芯微电子科技有限公司
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Patent Information
- Application Number
- CN202411857787.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-17
- Publication Date
- 2025-03-21
AI Technical Summary
Technical Problem
In the prior art, there is a vacancy time during the chip bonding process, resulting in a low chip bonding efficiency.
Method used
A chip bond auxiliary track positioning device is designed, including a guide box, an auxiliary groove and an auxiliary support base with adjustable height. Through the coordination of the auxiliary groove and the auxiliary support base, support and guiding positioning of the chip bonded semi-finished product is achieved, reducing vacancy time.
Benefits of technology
It effectively reduces the vacancy time during the chip bonding process, improves the efficiency of chip bonding, and ensures the efficiency of chip production.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to a chip bonding auxiliary track positioning device, and relates to the technical field of chip processing, the chip bonding auxiliary track positioning device comprises a guide box body, auxiliary grooves are formed in the guide box body, auxiliary supporting bases are slidably arranged in the auxiliary grooves, the height of the auxiliary supporting bases is adjustable, the number of the auxiliary grooves is two, and the movement directions of the adjacent auxiliary supporting bases are opposite. When one auxiliary supporting base moves downwards to carry out chip bonding, the other auxiliary supporting base moves upwards until the auxiliary supporting base is moved out of the auxiliary groove, so that a chip bonding product on the auxiliary supporting base can be moved out of the auxiliary groove, and the chip bonding quality is improved while blanking is conveniently realized. According to the auxiliary supporting base, the other set of chip bonding semi-finished products can be conveniently placed on the auxiliary supporting base, the vacancy time of chip bonding can be effectively shortened in the process, the efficiency of the chip bonding process is ensured, and the chip production efficiency is ensured.
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