5G signal transmission charging data line resistant to attenuation in low-temperature environment

By integrating signal compensation, temperature control, and signal transmission optimization units into the charging data cable, the problem of signal attenuation in low-temperature environments is solved, achieving stable 5G signal transmission and efficient data transmission.

CN120895324APending Publication Date: 2025-11-04SHENZHEN KAIJIESHENG TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202510939715.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-08
Publication Date
2025-11-04

AI Technical Summary

Technical Problem

Existing technologies cannot effectively solve the signal attenuation problem of embedded chips in charging data cables in low-temperature environments, especially in 5G signal transmission, which leads to a decrease in signal transmission efficiency and reliability.

Method used

The signal compensation unit uses dynamic millimeter-wave signal enhancement technology, the temperature control unit uses a micro-heating module based on thermoelectric effect and an adaptive temperature control algorithm, the signal transmission optimization unit uses an improved adaptive modulation and coding (AMC-Plus) algorithm, and the receiver verification unit uses a multi-level error correction mechanism to work together to improve signal stability and transmission efficiency.

Benefits of technology

It significantly improves the stability and reliability of signals in low-temperature environments, reduces data transmission interruptions and errors, extends chip lifespan, and improves data transmission efficiency and reliability.

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Abstract

The invention relates to the technical field of electronic communication and integrated circuits, in particular to an anti-attenuation 5G signal transmission charging data line in a low-temperature environment, which comprises a charging data line body and an anti-attenuation system, the anti-attenuation system is integrated on the charging data line, and the anti-attenuation system comprises a signal compensation unit, a signal processing unit and a power supply unit, the signal compensation unit performs real-time compensation on a signal in a low-temperature environment through a dynamic millimeter wave signal enhancement technology; and the temperature regulation and control unit is used for designing a micro-heating module based on the thermoelectric effect. Signal intensity, signal-to-noise ratio and temperature data are acquired in real time through a signal monitoring module of the signal compensation unit, millimeter wave transmitting power and phase offset can be dynamically adjusted by combining a signal enhancement module on the basis of a dynamic millimeter wave signal enhancement technology, signal attenuation caused by low temperature is accurately compensated, and the signal quality is improved. The stability and reliability of signals in a low-temperature environment are remarkably improved, and data transmission interruption or errors caused by signal attenuation are effectively avoided.
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Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of electronic communication and integrated circuits, and specifically relates to a 5G signal transmission charging data line with anti-attenuation in a low-temperature environment. BACKGROUND

[0002] With the rapid development of 5G communication technology and the wide application of portable electronic devices, the performance stability of the embedded chip of the charging data line in a low-temperature environment has become a research hotspot. Especially in cold regions or extreme temperature conditions, the signal transmission efficiency and anti-attenuation ability of the chip will decrease significantly, resulting in reduced user experience and serious impact on the reliability of the device. Therefore, it is of great significance to develop a system that can effectively resist attenuation and ensure stable transmission of 5G signals in a low-temperature environment.

[0003] In the prior art, a patent with publication number CN106783653B proposes a chip internal temperature monitoring device based on a multi-chip stacking process. By stacking a thin film encapsulated NTC thermistor on a multi-chip packaging substrate, real-time monitoring of the internal temperature of the chip is achieved, and multiple temperature monitoring points can be flexibly configured to adapt to the needs of different working environments. However, this technical solution mainly focuses on the monitoring of the internal temperature of the chip and does not involve the optimization of the signal transmission performance of the chip in a low-temperature environment. In addition, its temperature monitoring function relies on an additional thermistor, which not only increases the design complexity and manufacturing cost of the chip, but also fails to directly solve the problem of signal attenuation caused by low temperature.

[0004] Another prior art, a patent with publication number CN118731658B, proposes a cold and hot impact test method for IC chips. By combining cold and hot interval impact testing with cold and hot rapid impact testing, the performance stability of IC chips in high and low temperature environments is evaluated, especially the ability to resist cold and hot temperature difference impact. However, this technical solution is limited to testing the performance of the chip under extreme temperature conditions and does not provide a specific solution to signal attenuation in a low-temperature environment. At the same time, this method focuses on testing rather than performance optimization in actual applications and cannot be directly applied to the low-temperature anti-attenuation design of the embedded chip of the charging data line.

[0005] The above problems show that the existing technical solutions have obvious deficiencies in the optimization of chip signal transmission performance in a low-temperature environment, especially in terms of anti-attenuation ability and stable transmission of 5G signals. In particular, in high-frequency application scenarios such as millimeter wave communication, the influence of low-temperature environment on signal transmission is more significant, further exacerbating the decrease in data transmission efficiency and the increase in delay. Therefore, we propose a 5G signal transmission charging data line with anti-attenuation in a low-temperature environment to solve the technical problems existing in the above. SUMMARY

[0006] The purpose of the present application is to solve the technical problems raised in the background art by providing a 5G signal transmission charging data line resistant to attenuation in a low-temperature environment, thereby addressing the shortcomings of the prior art.

[0007] To solve the above technical problems, the technical solution is as follows: the low-temperature environment-resistant 5G signal transmission charging data line comprises a charging data line body and an anti-attenuation system, the anti-attenuation system is integrated on the charging data line, and the anti-attenuation system comprises: A signal compensation unit compensates the signal in a low-temperature environment in real time through a dynamic millimeter wave signal enhancement technology; A temperature regulation unit designs a micro-heating module based on the thermoelectric effect and optimizes the chip operating temperature in combination with a self-adaptive temperature control algorithm; A signal transmission optimization unit uses an improved self-adaptive modulation and coding (AMC-Plus) algorithm to improve the transmission efficiency of 5G signals in a low-temperature environment; A receiving end verification unit verifies the integrity of the received signal and restores the original data through a multi-stage error correction mechanism.

[0008] As a preferred embodiment, the signal compensation unit comprises a signal monitoring module and a signal enhancement module; The signal monitoring module acquires signal strength, signal-to-noise ratio and temperature data in real time and generates dynamic feature labels; The signal enhancement module compensates for signal attenuation caused by low temperature by adjusting millimeter wave transmission power and phase shift based on dynamic millimeter wave signal enhancement technology.

[0009] As a preferred embodiment, the temperature regulation unit designs a micro-heating module based on the thermoelectric effect and optimizes the chip operating temperature in combination with a self-adaptive temperature control algorithm, comprising the following steps: S101: Construct a micro-heating module by using thermoelectric materials to convert electrical energy into heat energy; S102: Calculate the deviation of the current chip surface temperature from the target temperature according to the temperature data in the dynamic feature labels; S103: Adjust the output power of the micro-heating module using the self-adaptive temperature control algorithm to maintain the chip temperature in the optimal working interval; S104: When the temperature fluctuation exceeds the set threshold, trigger a double-loop feedback mechanism to dynamically adjust the heating power and the heat dissipation rate.

[0010] As a preferred embodiment, the self-adaptive temperature control algorithm is as follows: Wherein, P represents the output power of the micro-heating module; represents the basic power; 、 、 respectively represent the proportional, integral and differential coefficients; represents the temperature deviation; represents the time.

[0011] As preferred, the signal transmission optimization unit uses the improved adaptive modulation and coding (AMC-Plus) algorithm to improve the transmission efficiency of 5G signals under low temperature conditions, including the following steps: S201: According to the signal-to-noise ratio data in the dynamic characteristic label, select the optimal modulation mode and coding rate; S202: Introduce a weight factor based on low temperature characteristics, adjust the modulation parameters to adapt to the low temperature environment; S203: Preferentially allocate high-quality frequency band resources through dynamic spectrum allocation technology; S204: Adopt a hybrid automatic repeat request (HARQ) mechanism to ensure the reliability of data transmission.

[0012] As preferred, the weight factor based on low temperature characteristics is calculated as follows: wherein, represents the low temperature characteristic weight factor; and respectively represent the temperature and signal-to-noise ratio weight coefficients; and respectively represent the current temperature and the optimal working temperature; SNR and SNR respectively represent the current signal-to-noise ratio and the signal-to-noise ratio threshold.

[0013] As preferred, the receiving end checking unit includes a signal checking module and a data recombination module; wherein, the signal checking module checks the integrity of the received signal through a multi-stage error correction mechanism, and marks the error data block; The data recombination module reorders and merges the block data according to the checking result to restore the original signal format.

[0014] As preferred, a 5G signal transmission method for a charging data line embedded chip includes the following steps: S301: Real-time acquisition of signal strength, signal-to-noise ratio and temperature data, and generation of dynamic characteristic label; S302: Real-time compensation of signals in low temperature environment through dynamic millimeter wave signal enhancement technology; S303: Design a micro-heating module based on the thermoelectric effect, and combine an adaptive temperature control algorithm to optimize the chip working temperature; S304: improve the transmission efficiency of 5G signals under low temperature conditions by using an improved adaptive modulation and coding (AMC-Plus) algorithm. S305: integrity check and original data recovery of the received signal by multi-level error correction mechanism.

[0015] As preferred, the dynamic millimeter wave signal enhancement technology proposed in the step S302 compensates for signal attenuation caused by low temperature by adjusting the millimeter wave transmission power and phase offset. The adaptive temperature control algorithm proposed in the step S303 dynamically adjusts the temperature deviation through proportional, integral and differential coefficients, and triggers a double-loop feedback mechanism when the temperature fluctuation exceeds the set threshold.

[0016] As preferred, the charging data line body includes a line body and a connecting head, the line body is connected with the connecting head, and an embedded chip is arranged on the inner side of the connecting head.

[0017] The beneficial effects of the present application are: 1. The signal monitoring module of the signal compensation unit can real-time collect signal strength, signal-to-noise ratio and temperature data, and the signal enhancement module can dynamically adjust the millimeter wave transmission power and phase offset based on the dynamic millimeter wave signal enhancement technology, accurately compensate for the signal attenuation caused by low temperature, significantly improve the stability and reliability of the signal under low temperature environment, and effectively avoid the data transmission interruption or error caused by signal attenuation.

[0018] 2. The temperature regulation unit is designed based on the thermoelectric effect, and the adaptive temperature control algorithm can calculate the deviation from the target temperature according to the real-time temperature data of the chip, and dynamically adjust the temperature through proportional, integral and differential coefficients, so that the temperature of the chip is stably maintained in the best working interval. When the temperature fluctuation exceeds the set threshold, the double-loop feedback mechanism is triggered, the heating power and the heat dissipation rate are dynamically adjusted, and a stable working environment is provided for the chip, reducing the performance degradation problem of the chip caused by low temperature, and prolonging the service life of the chip.

[0019] 3. The signal transmission optimization unit adopts an improved adaptive modulation and coding (AMC-Plus) algorithm, selects the optimal modulation mode and coding rate according to the signal-to-noise ratio data in the dynamic characteristic label, introduces a weight factor based on low temperature characteristics to adjust the modulation parameters, combines with the dynamic spectrum allocation technology to preferentially allocate high-quality frequency band resources, and simultaneously adopts the hybrid automatic repeat request (HARQ) mechanism, multiple measures are taken at the same time, which greatly improves the transmission efficiency and reliability of 5G signals under low temperature conditions, effectively reduces the data transmission delay and error rate.

[0020] 4. The signal verification module of the receiving end verification unit performs integrity verification on the received signal through a multi-stage error correction mechanism, marks the error data block, and the data reorganization module reorders and merges the block data according to the verification result, restores the original signal format, ensures the completeness and accuracy of the received data in a low-temperature environment, and guarantees the quality of data transmission, providing stable and reliable data transmission services for users.

[0021] 5. Through the cooperation and close cooperation between the units of the system, from signal acquisition, compensation, temperature regulation to transmission optimization, data verification and recovery, a complete and efficient anti-attenuation solution in a low-temperature environment is formed. Compared with a single technical means, this cooperative working mode can more comprehensively and effectively cope with the influence of the low-temperature environment on the performance of the embedded chip of the charging data line, greatly improving the overall performance and adaptability of the system. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0023] In the drawings: Figure 1 The structural block diagram of the low-temperature environment anti-attenuation system of the charging data line embedded chip of the present application; Figure 2 The flowchart of the 5G signal transmission method in the present application; Figure 3 The overall structure diagram of the charging data line in the present application; Figure 4 The cross-sectional structure diagram of the charging data line in the present application. DETAILED DESCRIPTION

[0024] The exemplary embodiments of the present disclosure will be described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present disclosure to help understanding, and should be considered only as exemplary. Therefore, those skilled in the art should recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Also, in order to be clear and concise, the description in the following description omits the description of well-known functions and structures.

[0025] The specific embodiments are given below.

[0026] As Figures 1-4As shown, the charging data line body includes a line body 5 and a connector 51, the line body 5 is connected with the connector 51, and the line body 5 and the connector 51 can be integrally formed or connected by plugging; the inner side of the connector 51 is provided with an embedded chip 52, and the embedded chip 52 integrates an anti-attenuation system; The charging data line body is composed of a line body and a connector, and the two are connected together to form a complete charging data line. The line body is the main channel for data and power transmission, which is usually composed of multiple wires, insulation layer, shielding layer, etc., which can ensure the stable transmission of signals and current. The connector is the interface for connecting the data line with external devices (such as mobile phones, computers, etc.), responsible for data interaction and power supply; The inner side of the connector is provided with an embedded chip, which is the core component for realizing the anti-attenuation function of the charging data line in a low-temperature environment. It can use BQ25703, SMB1396, SC1933C, etc. Control chip supporting PD, QC, SCP, VOOC, etc. Fast charging protocol.

[0027] The anti-attenuation system of the embedded chip of the charging data line in a low-temperature environment according to the embodiment of the application, first of all, the core system of the application includes a signal compensation unit, a temperature regulation unit, a signal transmission optimization unit and a receiving end verification unit. These units work together to realize efficient transmission and stability of signals in a low-temperature environment. The signal compensation unit compensates the signal in a low-temperature environment in real time through dynamic millimeter wave signal enhancement technology, which is composed of a signal monitoring module and a signal enhancement module. In actual operation, the signal monitoring module will collect signal strength, signal-to-noise ratio and current temperature data in real time, and generate dynamic characteristic labels. These labels not only contain the basic parameters of the signal, but also record the dynamic change trend in the low-temperature environment, providing a basis for subsequent signal compensation. The signal enhancement module is based on dynamic millimeter wave signal enhancement technology, which compensates for signal attenuation caused by low temperature by adjusting millimeter wave transmission power and phase offset; For example, in extremely cold conditions, if the signal strength is detected to drop below a certain threshold, the signal enhancement module will automatically increase the millimeter wave transmission power and redistribute the signal resources according to the calculation result of the phase offset, so as to ensure the integrity of the signal transmission. In addition, the module can also dynamically adjust the compensation strategy according to the temperature data in the dynamic characteristic label to adapt to different low-temperature environments.

[0028] The design of the temperature regulation unit is based on the thermoelectric effect, which optimizes the working temperature of the chip through the joint action of the micro-heating module and the adaptive temperature control algorithm. A signal transmission guarantee system in low-temperature environment is constructed through a multi-unit cooperative mechanism. A signal compensation unit is based on dynamic millimeter wave signal enhancement technology, adopts a signal monitoring and enhancement dual-module architecture, and uses adaptive signal processing theory to achieve accurate compensation. The signal monitoring module collects key parameters such as signal strength and signal-to-noise ratio, and temperature data in real time according to the communication system performance evaluation theory, constructs a dynamic feature tag combined with a pattern recognition algorithm, accurately captures the dynamic change trend of the signal in the low-temperature environment by using data processing methods such as Kalman filtering, and provides reliable data support for compensation. The signal enhancement module dynamically adjusts the millimeter wave transmission power through an adaptive power control algorithm based on electromagnetic field theory and microwave engineering principles, adjusts the phase offset by using phase modulation and beamforming technology, compensates for the attenuation problems such as dielectric loss and signal scattering caused by low temperature, for example, when low temperature changes the air dielectric constant and causes signal attenuation, the module automatically increases the transmission power and optimizes the phase according to the temperature-attenuation model in the dynamic feature tag, and continuously optimizes the compensation strategy according to the environmental changes by using reinforcement learning algorithm. The temperature control unit is based on the principle of thermoelectric effect such as Peltier effect, realizes accurate temperature control through the micro-heating module, and uses intelligent control theories such as fuzzy control and PID control to dynamically adjust the working parameters of the micro-heating module according to the deviation between the actual chip temperature and the preset working temperature range, so as to ensure the stable operation of the chip in the low-temperature environment and effectively improve the signal transmission performance and reliability of the system in the low-temperature scene.

[0029] As shown in the accompanying drawings Figure 1 , the micro-heating module is constructed by using thermoelectric materials, which can convert electrical energy into heat energy to increase the surface temperature of the chip. In actual application, the temperature control unit first calculates the deviation between the current chip surface temperature and the target temperature through the temperature data in the dynamic feature tag; Then, the output power of the micro-heating module is adjusted by using the adaptive temperature control algorithm to maintain the chip temperature in the optimal working interval. The specific formula of the algorithm is: Wherein, represents the output power of the micro-heating module; represents the basic power; , , respectively represent the proportional, integral and differential coefficients; represents the temperature deviation; represents the time. Through this algorithm, the system can dynamically adjust the heating power according to the temperature change to ensure that the chip is always in the best working state; When the temperature fluctuation exceeds the set threshold, the system will also trigger a double-loop feedback mechanism to dynamically adjust the heating power and the heat dissipation rate, thereby further improving the accuracy of temperature control.

[0030] The signal transmission optimization unit utilizes the improved adaptive modulation and coding (AMC-Plus) algorithm to significantly improve the transmission efficiency of 5G signals in low-temperature conditions. Specifically, the unit first selects the optimal modulation mode and coding rate based on the signal-to-noise ratio (SNR) data in the dynamic characteristic tag. Then, it introduces a low-temperature characteristic weight factor to adjust the modulation parameters to adapt to the low-temperature environment. The calculation formula of the weight factor is: wherein, represents the low-temperature characteristic weight factor; and represent the weight coefficients of temperature and SNR, respectively; and represent the current temperature and the optimal working temperature, respectively; and SNR represent the current SNR and the SNR threshold, respectively. Through this formula, the system can consider the changes in temperature and SNR and dynamically adjust the modulation parameters to achieve more efficient signal transmission in low-temperature environments. In addition, the signal transmission optimization unit also uses dynamic spectrum allocation technology to preferentially allocate high-quality frequency band resources and adopts the hybrid automatic repeat request (HARQ) mechanism to ensure the reliability of data transmission. For example, in a low-temperature environment, if the signal quality of a certain frequency band is detected to be declining, the system will automatically switch to other high-quality frequency bands to avoid signal loss caused by frequency band interference. The signal transmission optimization unit is based on the theory of cognitive radio and the principle of digital communication to build a spectrum adaptive management system in low-temperature environments. The dynamic spectrum allocation technology uses a multi-dimensional spectrum sensing algorithm combined with a channel characteristic model in low-temperature environments (such as a model of the ionospheric disturbance caused by low temperatures affecting high-frequency signals). It realizes the optimal allocation of spectrum resources through a Markov decision process. The system monitors the signal strength, bit error rate, Doppler shift, and other parameters of each frequency band in real time and establishes an environment-spectrum mapping relationship using a deep reinforcement learning algorithm. When it detects that the signal quality of a certain frequency band has decreased below the threshold due to low temperatures, it automatically triggers the spectrum switching mechanism and preferentially allocates frequency bands that are less affected by low temperatures (such as the millimeter wave frequency band, which has relatively stable propagation loss in low-temperature dry environments). The Hybrid Automatic Repeat Request (HARQ) mechanism integrates Chase combining and incremental redundancy techniques. Based on advanced coding theories such as Low-Density Parity-Check (LDPC) codes and Turbo codes, it improves decoding success rate at the receiver through a soft information combining algorithm. The system dynamically adjusts the number of HARQ processes and redundancy versions according to channel fading characteristics in low-temperature environments. For example, it increases redundancy and extends the retransmission window under extremely cold conditions. Simultaneously, it employs Adaptive Modulation and Coding (AMC) technology to select the optimal modulation order and coding rate based on real-time channel quality, achieving a balance between transmission reliability and spectral efficiency. Through collaborative optimization at the physical and link layers, it effectively resists adverse effects such as multipath fading and phase noise in low-temperature environments, ensuring the continuity and integrity of data transmission.

[0031] The receiver verification unit performs integrity verification on the received signal through a multi-level error correction mechanism and recovers the original data, as shown in the attached figure. Figure 1 As shown, the unit includes a signal verification module and a data reconstruction module. The signal verification module performs integrity verification on the received signal through a multi-level error correction mechanism and marks erroneous data blocks. For example, when there are errors in the received data packets, the signal verification module will analyze and mark the erroneous parts layer by layer according to the preset error correction rules, and the data reconstruction module will reorder and merge the block data according to the verification results to restore the original signal format. In practical applications, this process can effectively avoid signal loss or damage caused by low temperature environment, thereby ensuring high reliability of data transmission.

[0032] To further illustrate the actual operating principle and process of this invention, the following description is in conjunction with the appendix. Figure 2 The specific implementation steps of a 5G signal transmission charging data cable with low temperature resistance are described in detail. First, the system collects signal strength, signal-to-noise ratio and temperature data in real time through the signal monitoring module and generates dynamic feature tags. These tags contain key parameter information of the current environment, providing a basis for the operation of subsequent units. Next, the signal compensation unit performs real-time compensation for signals in low-temperature environments based on dynamic millimeter-wave signal enhancement technology; For example, in extremely cold conditions, if the signal strength is detected to drop below a certain threshold, the signal compensation unit will automatically adjust the millimeter wave transmission power and phase offset to compensate for the signal attenuation caused by low temperature, while the temperature regulation unit optimizes the working temperature of the chip through the micro-heating module and the adaptive temperature control algorithm. Specifically, the system first calculates the deviation between the current chip surface temperature and the target temperature, and adjusts the output power of the micro-heating module using the adaptive temperature control algorithm to maintain the chip temperature in the optimal working interval. When the temperature fluctuation exceeds the set threshold, the system will trigger a double-loop feedback mechanism to dynamically adjust the heating power and heat dissipation rate, thereby further improving the accuracy of temperature control. Subsequently, the signal transmission optimization unit uses the improved adaptive modulation and coding (AMC-Plus) algorithm to improve the transmission efficiency of 5G signals in low temperature conditions. The unit first selects the optimal modulation method and coding rate according to the signal-to-noise ratio data in the dynamic characteristic label, and introduces a weight factor based on low temperature characteristics to adjust the modulation parameters to adapt to the low temperature environment. In addition, the system also uses dynamic spectrum allocation technology to preferentially allocate high-quality frequency band resources, and uses the hybrid automatic repeat request (HARQ) mechanism to ensure the reliability of data transmission. Finally, the receiving end verification unit uses a multi-level error correction mechanism to verify the integrity of the received signal and recover the original data. For example, when there are errors in the received data packet, the signal verification module will analyze and mark the error part layer by layer according to the preset error correction rules, and then the data recombination module will reorder and merge the block data according to the verification result to recover the original signal format.

[0033] In actual application scenarios, the technical scheme of the present application can be widely applied to 5G communication equipment in extremely cold areas, such as polar research stations or high-altitude areas. Due to the extremely low environmental temperature, traditional 5G signal transmission equipment often has problems such as severe signal attenuation and low transmission efficiency. After using the system and method provided by the present application, the equipment can maintain stable signal transmission performance in low temperature environment, while significantly reducing energy consumption and maintenance cost. In addition, the present application can also be applied to vehicle charging equipment, especially in cold weather, the embedded chip of the vehicle charging data line needs to operate efficiently in low temperature environment. Through the signal compensation, temperature regulation and transmission optimization functions of the present system, the vehicle charging equipment can realize stable data transmission and fast charging in extreme conditions.

[0034] In summary, through the signal monitoring module of the signal compensation unit, real-time acquisition of signal strength, signal-to-noise ratio and temperature data is realized, combined with the signal enhancement module based on dynamic millimeter wave signal enhancement technology, which can dynamically adjust the millimeter wave transmission power and phase offset, accurately compensate the signal attenuation caused by low temperature, significantly improve the stability and reliability of the signal in low temperature environment, and effectively avoid the data transmission interruption or error caused by signal attenuation.

[0035] Through the temperature regulation unit, a micro-heating module is designed based on the thermoelectric effect, combined with an adaptive temperature control algorithm, which can calculate the deviation from the target temperature according to the real-time temperature data of the chip, and dynamically adjust through proportional, integral and differential coefficients, so that the chip temperature is stably maintained in the optimal working interval. When the temperature fluctuation exceeds the set threshold, a double-cycle feedback mechanism is triggered to dynamically adjust the heating power and heat dissipation rate, providing a stable working environment for the chip and reducing the performance degradation problem caused by low temperature, prolonging the service life of the chip.

[0036] Through the signal transmission optimization unit, an improved adaptive modulation and coding (AMC-Plus) algorithm is used to select the optimal modulation method and coding rate according to the signal-to-noise ratio data in the dynamic characteristic label, and a weight factor based on low temperature characteristics is introduced to adjust the modulation parameters. Combined with dynamic spectrum allocation technology, high-quality frequency band resources are preferentially allocated, and a hybrid automatic repeat request (HARQ) mechanism is used, which greatly improves the transmission efficiency and reliability of 5G signals in low temperature conditions, effectively reduces the data transmission delay and error rate.

[0037] The signal verification module of the receiving end verification unit verifies the integrity of the received signal through a multi-stage error correction mechanism, marking the error data block, and the data reorganization module reorders and merges the block data according to the verification result to restore the original signal format, ensuring the completeness and accuracy of the received data in low temperature environment, and ensuring the quality of data transmission, providing stable and reliable data transmission services for users.

[0038] Through the cooperation and close cooperation between the units of the system, from signal acquisition, compensation, temperature regulation to transmission optimization and data verification and recovery, a complete and efficient anti-attenuation solution in low temperature environment is formed. Compared with a single technical means, this cooperative working mode can more comprehensively and effectively cope with the influence of low temperature environment on the performance of the embedded chip of the charging data line, greatly improving the overall performance and adaptability of the system.

[0039] The above shows and describes the basic principles, main features and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A 5G signal transmission charging data line resistant to attenuation in a low temperature environment, characterized by: The system includes a charging data cable body and an anti-attenuation system, the anti-attenuation system being integrated into the charging data cable, and the anti-attenuation system comprising: Signal compensation unit (1), wherein the signal compensation unit (1) performs real-time compensation of signals in low-temperature environments through dynamic millimeter-wave signal enhancement technology; Temperature control unit (2), the temperature control unit (2) is designed with micro heating module based on thermoelectric effect, and combined with adaptive temperature control algorithm to optimize chip working temperature; The signal transmission optimization unit (3) uses the improved adaptive modulation and coding (AMC-Plus) algorithm to improve the transmission efficiency of 5G signals under low temperature conditions. The receiving end verification unit (4) performs integrity verification on the received signal and restores the original data through a multi-level error correction mechanism.

2. The anti-attenuation system according to claim 1, characterized in that: The signal compensation unit (1) includes a signal monitoring module (11) and a signal enhancement module (12). The signal monitoring module (11) collects signal strength, signal-to-noise ratio and temperature data in real time and generates dynamic feature tags. The signal enhancement module (12) is based on dynamic millimeter wave signal enhancement technology. It compensates for signal attenuation caused by low temperature by adjusting the millimeter wave transmission power and phase offset.

3. The anti-attenuation system according to claim 1, characterized in that: The temperature control unit (2) is designed with a micro-heating module based on the thermoelectric effect and combined with an adaptive temperature control algorithm to optimize the chip's operating temperature, including the following steps: S101: Micro-heating modules are constructed using thermoelectric materials to convert electrical energy into heat energy; S102: Calculate the deviation between the current chip surface temperature and the target temperature based on the temperature data in the dynamic feature label; S103: The output power of the micro-heating module is adjusted using an adaptive temperature control algorithm to keep the chip temperature within the optimal operating range; S104: When a temperature fluctuation is detected to exceed the set threshold, a dual-cycle feedback mechanism is triggered to dynamically adjust the heating power and heat dissipation rate.

4. The anti-attenuation system according to claim 3, characterized in that: The adaptive temperature control algorithm is as follows: in, This indicates the output power of the micro-heating module; Indicates the base power; , , These represent the proportional, integral, and differential coefficients, respectively. Indicates temperature deviation; Indicates time.

5. The anti-attenuation system according to claim 1, characterized in that: The signal transmission optimization unit (3) uses the improved adaptive modulation and coding (AMC-Plus) algorithm to improve the transmission efficiency of 5G signals under low temperature conditions, including the following steps: S201: Select the optimal modulation scheme and coding rate based on the signal-to-noise ratio data in the dynamic feature tags; S202: Introduce a weighting factor based on low-temperature characteristics to adjust the modulation parameters to adapt to the low-temperature environment; S203: Prioritize the allocation of high-quality frequency band resources through dynamic spectrum allocation technology; S204: Employs a Hybrid Automatic Repeat Request (HARQ) mechanism to ensure reliable data transmission.

6. The anti-attenuation system according to claim 5, characterized in that: The formula for calculating the weighting factor based on low-temperature characteristics is as follows: in, This represents the weighting factor for low-temperature characteristics; and These represent the weighting coefficients for temperature and signal-to-noise ratio, respectively. and These represent the current temperature and the optimal operating temperature, respectively; SNR and SNR These represent the current signal-to-noise ratio and the signal-to-noise ratio threshold, respectively.

7. The anti-attenuation system according to claim 1, characterized in that: The receiving end verification unit (4) includes a signal verification module (41) and a data reconstruction module (42). The signal verification module (41) performs integrity verification on the received signal through a multi-level error correction mechanism and marks erroneous data blocks. The data reconstruction module (42) reorders and merges the block data according to the verification results, and restores the original signal format.

8. A 5G signal transmission method for an embedded chip in a charging data cable, characterized in that: This method is applicable to the anti-attenuation system according to any one of claims 1-7; the method includes the following steps: S301: Real-time acquisition of signal strength, signal-to-noise ratio, and temperature data, and generation of dynamic feature labels; S302: Real-time compensation of signals in low-temperature environments through dynamic millimeter-wave signal enhancement technology; S303: A micro-heating module designed based on the thermoelectric effect, combined with an adaptive temperature control algorithm to optimize the chip's operating temperature; S304: Improve the transmission efficiency of 5G signals under low-temperature conditions by using the improved adaptive modulation and coding (AMC-Plus) algorithm; S305: Performs integrity verification on the received signal and recovers the original data through a multi-level error correction mechanism.

9. The 5G signal transmission method for an embedded chip in a charging data cable according to claim 8, characterized in that: The dynamic millimeter-wave signal enhancement technology proposed in step S302 compensates for signal attenuation caused by low temperature by adjusting the millimeter-wave transmission power and phase offset. The adaptive temperature control algorithm proposed in step S303 dynamically adjusts the temperature deviation through proportional, integral and derivative coefficients, and triggers a double-loop feedback mechanism when the temperature fluctuation exceeds the set threshold.

10. A 5G signal transmission charging data cable with attenuation resistance in low-temperature environments according to claim 1, characterized in that: The charging data cable body includes a cable body (5) and a connector (51). The cable body is connected to the connector. An embedded chip (52) is provided on the inner side of the connector. The embedded chip integrates the anti-attenuation system according to any one of claims 1-7.

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