Multiplexer and array antenna module

Abstract

A multiplexer and an array antenna module, the array antenna module comprises a circuit board and an array antenna, the multiplexer comprises a first end, at least two second ends and a plurality of conduction parts, and the at least two second ends and the first end are arranged on the same layer of the circuit board; the connecting part is connected between the first end and the at least two second ends, the first end and the at least two second ends are respectively arranged on two opposite sides of the connecting part, and the connecting part, the first end and the at least two second ends are arranged on different layers of the circuit board; the connecting part is respectively connected with the first end and the at least two second ends through a plurality of conducting parts; the first end or one of the at least two second ends is connected to the array antenna and is used for conducting signals of the array antenna.

Description

Technical Field

[0001] The present invention relates to the technical field of antennas, and in particular, to a multiplexer and an array antenna module. Background Art

[0002] A low-orbit satellite system (LEO) is a large satellite system composed of multiple satellites that can perform real-time information processing. Low-orbit satellites are also used for communication of mobile terminals such as mobile phones. Due to the low orbit altitude, mobile terminals using low-orbit satellite communication have the advantages of short transmission delay and small path loss. A mobile communication system composed of multiple low-orbit satellites can achieve true global coverage, and frequency reuse is more effective. Technologies such as cellular communication, multiple access, spot beam, and frequency reuse also provide technical guarantees for the application of low-orbit satellites in mobile communication. In short, low-orbit satellites are currently highly promising mobile communication systems.

[0003] However, in the existing array antenna module applied to low-orbit satellites, in order to reduce the overall area of the antenna design, the arrangement distance between the transmitting antenna and the receiving antenna is relatively close, and the signal transmission wiring between the antennas is difficult, so that more considerations are required in the design of the array antenna. Summary of the Invention

[0004] In view of the above, the present invention provides a multiplexer and an array antenna module.

[0005] In a first aspect of the present application, a multiplexer is provided, which is applied to an array antenna module. The array antenna module includes a circuit board and an array antenna. The multiplexer includes a first end, at least two second ends, and a plurality of conduction parts. At least two second ends and the first end are arranged on the same layer of the circuit board; a connection part, the connection part is connected between the first end and at least two second ends, the first end and at least two second ends are respectively arranged on opposite sides of the connection part, and the connection part, the first end, and at least two second ends are arranged on different layers of the circuit board; the connection part is respectively connected to the first end and at least two second ends through a plurality of conduction parts; one of the first end or at least two second ends is connected to the array antenna for conducting the signal of the array antenna.

[0006] In a second aspect of the present application, an array antenna module is provided, which includes a circuit board, an array antenna, and several multiplexers as described above. The array antenna is arranged on the surface layer of the circuit board in a preset arrangement manner, and several multiplexers and the array antenna are distributed on different layers of the circuit board.

[0007] The multiplexer provided by the present application is connected to the array antenna through one of the first end or at least two second ends, so that the multiplexer can conduct the signals of the array antenna. And the connection part, the first end and at least two second ends are arranged on different layers of the circuit board, which can prevent the multiplexer from being arranged flat on the same plane, saving the design space of the multiplexer on the plane and being more conducive to the signal transmission wiring of the array antenna module. Description of the Drawings

[0008] Figure 1 It is a schematic diagram of the functional modules of the array antenna module provided by the embodiment of the present application.

[0009] Figure 2 It is a schematic diagram of the structure of the multiplexer of the array antenna module provided by the embodiment of the present application.

[0010] Figure 3 It is a schematic cross-sectional view of the array antenna module provided by the embodiment of the present application.

[0011] Figure 4 It is a schematic diagram of the structure of the array antenna module provided by the embodiment of the present application.

[0012] Figure 5 is Figure 4 An enlarged schematic view of the V region of the shown array antenna module.

[0013] Figure 6 It is a curve graph of the S parameters of the multiplexer provided by the embodiment of the present application.

[0014] Figure 7 It is a curve graph of the S parameters of the multiplexer provided by another embodiment of the present application.

[0015] Description of the Main Element Symbols

[0016] Array antenna module 1; Array antenna 10; Antenna 12; LNA 20; Beamforming module 30;

[0017] Multiplexer 40; First end 41; Second end 42; Connection point 422; Connection part 43; First connection segment 432; Second connection segment 434; First conduction part 44; Second conduction part 45; Resistor 46;

[0018] Circuit board 50; First ground layer 60; Opening 62; Second ground layer 70; Third connection part 80.

[0019] The following specific embodiments will further illustrate the present invention in conjunction with the above drawings. Specific Embodiments

[0020] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0021] It should be noted that when an element is referred to as being "electrically connected" to another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "electrically connected" to another element, it can be a contact connection, for example, in the form of a wire connection, or a non-contact connection, for example, in the form of non-contact coupling.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0023] The following will make a detailed description of some embodiments of the present invention with reference to the accompanying drawings. Without conflict, the following embodiments and the features in the embodiments can be combined with each other.

[0024] A low-orbit satellite system (LEO) is a large satellite system composed of multiple satellites that can perform real-time information processing. Low-orbit satellites are also used for the communication of mobile terminals such as mobile phones. Due to the low orbit altitude, mobile terminals using low-orbit satellite communication have the advantages of short transmission delay and small path loss. A mobile communication system composed of multiple low-orbit satellites can achieve true global coverage and more effective frequency reuse. Technologies such as cellular communication, multiple access, spot beam, and frequency reuse also provide technical guarantees for the application of low-orbit satellites in mobile communication. All in all, low-orbit satellites are currently highly regarded mobile communication systems.

[0025] However, for the existing array antenna module applied to low-orbit satellites, in order to reduce the overall area of the antenna design, the arrangement distance between the transmitting antenna and the receiving antenna is relatively close, and the signal transmission wiring between the antennas is difficult, so that more considerations are required in the design of the array antenna.

[0026] For this reason, please refer to Figure 1 , this application provides an array antenna module 1, which can be applied to a wireless communication device (not shown in the figure) to realize the wireless communication of the wireless communication device based on low-orbit satellites. Among them, the array antenna module 1 is used to transmit or receive wireless signals to realize wireless communication.

[0027] Please continue to refer to Figure 1 In some embodiments of the present application, the array antenna module 1 includes an array antenna 10, a low noise amplifier (LNA) 20, a beamforming module 30, a multiplexer 40, and a circuit board 50.

[0028] The circuit board 50 may be a multi-layer circuit board structure. The array antenna 10, the LNA 20, the beamforming module 30, and the multiplexer 40 are electrically connected in sequence and disposed on the circuit board 50. In some embodiments, the array antenna 10, the LNA 20, the beamforming module 30, and the multiplexer 40 may be disposed on different layers of the circuit board 50.

[0029] The array antenna 10 may be used to receive or transmit wireless communication signals. The LNA 20 may be used to obtain wireless communication signals from the array antenna 10, amplify them, and output them to the beamforming module 30, or obtain wireless communication signals from the beamforming module 30, amplify them, and output them to the array antenna 10. The beamforming module 30 may be used to obtain wireless communication signals from the array antenna 10 through the LNA 20, analyze them, or compile wireless communication signals, and conduct them to the array antenna 10 through the LNA 20. The multiplexer 40 may be used to output the wireless communication signals received from the array antenna 10 that have been analyzed by the beamforming module 30, or compile the input wireless communication signals through the beamforming module 30 and transmit them by the array antenna 10.

[0030] Please refer to together Figure 2 The multiplexer 40 may include a first end 41, at least two second ends 42, a connecting portion 43, a first conducting portion 44, and a second conducting portion 45.

[0031] One of the first end 41 or at least two second ends 42 is connected to the array antenna 10 through the beamforming module 30 and the LNA 20 in sequence, for conducting the wireless communication signals of the array antenna 10. In some embodiments, the first end 41 and at least two second ends 42 are both substantially linear metal segment structures, and may be arranged substantially parallel or non-parallel to each other. The first end 41 and at least two second ends 42 are coplanarly arranged and may be arranged on the same layer of the circuit board 50, such as the third layer. In some embodiments, at least two second ends 42 may be symmetric or asymmetric structures. For example, two second ends 42 may be symmetric or asymmetrically arranged with respect to the first end 41. It can be understood that when at least two second ends 42 are parallel or symmetrically arranged, it can make at least two second ends 42 have substantially the same signal conduction path and have a better signal conduction effect.

[0032] In some embodiments, when at least two second ends 42 are sequentially connected to the array antenna 10 through the beamforming module 30 and the LNA 20, the multiplexer 40 can be a power combiner, which is configured to receive the wireless communication signals of the array antenna 10 through at least two second ends 42 and output a combined signal through the first end 41. Alternatively, when the first end 41 is sequentially connected to the array antenna 10 through the beamforming module 30 and the LNA 20, the multiplexer 40 can be a power splitter, which is configured to receive a wireless communication signal through the first end 41 and output split signals through at least two second ends 42 respectively.

[0033] The connecting portion 43 is connected between the first end 41 and at least two second ends 42, and the first end 41 and at least two second ends 42 are respectively disposed on opposite sides of the connecting portion 43. The connecting portion 43 may include a first connecting segment 432 and a second connecting segment 434. In some embodiments, the first connecting segment 432 is generally a straight metal segment, and the second connecting segment 434 is generally a rectangular ring-shaped metal segment structure. One end of the first connecting segment 432 is connected to the first end 41, and the other end of the first connecting segment 432 is connected to a position approximately in the middle of a long side of the second connecting segment 434. The other long side of the second connecting segment 434 may be respectively connected to at least two second ends 42. In some embodiments, the connecting portion 43 is not coplanar with the first end 41 and at least two second ends 42, and may be disposed on different layers of the circuit board 50. For example, the connecting portion 43 may be disposed on the second layer of the circuit board 50. In some embodiments, disposing the connecting portion 43 on the second layer of the circuit board 50 can facilitate routing cooperation with other multiplexers 40. In some embodiments, the second connecting segment 434 may also have other symmetric regular shapes, such as circular, elliptical, rectangular, etc., and the second connecting segment 434 is symmetrically structured with respect to the first connecting segment 432.

[0034] In some embodiments, the first end 41 and at least two second ends 42 have a first resistance value, and the connecting portion 43 has a second resistance value. Among them, the first resistance value may be less than or equal to the second resistance value. The first resistance value may be, but is not limited to, 50 ohms (ohm, Ω), and the second resistance value may be, but is not limited to, 70.7 ohms. In some embodiments, since one signal conduction path of the first end 41 is divided into two signal conduction paths of at least two second ends 42, in order to make the energies equal, the connecting portion 43 connecting the first end 41 and at least two second ends 42 conforms to the formula where Z 0 is the first resistance value between the first end 41 and at least two second ends 42, that is, Z 0= 50 ohms, Z is the second resistance value of the connecting portion 43, and it can be calculated that Z = 70.7 ohms. Since the first end 41 and at least two second ends 42 are set with the same preset resistance value, and the connecting portion 43 is set with a different preset resistance value, the energy conducted by the first end 41, the connecting portion 43, and at least two second ends 42 is approximately equal, reducing the loss of energy conduction. Among them, the first connection segment 432 can be used to convert the first resistance value of the first end 41 to the second resistance value of the connecting portion 43 during energy conduction, or convert the second resistance value of the connecting portion 43 to the first resistance value of the first end 41. In some embodiments, to cooperate with the setting of the circuit board 50, the connecting portion 43, the first end 41, and at least two second ends 42 can have different line widths so that the connecting portion 43, the first end 41, and at least two second ends 42 can have approximately equal signal transmission power.

[0035] The first conduction portion 44 is connected between the first end 41 and the connecting portion 43, and the first conduction portion 44 connects the layer or plane where the first end 41 is located to the layer or plane where the connecting portion 43 is located, that is, the first conduction portion 44 connects the second layer and the third layer of the circuit board 50. In some embodiments, the first conduction portion 44 can be, but is not limited to, a metal column. One end of the metal column is connected to the first end 41, and the other end of the metal column is connected to the first connection segment 432.

[0036] The second conduction portion 45 is connected between at least two second ends 42 and the connecting portion 43, and the second conduction portion 45 connects the layer or plane where at least two second ends 42 are located to the layer or plane where the connecting portion 43 is located, that is, the second conduction portion 45 connects the second layer and the third layer of the circuit board 50. In some embodiments, the second conduction portion 45 can be, but is not limited to, two metal columns. One end of each of the two metal columns is respectively connected to at least two second ends 42, and the other ends of the two metal columns are connected to the end of the second connection segment 434 far from the first connection segment 432. In some embodiments, the extension line of the first connection segment 432 is substantially perpendicular to the connection line of the two second conduction portions 45 (i.e., the two metal columns).

[0037] In some embodiments, each of the at least two second ends 42 includes a connection point 422. The connection point 422 is connected to the second conduction portion 45, and the second end 42 is formed by extending outward from the connection point 422 of the second conduction portion 45. Among them, the direction in which the second end 42 extends outward from the connection point 422 has an included angle θ with the direction perpendicular to the second connection segment 434. In some embodiments, the range of the included angle θ can be, but is not limited to, 0 degree to 90 degrees.

[0038] Please refer to Figure 2, in some embodiments, the signal conduction direction of the first end 41 is substantially the same as that of at least two second ends 42. In some embodiments, the vector difference between the signal conduction direction of the first end 41 and that of at least two second ends 42 can be from 0 degrees to 90 degrees. Exemplarily, the signal conduction direction of the first end 41 faces the first conduction portion 44, and the first conduction portion 44 conducts the signal to the first connection segment 432. The signal conduction direction of the first connection segment 432 is from the first conduction portion 44 towards the second connection segment 434. However, the signal conduction direction of the first end 41 is consistent with that of the first connection segment 432. The signal conduction direction of the first end 41 and the first connection segment 432 can be defined as the first vector. The second connection segment 434 obtains the signal from the first connection segment 432 and conducts it to the second conduction portion 45. At least two second ends 42 are respectively connected to the second conduction portion 45 through the connection points 422 and serve as the endpoints of the signal conduction of at least two second ends 42. The structure along at least two second ends 42 serves as the signal conduction path of at least two second ends 42. The signal conduction direction of at least two second ends 42 can be defined as the second vector. The vector difference between the first vector and the second vector can be from 0 degrees to 90 degrees. It can be understood that when at least two second ends 42 are signal input ends, the first end 41 is a signal output end, and the signal conduction path can be the same as the above description, but the signal conduction direction is opposite, which will not be elaborated here.

[0039] Please refer to Figure 3 , the multiplexer 40 may further include a resistor 46. The resistor 46 can be in contact with the connection portion 43 through the second conduction portion 45. In some embodiments, the resistor 46 is not coplanar with the first end 41, at least two second ends 42, and the connection portion 43. The resistor 46 can be disposed on the first layer of the circuit board 50. In some embodiments, the second conduction portion 45 can be respectively connected to the resistor 46, the second connection segment 434 of the connection portion 43, and at least two second ends 42, that is, the second conduction portion 45 can connect the first layer, the second layer, and the third layer of the circuit board 50.

[0040] In some embodiments, the array antenna 10 can be disposed on another layer of the circuit board 50, and is not coplanar with the layer where the first end 41 and at least two second ends 42 are located and the layer where the connection portion 43 is located. For example, the array antenna 10 can be disposed on the fifth layer of the circuit board 50. In some embodiments, the fifth layer where the array antenna 10 is located can be the surface layer of the array antenna module 1, and the first layer where the resistor 46 is located can be the internal layer of the array antenna module 1. In other embodiments, the first layer where the resistor 46 is located can be the surface layer of the array antenna module 1, and the fifth layer where the array antenna 10 is located can be the internal layer of the array antenna module 1.

[0041] In some embodiments, the array antenna module 1 may further include a first ground layer 60, a second ground layer 70, and a third ground layer 80.

[0042] The first ground layer 60 can be disposed on the first layer of the circuit board 50 and adjacent to the resistor 46. The second ground layer 70 can be disposed on the second layer of the circuit board 50 and adjacent to the connecting portion 43. The third ground layer 80 can be disposed on the fourth layer of the circuit board 50, and the third ground layer 80 can be located between the layer where the array antenna 10 is located and the layer where the first end 41 and at least two second ends 42 are located. The first ground layer 60, the second ground layer 70, and the third ground layer 80 can be used to provide a ground for the array antenna 10 and the multiplexer 30. Among them, the second ground layer 70 and the third ground layer 80 can be used as the reference ground for the first end 41 and at least two second ends 42, and the third ground layer 80 can be used as the reference ground for the connecting portion 43. In some embodiments, the first ground layer 60 is provided with an opening 62, and the opening 62 corresponds to the connecting portion 43, so that the connecting portion 43 can have a larger trace width on the circuit board 50, thereby reducing the loss of energy conduction when the connecting portion 43 conducts signals.

[0043] In some embodiments, a first through hole is formed through the second layer to the third layer of the circuit board 50, and the second through hole is filled with a metal conductor to form a first conduction portion 44. The first conduction portion 44 penetrates through the second layer to the third layer of the circuit board 50 to connect the connecting portion 43 located on the second layer and the first end 41 located on the third layer respectively, so as to realize the electrical connection and signal conduction between the connecting portion 43 and the first end 41. A second through hole is formed through the first layer to the third layer of the circuit board 50, and the second through hole is filled with a metal conductor to form a second conduction portion 45. The second conduction portion 45 penetrates through the first layer to the third layer of the circuit board 50 to connect the resistor 46 located on the first layer, the connecting portion 43 located on the second layer, and at least two second ends 42 located on the third layer respectively, so as to realize the electrical connection and signal conduction among the resistor 46, the connecting portion 43, and at least two second ends 42. It can be understood that the first layer to the fifth layer of the circuit board 50 can be spaced apart from each other and arranged in parallel.

[0044] Please refer to Figure 4 and Figure 5 together, the array antenna 10 may include a plurality of antennas 12.

[0045] The plurality of antennas 12 are arranged in rows. In each row, every two adjacent antennas 12 are spaced apart at a preset distance. Every two adjacent rows of antennas 12 are arranged in a staggered manner to form an array arrangement, that is, an array antenna 10 is formed. Exemplarily, in the (N + 1)-th row, each antenna 12 is arranged in a staggered manner between two adjacent antennas 12 in the N-th row, where N is a positive integer greater than or equal to 1.

[0046] The multiplexer 40 is misaligned and disposed between the antennas 12. In some embodiments, the array antenna module 1 may include a plurality of multiplexers 40. Each multiplexer 40 may be correspondingly connected to two antennas 12 through the beamforming module 30 and the LNA 20. For example, each multiplexer 40 may be connected to two antennas 12 through at least two second ends 42 respectively. When the array antenna 10 is arranged in a preset array, every two antennas 12 are connected to a multiplexer 40. The multiplexer 40 inputs the wireless communication signals of the two antennas 12 through at least two second ends 42 and outputs one path of signal through the first end 41. It can be understood that the plurality of multiplexers 40 connected to the antennas 12 are connected in parallel and are at the same level. After these multiplexers 40 output one path of signal, they are output to at least two second ends 42 of the multiplexers 40 at the next level again. The first end 41 of the multiplexer 40 at the next level further outputs one path of signal, and so on. Through the cascaded connection of multiple levels of multiplexers 40, finally one path of signal is output by the multiplexer 40 at the last level. It can be understood that in the signal conduction of multiple levels of multiplexers 40, the multiplexers 40 at the same level are connected in parallel, and the multiplexers 40 at different levels are connected in series. Herein, "a plurality" may refer to "one" or "more than one".

[0047] Exemplarily, in a 4*4 array antenna, that is, arranged in 4 rows, with 4 antennas 12 arranged in each row, a total of 16 antennas 12. Every two antennas 12 are connected to a multiplexer 40, then 16 antennas 12 are connected to 8 multiplexers 40, and these 8 multiplexers 40 may be at the first level. These 8 multiplexers 40 can conduct and output the wireless communication signals of the 16 antennas 12 into 8 paths of signals. Then, for every two paths of signals, they are connected to a multiplexer 40, so the 8 paths of signals are further connected to 4 multiplexers 40, and these 4 multiplexers 40 may be at the second level. These 4 multiplexers 40 can conduct and output the previous 8 paths of signals into 4 paths of signals. Then, for every two paths of signals, they are connected to a multiplexer 40, so the 4 paths of signals are further connected to 2 multiplexers 40, and these 2 multiplexers 40 may be at the third level. These 2 multiplexers 40 can conduct and output the previous 4 paths of signals into 2 paths of signals. The 2 paths of signals are further connected to a multiplexer 40, and this multiplexer 40 may be at the fourth level. This multiplexer 40 can conduct and finally output the previous 2 paths of signals into one path of signal. It can be understood that the one path of signal finally output by multiple levels of multiplexers 40 of the array antenna module 1 can be output to other modules or components of the wireless communication device to realize the wireless communication of the wireless communication device.

[0048] Please refer to Figure 6 and Figure 7 , Figure 6The figure shows the S-parameters curve when the first end 41 and at least two second ends 42 of the multiplexer 40 are disposed on the same layer, i.e., the third layer, of the circuit board 50, and the connection portion 43 is disposed on another layer, i.e., the second layer, of the circuit board 50. At this time, the overall maximum loss of the multiplexer 40 is approximately 3.41 decibels (dB). Figure 7 The figure shows the S-parameters curve when the first end 41, at least two second ends 42, and the connection portion 43 of the multiplexer 40 are disposed on the same layer, such as the third layer, of the circuit board 50. At this time, the overall maximum loss of the multiplexer 40 is approximately 4.91 decibels (dB). It can be seen that the loss of the inner layer is relatively large, and Figure 6 and Figure 7 Compared with the two settings, in the embodiment of the present application, the first end 41 and at least two second ends 42 of the multiplexer 40 and the connection portion 43 are disposed on different layers of the circuit board 50 (especially the connection portion 43 is disposed on the outer layer of the circuit board 50). Compared with the case where the first end 41, at least two second ends 42, and the connection portion 43 of the multiplexer 40 are disposed on the same layer of the circuit board 50, the signal conduction loss of the multiplexer 40 in the embodiment of the present application is lower, which is more conducive to the signal conduction of the multiplexer 40 for the array antenna 10.

[0049] The multiplexer 40 provided by the present application is connected to the array antenna 10 through one of the first end 41 or at least two second ends 42, so that the multiplexer 40 can conduct the signal of the array antenna 10. And the connection portion 43 and the first end 41 and at least two second ends 42 are disposed on different layers of the circuit board 50, which can prevent the multiplexer 40 from being arranged flat on the same plane, saving the design space of the multiplexer 40 on the plane, being more conducive to the signal transmission wiring of the array antenna module 1, and having a lower loss when the multiplexer 40 conducts signals, which is more conducive to the signal conduction of the multiplexer 40 for the array antenna 10.

[0050] The above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the above preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention. Those skilled in the art can also make other changes within the spirit of the present invention for use in the design of the present invention, as long as they do not deviate from the technical effects of the present invention. These changes made according to the spirit of the present invention should all be included within the scope claimed by the present invention.

Claims

1. A multiplexer is applied to an array antenna module. It is characterized in that the array antenna module includes a circuit board and an array antenna, and the multiplexer includes: a first end; at least two second ends, and at least two of the second ends and the first end are disposed on the same layer of the circuit board; a connecting portion that connects between the first end and at least two of the second ends, the first end and at least two of the second ends are respectively disposed on opposite sides of the connecting portion, and the connecting portion, the first end and at least two of the second ends are disposed on different layers of the circuit board; and a plurality of conducting portions, and the connecting portion is connected to the first end and at least two of the second ends respectively through the plurality of conducting portions; one of the first end or at least two of the second ends is connected to the array antenna for conducting the signal of the array antenna.

2. The multiplexer according to claim 1, characterized in that: the multiplexer further includes a resistor, and the resistor is connected to the connecting portion through the plurality of conducting portions.

3. The multiplexer according to claim 2, characterized in that: the resistor, the connecting portion, the first end and at least two of the second ends are respectively disposed on different layers of the circuit board in sequence, wherein the resistor is disposed on one of the surface layers of the circuit board.

4. The multiplexer according to claim 1, characterized in that: when at least two of the second ends are connected to the array antenna, the multiplexer is a power combiner for receiving the signals of the array antenna through at least two of the second ends and outputting a combined signal through the first end; or when the first end is connected to the array antenna, the multiplexer is a power splitter for receiving a signal through the first end and respectively outputting split signals through at least two of the second ends.

5. The multiplexer according to claim 1, characterized in that: the first end and at least two of the second ends have the same first resistance value, the connecting portion has a second resistance value, and the first resistance value is less than the second resistance value.

6. An array antenna module, characterized in that: the array antenna module includes a circuit board; an array antenna, and the array antenna is disposed on the surface layer of the circuit board in a preset arrangement manner; and a plurality of multiplexers according to any one of claims 1-5, and the plurality of multiplexers and the array antenna are distributed on different layers of the circuit board.

7. The array antenna module according to claim 6, characterized in that: among the plurality of multiplexers, the multiplexers at the same level are connected in parallel.

8. The array antenna module according to claim 6, characterized in that: the array antenna further includes: a plurality of antennas arranged in rows, in each row, every two adjacent antennas are spaced apart by a preset distance, and every two adjacent rows of antennas are arranged in a staggered manner to form an array arrangement; the multiplexers are arranged in a staggered manner between the antennas.

9. The array antenna module according to claim 6, characterized in that: when the multiplexer further includes a resistor, the resistor and the array antenna are distributed on opposite two surfaces of the circuit board.

10. The array antenna module according to claim 6, It is characterized in that: The array antenna module further includes a ground layer, and the ground layer is disposed between the layer where the first end and at least two of the second ends are located and the layer where the array antenna is located.

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