High-lead solder paste for semiconductor and method for manufacturing the same
By optimizing the raw material formulation and preparation process of high-lead solder paste, the wettability and soldering reliability issues of high-lead solder paste in high-reliability application scenarios have been solved, achieving low spatter rate and no post-soldering corrosion, meeting the usage requirements of aerospace, automotive electronics and other fields.
CN120772713BActive Publication Date: 2026-07-03浙江强力控股有限公司
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 浙江强力控股有限公司
- Filing Date
- 2025-07-31
- Publication Date
- 2026-07-03
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Figure SMS_1
Abstract
The application discloses a high-lead soldering paste for semiconductors and a manufacturing method thereof. The high-lead soldering paste comprises 85-90% of high-lead alloy powder and 10-15% of soldering paste according to the percentage by weight. The soldering paste comprises the following raw materials according to the percentage by weight: 40-50% of modified rosin, 2.5-5% of phthalic acid, 2.5-5% of hydroxyethyl propionic acid, 2-5% of polyethylene glycol, 1-2% of sodium dodecyl benzene sulfonate, 0.5-1.5% of 2,6-di-tert-butyl-p-cresol, 0.5-1% of benzotriazole, 10-30% of propylene glycol, 5-17% of ethylene glycol monobutyl ether and 2-5% of hydroxyethyl cellulose. The high-lead soldering paste is simple to manufacture and easy to operate, has excellent wetting performance and reliable welding performance, has low spatter rate in the welding process, has no corrosion phenomenon of post-welding residues and meets the use requirements of high-reliability application scenarios.
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Citation Information
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