Display panel, display device thereof and preparation method

Abstract

The embodiment of the invention provides a display panel, a display device thereof and a preparation method. The display panel comprises a first substrate, a cofferdam and a second substrate. A plurality of plasma cavities are defined by the cofferdams, and plasma particles are contained in the plasma cavities. The second substrate is located on the side, away from the first substrate, of the cofferdam. A gap exists between at least part of the cofferdam and the second substrate. The display area comprises a plurality of expansion supporting structures, and the expansion supporting structures are located between the first substrate and the second substrate. The side, facing the first substrate, of the expansion supporting structure is in contact with the first substrate or / and the cofferdam, and the side, away from the first substrate, of the expansion supporting structure is in contact with the second substrate, so that when the display panel is pressed, the expansion supporting structure provides supporting force, and the influence that the cofferdam is directly pressed to deform and the like is avoided; the pressure resistance of the display panel is improved, and the durability of the display panel is further improved.

Description

Technical Field

[0001] This application relates to the field of display technology, specifically to a display panel and its display device, and a method for manufacturing the same. Background Technology

[0002] Display devices include electronic paper products, which contain microcavities enclosed by dams. These microcavities contain plasma particles, and the display is achieved by controlling the movement of these plasma particles. Electronic paper is easily damaged by pressure; therefore, improving its pressure resistance is crucial for enhancing its performance. Summary of the Invention

[0003] In view of this, this application provides a display panel, a display device thereof, and a manufacturing method thereof to help solve the above problems.

[0004] In a first aspect, this application provides a display panel, the display panel comprising: First substrate; A cofferdam is located on one side of the first substrate, and the cofferdam surrounds and forms multiple plasma chambers, which contain plasma particles. The second substrate is located on the side of the dam away from the first substrate; in a direction perpendicular to the plane where the display panel is located, at least part of the dam and the second substrate have a gap. The display panel includes a display area and a bezel area, with the bezel area at least partially surrounding the display area; the display area includes a plurality of expansion support structures, which are located between a first substrate and a second substrate. The expansion support structure is in contact with the first substrate and / or the dam on the side facing the first substrate, and the expansion support structure is in contact with the second substrate on the side away from the first substrate.

[0005] Secondly, this application provides a display device, including a display panel as provided in the first aspect.

[0006] Thirdly, this application provides a method for manufacturing a display panel, used to manufacture the display panel as provided in the first aspect.

[0007] Fourthly, this application provides yet another method for preparing a display panel, used to prepare a display panel as provided in the first aspect.

[0008] In this embodiment, an expansion support structure is provided with one side facing the first substrate and in contact with the first substrate, and the side of the expansion support structure away from the first substrate in contact with the second substrate. Optionally, the expansion support structure can be prepared in a plasma cavity and mixed with plasma particles. After the second substrate is prepared, the display panel is heated to obtain an expanded support structure. At this time, the expansion support structure is in the plasma cavity, with the side facing the first substrate in contact with the first substrate, and the side of the expansion support structure away from the first substrate in contact with the second substrate. As can be seen from the above, there is a gap between the prepared dam and the second substrate. Here, the use of an expansion support structure in the display area ensures that the expansion support structure is in contact with both the first and second substrates on both sides in the vertical direction, thereby creating a complete support structure between the first and second substrates, compensating for at least part of the support failure space between the dam and the second substrate. This ensures that when the display panel is pressed, the expansion support structure provides support force, avoiding direct pressure on the dam and its deformation, thus improving the display panel's pressure resistance and durability.

[0009] Alternatively, the expansion support structure can be positioned such that the side facing the first substrate contacts the cofferdam, while the side away from the first substrate contacts the second substrate. Optionally, the expansion support structure can be fabricated together with the cofferdam while it is still a microstructure. Exemplarily, the fabrication process can be as follows: when fabricating the cofferdam on one side of the first substrate, a cofferdam fabrication material is first laid in a continuous layer on one side of the first substrate. Then, a layer of microstructures for fabricating the expansion support structure is laid on the continuous layer of cofferdam fabrication material. The microstructures are then cured together with the continuous layer of cofferdam fabrication material. It is understood that at this point, the surface of the continuous layer of cofferdam fabrication material includes portions of the microstructures embedded within it, as well as portions of the microstructures exposed outside the surface of the continuous layer of cofferdam fabrication material. The cured continuous layer of cofferdam fabrication material is then patterned to obtain the cofferdam.

[0010] After the second substrate is fabricated on the side of the cofferdam away from the first substrate, the display panel is heated, causing the microstructures to expand. The portion of the microstructure exposed outside the cofferdam still has the potential to expand, while the portion embedded inside the cofferdam does not expand significantly due to the cofferdam's constraint. Thus, at least a portion of the expansion support structure expands on the surface of the cofferdam away from the first substrate, allowing it to directly fill at least part of the gap between the cofferdam and the second substrate. This reduces the gap space between the cofferdam and the second substrate, improving the stability of the support structure between the first and second substrates and enhancing the display panel's compressive strength. Furthermore, by filling at least part of the gap between the cofferdam and the second substrate with the expansion support structure, the flow channel for plasma particles between adjacent plasma chambers is reduced, which helps to decrease the fluidity of plasma particles between adjacent plasma chambers and improves the uniformity and stability of plasma particles within the multiple plasma chambers 1.

[0011] On the other hand, fabricating the expansion support structure between the cofferdam and the second substrate helps to avoid fabricating the expansion support structure inside the plasma cavity, thereby avoiding the expansion support structure occupying the space inside the plasma cavity. This helps to ensure the pixel aperture ratio in the display area, avoid the expansion support structure occupying the display space inside the plasma cavity, and improve the display panel's compressive strength while also ensuring the display effect of the display panel.

[0012] Alternatively, the expansion support structure can be positioned such that its side facing the first substrate contacts both the first substrate and the surrounding dam, while its side away from the first substrate contacts the second substrate. Optionally, the expansion support structure is fabricated near the surrounding dam, which helps prevent it from being located near the center of the plasma cavity and affecting the display, thus reducing its impact on the display effect. Furthermore, fabricating the expansion support structure close to the surrounding dam ensures that its side closest to the first substrate contacts both the first substrate and the surrounding dam, enhancing the structural stability at the dam. The surrounding dam also limits the position of the expansion support structure, reducing sliding movement within the plasma cavity caused by pressure or other factors, thus ensuring the expansion support structure's compressive strength. Attached Figure Description

[0013] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a cross-sectional schematic diagram of a display panel provided in an embodiment of this application; Figure 2A cross-sectional schematic diagram of another display panel provided in this application; Figure 3 A cross-sectional schematic diagram of another display panel provided in this application; Figure 4 A structural comparison diagram provided for this application; Figure 5 A cross-sectional schematic diagram of yet another display panel provided in this application; Figure 6 Another structural comparison diagram provided for this application; Figure 7 A cross-sectional schematic diagram of yet another display panel provided in this application; Figure 8 A method provided for this application Figure 7 A plan view of the central display panel; Figure 9 A cross-sectional schematic diagram of another display panel provided in this application; Figure 10 A method provided for this application Figure 9 A plan view of the central display panel; Figure 11 A method provided for this application Figure 10 A partial schematic diagram of the central display panel; Figure 12 Another one provided for this application Figure 9 A plan view of the central display panel; Figure 13 A method provided for this application Figure 12 A partial schematic diagram of the central display panel; Figure 14 A cross-sectional schematic diagram of another display panel provided in this application; Figure 15 A schematic diagram of a display device provided in this application; Figure 16 A flowchart illustrating the fabrication process of a display panel provided in this application; Figure 17 A flowchart illustrating another method for manufacturing a display panel provided in this application; Figure 18 A flowchart illustrating another method for manufacturing a display panel provided in this application. Detailed Implementation

[0015] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0016] It should be understood that the described embodiments are only some embodiments of this application, and not all embodiments.

[0017] Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort, including new embodiments obtained by combining the various embodiments mentioned in this application without technical conflict, are within the scope of protection of this application.

[0018] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0019] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0020] In the description of this specification, it should be understood that the terms "substantially", "approximately", "about", "about", "generally", "largely" used in the claims and embodiments of this application refer to values ​​that can be generally agreed upon within a reasonable range of process operations or tolerances, rather than a precise value.

[0021] It should be understood that although terms such as "first," "second," etc., may be used to describe substrates, parts, etc., in the embodiments of this application, these should not be limited to these terms. These terms are only used to distinguish substrates, parts, etc. from each other. For example, without departing from the scope of the embodiments of this application, a first substrate may also be referred to as a second substrate, and similarly, a second substrate may also be referred to as a first substrate. Through careful and in-depth research, the applicant of this application has provided a solution to the problems existing in the prior art.

[0022] Figure 1 This is a cross-sectional schematic diagram of a display panel provided in an embodiment of this application. Figure 2 This is a cross-sectional schematic diagram of another display panel provided in this application. Figure 3 A cross-sectional schematic diagram of another display panel provided in this application.

[0023] This application provides a display panel 100, such as Figures 1-3As shown, the display panel 100 includes a first substrate 10 and a surrounding dam 20. The surrounding dam 20 is located on one side of the first substrate. The surrounding dam 20 surrounds and forms a plurality of plasma cavities 201, each containing plasma particles 202. In this embodiment, the display panel 100 is described as an electronic paper panel. The movement of the plasma particles 202 within the plasma cavities 201 enables the display of the display panel 100. Optionally, the first substrate 10 includes a circuit control structure that can be used to control the movement of the plasma particles 202 within the plasma cavities 201.

[0024] The display panel 100 also includes a second substrate 30, which is located on the side of the dam 20 away from the first substrate 10. In a direction perpendicular to the plane of the display panel 100, at least a portion of the dam 20 and the second substrate 30 have a gap. Taking the second substrate 30 as an example, which also includes a circuit control structure, the first substrate 10 and the second substrate 30 can provide an electric field for the plasma particles 202 on both sides of the dam 20, thereby controlling the movement of the plasma particles 202.

[0025] Combination Figure 1 As shown, taking the first substrate 10 located on the side of the dike 20 facing the backlight surface of the display panel 100 as an example, during the fabrication process, the dike 20 and the first substrate 10 are fixed together. Then, the second substrate 30 is fabricated on the side of the dike 20 away from the first substrate 10. However, due to process errors and other reasons during the fabrication of the second substrate 30, there may be some gaps between the second substrate 30 and the dike 20. The second substrate 30 cannot be completely sealed and bonded to the side of the dike 20 away from the first substrate 10, resulting in some support failure spaces between the second substrate 30 and the dike 20. This also affects the compressive strength of the display panel 100 and can easily cause the plasma particles 202 in two adjacent plasma cavities 201 to move around, which is not conducive to ensuring the uniformity of the plasma particles 202 in each plasma cavity 201.

[0026] The display panel 100 includes a display area A1 and a bezel area A2, with the bezel area A2 at least partially surrounding the display area A1. A second substrate 30 can be fixed to the first substrate 10 via a frame adhesive 40 in the bezel area A2. The height of the frame adhesive within the bezel area A2 can be slightly higher than the height of the surrounding dam 20 within the display area A1, thereby structurally fixing the second substrate 30 to the first substrate 10 on the side of the surrounding dam 20 away from the first substrate 10. Plasma particles 202 are all located within the display area A1 for display purposes.

[0027] To improve the compressive strength of the display panel 100, a plurality of expansion support structures 50 are proposed to be included in the display area A1, with the expansion support structures 50 located between the first substrate 10 and the second substrate 30. The expansion support structures 50 can be used to support between the first substrate 10 and the second substrate 30, reducing the degree of deformation of the dam 20 caused by pressing and improving the compressive strength of the display panel 100.

[0028] It should be noted that the expansion support structure 50 is a small microstructure before expansion, which can be prepared in advance within the display area A1 during the preparation of the cofferdam 20 or the preparation of the plasma particles 202. Then, the second substrate 30 is prepared to encapsulate and fix the stacked structure of the first substrate 10, the cofferdam 20, and the second substrate 30. After the second substrate 30 is prepared, the microstructure located within the display area A1 is expanded and enlarged under external heating or other conditions, thereby forming the expansion support structure 50 within the display area A1.

[0029] In the embodiments of this application, such as Figure 1 As shown, the expansion support structure 50 is positioned so that its side facing the first substrate 10 is in contact with the first substrate 10, and its side away from the first substrate 10 is in contact with the second substrate 30. Optionally, the expansion support structure 50 can be fabricated within the plasma cavity 201 and mixed with plasma particles 202. After the second substrate 30 is fabricated, the display panel 100 is heated to obtain an expanded support structure. At this point, the expansion support structure 50 is within the plasma cavity 201, with its side facing the first substrate 10 in contact with the first substrate 10, and its side away from the first substrate 10 in contact with the second substrate 30. Based on the above, it can be seen that there is a gap between the fabricated dam 20 and the second substrate 30. Here, the expansion support structure 50 is used within the display area A1 so that the expansion support structure 50 is in contact with both the first substrate 10 and the second substrate 30 on both sides in the vertical direction, thereby creating a complete support structure between the first substrate 10 and the second substrate 30, compensating for at least part of the support failure space between the dam 20 and the second substrate 30. This design ensures that when the display panel 100 is pressed, the expansion support structure 50 provides support, preventing direct pressure on the dam 20 and its deformation, thus improving the pressure resistance of the display panel 100 and consequently enhancing its durability.

[0030] Or, such as Figure 2As shown, the expansion support structure 50 is positioned so that its side facing the first substrate 10 contacts the cofferdam 20, and its side away from the first substrate 10 contacts the second substrate 30. Optionally, the expansion support structure 50 can be fabricated together with the cofferdam 20 while it is still a microstructure. Exemplarily, the fabrication process can be as follows: when fabricating the cofferdam 20 on one side of the first substrate 10, a material for fabricating the cofferdam 20 is first laid in a single layer on one side of the first substrate 10. Then, a layer of microstructures for fabricating the expansion support structure 50 is laid on the single layer of the cofferdam 20 material. The microstructures are then cured together with the single layer of the cofferdam 20 material. It is understood that at this point, the surface of the single layer of the cofferdam 20 material includes portions of the microstructures embedded within it, and portions of the microstructures are exposed outside the surface of the single layer of the cofferdam 20 material. The cured single layer of the cofferdam 20 material is then patterned to obtain the cofferdam 20.

[0031] After the second substrate 30 is fabricated on the side of the cofferdam 20 away from the first substrate 10, the display panel 100 is heated, causing the microstructures to expand and enlarge. (Continue to refer to...) Figure 2 As shown, the portion of the microstructure exposed outside the dam 20 still has the potential to expand, while the portion embedded inside the dam 20 does not expand significantly due to the constraint of the dam 20. Thus, at least a portion of the expansion support structure 50 expands on the surface of the dam 20 away from the first substrate 10, allowing the expansion support structure 50 to directly fill at least a portion of the gap between the dam 20 and the second substrate 30, reducing the gap space between the dam 20 and the second substrate 30, thereby improving the stability of the support structure between the first substrate 10 and the second substrate 30 and enhancing the compressive strength of the display panel 100. Furthermore, after filling at least a portion of the gap between the dam 20 and the second substrate 30 with the expansion support structure 50, the flow channel of plasma particles 202 between two adjacent plasma chambers 201 is reduced, which helps to reduce the fluidity of plasma particles 202 between two adjacent plasma chambers 201 and improves the uniformity and stability of plasma particles 202 within the multiple plasma chambers 201.

[0032] On the other hand, such as Figure 2 As shown, the expansion support structure 50 is fabricated between the cofferdam 20 and the second substrate 30, which helps to avoid fabricating the expansion support structure 50 inside the plasma cavity 201, thereby avoiding the expansion support structure 50 occupying the space inside the plasma cavity 201. This helps to ensure the pixel aperture ratio in the display area A1, avoids the expansion support structure 50 occupying the display space inside the plasma cavity 201, and ensures the display effect of the display panel 100 while improving the compressive strength of the display panel 100.

[0033] Or, such as Figure 3 As shown, the expansion support structure 50 is positioned such that the side facing the first substrate 10 contacts both the first substrate 10 and the surrounding dam 20, while the side away from the first substrate 10 contacts the second substrate 30. Optionally, the expansion support structure 50 is positioned close to the surrounding dam 20, which helps to prevent the expansion support structure 50 from being located near the center inside the plasma cavity 201 and affecting the display, thus reducing the impact of the expansion support structure 50 on the display effect. Furthermore, the expansion support structure 50 is positioned close to the surrounding dam 20, so that the side of the expansion support structure 50 closest to the first substrate 10 contacts both the first substrate 10 and the surrounding dam 20. This enhances the structural stability at the surrounding dam 20, and the surrounding dam 20 limits the position of the expansion support structure 50, reducing sliding movement of the expansion support structure 50 within the plasma cavity 201 caused by pressing or other factors, thus ensuring the compressive strength of the expansion support structure 50.

[0034] In one embodiment of this application, reference continues to be made to... Figure 1 As shown, at least a portion of the expansion support structure 50 is located within the plasma cavity 201, which facilitates the contact between the expansion support structure 50 and the first substrate 10 and the second substrate 30 on opposite sides in the direction perpendicular to the display panel 100. Since the plasma cavity 201 does not include supporting structures such as the dike 20, the use of the expansion support structure 50 within the plasma cavity 201 helps to increase the structural support points within the display area A1, thereby improving the compressive strength of the display panel 100.

[0035] Of course, in some other embodiments, an expansion support structure 50 can be prepared in the plasma cavity 201 within the display area A1, as well as between the dam 20 and the second substrate 30.

[0036] In one embodiment of this application, reference continues to be made to... Figure 1 As shown, along the plane perpendicular to the display panel 100, the height H1 of the expansion support structure 50 is greater than the height H2 of the dam 20. This helps to compensate for the space lacking an effective support structure caused by the gap between the dam 20 and the expansion support structure 50, allowing the second substrate 30 to contact the expansion support structure 50 first when the display panel 100 is pressed. The expansion support structure 50 forms a support structure between the first substrate 10 and the second substrate 30. This helps to avoid and alleviate the structural support pressure on the dam 20, reduce the pressure on the dam 20 during pressing, reduce the risk of deformation of the dam 20 due to pressure, and improve the structural and operational stability of the display panel 100.

[0037] It should be noted that when selecting an expansion support structure 50 with a height H1 greater than the height H2 of the dam 20 in the display panel 100, the expansion support structure 50 can be selected to expand to a height slightly greater than the distance between the first substrate 10 and the second substrate 30 within a feasible range. Thus, when the microstructure expands into the expansion support structure 50 within the display panel 100, the expansion support structure 50, with a height slightly greater than the distance between the first substrate 10 and the second substrate 30, is compressed by the first substrate 10 and the second substrate 30. Combined with... Figure 1 As shown, the portion of the expansion support structure 50 that contacts the first substrate 10 is not just a vertex or a small top area, but a planar contact with a slightly larger area. Furthermore, the portion of the expansion support structure 50 that contacts the second substrate 30 is also a planar contact, which helps improve the structural stability and support of the expansion support structure 50 within the plasma cavity 201.

[0038] Figure 4 A comparative structural diagram is provided for this application.

[0039] In one embodiment of this application, such as Figure 4 As shown, the example here is a partially expanded support structure 50 prepared within the plasma cavity 201.

[0040] Combination Figure 4 As shown in Figure (1), the membrane layer containing the cofferdam 20 is filled with an expanding microstructure 501. The expanding microstructure 501 represents the state before the expanding support structure 50 expands. The expanding microstructure 501 is the microstructure state of the expanding support structure 50 mentioned above before it expands. The expanding microstructure 501 can be doped with plasma particles 202 and then filled together in the plasma cavity 201.

[0041] Before the second substrate 30 is fabricated, the expansion microstructure 501 within the plasma cavity 201 has not yet expanded. Figure 4 As shown in Figure (2), after the second substrate 30 is fabricated, external conditions such as heating are used to give the expansion microstructure 501 the conditions to expand and enlarge it, so that it becomes the expansion support structure 50. The expansion support structure 50 is in contact with the first substrate 10 and the second substrate 30.

[0042] In this embodiment, the ratio between the total volume of the expanded microstructures 501 filling the membrane layer where the cofferdam 20 is located and the total volume of the plasma particles 202 is between 0.1% and 10%. This is beneficial for quantifying the expanded microstructures 501 in the plasma cavity 201, avoiding an excessive number of expanded microstructures 501 in the plasma cavity 201, thereby preventing the expanded support structure 50 from occupying too much space in the plasma cavity 201 after the expanded microstructures 501 expand and become larger, reducing the impact of the expanded support structure 50 on the pixel opening, and ensuring the display effect of the display panel 100.

[0043] Figure 5 A cross-sectional schematic diagram of another display panel provided in this application.

[0044] In one embodiment of this application, such as Figure 2 As shown, the expansion support structure 50 is fabricated between the dam 20 and the second substrate 30. At least a portion of the expansion support structure 50 overlaps with the dam 20 in a direction perpendicular to the plane of the display panel 100, and is located on the side of the dam 20 away from the first substrate 10. This allows the side of the expansion support structure 50 facing the first substrate 10 to be disconnected from the dam 20, while the side of the expansion support structure 50 away from the first substrate 10 contacts the second substrate 30. The expansion support structure 50 can be used to support the gap space between the surface of the dam 20 away from the first substrate 10 and the second substrate 30, which is beneficial to improving the structural stability of the dam 20 and the compressive strength of the display panel 100. Furthermore, it helps to reduce the impact of the expansion support structure 50 occupying the pixel opening area within the plasma cavity 201, ensuring the usable display area of ​​the display area A1. The expansion support structure 50, which overlaps with the cofferdam 20, can also be used to fill at least part of the gap between the cofferdam 20 and the second substrate 30, thereby reducing the flow of plasma particles 202 in two adjacent plasma chambers 201 through the gap and improving the uniformity of plasma particles 202 in multiple plasma chambers 201.

[0045] Or, such as Figure 5 As shown, an expansion support structure 50 is included in the plasma chamber 201 and between the dam 20 and the second substrate 30. At least a portion of the expansion support structure 50 overlaps with the dam 20 in the direction perpendicular to the plane where the display panel 100 is located, and is located on the side of the dam 20 away from the first substrate 10. This is beneficial to further improve the compressive strength of the display panel 100 and make the working performance of the display panel 100 stable.

[0046] Figure 6 This is another structural comparison diagram provided for this application.

[0047] In one embodiment of this application, such as Figure 6As shown, on the cofferdam 20, at least a portion of an expansion support structure 50 is embedded within the cofferdam 20 and at least a portion protrudes from the surface of the cofferdam 20 away from the first substrate 10.

[0048] Based on the above, it can be seen that when the expansion support structure 50 is located between the cofferdam 20 and the second substrate 30, as... Figure 6 As shown in Figure (1), the expanded microstructure 501 can be fabricated on the surface of the dam 20 away from the first substrate 10. The expanded microstructure 501 is fabricated before the material for fabricating the dam 20 is cured. The material for fabricating the dam 20 can be first laid in a whole layer on the surface of the first substrate 10, and then a certain amount of expanded microstructure 501 can be laid on the surface of the material for fabricating the dam 20 away from the first substrate 10. The expanded microstructure 501 is fabricated after the material for fabricating the dam 20 is laid in a whole layer, allowing the portion of the expanded microstructure 501 on the side closest to the material for fabricating the dam 20 to adhere to or be partially embedded in the material, while the portion of the expanded microstructure 501 on the side away from the material for fabricating the dam 20 is exposed. After curing the material for fabricating the dam 20 in this way, the portion of the expanded microstructure 501 embedded within the dam 20 is also fixed together with the dam 20. Next, the solidified, fully laid cofferdam 20 material is patterned to obtain the cofferdam 20 structure. This structure is now... Figure 6 In Figure (1), part of the expanded microstructure 501 is embedded in the dam 20, and part of the structure is exposed on the side of the dam 20 facing the second substrate 30.

[0049] Then, a second substrate 30 is fabricated on the side of the cofferdam 20 away from the first substrate 10, at which point a gap still exists between the second substrate 30 and the cofferdam 20. Furthermore, the expanded microstructure 501 exposed on the side of the cofferdam 20 away from the first substrate 10 has not yet expanded, and at this point, the expanded microstructure 501 may not be sufficient to fill the gap between the cofferdam 20 and the second substrate 30. At this time, it is as follows... Figure 6 As shown in Figure (2), there is an expansion microstructure 501 partially embedded inside the cofferdam 20 between the second substrate 30 and the cofferdam 20.

[0050] Next, as Figure 6 As shown in Figure (3), external conditions such as heating are applied to the display panel 100 at this time, so that the expansion microstructure 501 can expand and enlarge to obtain the expansion support structure 50. The part of the expansion support structure 50 embedded in the dam 20 will not expand significantly due to the influence of the solidified dam 20, while the part exposed between the dam 20 and the second substrate 30 will expand due to heat, so that it comes into contact with the second substrate 30.

[0051] In this embodiment, an expansion support structure 50 is at least partially embedded within the dam 20 and at least partially protrudes from the surface of the dam 20 away from the first substrate 10. This facilitates the support of the expansion support structure 50 between the second substrate 30 and the dam 20, improving the compressive strength of the display panel 100. It also helps to fix the expansion support structure 50 using the dam 20, preventing it from sliding within the display area A1, thereby further improving the reliability of the expansion support structure 50.

[0052] Figure 7 This is a cross-sectional schematic diagram of another display panel provided in this application. Figure 8 A method provided for this application Figure 7 A plan view of the central display panel.

[0053] In one embodiment of this application, such as Figure 7 As shown, the cofferdam 20, on the side away from the display area A1, includes a frame adhesive 40. The frame adhesive 40 surrounds the display area A1, and the height H3 of the frame adhesive 40 in the direction perpendicular to the plane of the display panel 100 is equal to the distance between the first substrate 10 and the second substrate 30. The frame area A2 at least partially surrounds the display area A1, and it can be considered that the frame adhesive 40 is formed within the frame area A2. The frame adhesive 40 can be used to fix the second substrate 30 to the first substrate 10, improving the stability of the structure. Figure 8 As shown in this embodiment, the frame adhesive 40 is arranged around the display area A1, which helps to improve the stability of the frame adhesive 40 in fixing the first substrate 10 and the second substrate 30. Due to process errors, there is a gap between the dam 20 and the second substrate 30. It can be deduced that the height H3 of the frame adhesive 40 in the plane perpendicular to the display panel 100 is greater than the height H2 of the dam 20 perpendicular to the display panel 100.

[0054] When at least a portion of the expanded microstructure 501 is fabricated within the plasma cavity 201, the expanded microstructure 501 expands and enlarges within the plasma cavity 201 to form an expanded support structure 50. The expanded support structure 50 compresses the space within the plasma cavity 201, causing some of the plasma particles 202 that were originally mixed and filled in the same plasma cavity 201 with the expanded microstructure 501 to be squeezed out of the plasma cavity 201. From the perspective of the entire display area A1, multiple expanded support structures 501 will squeeze the plasma particles 202 in multiple plasma cavities 201 out of their respective plasma cavities 201, thereby causing the plasma particles 202 in the display area A1 to flow out of the display area A1.

[0055] If the plasma particles 202 do not have a space to flow within the display panel 100, the expansion microstructure 501 will expand and form the expansion support structure 50. This could lead to the expansion support structure 50 and the squeezed plasma particles 202 causing the structure between the first substrate 10 and the second substrate 30 to be squeezed and deformed.

[0056] In this embodiment, a drainage channel 60 is provided between the frame adhesive 40 and the outermost dike 20 of the display area A2. This allows the plasma particles 202 within the display area A1 to flow into the drainage channel 60 after being compressed by the expansion support structure 50, providing a certain flow space for the plasma particles 202 between the first substrate 10 and the second substrate 30, thus reducing the risk of the plasma particles 202 deforming the space between the first substrate 10 and the second substrate 30.

[0057] It should be noted that the solution provided in this application embodiment can be applied to situations where at least a portion of the expansion support structure 50 is fabricated within the plasma cavity 201. It is also applicable to solutions where the expansion support structure 50 is fabricated within the plasma cavity 201 and also between the cofferdam 20 and the second substrate 30, as well as other solutions where the expansion support structure 50 would compress the space occupied by the plasma particles 202.

[0058] Figure 9 This is a cross-sectional schematic diagram of another display panel provided in this application. Figure 10 A method provided for this application Figure 9 A plan view of the central display panel.

[0059] In one embodiment of this application, combined with Figure 9 , Figure 10 As shown, the surface of the cofferdam 20 facing the second substrate 30 includes a groove 70. As mentioned above, when the expansion support structure 50 in the plasma chamber 201 compresses the space where the plasma particles 202 are located, some of the plasma particles 202 will flow out of the plasma chamber 201.

[0060] In this embodiment, the surface of the dam 20 facing the second substrate 30 includes a groove 70. The dam 20 structure forms a series of plasma cavities 201, so the dam 20 is the sidewall of the plasma cavity 201. The groove 70 on the surface of the dam 20 facing the second substrate 30 facilitates the flow of plasma particles 202 from the plasma cavities 201 through the gap between the dam 20 and the second substrate 30. This prevents the plasma particles 202 from flowing between the multiple plasma cavities 201. It also provides sufficient flow space for the plasma particles 202, reducing the risk of deformation of the structure between the first substrate 10 and the second substrate 30 due to the expanding support structure and the compressed plasma particles 202, thus improving the structural stability of the display panel 100.

[0061] Figure 11 A method provided for this application Figure 10 A partial schematic diagram of the central display panel.

[0062] In one embodiment of this application, reference continues to be made to... Figure 10 , Figure 11 As shown, the cofferdam 20 has a mesh structure, and the multiple holes in the mesh structure are the multiple plasma chambers 201 enclosed by the cofferdam 20. (Combined with...) Figure 12 As shown, the cofferdam 20 includes a first part 20A and a second part 20B connected together. The first part 20A is located between two adjacent plasma chambers 201, and the extension length of the first part 20A is equal to that of the sidewall of the adjacent plasma chamber 201. The first part 20A can serve as a sidewall that acts as a spacer between two adjacent plasma chambers 201. The second part 20B is located at the connection of multiple first parts 20A.

[0063] In the embodiments of this application, such as Figure 11 As shown, the first part 20A includes a groove 70, with the opening of the groove 70 facing the second substrate 30. It can be seen that the structure of the first part 20A on the cofferdam 20 has a certain continuity, a large usable space, and the largest contact area with the adjacent plasma chamber 201. Providing the groove 70 on the first part 20A facilitates the smooth flow of plasma particles 202 towards the groove 70 and also increases the usable space of the prepared groove 70. The second part 20B is located at the connection point of multiple first parts 20A and serves as the main support point for fixing the cofferdam 20. The absence of the groove 70 at the second part 20B helps ensure the structural stability of the cofferdam 20.

[0064] Figure 12 Another one provided for this application Figure 9 A plan view of the central display panel. Figure 13 A method provided for this application Figure 12 A partial schematic diagram of the central display panel.

[0065] In one embodiment of this application, combined with Figure 12 , Figure 13 As shown, the cofferdam 20 has a mesh structure. The cofferdam 20 includes a first part 20A and a second part 20B connected together. The first part 20A is located between two adjacent plasma chambers 201, and the extension length of the first part 20A is equal to that of the sidewall of the adjacent plasma chamber 201; the first part 20A can serve as a sidewall between two adjacent plasma chambers 201. The second part 20B is located at the connection point of multiple first parts 20A.

[0066] In this embodiment, both the first part 20A and the second part 20B include grooves 70, and the openings of the grooves 70 face the second substrate 30. Furthermore, the grooves 70 of the first part 20A and the second part 20B are connected, meaning that the entire structure of the cofferdam 20 includes grooves 70 opening towards the second substrate 30. This improves the available space for the plasma particles 202 to flow after being compressed by the expansion support structure 50, further reducing the risk of the expansion support structure 50 and the plasma particles 202 compressing and deforming the structure between the first substrate 10 and the second substrate 30.

[0067] Figure 14 A cross-sectional schematic diagram of another display panel provided in this application.

[0068] In one embodiment of this application, such as Figure 14 As shown, at least a portion of the expansion support structure 50 is the same color as at least a portion of the plasma particles 202. When the display panel 100 is an electronic paper product, the plasma particles 202 included in the plasma cavity 201 can be a mixture of black and white, or include colored plasma particles 202. In this embodiment, the example of the plasma cavity 201 including black plasma particles 202 and white plasma particles 202 will be described. When selecting the expansion support structure 50, a portion of the expansion support structure 50 can be white, and a portion of the expansion support structure 50 can be black. In this way, when the expansion support structure 50 is located within the display area A1, the color of the expansion support structure 50 is the same as the color of a certain type of plasma particle 202, which can enhance the reflectivity of that color. For example, enhancing the white reflectivity or the black reflectivity can reduce the impact of the expansion support structure 50 on the display.

[0069] The expansion support structure 50 includes an inner layer and an outer layer. When the material of the expansion microstructure 501 is heated, the outer layer of the expansion microstructure 501 softens, and the inner layer expands, causing the entire expansion microstructure 501 to expand and become the expansion support structure 50. For example, the material of the inner layer of the expansion support structure 50 includes one of isobutane, propane, and n-pentane, and the material of the outer layer includes one of acrylic resin, vinylidene chloride copolymer, polypropylene resin, polystyrene, and styrene-propylene copolymer.

[0070] In addition, a crosslinking agent material can be placed in the outer layer of the expansion support structure 50, which helps to enhance the pressure resistance of the outer layer and prevent the expansion support structure 50 from cracking prematurely.

[0071] Figure 15 This is a schematic diagram of a display device provided in this application.

[0072] This application provides a display device 200, such as... Figure 15As shown, the display device 200 includes a display panel 100 as provided in any of the above embodiments.

[0073] In the display device 200, an expansion support structure 50 is provided with its side facing the first substrate 10 in contact with the first substrate 10, and its side away from the first substrate 10 in contact with the second substrate 30. Optionally, the expansion support structure 50 can be fabricated within the plasma chamber 201 and mixed with plasma particles 202. After the second substrate 30 is fabricated, the display panel 100 is heated to obtain an expanded expansion support structure. At this time, the expansion support structure 50 is within the plasma chamber 201, with its side facing the first substrate 10 in contact with the first substrate 10, and its side away from the first substrate 10 in contact with the second substrate 30. As described above, a gap exists between the prepared dam 20 and the second substrate 30. Here, an expansion support structure 50 is used within the display area A1, ensuring that the expansion support structure 50 contacts both the first substrate 10 and the second substrate 30 on both sides in the vertical direction. This creates a complete support structure between the first substrate 10 and the second substrate 30, compensating for at least part of the support failure space between the dam 20 and the second substrate 30. When the display panel 100 is pressed, the expansion support structure 50 provides support force, preventing direct pressure on the dam 20 and its deformation, thus improving the pressure resistance and durability of the display panel 100.

[0074] Alternatively, the expansion support structure 50 can be positioned such that the side facing the first substrate 10 contacts the dike 20, and the side of the expansion support structure 50 away from the first substrate 10 contacts the second substrate 30. Optionally, the expansion support structure 50 can be fabricated together with the dike 20 while it is still a microstructure. Exemplarily, the fabrication process can be as follows: when fabricating the dike 20 on one side of the first substrate 10, a material for fabricating the dike 20 is first laid in a continuous layer on one side of the first substrate 10. Then, a layer of microstructures for fabricating the expansion support structure 50 is laid on the continuous layer of material for fabricating the dike 20. The microstructures are then cured together with the continuous layer of material for fabricating the dike 20. It is understood that at this point, the surface of the continuous layer of material for fabricating the dike 20 includes portions of the microstructures embedded within it, as well as portions of the microstructures exposed outside the surface of the continuous layer of material for fabricating the dike 20. The cured continuous layer of material for fabricating the dike 20 is then patterned to obtain the dike 20.

[0075] After the second substrate 30 is fabricated on the side of the cofferdam 20 away from the first substrate 10, the display panel 100 is heated, causing the microstructures to expand and enlarge. (Continue to refer to...) Figure 2As shown, the portion of the microstructure exposed outside the dam 20 still has the potential to expand, while the portion embedded inside the dam 20 does not expand significantly due to the constraint of the dam 20. Thus, at least a portion of the expansion support structure 50 expands on the surface of the dam 20 away from the first substrate 10, allowing the expansion support structure 50 to directly fill at least a portion of the gap between the dam 20 and the second substrate 30, reducing the gap space between the dam 20 and the second substrate 30, thereby improving the stability of the support structure between the first substrate 10 and the second substrate 30 and enhancing the compressive strength of the display panel 100. Furthermore, after filling at least a portion of the gap between the dam 20 and the second substrate 30 with the expansion support structure 50, the flow channel of plasma particles 202 between two adjacent plasma chambers 201 is reduced, which helps to reduce the fluidity of plasma particles 202 between two adjacent plasma chambers 201 and improves the uniformity and stability of plasma particles 202 within the multiple plasma chambers 201.

[0076] On the other hand, by placing the expansion support structure 50 between the cofferdam 20 and the second substrate 30, it is beneficial to avoid placing the expansion support structure 50 inside the plasma cavity 201, thereby avoiding the expansion support structure 50 occupying the space inside the plasma cavity 201. This helps to ensure the pixel aperture ratio in the display area A1, avoids the expansion support structure 50 occupying the display space inside the plasma cavity 201, and ensures the display effect of the display panel 100 while improving the compressive strength of the display panel 100.

[0077] Alternatively, the expansion support structure 50 can be positioned such that its side facing the first substrate 10 contacts both the first substrate 10 and the containment dam 20, while its side away from the first substrate 10 contacts the second substrate 30. Optionally, the expansion support structure 50 is positioned close to the containment dam 20, which helps prevent its location near the center of the plasma cavity 201 from affecting the display and reduces its impact on the display effect. Furthermore, positioning the expansion support structure 50 close to the containment dam 20, so that its side closest to the first substrate 10 contacts both the first substrate 10 and the containment dam 20, enhances the structural stability at the containment dam 20. The containment dam 20 also limits the position of the expansion support structure 50, reducing sliding movement within the plasma cavity 201 caused by pressure or other factors, thus ensuring the compressive strength of the expansion support structure 50.

[0078] Figure 16 This application provides a flowchart of the manufacturing process for a display panel.

[0079] This application provides a method for manufacturing a display panel 100, which is used to manufacture the display panel 100 provided in the above embodiments. Figure 16 As shown, the preparation method includes: S1: Provide a first substrate 10. The first substrate 10 may be a pre-fabricated film layer including a circuit structure, which can control the movement of plasma particles 202 within the plasma cavity 201.

[0080] S2: A dam 20 is formed on one side of the first substrate 10. Optionally, the resulting dam 20 is mesh-like and includes multiple plasma cavities 201.

[0081] S3: Provide a premixed material 80, which includes a mixture of expanded microstructures 501 and plasma particles 202. At this stage, the expanded microstructures 501 are small in volume and have not yet expanded. The expanded microstructures 501 and plasma particles 202 are first mixed in a certain proportion to obtain the premixed material 80. The premixing can be carried out according to the ratio of the total volume of the expanded microstructures 501 filling the membrane layer of the cofferdam 20 to the total volume of the plasma particles 202, which is between 0.1% and 10%.

[0082] S4: Fill the plasma cavity 201 with premixed material 80. At this time, at least part of the plasma cavity 201 contains both plasma particles 202 and expanded microstructures 501. To ensure the smooth fabrication of the second substrate 30, expansion conditions are not applied to the expanded microstructures 501 at this time.

[0083] S5: A second substrate 30 is prepared on the side of the cofferdam 20 away from the first substrate 10 to obtain a sub-display structure 100A. The first substrate 10 and the second substrate 30 are bonded together with frame adhesive 40. At this time, the frame adhesive 40 bonds and fixes the first substrate 10 and the second substrate 30 together, but there is still a certain gap between the cofferdam 20 and the second substrate 30.

[0084] S6: The sub-display structure 100A is heated using a preset temperature. Optionally, the preset temperature is a temperature that allows the expansion microstructure 501 to expand to a preset height. This facilitates applying the preset temperature to the sub-display structure 100A according to the desired height of the expansion microstructure 501, thereby more accurately obtaining the adaptive expansion support structure 50. The expansion microstructure 501 expands upon heating to become the expansion support structure 50. Alternatively, when setting the expansion microstructure 501, a material with a high threshold temperature for expansion can be selected for fabrication, for example, greater than 60°C. This ensures that the expansion microstructure 501 expands to the target height of the expansion support structure 50 during the product manufacturing stage. During normal product use, the product heat generated or the temperature of the normal environment will not cause secondary expansion of the expansion support structure 50, improving the reliability of the expansion support structure 50.

[0085] Figure 17 A flowchart illustrating another method for fabricating a display panel provided in this application. Figure 18 A flowchart illustrating another method for manufacturing a display panel provided in this application.

[0086] This application provides yet another method for manufacturing a display panel 100, which is used to manufacture the display panel 100 provided in the above embodiments. For example... Figure 17 , Figure 18 As shown, the preparation method includes: B1: Provides a first substrate 10.

[0087] B2: Lay the initial cofferdam layer 20' on one side of the first substrate 10.

[0088] B3: Expanded microstructures 501 are fabricated on the surface of the initial cofferdam layer 20', with gaps between adjacent expanded microstructures 501, exposing the initial cofferdam layer 20'. Fabricating the expanded microstructures 501 above the initial cofferdam layer 20' allows for a relatively scattered fabrication on its surface, ensuring that the gaps between adjacent expanded microstructures 501 expose the initial cofferdam layer 20', rather than completely covering it. This helps reduce the risk of adjacent expanded microstructures 501 becoming severely compressed together during subsequent expansion stages.

[0089] Since the initial cofferdam layer 20' has not yet been solidified, the material on the surface of the initial cofferdam layer 20' will have some of the expanded microstructures 501 embedded in the initial cofferdam layer 20', and some of the structures exposed outside the initial cofferdam layer 20'.

[0090] B4: The initial cofferdam layer 20' is cured using a UV curing process. In this embodiment, the selected expansion microstructure 501 is a material that expands due to heat. Therefore, to avoid premature expansion of the expansion microstructure 501, a UV curing process can be used to cure the initial cofferdam layer 20' without affecting the expansion microstructure 501. In this case, a portion of the structure containing the expansion microstructure 501 is fixed within the initial cofferdam layer 20', and this portion of the structure is subsequently constrained by the cured cofferdam 20, preventing significant expansion changes.

[0091] B5: Patterning the initial cofferdam layer 20' yields cofferdam 20, which encloses and forms multiple plasma cavities 201.

[0092] B6: Continue to refer to Figure 17 As shown, plasma particles 202 are provided.

[0093] Alternatively, continue to refer to Figure 17 As shown, a premixed material 80 is provided, which includes a mixture of expanded microstructures 501 and plasma particles 202.

[0094] B7: Continue to refer to Figure 17As shown, plasma particles are filled into the plasma cavity 201, and at this time, only the expansion microstructure 501 is included between the dam 20 and the second substrate 30 in the display area A1.

[0095] Alternatively, continue to refer to Figure 18 As shown, a premixed material 80 is filled into the plasma cavity 201. At this time, an expansion microstructure 501 is included between the dam 20 and the second substrate 30 in the display area A1, and an expansion microstructure 501 is also included in the plasma cavity 201.

[0096] B8: A second substrate 30 is prepared on the side of the cofferdam 20 away from the first substrate 10 to obtain a sub-display structure 100A. The first substrate 10 and the second substrate 30 are bonded together with a frame adhesive 40, the height of which is greater than the height of the cofferdam 20, and a gap exists between the surface of the cofferdam 20 away from the first substrate 10 and the second substrate 30.

[0097] B9: The sub-display structure 100A is heated using a preset temperature. Optionally, the preset temperature is a temperature that allows the expansion microstructure 501 to expand to a preset height. This allows the preset temperature to be applied to the sub-display structure 100A according to the desired height of the expansion microstructure 501, thereby more accurately obtaining the adaptive expansion support structure 50. The expansion microstructure 501 expands upon heating to form the expansion support structure 50. Between the dam 20 and the second substrate 30, the portion of the expansion microstructure 501 confined within the dam 20 experiences minimal or no deformation due to heating. Optionally, when setting the expansion microstructure 501, a material with a high threshold temperature for expansion, such as greater than 60°C, can be selected for fabrication. This ensures that the expansion microstructure 501 expands to the target height of the expansion support structure 50 during product fabrication. During normal product use, the product heat or ambient temperature will not cause secondary expansion of the expansion support structure 50, improving its reliability.

[0098] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A display panel, characterized in that, include: First substrate; A cofferdam is located on one side of the first substrate, and the cofferdam surrounds and forms a plurality of plasma cavities, the plasma cavities containing plasma particles; The second substrate is located on the side of the dam away from the first substrate; in a plane perpendicular to the display panel, at least a portion of the dam and the second substrate have a gap. The display panel includes a display area and a border area, the border area at least partially surrounding the display area; the display area includes a plurality of expansion support structures, the expansion support structures being located between the first substrate and the second substrate; The expansion support structure is in contact with the first substrate and / or the dike on the side facing the first substrate, and the expansion support structure is in contact with the second substrate on the side away from the first substrate.

2. The display panel according to claim 1, characterized in that, At least a portion of the expansion support structure is located within the plasma cavity.

3. The display panel according to claim 2, characterized in that, Along the plane perpendicular to the display panel, the height of the expansion support structure is greater than the height of the cofferdam.

4. The display panel according to claim 2, characterized in that, The membrane layer containing the cofferdam is filled with expandable microstructures, which are in a state where the expandable support structure has not yet expanded. The ratio between the total volume of the expanded microstructures filling the membrane layer where the cofferdam is located and the total volume of the plasma particles is between 0.1% and 10%.

5. The display panel according to claim 1 or 2, characterized in that, At least a portion of the expansion support structure overlaps with the dam in a direction perpendicular to the plane of the display panel, and is located on the side of the dam away from the first substrate.

6. The display panel according to claim 5, characterized in that, On the cofferdam, at least a portion of the expansion support structure is embedded within the cofferdam and at least a portion protrudes from the surface of the cofferdam away from the first substrate.

7. The display panel according to claim 2 or 5, characterized in that, The side of the cofferdam away from the display area includes a frame adhesive, which surrounds the display area, and the height of the frame adhesive in the direction perpendicular to the plane where the display panel is located is equal to the distance between the first substrate and the second substrate; The frame adhesive and the outermost layer of the display area include a drainage trough.

8. The display panel according to claim 2 or 5, characterized in that, The surface of the cofferdam facing the second substrate includes grooves.

9. The display panel according to claim 8, characterized in that, The cofferdam has a mesh structure; the cofferdam includes a first part and a second part connected together; the first part is located between two adjacent plasma chambers, and the extension length of the first part and the sidewall of the adjacent plasma chamber are equal; the second part is located at the connection of multiple first parts. The first part includes a groove, and the opening of the groove faces the second substrate.

10. The display panel according to claim 8, characterized in that, The cofferdam has a mesh structure; the cofferdam includes a first part and a second part connected together; the first part is located between two adjacent plasma chambers, and the extension length of the first part and the sidewall of the adjacent plasma chamber are equal; the second part is located at the connection of multiple first parts. Both the first part and the second part include grooves, and the openings of the grooves face the second substrate; The groove in the first part is connected to the groove in the second part.

11. The display panel according to claim 1, characterized in that, The color of at least a portion of the expansion support structure is the same as the color of at least a portion of the plasma particles.

12. A display device, characterized in that, Includes the display panel as described in any one of claims 1-11.

13. A method for manufacturing a display panel, characterized in that, A method for preparing a display panel as described in any one of claims 1-11; the method includes: Provide a first substrate; A dam is prepared on one side of the first substrate; the dam includes the formation of multiple plasma cavities; A premixed material is provided, the premixed material comprising a mixture of expanded microstructures and plasma particles; Fill the plasma cavity with a premixed material; A second substrate is prepared on the side of the cofferdam away from the first substrate to obtain a sub-display structure; the first substrate and the second substrate are bonded together with frame adhesive; The sub-display structure is heated to a preset temperature, and the expanded microstructure expands to become an expanded support structure.

14. A method for manufacturing a display panel, characterized in that, A method for preparing a display panel as described in any one of claims 1-11; the method includes: Provide a first substrate; An initial cofferdam layer is laid in one whole layer on one side of the first substrate. Expanded microstructures are prepared on the surface of the initial cofferdam layer, with gaps between adjacent expanded microstructures, the gaps exposing the initial cofferdam layer; The initial cofferdam layer was cured using a UV curing process. The initial cofferdam layer is patterned to obtain a cofferdam, which encloses and forms multiple plasma chambers; Plasma particles are provided, or a premixed material is provided; the premixed material comprises a mixture of expanded microstructures and plasma particles; The plasma cavity is filled with plasma particles, or a premixed material is filled into the plasma cavity; A second substrate is prepared on the side of the cofferdam away from the first substrate to obtain a sub-display structure; the first substrate and the second substrate are bonded together with frame adhesive; The sub-display structure is heated to a preset temperature, and the expanded microstructure expands to become an expanded support structure.

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