Application formula of cumyl hydroperoxide in preparation of delayed curing adhesive

Abstract

The invention relates to an application formula of cumyl hydroperoxide in preparation of a delayed curing adhesive, and belongs to the technical field of electronic industry assembly, the application formula comprises an original formula and cumyl hydroperoxide added in the original formula, and the original formula comprises the following components in parts by weight: 55-70 parts of epoxy resin, 1-3 parts of a curing agent, 1-3 parts of a curing agent and 1-3 parts of a curing agent. The component A comprises 20 to 50 parts of polyol, 1 to 2 parts of a photoinitiator, 0.05 to 0.1 part of a photosensitizer, 2 to 3 parts of a thixotropic agent and 0.1 to 0.5 part of a defoaming agent; the adhesive combines the advantages of photocuring and thermocuring process properties, is a single-component product, can be stored and used for a long time at room temperature under the dark condition, is different from a traditional thermocuring single-component adhesive, and is started in reaction but not immediately polymerized and cured after light irradiation, so that the adhesive has the advantages of low cost and high efficiency. A certain operable time is reserved for a user to carry out an operation step of bonding and assembling, and cumyl hydroperoxide is added, so that the retardancy of the glue after illumination is improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of electronic industry assembly, and specifically relates to an application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives. Background Art

[0002] Electronic industry assembly refers to the assembly process of parts completed by combination during the production process. Currently, the adhesive products used in electronic industry assembly are classified according to the curing method into: photo-curing adhesives, heat-curing adhesives, moisture reaction adhesives, moisture-curing adhesives, photo-curing + heat-curing dual-curing adhesives, photo-curing + moisture-curing dual-curing adhesives, etc.

[0003] Among them, the formula composition of the adhesive is basically epoxy resin, acrylic resin, polyurethane resin, silicone resin, amine curing agent, anhydride curing agent, free radical photoinitiator, free radical thermal initiator, filler, pigment, and various silane auxiliaries, etc.

[0004] However, traditional photo-curing adhesives require the adherends to be exposed to light irradiation to initiate the polymerization reaction of the adhesive. If applied under opaque or poorly light-transmitting materials, the light cannot reach the colloid, resulting in non-curing. Moreover, after light irradiation, it will immediately polymerize and cure, leaving very little time for users to bond and assemble. For heat-curing adhesives, the pot life is limited and they cannot be stored and used at room temperature for a long time. In view of this, the present application proposes an application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives. Summary of the Invention

[0005] The purpose of the present invention is to provide an application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives to solve the problems of limitations in use, short shelf life, and extremely short delayed-curing time of adhesives in the prior art.

[0006] The present invention achieves the above purpose through the following technical solutions:

[0007] An application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives, characterized by comprising: an original formula, and cumene hydroperoxide added to the original formula; the original formula comprises the following components in parts by weight: 55 - 70 parts of epoxy resin, 20 - 50 parts of polyol, 1 - 2 parts of photoinitiator, 0.05 - 0.1 part of photosensitizer, 2 - 3 parts of thixotropic agent, 0.1 - 0.5 part of defoaming agent, and the weight component of cumene hydroperoxide is 0.5 - 2 parts.

[0008] As a further optimized solution of the present invention, the photosensitizer is fluorescent powder, and the photoinitiator is hexafluorophosphate.

[0009] As a further optimization solution of the present invention, the thixotropic agent is fumed silica or high-performance amide wax fine powder.

[0010] As a further optimization solution of the present invention, the defoaming agent is ethylene glycol siloxane.

[0011] As a further optimization solution of the present invention, the epoxy resin is at least two of aliphatic epoxy resin, bisphenol A epoxy resin, modified epoxy resin and vinyl ester epoxy resin, and the polyol is polyester polyol or polyether polyol.

[0012] As a further optimization solution of the present invention, the modified epoxy resin is modified cyclopentadiene epoxy resin or modified hydrogenated polybutadiene epoxy resin.

[0013] As a further optimization solution of the present invention, the polyester polyol is at least two of polyethylene glycol phthalate glycol, diethylene glycol adipate glycol, 2-methyl-1,8-octanediol-1,9-nonanediol adipate glycol, 3-methyl-1,5-pentanediol adipate glycol, 1,6-hexanediol carbonate glycol, 1,4-butanediol polycaprolactone glycol.

[0014] As a further optimization solution of the present invention, the polyether polyol is polypropylene glycol, trihydroxy polyoxypropylene ether or polyphenylene glycol.

[0015] The beneficial effects of the present invention are as follows:

[0016] 1. The present invention combines the process performance advantages of photocuring and thermosetting. It is a one-component product, without the need for subsequent mixing during use, and can be stored and used at room temperature for a long time in the dark. Different from traditional thermosetting one-component adhesives, after light irradiation, the reaction starts, but the polymerization curing will not be completed immediately, leaving a certain operation time for users to perform the bonding and assembly operation steps. When the transparency is not good, auxiliary heating can be used for fixation, solving the problem that non-transparent materials cannot use photocuring adhesives for bonding.

[0017] 2. By adding cumene hydroperoxide, the present invention not only increases the delay after glue irradiation, but also can improve the final curing degree of the glue by increasing the room temperature or heating. For example, those without cumene hydroperoxide need to be heated to cure, while those with cumene hydroperoxide can cure at room temperature after photoactivation, which saves more energy. Specific Embodiments

[0018] The present invention will be further described in detail below in combination with specific implementation cases. It is necessary to point out here that the following specific implementation manners are only used for further illustration of the present application and should not be construed as limiting the protection scope of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application according to the above application content.

[0019] Example 1

[0020] The raw material composition is shown in Table 1;

[0021] Table 1

[0022]

[0023] Its preparation process is as follows:

[0024] S1: Mix the aliphatic epoxy resin and the photosensitizer, heat them in an oil bath to 90 °C, and stir at 200 rpm until evenly mixed;

[0025] S2: Mix the raw materials obtained from the first step with the remaining raw materials such as cumene hydroperoxide, and stir evenly with a high-speed disperser;

[0026] S3: Use a vacuum degassing device to extract the air mixed in the raw material system obtained after stirring evenly;

[0027] S4: Sub-pack into specified containers and store them sealed.

[0028] Example 2

[0029] The raw material composition is shown in Table 2;

[0030] Table 2

[0031]

[0032] Its preparation process is as follows:

[0033] S1: Mix the polyether polyol and the photosensitizer, heat them in an oil bath to 80 °C, and stir at 200 rpm until evenly mixed;

[0034] S2: Mix the raw materials obtained from the first step with the remaining raw materials such as cumene hydroperoxide, and stir evenly with a high-speed disperser;

[0035] S3: Use a vacuum degassing device to extract the air mixed in the raw material system obtained after stirring evenly;

[0036] S4: Sub-pack into specified containers and store them sealed.

[0037] Example 3

[0038] The raw material composition is shown in Table 3;

[0039] Table 3

[0040]

[0041]

[0042] The preparation process is as follows:

[0043] S1: Mix polyether polyol and photosensitizer and heat them in an oil bath to 80°C, and stir at 200 rpm until evenly mixed;

[0044] S2: Mix the raw materials mixed in the first step with the remaining raw materials such as cumene hydroperoxide, and stir evenly with a high-speed disperser;

[0045] S3: Use a vacuum degassing device to extract the air mixed in the raw material system obtained after stirring evenly;

[0046] S4: Sub-pack into designated containers and store them sealed.

[0047] After testing, the technical performance indicators and experimental results of the present invention are as shown in Table 4 below:

[0048] Table 4

[0049]

[0050]

[0051] The test shows that: the original formula without cumene hydroperoxide needs to be heated to cure, while the adhesive with cumene hydroperoxide can cure at room temperature after photoactivation, and can be completely cured at room temperature for 24 hours. Moreover, the curing speed is faster when cured at 80°C. The adhesive without cumene hydroperoxide cures very slowly at room temperature, only slightly skins after 24 hours, and can only be completely cured by heating. Therefore, the curing time can be selected according to requirements. By adding cumene hydroperoxide, both the delay after light irradiation of the glue is increased, and the final curing degree of the glue can be improved by increasing the room temperature or heating. Compared with directly heating the glue with a heat source for curing, it saves more energy.

[0052] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation to the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention.

Claims

1. An application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives, characterized in that, Comprising: The original formulation, and cumene hydroperoxide added to the original formulation; The original formulation comprises the following components in parts by weight: 55 - 70 parts of epoxy resin, 20 - 50 parts of polyol, 1 - 2 parts of photoinitiator, 0.05 - 0.1 part of photosensitizer, 2 - 3 parts of thixotropic agent, 0.1 - 0.5 part of defoamer, and the weight component of the cumene hydroperoxide is 0.5 - 2 parts.

2. The application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives according to claim 1, characterized in that: The photosensitizer is a phosphor powder, and the photoinitiator is hexafluorophosphate.

3. The application formula of cumene hydroperoxide in the preparation of delayed curing adhesives according to claim 1, characterized in that: The thixotropic agent is fumed silica or high-performance amide wax micropowder.

4. The application formula of cumene hydroperoxide in the preparation of delayed curing adhesives according to claim 1, characterized in that: The defoamer is ethylene glycol siloxane.

5. The application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives according to claim 1, characterized in that: The epoxy resin is at least two of aliphatic epoxy resin, bisphenol A epoxy resin, modified epoxy resin and vinyl ester epoxy resin, and the polyol is polyester polyol or polyether polyol.

6. The application formula of cumene hydroperoxide in the preparation of delayed curing adhesives according to claim 5, characterized in that: The modified epoxy resin is modified cyclopentadiene epoxy resin or modified hydrogenated polybutadiene epoxy resin.

7. The application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives according to claim 5, wherein: The polyester polyol is at least two of polyethylene glycol phthalate glycol, diethylene glycol adipate glycol, 2-methyl-1,8-octanediol-1,9-nonanediol adipate glycol, 3-methyl-1,5-pentanediol adipate glycol, 1,6-hexanediol polycarbonate glycol, 1,4-butanediol polycaprolactone glycol.

8. The application formula of cumene hydroperoxide in the preparation of delayed-curing adhesives according to claim 5, characterized in that: The polyether polyol is polypropylene glycol, trihydroxy polypropylene oxide ether or polyphenylene glycol.

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