Low-VOC (volatile organic compound) hot-melt pressure-sensitive adhesive and preparation method thereof
Low-VOC hot-melt pressure-sensitive adhesives are prepared by heating, stirring, and vacuuming thermoplastic elastomers, stabilizers, and tackifying resins in a reactor. This solves the VOC release problem of traditional hot-melt pressure-sensitive adhesives and enables the preparation of environmentally friendly, healthy, and safe adhesives.
Patent Information
- Application Number
- CN202511181912.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-22
- Publication Date
- 2025-10-17
AI Technical Summary
Traditional hot-melt pressure-sensitive adhesives release volatile organic compounds (VOCs) during production and use, causing environmental pollution and health risks, and cannot meet environmental regulations and green development needs.
A low-VOC hot-melt pressure-sensitive adhesive is prepared by heating, stirring, and vacuuming a specific proportion of thermoplastic elastomer, stabilizer, tackifying resin, and plasticizer in a reactor. The specific steps include heating to 150°C to 160°C, adding the materials, and vacuuming and stirring to ensure that the materials are completely melted before pouring them out.
Effectively reduce the release of VOCs, reduce harm to the environment and human health, and comply with environmental protection regulations.
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Figure CN120795838A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field, and in particular to a low-VOC hot-melt pressure-sensitive adhesive and a preparation method thereof. Background Art
[0002] Hot melt pressure-sensitive adhesive is an adhesive that does not require solvents, can be melted and coated by heating, and has long-lasting adhesion. It is widely used in many fields such as packaging, building materials, electronics, and medical care due to its convenient construction, high efficiency, and wide range of applications.
[0003] However, traditional hot-melt pressure-sensitive adhesives (HMPAs) often release a certain amount of volatile organic compounds (VOCs) during production and use. These VOCs not only pollute the environment, such as exacerbating atmospheric smog and damaging the ozone layer, but also directly affect human health. Long-term exposure may cause respiratory diseases, allergic reactions, and even cancer risks, which is inconsistent with increasingly stringent environmental regulations and green development needs. Summary of the Invention
[0004] The purpose of the present invention is to provide a low-VOC hot-melt pressure-sensitive adhesive and a preparation method thereof, which solves the problem that traditional hot-melt pressure-sensitive adhesives often release a certain amount of volatile organic compounds (VOCs) during production and use. These VOCs not only pollute the environment, but also directly affect human health. Long-term exposure may cause respiratory diseases, allergic reactions and even cancer risks.
[0005] To achieve the above object, the present invention provides a method for preparing a low-VOC hot-melt pressure-sensitive adhesive, comprising the following steps:
[0006] Turn on the heating jacket of the reactor and raise the temperature to 150℃~160℃;
[0007] Add thermoplastic elastomer, stabilizer and part of plasticizer into the reactor, heat for 20 to 30 minutes, then start stirring and evacuate for 20 to 30 minutes;
[0008] Open the lid every 10 minutes to check the melting state of the thermoplastic elastomer until the thermoplastic elastomer is completely melted;
[0009] Add tackifying resin and remaining plasticizer into the reactor, continue vacuum stirring for 10 to 20 minutes, and then pour out to obtain a low-VOC hot melt pressure-sensitive adhesive.
[0010] The method comprises adding 10-40 parts of thermoplastic elastomer, 0.1-5 parts of stabilizer and part of plasticizer into the reactor, heating for 20-30 minutes, stirring, and vacuuming for 20-30 minutes. The total amount of plasticizer is 5-30 parts, and the amount of thermoplastic elastomer is 20-30 parts.
[0011] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0012] The total amount of the plasticizer is 10-20 parts.
[0013] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0014] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0015] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0016] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0017] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out.
[0018] The low VOC hot melt pressure sensitive adhesive is obtained by pouring 30-70 parts of tackifying resin and the remaining plasticizer into the reaction kettle, continuing to stir under vacuum for 10-20 min, and then pouring out. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiment or prior art description will be briefly introduced as follows.
[0020] Figure 1 is a step schematic diagram of the low VOC hot melt pressure sensitive adhesive preparation method of the first embodiment of the present application.
[0021] Figure 2 is a step schematic diagram of the low VOC hot melt pressure sensitive adhesive preparation method of the second embodiment of the present application.
[0022] Figure 3 is a step schematic diagram of the low VOC hot melt pressure sensitive adhesive preparation method of the third embodiment of the present application. DETAILED DESCRIPTION
[0023] Embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, the embodiments described below by reference to the drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.
[0024] The first embodiment of the present application is:
[0025] Please refer to Figure 1 , wherein, Figure 1 is the step schematic diagram of the low VOC hot melt pressure sensitive adhesive preparation method of the first embodiment of the present application, the present application provides a low VOC hot melt pressure sensitive adhesive preparation method, comprising the following steps:
[0026] S101: open the reaction kettle heating jacket, and raise the temperature to 150-160℃;
[0027] S102: put 20 parts of thermoplastic elastomer, 1 part of stabilizer and 20 parts of plasticizer into the reaction kettle, heat for 20-30 min, then start stirring, and vacuum for 20-30 min;
[0028] S103: open the cover every 10 min to confirm the melting state of the thermoplastic elastomer, until the thermoplastic elastomer is completely melted;
[0029] S104: put 40 parts of tackifying resin and 19 parts of plasticizer into the reaction kettle, continue to vacuum stirring for 10-20 min, then pour out, to obtain the low VOC hot melt pressure sensitive adhesive.
[0030] The low VOC hot melt pressure sensitive adhesive and the preparation method thereof of the present embodiment solve the problem that the traditional hot melt pressure sensitive adhesive often releases a certain amount of volatile organic compounds (VOC) in the production and use process, these VOC not only pollute the environment, but also directly affect human health, long-term contact may cause respiratory diseases, allergic reactions and even carcinogenic risk.
[0031] The second embodiment of the present application is:
[0032] Based on the first embodiment, please refer to Figure 2 , wherein, Figure 2 is the step schematic diagram of the low VOC hot melt pressure sensitive adhesive preparation method of the second embodiment of the present application.
[0033] The low VOC hot melt pressure sensitive adhesive preparation method of the present embodiment comprises the following steps.
[0034] S201: open the reaction kettle heating jacket, and raise the temperature to 150-160℃;
[0035] S202: 25 parts of thermoplastic elastomer, 1 part of stabilizer and 24 parts of plasticizer are put into the reaction kettle, heated for 20-30 min, then start stirring, and vacuum for 20-30 min;
[0036] S203: The thermoplastic elastomer melting state is confirmed every 10 min, until the thermoplastic elastomer is completely melted;
[0037] S204: 50 parts of tackifying resin are put into the reaction kettle, vacuum stirring is continued for 10-20 min, then poured out, to obtain the low VOC hot melt pressure sensitive adhesive.
[0038] The third embodiment of the present application is:
[0039] Based on the first embodiment and the second embodiment, please refer to Figure 3 , wherein, Figure 3 is a schematic diagram of the steps of the low VOC hot melt pressure sensitive adhesive preparation method of the third embodiment of the present application.
[0040] The low VOC hot melt pressure sensitive adhesive preparation method of the present embodiment comprises the following steps.
[0041] S301: Turn on the reaction kettle heating jacket, and raise the temperature to 150-160℃;
[0042] S302: 15 parts of thermoplastic elastomer, 1 part of stabilizer and 15 parts of plasticizer are put into the reaction kettle, heated for 20-30 min, then start stirring, and vacuum for 20-30 min;
[0043] S303: The thermoplastic elastomer melting state is confirmed every 10 min, until the thermoplastic elastomer is completely melted;
[0044] S304: 60 parts of tackifying resin and 9 parts of plasticizer are put into the reaction kettle, vacuum stirring is continued for 10-20 min, then poured out, to obtain the low VOC hot melt pressure sensitive adhesive.
[0045] The fourth embodiment of the present application is:
[0046] Based on the first embodiment, the low VOC hot melt pressure sensitive adhesive of the present embodiment is applied to the low VOC hot melt pressure sensitive adhesive preparation method.
[0047] The above disclosure is only one or more preferred embodiments of the present application, which cannot limit the scope of the present application. Those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the present application, still belong to the scope covered by the present application.
Claims
1. A method for preparing a low-VOC hot-melt pressure-sensitive adhesive, characterized in that: The following steps are included: Turn on the heating jacket of the reactor and raise the temperature to 150℃~160℃; Add thermoplastic elastomer, stabilizer and part of plasticizer into the reactor, heat for 20 to 30 minutes, then start stirring and evacuate for 20 to 30 minutes; Open the lid every 10 minutes to check the melting state of the thermoplastic elastomer until the thermoplastic elastomer is completely melted; Add tackifying resin and remaining plasticizer into the reactor, continue vacuum stirring for 10 to 20 minutes, and then pour out to obtain a low-VOC hot melt pressure-sensitive adhesive.
2. The method for preparing a low-VOC hot-melt pressure-sensitive adhesive according to claim 1, wherein: 10-40 parts of thermoplastic elastomer, 0.1-5 parts of stabilizer and part of plasticizer are added to the reactor, heated for 20-30 minutes, then stirred, and vacuumed for 20-30 minutes, wherein the total amount of plasticizer is 5-30 parts, and the amount of thermoplastic elastomer is 20-30 parts.
3. The method for preparing a low-VOC hot-melt pressure-sensitive adhesive according to claim 1, wherein: 30-70 parts of tackifying resin and the remaining plasticizer are added to the reaction kettle, and the mixture is continuously vacuum-stirred for 10-20 minutes and then poured out to obtain the low-VOC hot-melt pressure-sensitive adhesive, in which the amount of the tackifying resin is 40-60 parts.
4. The method for preparing a low-VOC hot-melt pressure-sensitive adhesive according to claim 1, wherein: The total amount of the plasticizer is 10-20 parts.
5. The method for preparing a low VOC hot melt pressure sensitive adhesive according to claim 1, wherein: Thermoplastic elastomer, stabilizer and part of plasticizer are added into the reaction kettle, heated for 20 to 30 minutes, then stirred, and vacuumed for 20 to 30 minutes. The amount of the stabilizer is 0.5 to 2 parts.
6. The method for preparing a low-VOC hot-melt pressure-sensitive adhesive according to claim 1, wherein: The thermoplastic elastomer is at least one selected from styrene-isoprene-styrene block copolymer (SIS), styrene-butadiene-styrene block copolymer (SBS), and hydrogenated styrene-butadiene-styrene block copolymer (SEBS).
7. The method for preparing a low-VOC hot-melt pressure-sensitive adhesive according to claim 1, wherein: The tackifying resin is selected from at least one of terpene resin, rosin resin and petroleum resin.
8. The method for preparing a low VOC hot melt pressure sensitive adhesive according to claim 1, wherein: The plasticizer is selected from at least one of naphthenic oil, paraffin base oil, and low molecular weight polyisobutylene.
9. A low-VOC hot-melt pressure-sensitive adhesive and a preparation method thereof, applied to the preparation method of the low-VOC hot-melt pressure-sensitive adhesive according to claim 1.