Display panel and display device

Abstract

The invention discloses a display panel and a display device, which are characterized in that a block-up part is arranged in a binding area of a driving chip, and the block-up part can compensate the segment difference of different positions of a binding bonding pad; for example, the thickness of the display panel corresponding to the overlapping area of the binding bonding pad and the fan-out line is the same as the thickness of the display panel corresponding to the non-overlapping area of the binding bonding pad and the fan-out line, so that the height of each position of the binding bonding pad has no segment difference; and all positions of the binding pad are uniformly stressed, so that the binding effect is improved, and the product yield of the display panel is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] The driver chip is used to provide various driving signals required for the normal operation of the display panel and is one of the important components of the display device. The driver chip is usually installed on the display panel in a chip on glass (COG) manner. Specifically, the driver chip includes multiple input terminals and multiple output terminals, and the display panel includes multiple input binding pads and multiple output binding pads. The input binding pads are electrically connected to the input terminals in a one-to-one correspondence, and the output binding pads are electrically connected to the output terminals in a one-to-one correspondence. However, when the driver chip is bound to the display panel, due to the height difference in different positions of the area where the binding pads on the display panel are located, the binding pads will be unevenly stressed during binding, which seriously affects the product yield of the display panel. Summary of the Invention

[0003] The embodiments of the present invention provide a display panel and a display device for solving the problem of uneven force on the binding pads during binding. The specific solution is as follows:

[0004] An embodiment of the present invention provides a display panel, comprising a base substrate, the base substrate including a display area and a non-display area, the non-display area including a fan-out area located on one side of the display area and a driver chip binding area located on a side of the fan-out area away from the display area; the fan-out area including a plurality of fan-out lines, the driver chip binding area including a plurality of binding pads, the fan-out lines extending to the driver chip binding area and electrically connected to corresponding binding pads;

[0005] The plurality of fan-out lines are located between the base substrate and the binding pads, and the orthographic projections of the fan-out lines on the base substrate overlap with the orthographic projections of the binding pads on the base substrate;

[0006] The driver chip binding area further includes a raised portion located between the base substrate and the binding pad, and an orthographic projection of the raised portion on the base substrate at least partially overlaps with an orthographic projection of the binding pad on the base substrate.

[0007] Optionally, in the above-mentioned display panel provided by an embodiment of the present invention, the non-display area includes two metal layers located between the base substrate and the binding pad, and each of the metal layers is provided with the fan-out line and the padding portion.

[0008] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, the display area includes a light-shielding metal layer, a gate metal layer and a source-drain metal layer stacked in sequence on the base substrate, one of the metal layers is the same metal layer as the light-shielding metal layer, the other metal layer is the same metal layer as the gate metal layer, and the binding pad includes a first conductive part arranged in the same layer as the source-drain metal layer.

[0009] Optionally, in the display panel provided by an embodiment of the present invention, a direction from the display area to the binding area is a first direction, and a direction intersecting the first direction is a second direction;

[0010] The fan-out line of each metal layer includes a first line extending along the second direction and a second line extending along the first direction, an end of the second line facing away from the first line is electrically connected to the binding pad, at least part of the binding pad overlaps with a plurality of first lines arranged sequentially along the first direction, and an orthographic projection of at least part of the first line of one metal layer and at least part of the first line of another metal layer on the substrate overlaps with each other;

[0011] A plurality of raised portions arranged at intervals along the first direction are provided between adjacent second routing lines of each metal layer, and the orthographic projections of the raised portions and the fan-out lines located in the same metal layer on the base substrate do not overlap, and the orthographic projection of at least part of the raised portions of one of the metal layers on the base substrate overlaps with the orthographic projection of the fan-out lines located in another metal layer on the base substrate.

[0012] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, among the multiple first routing lines arranged in sequence along the first direction, the nth first routing line is close to the display area, and the n+1th first routing line is far away from the display area. Among the elevated portions between the second routing line corresponding to the nth first routing line and the second routing line corresponding to the n+1th first routing line, the elevated portion closest to the n+1th first routing line is aligned with the nth first routing line along the second direction, and n is an integer greater than or equal to 1.

[0013] Optionally, in the above display panel provided by an embodiment of the present invention, the width of the second wiring is greater than the width of the first wiring.

[0014] Optionally, in the display panel provided in an embodiment of the present invention, at least part of the raised portion has an orthographic projection on the base substrate covering an orthographic projection of one of the binding pads on the base substrate, and at least part of the raised portion extends to the outside of the binding pad.

[0015] Optionally, in the display panel provided in the embodiment of the present invention, at least a portion of the raised portion has an orthographic projection on the base substrate that covers the orthographic projections of the plurality of binding pads on the base substrate, and at least a portion of the raised portion extends to the outside of the plurality of binding pads. Optionally, in the display panel provided in the embodiment of the present invention, some of the fan-out lines are electrically connected to the binding pads by passing through one side of the driver chip binding area, and another portion of the fan-out lines are electrically connected to the binding pads by passing through at least one other side of the driver chip binding area.

[0016] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, along the arrangement direction of the binding pads, the multiple binding pads include a first area and a second area, part of the fan-out lines pass through the first side of the driver chip binding area and are electrically connected to the binding pads of the first area, and part of the fan-out lines pass through the second side of the driver chip binding area and are electrically connected to the binding pads of the second area, the second side is close to the fan-out area, and the first side and the second side are arranged opposite to each other.

[0017] Optionally, in the above-mentioned display panel provided in an embodiment of the present invention, the multiple binding pads also include a third area located on the side of the second area away from the first area, and some of the fan-out lines are electrically connected to the binding pads of the third area through the third side of the driver chip binding area, and the third side is arranged adjacent to the second side.

[0018] Optionally, in the above display panel provided by an embodiment of the present invention, the plurality of binding pads further include a fourth area located on a side of the third area away from the first area, and some of the fan-out lines are electrically connected to the binding pads of the fourth area through the first side.

[0019] Optionally, in the above display panel provided by an embodiment of the present invention, the fan-out line corresponding to the fourth area in the same metal layer is located on a side of the fan-out line corresponding to the first area away from the display area.

[0020] Correspondingly, an embodiment of the present invention further provides a display device, comprising the above-mentioned display panel provided by an embodiment of the present invention.

[0021] The beneficial effects of the embodiments of the present invention are as follows:

[0022] A display panel and a display device provided by an embodiment of the present invention provide a raised portion in the binding area of ​​a driver chip. The raised portion can compensate for the step difference at different positions of the binding pad. For example, the thickness of the display panel in the first overlapping area of ​​the binding pad and the fan-out line is made the same as the thickness of the display panel corresponding to the non-overlapping area of ​​the binding pad and the fan-out line. In this way, there is no step difference in the height of the binding pad at each position. Therefore, when the terminal of the driver chip is bound to the binding pad in the binding area of ​​the driver chip, the force at each position of the binding pad is uniform, thereby improving the binding effect and thus improving the product yield of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 A schematic top view of a display panel provided by an embodiment of the present invention;

[0024] Figure 2 for Figure 1 A local enlarged schematic diagram in FIG.

[0025] Figure 3 for Figure 2 A local enlarged schematic diagram in FIG;

[0026] Figure 4 for Figure 2 Another partially enlarged schematic diagram in FIG.

[0027] Figure 5 for Figure 3 and Figure 4 Schematic diagram of the local cross-section structure;

[0028] Figure 6 A schematic structural diagram of a display device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. And in the absence of conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] Unless otherwise defined, the technical or scientific terms used in the present invention shall have the usual meanings understood by persons of ordinary skill in the field to which the present invention belongs. The words “include” or “comprise” and the like used in the present invention mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as “connect” or “connected” and the like are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. “Inside”, “outside”, “upper”, “lower”, etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0031] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0032] The present disclosure describes exemplary embodiments with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0033] The technical direction of mobile phones on the market is mainly narrow-border full-screen, high refresh rate, high brightness, etc. In order to further reduce the bottom frame of the display panel, a design scheme for routing under the IC Pin (binding pad) has been proposed. That is, part of the routing that originally led out from the upper side of the driver chip binding area (the side close to the display area) to the fan-out area is replaced by routing from the side of the driver chip binding area (the two sides adjacent to the upper side of the driver chip binding area) to the fan-out area. This design scheme can reduce the number of routing lines in the fan-out area, thereby reducing the bottom frame. However, due to the presence of routing positions and non-routing positions under the Pin, there is a height difference between the routing positions and non-routing positions, which makes the binding pad unevenly stressed when the IC is bound to the Pin in the driver chip binding area, seriously affecting the yield rate of narrow-border products with routing designs under the Pin.

[0034] In view of this, in order to solve the problem of uneven force on the binding pads when the IC and the driver chip are bound to the pins in the binding area due to the height difference between the wiring position under the pin and the non-wiring position, an embodiment of the present invention provides a display panel, such as Figure 1-Figure 5As shown, Figure 1 A schematic top view of a display panel provided by an embodiment of the present invention is shown. Figure 2 for Figure 1 The enlarged schematic diagram in the dotted box E, Figure 3 for Figure 2 A partial enlarged schematic diagram of the driver chip bonding area. Figure 4 for Figure 2 Another partial enlarged schematic diagram of the middle driver chip binding area, Figure 5 for Figure 3 and Figure 4 The partial cross-sectional structural diagram in FIG. 1 shows a display panel including a base substrate 10, the base substrate 10 including a display area AA and a non-display area BB, the non-display area BB including a fan-out area B1 located on one side of the display area AA and a driver chip binding area B2 located on a side of the fan-out area B1 away from the display area AA; the fan-out area B1 includes a plurality of fan-out lines 20, the driver chip binding area B2 includes a plurality of binding pads 30, and the fan-out lines 20 extend to the driver chip binding area B2 and are electrically connected to the corresponding binding pads 30;

[0035] A plurality of fan-out lines 20 are located between the base substrate 10 and the bonding pads 30 , and the orthographic projections of the fan-out lines 20 on the base substrate 10 overlap with the orthographic projections of the bonding pads 30 on the base substrate 10 ;

[0036] The driver chip bonding area B2 further includes a raised portion 40 located between the base substrate 10 and the bonding pad 30 . The orthographic projection of the raised portion 40 on the base substrate 10 at least partially overlaps with the orthographic projection of the bonding pad 30 on the base substrate 10 .

[0037] The above-mentioned display panel provided by an embodiment of the present invention, by setting a raised portion in the binding area of ​​the driver chip, the raised portion can compensate for the step difference of different positions of the binding pad, for example, making the thickness of the display panel corresponding to the overlapping area of ​​the binding pad and the fan-out line the same as the thickness of the display panel corresponding to the non-overlapping area of ​​the binding pad and the fan-out line. In this way, there is no step difference in the height of the binding pad at each position, so that when the terminal of the driver chip is bound to the binding pad of the binding area of ​​the driver chip, the force at each position of the binding pad is uniform, avoiding damage to the binding pad, improving the binding effect, and thus improving the product yield of the display panel.

[0038] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1-Figure 5As shown, the display area AA includes a light-shielding metal layer (LS), a gate metal layer (Gate), a source-drain metal layer (SD) and a transparent electrode layer (ITO) stacked in sequence on the base substrate 10. The light-shielding metal layer (LS) generally includes a light-shielding structure for shielding the active layer of the display area AA and is used to transmit electrical signals. The gate metal layer (Gate) generally includes structures such as a gate and a gate line. The source-drain metal layer (SD) generally includes a source and drain electrode, a data line, a power line, etc. The transparent electrode layer (ITO) can be a common electrode layer or a pixel electrode layer. The binding pad 30 generally includes a first conductive portion 31 arranged on the same layer as the source-drain metal layer (SD).

[0039] In some embodiments, as Figure 5 As shown, in order to protect the first conductive part 31 located in the source-drain metal layer (SD) and improve the binding performance, the binding pad 30 generally also includes a second conductive part (not shown) arranged in the same layer as the transparent electrode layer (ITO), that is, the second conductive part is located on the side of the first conductive part 31 away from the base substrate 10, and the first conductive part 31 is electrically connected to the second conductive part.

[0040] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5 As shown, the non-display area BB includes two metal layers located between the base substrate 10 and the binding pad 30, such as a first metal layer M1 and a second metal layer M2. The first metal layer M1 and the second metal layer M2 are both provided with fan-out lines 20 and a pad 40, that is, the fan-out lines 20 of the fan-out area B1 generally use at least two layers of metal routing, which can reduce the wiring space for large-size display panels and is conducive to achieving a narrow frame.

[0041] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5 As shown, the first metal layer M1 can be the same metal layer as the light-shielding metal layer (LS), and the second metal layer M2 can be the same metal layer as the gate metal layer (Gate). In this way, a film structure in which the display area AA and the non-display area BB are located on the same metal layer can be produced using a single patterning process, thereby simplifying the production process and reducing costs.

[0042] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1-Figure 5 As shown, Figure 3 Schematic diagram of a plan view of the film layer where the bonding pads 30 of the driver chip bonding area B2 are located and the light shielding metal layer (LS) thereunder. Figure 4 Schematic diagram of the planar structure of the film layer where the bonding pad 30 of the driver chip bonding area B2 is located and the gate metal layer (Gate) thereunder. Figure 5 for Figure 3 and Figure 4A schematic cross-sectional view of the three layers corresponding to the bonding pad 30, the gate metal layer (Gate) and the light shielding metal layer (LS);

[0043] The direction from the display area AA to the binding area B2 is the first direction X, and the direction intersecting the first direction X is the second direction Y; optionally, the first direction X and the second direction Y may be perpendicular to each other;

[0044] The fan-out lines 20 of each metal layer (M1 and M2) include a first trace 21 extending along the second direction Y and a second trace 22 extending along the first direction X. The end of the second trace 22 facing away from the first trace 21 is electrically connected to the binding pad 30. At least part of the binding pad 30 overlaps with the multiple first traces 21 arranged in sequence along the first direction X. The orthographic projections of at least part of the first trace 21 of one metal layer (for example, M1) and at least part of the first trace 21 of another metal layer (for example, M2) on the substrate 10 overlap with each other. In this way, the first traces 21 of the two metal layers are routed in an orthographically overlapping manner, which can further save wiring space.

[0045] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5 As shown, a plurality of raised portions 40 are provided between adjacent second traces 22 of each metal layer, spaced apart along the first direction X. The orthographic projections of the raised portions 40 and the fan-out lines 20 on the same metal layer on the substrate 10 do not overlap. The orthographic projections of at least part of the raised portions 40 of one metal layer (e.g., M1) on the substrate 10 overlap with the orthographic projections of the fan-out lines 20 on another metal layer (e.g., M2) on the substrate 10. In this way, the raised portions 40 can increase the thickness of the area where the fan-out lines 20 are provided only on one metal layer, allowing the fan-out lines 20 to be provided on both metal layers below the bonding pads 30, thereby improving the uniformity of the thickness of each location of the bonding pads 30.

[0046] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3 and Figure 4 As shown, among the plurality of first wirings 21 sequentially arranged along the first direction X, the nth first wiring 21 is close to the display area AA (eg Figure 3 and Figure 4 1), the n+1th first wiring 21 is away from the display area AA (for example Figure 3 and Figure 42 ), among the elevated portions 40 between the second route 22 corresponding to the nth first route 21 and the second route 22 corresponding to the n+1th first route 21, the elevated portion 40 closest to the n+1th first route 21 (the bottom elevated portion 40 in the dashed boxes D and F) is aligned with the nth first route 21 along the second direction Y, where n is an integer greater than or equal to 1. In this way, the elevated portion 40 and the first route 21 are equivalent to the same route extending along the second direction Y, except that the elevated portion 40 is disconnected from the first route 21. That is, the first route 21 continues to extend along the first direction X at the location where it is disconnected from the elevated portion 40 to form the second route 22.

[0047] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3 and Figure 4 As shown, the arrangement density of the raised portions 40 along the first direction X between the second trace 22 corresponding to the nth first trace 21 and the second trace 22 corresponding to the (n+1)th first trace 21 can be the same as the arrangement density of the first traces 21 along the first direction X. This ensures uniform wiring of the entire driver chip binding area B2, ensuring no height difference in thickness at various locations of the entire driver chip binding area B2, and ensuring uniform force on the entire driver chip binding area B2 during binding.

[0048] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3 and Figure 4 As shown, the extension direction of the second trace 22 is the same as the extension direction of the binding pad 30, and the second trace 22 is generally located directly below the binding pad 30. Although the raised portion 40 extends to both sides of the second trace 22, there is a certain gap between the raised portion 40 and the second trace 22, resulting in a certain step difference between the gap position and the trace position corresponding to the binding pad 30. In order to further ensure that the thickness of each position of the binding pad 30 is consistent, the width of the second trace 22 can be set to be greater than the width of the first trace 21, so that the gap is closer to both sides of the binding pad 30, which has less impact on the uneven force during binding.

[0049] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5As shown, since the raising portion 40 is used to compensate the height of each position of the binding pad 30 to be consistent, the raising portion 40 located at the metal layer can be made at the same time when the fan-out line 20 of each metal layer is made. As long as the orthographic projection of the raising portion 40 on the base substrate 10 and the orthographic projection of the fan-out line 20 of the corresponding metal layer on the base substrate 10 do not overlap, the orthographic projection of the raising portion 40 on the base substrate 10 and the orthographic projection of the binding pad 30 on the base substrate 10 at least partially overlap, that is, the raising portion 40 can be set at the same layer and material as the fan-out line 20 of the corresponding metal layer. In this way, the raising portion 40 can adopt the original manufacturing process of the display panel, and there is no need to add a separate process for preparing the raising portion 40, thereby reducing costs.

[0050] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5 As shown, when the fan-out line 20 is being routed, there will be fan-out lines 20 routed along the extension direction of the binding pad 30 below two binding pads 30 separated by a column of binding pads 30. In this way, a raised portion 40 that does not overlap with the fan-out line 20 needs to be provided below the binding pad 30 in the middle column where no fan-out line 20 is provided, that is, the positive projection of at least part of the raised portion 40 (within the dotted box D) on the base substrate 10 covers the positive projection of a binding pad 30 on the base substrate 10, and at least part of the raised portion 40 extends to the outside of the binding pad 30. This not only makes the heights of the binding pads 30 at various positions consistent, but also makes the height of the outer periphery of the binding pad 30 consistent with the height of the position where the binding pad 30 is located, so that there is basically no height difference at various positions of the entire driver chip binding area B2. Therefore, during binding, the entire driver chip binding area B2 can be subjected to uniform force, further improving the binding effect and product yield.

[0051] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3-Figure 5 As shown, when the fan-out line 20 is being wired, there will be two binding pads 30 separated by two columns of binding pads 30, and fan-out lines 20 are arranged under both of them, which are wired along the extension direction of the binding pads 30. In this way, a raised portion 40 that does not overlap with the fan-out line 20 needs to be arranged under the binding pads 30 in the middle two columns where no fan-out line 20 is arranged, that is, at least part of the raised portion 40 (within the dotted box F) has a positive projection on the base substrate 10 covering the positive projections of multiple binding pads 30 on the base substrate 10, and at least part of the raised portion 40 extends to the outside of the multiple binding pads 30. In this way, not only the height of each position of the binding pad 30 is consistent, but also the height of the outer periphery of the binding pad 30 is consistent with the height of the position where the binding pad 30 is located, so that there is basically no height difference at each position of the entire driver chip binding area B2, so that during binding, the entire driver chip binding area B2 can be subjected to uniform force, further improving the binding effect and product yield.

[0052] Of course, in a specific implementation, when routing the fan-out line 20, there may be fan-out lines 20 routed along the extension direction of the binding pads 30 under two binding pads 30 that are separated by three or more columns of binding pads 30. In this way, a raised portion 40 that does not overlap with the fan-out line 20 needs to be set under the binding pads 30 in the middle three or more columns where no fan-out line 20 is set.

[0053] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 3 and Figure 4 As shown, Figure 3 and Figure 4 It is only a schematic illustration of the structure of the corresponding raised portion 40 set when the fan-out line 20 crosses the binding pad 30 and is connected to the corresponding binding pad 30. Of course, it is not limited to this. When making the fan-out line 20 of each metal layer, as long as there is a non-routing area under or around each binding pad 30, a raised portion 40 can be set to ensure that there is no height difference at each position of the entire driver chip binding area B2, thereby improving the height uniformity of the entire driver chip binding area B2 and thus improving the binding effect.

[0054] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 5 As shown, it also includes: a buffer layer 50 located between the shading metal layer (LS) and the gate metal layer (Gate), a gate insulating layer 60 located between the buffer layer 50 and the gate metal layer (Gate), and an interlayer insulating layer 70 located between the gate metal layer (Gate) and the source-drain metal layer (SD); the fan-out line 20 located in the shading metal layer (LS) needs to be electrically connected to the strapping electrode located in the gate metal layer (Gate) through a via penetrating the buffer layer 50 and the gate insulating layer 60 in the area where the binding pad 30 is located, and then the strapping electrode is electrically connected to the binding pad 30 located in the source-drain metal layer (SD) through a via penetrating the interlayer insulating layer 70; the fan-out line 20 located in the gate metal layer (Gate) needs to be electrically connected to the binding pad 30 located in the source-drain metal layer (SD) through a via penetrating the interlayer insulating layer 70 in the area where the binding pad 30 is located.

[0055] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1 and Figure 2As shown, some fan-out lines 20 pass through one side of the driver chip binding area B2 (for example, the upper side near the display area AA) and are electrically connected to the bonding pad 30, while another part of the fan-out lines 20 pass through at least one remaining side of the driver chip binding area B2 (for example, the left side, right side adjacent to the upper side, or the lower side opposite to the upper side) and are electrically connected to the bonding pad 30. Compared to a method in which all fan-out lines 20 pass through the upper side of the driver chip binding area B2 to connect to the bonding pad 30, the fan-out line 20 routing scheme in this via embodiment can relatively reduce the routing width of the fan-out area B1, thereby reducing the width of the bottom bezel of the display panel and achieving a narrow bezel.

[0056] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1 and Figure 2 As shown, along the arrangement direction (row direction) of the bonding pads 30, the plurality of bonding pads 30 include a first region C1 and a second region C2. Some fan-out lines 20 pass through the first side B21 of the driver chip bonding area B2 to electrically connect to the bonding pads 30 in the first region C1, and some fan-out lines 20 pass through the second side B22 of the driver chip bonding area B2 to electrically connect to the bonding pads 30 in the second region C2. The second side B22 is adjacent to the fan-out area B1, and the first side B21 and the second side B22 are arranged opposite each other. In this way, some fan-out lines 20 pass through the lower side (opposite to the upper side) of the driver chip bonding area B2 to electrically connect to the corresponding bonding pads 30, and some fan-out lines 20 pass through the upper side of the driver chip bonding area B2 to electrically connect to the corresponding bonding pads 30. This can reduce the routing width of the fan-out area B1, thereby reducing the width of the bottom bezel of the display panel and achieving a narrow bezel.

[0057] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1 and Figure 2 As shown, the plurality of bonding pads 30 also includes a third region C3 located on the side of the second region C2 away from the first region C1. Some fan-out lines 20 are electrically connected to the bonding pads 30 in the third region C3 via the third side B23 of the driver chip bonding region B2, and the third side B23 is disposed adjacent to the second side B22. Thus, some fan-out lines 20 are electrically connected to the corresponding bonding pads 30 via the left side (the side adjacent to the top) of the driver chip bonding region B2, further reducing the routing width of the fan-out region B1, thereby further reducing the width of the bottom bezel of the display panel and further achieving a narrow bezel.

[0058] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1 and Figure 2As shown, the plurality of bonding pads 30 also includes a fourth region C4 located on a side of the third region C3 away from the first region C1. Some fan-out lines 20 are electrically connected to the bonding pads 30 in the fourth region C4 via the first side B21. In this way, a portion of the fan-out lines 20 are also electrically connected to the corresponding bonding pads 30 via the lower side (opposite to the upper side) of the driver chip bonding region B2. This can further reduce the trace width of the fan-out region B1, thereby further reducing the width of the bottom bezel of the display panel and further achieving a narrow bezel.

[0059] In some embodiments, in the above display panel provided by the embodiment of the present invention, as Figure 1 and Figure 2 As shown, since the fan-out lines 20 electrically connected to the binding pads 30 of the first area C1 and the fourth area C4 are both led out from the lower side of the driver chip binding area B2, in order to avoid a short circuit between the fan-out lines 20 corresponding to the first area C1 and the fourth area C4 and located on the same metal layer, the fan-out line 20 corresponding to the fourth area C4 can be set to be located on the side of the fan-out line 20 corresponding to the first area C1 away from the display area AA, so that the fan-out line 20 corresponding to the fourth area C4 and the fan-out line 20 corresponding to the first area C1 located on the same metal layer will not overlap and cause a short circuit.

[0060] It should be noted that this via embodiment Figure 1 and Figure 2 Only the fan-out line 20 routing mode corresponding to half of the driver chip binding area B2 (left half) is illustrated. The fan-out line 20 routing mode corresponding to the other half of the driver chip binding area B2 (right half) can be symmetrically arranged with the left half.

[0061] It should be noted that the embodiments of the present invention Figure 1 and Figure 2 This is only a schematic illustration of the area division method of the driver chip binding area B2, and is of course not limited to this. As long as the routing method of the fan-out line 20 corresponding to the binding pad 30 is set to be led out from each side of the driver chip binding area B2, it falls within the protection content of the embodiment of the present invention.

[0062] In some embodiments, as Figure 1 and Figure 2 As shown, the display panel also includes a flexible printed circuit (FPC) bonding area B3 located on the side of the driver chip bonding area B2 away from the display area AA. The flexible printed circuit (FPC) bonding area B3 is used for bonding with the flexible printed circuit (FPC). Signals transmitted to the display area AA are generally first transmitted to the driver chip via the flexible printed circuit board, and then from the driver chip to the bonding pads 30, and then transmitted to the display area AA via the bonding pads 30.

[0063] In a specific implementation, the fan-out line can be extended to the display area to be electrically connected to the data line (Data), touch (senor) signal line and other signal lines in the display area to achieve transmission of electrical signals.

[0064] Optionally, the display panel provided in the embodiment of the present invention may be a liquid crystal display panel (LCD), an organic light emitting diode display panel (OLED), a Mini LED display panel or a Micro LED display panel, etc.

[0065] Optionally, the display panel provided in the embodiment of the present invention may be a display panel using TDDI technology, or may be a display panel using TDDI technology.

[0066] Optionally, the display panel provided by the embodiment of the present invention is applicable to a small-size, large-size or extra-large-size display panel.

[0067] Optionally, the display panel provided in the embodiment of the present invention may further include other functional film layers well known to those skilled in the art, which will not be described in detail here.

[0068] Based on the same inventive concept, embodiments of the present invention further provide a display device comprising the display panel described above. The principles of this display device are similar to those of the aforementioned display panel, and thus the implementation of this display device can refer to the implementation of the aforementioned display panel, and any repetitions will not be repeated here.

[0069] In specific implementation, the display device provided in the embodiment of the present invention may be an organic light emitting display device or a liquid crystal display device, which is not limited herein.

[0070] In specific implementation, the display device provided in the embodiment of the present invention may be a full-screen display device, or may be a flexible display device, etc., which is not limited here.

[0071] In specific implementation, the display device provided by the embodiment of the present invention can be as follows: Figure 6 The full-screen mobile phone shown. Of course, the display device provided in the embodiments of the present invention may also be any product or component with a display function, such as a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc. The other essential components of the display device are well understood by those skilled in the art and are not detailed here, nor should they be construed as limitations of the present invention.

[0072] A display panel and a display device provided by an embodiment of the present invention provide a raised portion in the binding area of ​​a driver chip. The raised portion can compensate for the step difference at different positions of the binding pad. For example, the thickness of the display panel corresponding to the overlapping area of ​​the binding pad and the fan-out line is made the same as the thickness of the display panel corresponding to the non-overlapping area of ​​the binding pad and the fan-out line. In this way, there is no step difference in the height of the binding pad at each position. Therefore, when the terminal of the driver chip is bound to the binding pad in the binding area of ​​the driver chip, the force at each position of the binding pad is uniform, thereby improving the binding effect and thus improving the product yield of the display panel.

[0073] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, characterized in that: The invention comprises a base substrate, the base substrate comprising a display area and a non-display area, the non-display area comprising a fan-out area located on one side of the display area and a driver chip binding area located on a side of the fan-out area away from the display area; the fan-out area comprises a plurality of fan-out lines, the driver chip binding area comprises a plurality of binding pads, the fan-out lines extend to the driver chip binding area and are electrically connected to the corresponding binding pads; The plurality of fan-out lines are located between the base substrate and the binding pads, and the orthographic projections of the fan-out lines on the base substrate overlap with the orthographic projections of the binding pads on the base substrate; The driver chip binding area further includes a raised portion located between the base substrate and the binding pad, and an orthographic projection of the raised portion on the base substrate at least partially overlaps with an orthographic projection of the binding pad on the base substrate.

2. The display panel according to claim 1, wherein The non-display area includes two metal layers located between the base substrate and the binding pad, and each of the metal layers is provided with the fan-out line and the padding portion.

3. The display panel according to claim 2, wherein: The display area includes a light-shielding metal layer, a gate metal layer and a source-drain metal layer stacked in sequence on the base substrate, one of the metal layers is the same metal layer as the light-shielding metal layer, and the other metal layer is the same metal layer as the gate metal layer, and the binding pad includes a first conductive portion arranged on the same layer as the source-drain metal layer.

4. The display panel according to claim 3, wherein: A direction from the display area to the binding area is a first direction, and a direction intersecting the first direction is a second direction; The fan-out line of each metal layer includes a first line extending along the second direction and a second line extending along the first direction, an end of the second line facing away from the first line is electrically connected to the binding pad, at least part of the binding pad overlaps with a plurality of first lines arranged sequentially along the first direction, and an orthographic projection of at least part of the first line of one metal layer and at least part of the first line of another metal layer on the substrate overlaps with each other; A plurality of raised portions arranged at intervals along the first direction are provided between adjacent second routing lines of each metal layer, and the orthographic projections of the raised portions and the fan-out lines located in the same metal layer on the base substrate do not overlap, and the orthographic projection of at least part of the raised portions of one of the metal layers on the base substrate overlaps with the orthographic projection of the fan-out lines located in another metal layer on the base substrate.

5. The display panel according to claim 4, wherein: Among the multiple first routing lines arranged in sequence along the first direction, the nth first routing line is close to the display area, the n+1th first routing line is far away from the display area, and among the elevated portions between the second routing line corresponding to the nth first routing line and the second routing line corresponding to the n+1th first routing line, the elevated portion closest to the n+1th first routing line is aligned with the nth first routing line along the second direction, where n is an integer greater than or equal to 1.

6. The display panel according to claim 4, wherein: The width of the second routing line is greater than the width of the first routing line.

7. The display panel according to any one of claims 4 to 6, wherein: An orthographic projection of at least a portion of the raised portion on the base substrate covers an orthographic projection of one of the binding pads on the base substrate, and at least a portion of the raised portion extends to an outer side of the binding pad.

8. The display panel according to any one of claims 4 to 6, wherein: An orthographic projection of at least part of the raised portion on the base substrate covers an orthographic projection of the plurality of binding pads on the base substrate, and at least part of the raised portion extends to outsides of the plurality of binding pads.

9. The display panel according to any one of claims 1 to 6, wherein: Part of the fan-out lines passes through one side of the driver chip binding area and is electrically connected to the binding pad, and another part of the fan-out lines passes through at least the remaining side of the driver chip binding area and is electrically connected to the binding pad.

10. The display panel according to claim 9, wherein: Along the arrangement direction of the binding pads, the multiple binding pads include a first area and a second area, some of the fan-out lines pass through the first side of the driver chip binding area and are electrically connected to the binding pads of the first area, and some of the fan-out lines pass through the second side of the driver chip binding area and are electrically connected to the binding pads of the second area, the second side is close to the fan-out area, and the first side and the second side are arranged opposite to each other.

11. The display panel according to claim 10, wherein: The plurality of binding pads further include a third area located on a side of the second area away from the first area, part of the fan-out lines pass through the third side of the driver chip binding area and are electrically connected to the binding pads of the third area, and the third side is adjacent to the second side.

12. The display panel according to claim 11, wherein: The plurality of bonding pads further include a fourth region located on a side of the third region away from the first region, and part of the fan-out lines are electrically connected to the bonding pads of the fourth region through the first side.

13. The display panel according to claim 12, wherein: The fan-out line corresponding to the fourth area in the same metal layer is located on a side of the fan-out line corresponding to the first area away from the display area.

14. A display device, characterized in that: The display panel comprises the display panel according to any one of claims 1 to 13.

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