Multi-dimensional coupling sensing acquisition system
Through a multi-dimensional coupled perception acquisition system, multiple sensors are integrated and signal preprocessing and synchronous sampling is performed, which solves the problems of inaccurate monitoring and insufficient noise immunity of the existing tool monitoring system, and achieves high-precision, real-time monitoring of tool status and system stability.
Patent Information
- Application Number
- CN202510656610.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-21
- Publication Date
- 2025-07-08
Smart Images
Figure CN120269400A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of machine tool tool wear monitoring, and particularly to a multi-dimensional coupling perception acquisition system. Background Art
[0002] At present, most of the existing tool monitoring systems in the market rely on one or a few sensors to monitor the operating state of the tool. For example, a cutting force sensor only evaluates the tool state by collecting force signals during the cutting process. This monitoring method often cannot comprehensively reflect the actual working state of the tool. Especially when detecting wear, thermal deformation, and vibration abnormalities, misjudgments are likely to occur, resulting in reduced production efficiency and unstable product quality. Secondly, vibration sensors are usually used to monitor the vibration information of the machine tool during the machining process to evaluate tool wear or abnormalities. However, the sensitivity difference of traditional vibration sensors to low-frequency and high-frequency vibrations makes it impossible to identify these changes in some frequency bands, resulting in missed detection of potential faults. In addition, due to the influence of noise in the machining environment, the quality of vibration signals is easily disturbed, further reducing the monitoring accuracy. Temperature sensors monitor the tool state by measuring the temperature changes in the cutting area, but it is difficult for them to accurately capture instantaneous high-temperature events. Especially during high-speed machining, the temperature in the cutting area changes rapidly, and the temperature sensors may not be able to reflect the true thermal state in time. In addition, due to the interference of environmental heat sources, the reliability of temperature data is questioned, increasing the complexity of monitoring. The limitation of traditional acoustic emission technology is that they are more sensitive to fault signals within a specific frequency range, resulting in insufficient monitoring of non-typical fault modes, such as micro-cracks or wear. Research has found that acoustic emission systems often cannot give early warnings in about 30% of actual fault cases, which greatly reduces their effectiveness.
[0003] Existing systems usually only use one or two of the above sensors. After the collected signals are amplified, filtered, and analog-to-digital converted, they are transmitted to the monitoring terminal through a data acquisition device. Since the hardware systems are independent of each other and the data acquisition dimension is limited, it is easy to cause inaccurate monitoring due to local faults or misjudgments, and thus cannot comprehensively reflect the true working state of the tool. There are deficiencies in aspects such as multi-sensor data synchronization, signal timing calibration, and overall system anti-noise performance. There is a lack of a unified clock synchronization mechanism, which makes it difficult to effectively fuse multi-dimensional data. There is mainly a contradiction between the single-dimensional sensing system and the comprehensive monitoring requirements of complex machining states. In addition, there is a lack of good integrated design between each sensor, the front-end conditioning circuit, and the data acquisition module. The installation and debugging are complex, the system volume is large, and the anti-interference performance is poor. Existing equipment mainly focuses on wear or tool breakage monitoring, and lacks sufficient data support and hardware acquisition solutions for other tool abnormalities, such as thermal deformation, cutting deviation, and vibration abnormalities, and it is difficult to adapt to complex machining environments. Summary of the Invention
[0004] The present invention aims to solve the problems of insufficient data synchronization, signal timing calibration, and system anti-noise performance in multi-sensors, which directly affect the accuracy and real-time performance of tool state monitoring. In severe cases, it may lead to machine tool failures or a decline in machining quality. Therefore, the present invention provides a multi-dimensional coupled perception acquisition system that can effectively integrate multiple sensors and ensure data timeliness and consistency.
[0005] The technical solution adopted by the present invention to solve its technical problems is as follows: A multi-dimensional coupled perception acquisition system includes a multi-dimensional sensor array module with a force perception layer, a vibration perception layer, a thermal-mechanical coupling layer, and a process parameter layer. The multi-dimensional sensor array module is used to collect the operating state signals of the machine tool tool; A signal conditioning unit, including an adaptive impedance matching circuit, a low-noise amplifier, and an 8th-order Butterworth anti-aliasing filter, is used to preprocess the signals collected by the multi-dimensional sensor array module; A data synchronous sampling unit, including a data acquisition module and a data synchronization module. The data acquisition module uses a 24-bit ADC to perform high-speed and multi-channel digital sampling on the analog signals preprocessed by the signal conditioning unit; The data synchronization module includes a physical layer synchronization unit, a protocol layer synchronization unit, and an application layer synchronization unit, which ensure the data synchronization of the 24-bit ADC digital sampling through multiple synchronization units; A communication interface module is used to transmit the data collected by the data acquisition module to a monitoring terminal or a control system.
[0006] Preferably, the force perception layer of the multi-dimensional sensor array module includes a cutting force detection unit composed of a piezoelectric cutting force sensor and a strain gauge composite installation;
[0007] The vibration perception layer includes a triaxial MEMS accelerometer and a piezoelectric ceramic sensor arranged in parallel; The thermal-mechanical coupling layer includes a micro infrared temperature measurement module and a contact thermocouple arranged in cooperation; The process parameter layer directly couples the real-time data of the rotational speed, feed rate, and cutting depth of the machine tool control system through the EtherCAT bus.
[0008] Preferably, the impedance coverage range of the adaptive impedance matching circuit is 10Ω to 10kΩ.
[0009] Preferably, the working bandwidth range of the data acquisition module is DC to 50kHz, which can cover the acquisition requirements of a wide range of frequency signals.
[0010] Preferably, the physical layer synchronization unit is a master clock source based on an OCXO constant temperature crystal oscillator; The protocol layer synchronization unit realizes the hardware-level timestamp marking of the IEEE 1588PTP protocol through an FPGA; The application layer synchronization unit adopts a TDMA data frame structure with time stamp compensation.
[0011] Preferably, the FPGA of the distributed processing unit is responsible for data synchronization and timing control, and the embedded processor of the distributed processing unit executes data analysis.
[0012] Preferably, the signal conditioning unit further includes an FPGA capable of implementing a digital baseline correction algorithm. The digital baseline correction algorithm collects and analyzes the baseline drift of the signal in real time, and uses adaptive filtering technology for dynamic compensation, thereby ensuring the accuracy and stability of the signal in an interference environment.
[0013] Preferably, the communication interface module includes a wired interface and a wireless interface.
[0014] Preferably, the multi-dimensional sensor array module further includes an acoustic emission sensor.
[0015] The beneficial effects of the present invention are as follows: First, the data acquisition is comprehensive and accurate. With the collaborative effect of multiple sensors, the monitoring accuracy of the tool state is significantly improved, and potential problems affecting the machining quality can be detected in a timely manner. Second, high-precision synchronous sampling and low-latency response. The application of the unified clock synchronization technology and high-precision ADC makes the time error between multi-source signals less than 0.1 ms, thereby ensuring real-time data transmission and consistency in a high-speed machining environment. Third, modular hardware integration, easy installation and debugging. The standardized and distributed module design is adopted, which is convenient for on-site installation, maintenance and upgrade. At the same time, it can adapt to the monitoring requirements of different types of machine tool tools and has high versatility. Fourth, the system has strong anti-interference ability. The signal conditioning unit adopts a low-noise design and adaptive filtering technology, effectively improving the signal quality, reducing the environmental interference and the risk of misjudgment, and thus improving the stability and reliability of the monitoring system. Description of the Drawings
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only exemplary, and for those of ordinary skill in the art, without creative efforts, other implementation drawings can also be obtained according to the provided drawings.
[0017] Figure 1 It is the overall architecture diagram of a multi-dimensional coupled perception acquisition system of the present invention. Detailed Embodiments
[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.
[0019] First, the concepts involved in the present application will be described in conjunction with the accompanying drawings. It should be noted here that the descriptions of the following concepts are only for making the content of the present application easier to understand and do not represent a limitation on the protection scope of the present application; at the same time, without conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in conjunction with the embodiments.
[0020] As Figure 1 shown, the present invention provides an embodiment of a multi-dimensional coupled perception acquisition system, including a multi-dimensional sensor array module having a force perception layer, a vibration perception layer, a thermal-mechanical coupling layer, and a process parameter layer. The multi-dimensional sensor array module further includes an acoustic emission sensor, and the multi-dimensional sensor array module is used to collect the operating state signals of a machine tool cutter.
[0021] The force perception layer of the multi-dimensional sensor array module is composed of a composite installation of a piezoelectric cutting force sensor and a strain gauge to form a high-precision cutting force detection unit with a measuring range of 0 - 5 kN, which can monitor the force on the cutter in real time in a real cutting environment, so as to provide accurate wear assessment data; the vibration perception layer includes a triaxial MEMS accelerometer and a piezoelectric ceramic sensor arranged in parallel, and the measuring range of the triaxial MEMS accelerometer is ±50 g; the thermal-mechanical coupling layer includes a micro infrared temperature measurement module and a contact thermocouple arranged in a coordinated layout, and the temperature measurement range of the micro infrared temperature measurement module is 50 - 600 °C; the process parameter layer directly couples the real-time data of the rotational speed, feed rate, and cutting depth of the machine tool control system through the EtherCAT bus. By deploying various sensors such as cutting force sensors, vibration sensors, temperature sensors, acoustic emission sensors, and processing process parameter acquisition elements such as feed speed, rotational speed, and cutting depth, the diversity and complementarity of the collected signals are ensured, and a complete multi-dimensional data acquisition system is formed to make up for the deficiencies of single-sensor monitoring.
[0022] In addition to traditional resistive and piezoelectric sensors, fiber optic sensors, MEMS sensors, etc. are used as data acquisition elements, and these sensors have different advantages in terms of volume, accuracy, and resistance to environmental interference.
[0023] The signal conditioning unit includes an adaptive impedance matching circuit, a low-noise amplifier, and an 8th-order Butterworth anti-aliasing filter. The signal conditioning unit is used to preprocess the signals collected by the multi-dimensional sensor array module, and can be adaptively adjusted according to the sensor conditions to ensure high anti-interference and excellent frequency response characteristics during signal transmission. The impedance coverage range of the adaptive impedance matching circuit is from 10Ω to 10kΩ. The signal conditioning unit also includes an FPGA that can implement a digital baseline correction algorithm. The digital baseline correction algorithm dynamically compensates by real-time collecting and analyzing the baseline drift of the signal using adaptive filtering technology, thereby ensuring the accuracy and stability of the signal in an interference environment. The digital baseline correction algorithm implemented by the FPGA ensures that the collected signal still maintains high accuracy in a strong interference environment. The analog signals output by each sensor are preprocessed by the signal conditioning unit through amplification, filtering, and conversion, effectively improving the signal quality, reducing the environmental interference and the risk of misjudgment, and thus improving the stability and reliability of the monitoring system.
[0024] Low-noise amplifiers and high-speed ADC chips from different manufacturers or of different models can be used, or an integrated data acquisition card can be used to replace the discrete circuit design to achieve the same effect of synchronous acquisition and signal preprocessing.
[0025] The data synchronous sampling unit includes a data acquisition module and a data synchronization module, where:
[0026] The data acquisition module uses a 24-bit high-precision ADC to perform high-speed and multi-channel digital sampling on the analog signals preprocessed by the signal conditioning unit. The working bandwidth range of the data acquisition module is from DC to 50kHz (accuracy ±0.1dB), which can cover the acquisition requirements of a wide range of frequency signals. The 8-channel synchronous error ≤50μs, and the dynamic delay compensation response time <200ns. The spatio-temporal consistency of multi-source data is guaranteed through hardware-level synchronous acquisition. The specific registration method is to use the FPGA to implement the timestamp marking of the signal, and dynamically adjust the sampling timing in multi-channel data synchronization through an improved digital signal processing algorithm, thereby effectively reducing the time delay between different sensor signals and providing standardized data input for the subsequent analysis.
[0027] Multi-dimensional acquisition ensures the complementarity of data between sensors, can more comprehensively and accurately reflect the state of the tool under complex working conditions, improves the monitoring robustness, realizes the synchronous acquisition of all sensor channel data, ensures the consistency of the data acquisition timing, and significantly improves the monitoring accuracy.
[0028] The data synchronization module includes a physical layer synchronization unit, a protocol layer synchronization unit, and an application layer synchronization unit.
[0029] The physical layer synchronization unit is the main clock source based on an OCXO (precision ±0.1ppm); the protocol layer synchronization unit implements hardware-level timestamp marking of the IEEE 1588 PTP protocol through an FPGA; the application layer synchronization unit adopts a TDMA (Time Division Multiple Access) data frame structure with timestamp compensation, enabling extremely small time errors between signal acquisitions during digital sampling by a 24-bit high-precision ADC, usually less than 0.1ms, ensuring the real-time and consistency of data acquisition, and being applicable to high-speed machining environments.
[0030] The communication interface module is used to transmit the data collected by the data acquisition module to the monitoring terminal or control system. The monitoring terminal or control system receives the real-time monitoring data to achieve intuitive monitoring and alarm display of the tool state. The communication interface module includes a wired interface and a wireless interface, supporting wired or wireless transmission protocols, including Wi-Fi, Bluetooth, and 5G.
[0031] The modular hardware platform includes a distributed processing unit and a standardized interface. The FPGA of the distributed processing unit is responsible for high-speed data synchronization and timing control to decouple data acquisition and preprocessing tasks. The embedded processor of the distributed processing unit performs data analysis to achieve an efficient collaborative working mode with deep integration of hardware and software.
[0032] The multi-dimensional sensor array module, signal conditioning unit, data acquisition module, and communication interface module interconnected through standardized interfaces are not only convenient for on-site installation and debugging but also for future function expansion and replacement and upgrade. They adopt a compact design layout, effectively reducing volume and wiring complexity, while being able to adapt to different types of machine tool tool monitoring requirements and being suitable for installation and application on actual machine tools.
[0033] In practical applications, the acquisition system also includes a power management unit, a power supply module, and an environmental compensation unit. The power management module includes an isolation converter and a backup power supply, responsible for managing power distribution and conversion to ensure stable power supply for each module; the power supply module provides the original power for the power management unit, which is then distributed to other modules through the power management module; the environmental compensation unit compensates for environmental factors (such as temperature, humidity, and air pressure) to improve the measurement accuracy of the sensor.
[0034] In addition, the overall hardware architecture in the present invention adopts a modular hardware platform design, including:
[0035] Distributed structure: To achieve the decoupling of data acquisition and preprocessing tasks, this system adopts a distributed processing unit. Among them, the FPGA is responsible for high-speed data synchronization and timing control, while the embedded processor performs subsequent data analysis, realizing an efficient collaborative working mode with deep integration of hardware and software;
[0036] Encapsulation modularization: Using the standardized and modular design concept, each subsystem (sensor array, signal conditioning, data acquisition, communication, and power management) is interconnected through a unified interface, which is convenient for on-site installation and debugging, and also facilitates future function expansion, replacement, and upgrade. Adopting a compact design layout effectively reduces the volume and wiring complexity, and is suitable for actual machine tool installation applications.
[0037] The system works as follows:
[0038] S1. After the machine tool starts, the multi-dimensional sensor array module senses the signals of each dimension in real time;
[0039] S2. The signal conditioning unit performs preprocessing such as amplification and filtering;
[0040] S3. The data acquisition module synchronously acquires the digital signals of each channel;
[0041] S4. The data synchronization module corrects the sampling timings of each channel and transmits the data to the communication interface uniformly;
[0042] S5. The communication interface transmits the data to the monitoring terminal for real-time display and reference for monitoring and analysis.
[0043] In this article, specific examples are used to elaborate on the principle and implementation manner of this application. The description of the above embodiments is only used to help understand the method and its core idea of this application. The above is only the preferred implementation manner of this application. It should be noted that due to the limited nature of language expression and the objectively infinite specific structures, for those of ordinary skill in the art in this technical field, without departing from the principle of this application, several improvements, refinements, or changes can be made, or the above technical features can be combined in an appropriate manner; these improvements, refinements, changes, or combinations, or directly applying the concept and technical solution of the invention to other occasions without improvement, should all be regarded as the protection scope of this application.
Claims
1. A multi-dimensional coupled perception acquisition system, characterized in that: It includes a multi-dimensional sensor array module with a force sensing layer, a vibration sensing layer, a thermal-mechanical coupling layer, and a process parameter layer. The multi-dimensional sensor array module is used to collect the operating state signals of the machine tool cutter; it also includes: A signal conditioning unit, including an adaptive impedance matching circuit, a low-noise amplifier, and an 8th-order Butterworth anti-aliasing filter. The signal conditioning unit is used to preprocess the signals collected by the multi-dimensional sensor array module; A data synchronous sampling unit, including a data acquisition module and a data synchronization module. The data acquisition module uses a 24-bit ADC to perform high-speed and multi-channel digital sampling on the analog signals preprocessed by the signal conditioning unit; the data synchronization module includes a physical layer synchronization unit, a protocol layer synchronization unit, and an application layer synchronization unit, and ensures the data synchronization of the 24-bit ADC digital sampling through multiple synchronization units; A communication interface module, which is used to transmit the data collected by the data acquisition module to the monitoring terminal or the control system.
2. The multi-dimensional coupled perception acquisition system according to claim 1, wherein: The force sensing layer of the multi-dimensional sensor array module includes a cutting force detection unit composed of a piezoelectric cutting force sensor and a strain gauge composite installation; The vibration sensing layer includes a three-axis MEMS accelerometer and a piezoelectric ceramic sensor arranged in parallel; The thermal-mechanical coupling layer includes a micro infrared temperature measurement module and a contact thermocouple arranged in a coordinated manner; The process parameter layer directly couples the real-time data of the rotational speed, feed rate, and cutting depth of the machine tool control system through the EtherCAT bus.
3. A multi-dimensional coupled perception acquisition system according to claim 1, characterized in that: The impedance coverage range of the adaptive impedance matching circuit is from 10Ω to 10kΩ.
4. A multi-dimensional coupled perception acquisition system according to claim 1, characterized in that: The working bandwidth range of the data acquisition module is from DC to 50kHz, which can cover the acquisition requirements of a wide range of frequency signals.
5. The multi-dimensional coupled perception acquisition system according to claim 1, characterized in that: The physical layer synchronization unit is a master clock source based on an OCXO constant temperature crystal oscillator; The protocol layer synchronization unit realizes the hardware-level timestamp marking of the IEEE 1588PTP protocol through an FPGA; The application layer synchronization unit adopts a TDMA data frame structure with time stamp compensation.
6. A multi-dimensional coupled sensing and acquisition system according to claim 1, characterized in that: The signal conditioning unit also includes an FPGA that can implement a digital baseline correction algorithm. The digital baseline correction algorithm collects and analyzes the baseline drift of the signal in real time, and uses adaptive filtering technology for dynamic compensation, so as to ensure the accuracy and stability of the signal in an interference environment.
7. A multi-dimensional coupled sensing and acquisition system according to claim 1, characterized in that: The communication interface module includes a wired interface and a wireless interface.
8. The multi-dimensional coupled perception acquisition system according to claim 1, wherein: The multi-dimensional sensor array module also includes an acoustic emission sensor.