Plated seal with improved surface

Abstract

The present technology includes unitary electroplated seals, such as electroplated seals formed using additive manufacturing. The seal includes an outer seal member and an inner seal member. The outer sealing member includes an inner annular radius, an outer annular radius, and an outer sealing member body defined between an outer surface and an inner surface opposite the outer surface. The outer surface is formed from at least one polymer layer having a porosity of less than or about 10% by volume, and the outer sealing member body includes a filler. The inner sealing member is integrally formed with the outer sealing member and extends from the inner annular radius toward the outer annular radius along at least a portion of the inner surface of the outer sealing member. The inner sealing member includes a deformable thermoplastic elastomer.

Description

[0001] Cross-references to related applications

[0002] This application claims the benefit and priority of U.S. Patent Application No. 18 / 298,223, filed April 10, 2023, entitled “PLATING SEAL WITHIMPROVEDSURFACE”, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This technology relates to the production of three-dimensional objects with improved surface properties. It also relates to objects that can be used in electroplating systems, such as system seals that can be used to support a substrate during electroplating operations. Background Technology

[0004] Integrated circuits are made possible through a process that creates finely patterned layers of material on the surface of a substrate. After forming, etching, and other processes on the substrate, metals or other conductive materials are typically deposited or formed to provide electrical connections between components. Because this metallization may be performed after many manufacturing operations, problems arising during metallization can result in costly discarded substrates or wafers.

[0005] During the formation of metal on a wafer or substrate, the wafer may be immersed in a plating bath, followed by metal formation on the wafer. The wafer may be held in place in a device that immerses the wafer in an electrolyte plating bath. The device for holding the wafer may include conductive components that contact the wafer, thereby allowing the wafer to be used as a cathode in the plating operation. Since the device and electrical contacts may be similarly immersed in the plating bath, the device may include a seal or multiple components that serve as a seal to limit or prevent electrolyte contact with internal conductive components. These seal materials may include complex machined parts and specialized materials that can be relatively expensive.

[0006] Therefore, there is a need for improved systems and components that can be used to support the substrate during electroplating operations. These and other needs are addressed by this technology. Summary of the Invention

[0007] This technology generally relates to integral electroplated seals, such as electroplated seals formed using additive manufacturing. The seal includes an outer sealing member and an inner sealing member. The outer sealing member includes an inner annular radius, an outer annular radius, and an outer sealing member body defined between an outer surface and an inner surface opposite to the outer surface. The outer surface is formed of at least one polymer layer with a porosity of less than or about 10% by volume, and the outer sealing member body includes filler. The inner sealing member is integrally formed with the outer sealing member and extends along at least a portion of the inner surface of the outer sealing member from the inner annular radius toward the outer annular radius. The inner sealing member includes a deformable thermoplastic elastomer.

[0008] In various embodiments, a portion of the outer surface of the external sealing member defines one or more ramp profile features. In another embodiment, the one or more ramp profile features have a slope from about 1° to about 45°. In more embodiments, the external sealing member, the internal sealing member, or both the external sealing member and the internal sealing member define an inner sidewall at an inner annular radius, wherein the inner sidewall includes a ramp profile or a generally straight profile. In various embodiments, at least one polymer layer forming the outer surface comprises a thermoplastic polymer. Additionally or alternatively, embodiments include an external sealing member body comprising a thermoplastic polymer and about 10% to about 50% by weight of filler based on the weight of the external sealing member body. In another embodiment, the integral electroplated seal is substantially free of adhesives and / or metal support members. In various embodiments, the outer surface of the external sealing member comprises polypropylene, the external sealing member body comprises glass-filled polypropylene, and the internal sealing member comprises thermoplastic vulcanized rubber or styrene-ethylene-butene-styrene.

[0009] This technology also generally relates to seals for electroplating systems. The system seal includes an annular manifold, an outer sealing member, and an inner sealing member. The annular manifold defines an inner annular radius and an outer annular radius, and a plurality of contact extensions are disposed along the inner annular radius. The outer sealing member includes an inner annular radius, an outer annular radius, and an outer sealing member body defined between an outer surface and an inner surface opposite to the outer surface. The outer surface is formed of at least one polymer layer with a porosity of less than or about 10% by volume, and the outer sealing member body includes filler. The inner sealing member is integrally formed with the outer sealing member and extends from the inner annular radius toward the outer annular radius along at least a portion of the inner surface of the outer sealing member.

[0010] In various embodiments, the inner sealing member and the outer sealing member form an integral seal body. In more embodiments, the integral seal body is formed by additive manufacturing. In another embodiment, the system seal further includes a back plate. In still more embodiments, an annular manifold is disposed between the back plate and at least a portion of the outer sealing member.

[0011] This technology also generally relates to a method of fabricating polymer semiconductor system components. The method includes printing a molten first feed onto the top surface of a profiled platform to form at least one first layer. The method further includes printing a second feed onto the at least one first layer to form at least one second layer. The method includes a top surface of the profiled platform defining a ramp profile feature having a slope from about 1° to about 45°, and the platform being formed of an inert material with a porosity of 10% by volume or less.

[0012] In various embodiments, the method includes a profiled platform comprising a second ramp profile feature spaced apart from a first ramp profile feature, wherein the second ramp profile feature has a slope from about 1° to about 45°. In further embodiments, the first feed and the second feed are formed of different polymers forming a compatible interface. In another embodiment, the first feed and the second feed are formed of the same polymer, wherein the second feed further comprises filler. Additionally or alternatively, in various embodiments, each first layer is printed such that each first layer includes a profiled surface mirrored to the top surface of the profiled platform. In various embodiments, the molten first feed is printed at a temperature about 10° to about 70° higher than the melting point of the material forming the first feed. In still more embodiments, the polymer semiconductor system component is an electroplated seal. The electroplated seal includes printing a third feed on a portion of at least one second layer adjacent to the inner annular radius of the at least one second layer, wherein the first feed comprises a thermoplastic polymer and at least one first layer has a porosity of 10 vol% or less, the second feed comprises a thermoplastic polymer and about 10 wt% to about 50 wt% of filler based on the weight of each second layer, and the first feed comprises thermoplastic vulcanizate or styrene-ethylene-butene-styrene.

[0013] This technology offers numerous benefits compared to conventional systems and techniques. For example, these processes and systems can significantly improve the surface properties of printed parts. Additionally, these processes and systems can significantly reduce surface porosity, allowing the use of “cleaner” and stronger materials, while enabling integral seals. Many of these and other advantages and features, among others, are described in more detail in conjunction with the following description and figures. Attached Figure Description

[0014] A further understanding of the nature and advantages of the disclosed technology can be achieved by referring to the remainder of the specification and the accompanying drawings.

[0015] Figure 1A A top perspective view of an exemplary electroplating system according to an embodiment of the present technology is shown.

[0016] Figure 1B A partial cross-sectional view of a plating system according to an embodiment of the present technology is shown.

[0017] Figure 2A A top perspective exploded view of a system sealing assembly according to an embodiment of the present technology is shown.

[0018] Figure 2B A partial cross-sectional schematic diagram of a seal of an electroplating system according to an embodiment of the present technology is shown.

[0019] Figure 2C A partial cross-sectional schematic diagram of a seal of an electroplating system according to an embodiment of the present technology is shown.

[0020] Figure 3 A schematic bottom plan view of an electroplating system seal according to some embodiments of the present technology is shown.

[0021] Figure 4 A partial cross-sectional schematic diagram of a seal of an electroplating system according to an embodiment of the present technology is shown.

[0022] Figure 5 A schematic cross-sectional side view of an additive manufacturing apparatus according to an embodiment of the present technology is shown.

[0023] Figure 6 The operation in a method according to an embodiment of the present technology is illustrated.

[0024] Several figures are included as schematic diagrams. It will be understood that the figures are for illustrative purposes and will not be considered to scale unless specifically stated otherwise. Additionally, as schematic diagrams, the figures are provided to aid understanding and may not include all aspects or information compared to the actual representation, and may include exaggerated material for illustrative purposes.

[0025] In the accompanying drawings, similar parts and / or features may have the same element symbol. Additionally, various parts of the same type may be distinguished by adding a letter after the element symbol to differentiate them. If only a first element symbol is used in this specification, the description applies to any of the similar parts having the same first element symbol, regardless of the letter used. Detailed Implementation

[0026] Electroplating operations can be performed to provide conductive material to vias and other features on a substrate. Electroplating utilizes an electrolyte bath containing ions of the conductive material to electrochemically deposit the conductive material onto the substrate and defined features on the substrate. The substrate, to be plated, serves as the cathode. Electrical contacts (such as rings or pins) allow current to flow through the system. During electroplating, the substrate can be clamped to the head and immersed in the electroplating bath to form a metallization layer. In the system described below, the substrate can also be held by a chuck or placed within a seal that can be coupled to the head during processing. The seal may include one or more components that engage the substrate with the electrical contacts and restrict electrolyte access to the head. For example, the seal may include structural components and a flexible material that creates a seal against the substrate. Since several components of the head are conductive and electrically connected, plating or deposition may also occur on these components if the electrolyte comes into contact with them during the plating operation.

[0027] Conventional techniques typically use machined materials for structural sealing components, which may be robust and / or non-reactive in the plating bath. Polyetheretherketone (PEEK) is a common material for structural rigidity. Metallic materials (including stainless steel or titanium) can also be used for some structural head components, although stainless steel may require coating to prevent iron or other materials from entering the bath. Coatings on these materials, as well as elastomers, may include fluorinated materials (such as fluoroelastomers), other crosslinked elastomers, or thermosetting materials, which may be robust and potentially inert to the electrolyte bath. However, due to the nature of many conventional elastomer components, adhesives may be required to perform the actual coupling between the structural and elastomer components. This combination of materials and difficulties in manufacturing can result in expensive and time-consuming conventional sealing materials.

[0028] Molded seals have been explored. However, they failed to provide the required combination of strength and surface finish. Additionally, additive manufacturing processes have been explored for forming system seals. Additive manufacturing (AM), also known as solid freeform manufacturing or 3D printing, refers to any manufacturing process in which a three-dimensional object is constructed from raw materials (typically powders, liquids, suspensions, or molten solids) in a series of two-dimensional layers or cross-sections. However, seals and other plastic parts formed via additive manufacturing involve the incremental construction of extruded plastic material. Consequently, the exposed surfaces of such seals and plastic parts exhibit a rough, granular surface structure, with smoothness limited by the size of the extruded material, and also exhibit a highly porous surface structure, especially on ramp surfaces. Conversely, as mentioned above, system seals and other plastic parts must be robust and non-reactive to plating bath components, thus requiring smooth contact surfaces with low to zero porosity.

[0029] This technology overcomes these and other problems by utilizing a unique additive manufacturing process. Specifically, this technology surprisingly discovers that parts and seals with high-quality surfaces (featuring one or more ramp features) can be formed by printing at least a first layer of molten material, which forms the contact surface (also called the outer surface) of the part against a platform with high smoothness and a desired profile. For example, by combining a predetermined temperature with the target material, one or more layers can be formed above the profiled surface in a way that imparts the surface properties of the profiled surface to the contact surface of the part or seal. Therefore, this technology can form parts and seals with low-porosity to non-porosity contact surfaces even when the surface is not linear across the entire surface. Furthermore, this type of process allows for the incorporation of lower-cost materials, less reactive to electrolyte baths, materials that do not require adhesives, and / or the incorporation of more than one material, while forming a monolithic component body.

[0030] While the remainder of this disclosure will conventionally specify the particular electroplating processes utilizing the disclosed technology, it will be readily understood that the systems and methods are equally applicable to plating chambers and other polymer parts and seals within the systems, as well as processes that may occur in the systems and other semiconductor systems. Therefore, this technology should not be considered as being limited to use only with these specific plating processes or systems. This disclosure will discuss possible systems according to embodiments of the technology, which may include electroplating components, followed by descriptions of additional variations and modifications to these systems according to embodiments of the technology.

[0031] Figure 1AA schematic perspective view of an exemplary plating system 100 that performs a plating method according to an embodiment of the present technology is shown. The plating system 100 may be operable to perform both electroplating and electroless plating operations. In an electroplating operation, the plating system 100 delivers current to a substrate such that ions in an electroplating bath in contact with the substrate may be reduced and deposited onto the substrate. In an electroless plating operation, the plating system 100 does not deliver current to the substrate. Instead, plating relies on the spontaneous reduction of these ions when ions in the plating bath contact a surface of the substrate comprising a material having a standard electrode potential (E°) lower than that of the ions. The plating system 100 exemplifies an exemplary plating system including a system head 110 and a bowl 115. During a plating operation, a wafer may be clamped to the system head 110, inverted, and extended into the bowl 115 to perform the plating operation. The plating system 100 may include a head lift 120, which can be configured to both raise and rotate the head 110, or otherwise position the head within the system, including tilting operations. The head and bowl may be attached to a table panel 125 or other structure, which may be part of a larger system comprising multiple plating systems 100 and may share electrolytes and other materials. A rotor may allow a substrate clamped to the head to rotate within or outside the bowl during different operations. The rotor may include contact rings that provide conductive contact with the substrate.

[0032] The system seal 130, as discussed further below, may be connected to the head. The seal 130 may include the wafer to be processed, held by the suction cup. Figure 1A Examples may include a plating system 100 that can be cleaned directly on a platform. In various embodiments, the plating system 100 further includes an in-situ rinsing system 135 for cleaning the components. In additional embodiments (not shown), the plating system may be configured with a platform on which a head can move to an additional module to perform cleaning of seals or other components.

[0033] Figure 1B A partial cross-sectional view of a plating chamber including plating apparatus 102 according to some embodiments of the present technology is shown. Plating apparatus 102 can be combined with a plating system, including system 100 described above. Figure 1BThe plating bath 104 of the plating system illustrated is shown together with a head 106 having a substrate 108 coupled to the head. In the illustrated embodiment, the substrate is coupled to a seal 112 bonded to the head 106. A rinsing frame 114 may be coupled above the plating bath container 104 and may be configured to receive the head 106 into the container during plating. The rinsing frame 114 may include an edge 116 extending circumferentially around the upper surface of the plating bath container 104. A rinsing channel 118 may be defined between the edge 116 and the upper surface of the plating bath container 104. For example, the edge 116 may include an inner sidewall 122 characterized by an inclined profile. Rinse fluid ejected from the substrate may contact the sidewall 122 and may be received into an air chamber 124 extending around the edge to collect the rinsing fluid from the plating apparatus 102. In various embodiments, the plating apparatus 102 may additionally include one or more cleaning components. The cleaning components may include one or more nozzles for delivering fluid to or toward the substrate 108 or the head 106. In an additional embodiment, a side cleaning nozzle 126 may extend through the edge 116 of the rinsing frame 114 and be guided to rinse the seal 112 and various aspects of the substrate 108.

[0034] Nevertheless, in various embodiments, the seal (such as one or more of the seals 112 and / or 130 discussed above) may be the electroplating system seal 200. Figure 2A As illustrated, the system sealing assembly 200 includes a seal 202 and a backplate 205, configured to releasably hold a substrate 206 between them for processing. However, it should be understood that other configurations known in the art can be utilized. For example, in various embodiments, as will be discussed in more detail below, the seal 202 may include a retaining ring formed of a different material, such as a non-plastic material. Nevertheless, as illustrated, in various embodiments, the sealing assembly 202 may include one or more centering pins 208. In another embodiment, the backplate assembly 204 may include one or more suction cup holding pins 220 and / or one or more sealing assembly positioning pins 209 and a substrate support surface 212. In various embodiments, the substrate support surface 212 may include a seal 216 for contacting the back surface of the substrate 206 (e.g., the surface opposite the working surface that contacts the plating bath liquid) and a base 214. The back seal 216 between the substrate support surface 212 and the back surface of the substrate 206 may include vacuum pressure utilizing one or more vacuum ports 213.

[0035] Figure 2BA partial cross-sectional schematic diagram of an electroplating system seal 200 according to some embodiments of the present technology is shown. The system seal 200 according to the present technology may include multiple components engageable to manufacture a system seal for supporting and retaining a substrate during electroplating. For example, the system seal 200 may include a backplate 205, a sealing member 210, and / or a busbar 215, as well as other components known in the art. However, as discussed above, the sealing member 210 according to the present technology is a monolithic body, eliminating the need for adhesives and non-polymer reinforcing members and improving the sealing surface of the seal body 210. In any case, the system seal 200 includes a backplate 205, which may include a portion 207 on which a substrate can be positioned and engaged by the sealing member 210 (e.g., Figure 2A (The support surface 212 is illustrated more clearly in the diagram). The backplate 205 may also include a base 214 to which the seal may be coupled via a manifold 215 and / or an outer sidewall 239. In some embodiments, the backplate, manifold, and seal may all be coaxially aligned about a central axis extending vertically through the system seal 200, such as... Figure 2A This is illustrated more clearly in the text.

[0036] Bus 215 may be an annular component and may include one or more components connected together. The bus may be characterized by an outer wall 217 at the outer annular radius of the component. Bus 215 may also be characterized by an inner annular radius, which may be defined by an inner sidewall 218 of the bus or by a component extending from the inner sidewall 218 of the bus 215. For example, bus 215 may include a plurality of contact pins 220 disposed along the inner annular radius and extending inwardly from the inner sidewall 218 toward a central axis. Contact pins 220 may be included in any spacing or orientation to provide uniform or oriented contact to a substrate engaging with an electrical contact. Although referred to as contact pins, contact pins 220 may be shaped in various forms and may be contact extensions or conductive extensions; in some embodiments, they may include annular features to limit any piercing contact with the substrate. In some embodiments, contact pins may be coupled to or extend from the upper surface of bus 215, as illustrated in the figure.

[0037] Additionally, one or more support members 222 may extend from the inner sidewall 218 and beyond the upper surface of the busbar to interact with the contact pins 220. The support members 222 may be radially distributed around the busbar 215 and may be configured to facilitate centering and support of the substrate coupled to the system seal 200. The busbar 215 may receive current through the contact pins 220, forming an electrode with the substrate, which can serve as a cathode on which reduction reactions and electroplating can occur. The busbar 215 may have a lateral base 214 formed near the outer annular radius, and a backplate may be coupled to this lateral base. The busbar 215 may extend vertically toward the inner annular radius and may form a neck 219 region toward the interior, which may define a truncated cone volume within the inner sidewall, although other cylindrical or geometrical forms may similarly be formed.

[0038] In some embodiments, two or more components of the seal may be removably coupled to allow separation of the components for delivery and removal of the substrate. Coupling can occur in a variety of ways, including mechanical coupling using bolts, screws, or other means configured to engage the two components. Coupling can also be achieved using magnets contained within busbar 215 and backplate 205. For example, a first plurality of magnets 223 may be disposed within busbar 215, and a second plurality of magnets 225 may be disposed within backplate 205. When aligned, the magnets can attract each other and engage the backplate with the busbar. Overcoming the magnetic force of the magnets allows for decoupling of the two parts of the seal.

[0039] The sealing member 210 of the system seal 200 may form a housing around portions of the busbar and backplate that may be exposed to the plating solution. The sealing member 210 may be coupled to the busbar 215 in various ways, and may be mechanically coupled to the busbar via bolts or other means. Coupling may include adhesives or other irreversible couplings, although in some embodiments, the coupling may be reversible, such as using screws, bolts, or other mechanical fasteners, such as via one or more mounting holes 224 (…). Figure 2A This allows the busbar 215 to be removed from the sealing member 210. In some embodiments, the sealing member 210 may include an outer sealing member 230 and an inner sealing member 235. However, as discussed above, the outer sealing member 230 and the inner sealing member 235 are part of the integral sealing member 210 and may therefore be formed integrally according to the methods and systems described herein, and may be referred to as the outer sealing member 230 and the inner sealing member 235 only for orientation purposes.

[0040] The external sealing member 230 may be an annular component extending around a central axis passing through the system seal 200. The external sealing member 230 may be characterized by an inner annular radius at the inner sidewall 237. The external sealing member 230 may also be characterized by an outer annular radius at the outer sidewall 239. The sealing member 210, specifically the external sealing member 230, may extend to the inside and outside of the manifold 215 and / or backplate 205 of the system seal 200. For example, the inner sidewall 237 may extend radially inward beyond the contact pin 220 at the inner annular radius of the external sealing member 230. The inner portion of the external sealing member 230 may also be vertically aligned with the contact pin 220, which can position the inner sealing member 235 adjacent to the contact pin 220, thereby providing a more complete or fully complete seal using a substrate positioned between the inner sealing member and the contact pin 220.

[0041] In embodiments, the external sealing member 230 may include multiple features and surfaces. For example, the external sealing member 230 may include an inner surface 240 extending along a radial length of the external sealing member 230 and defining multiple features of the external sealing member 230. The inner surface 240 may at least partially face the contact pin 220, such as near an inner region of the external sealing member 230. In some embodiments, the external sealing member 230 may also include an outer surface 242 (which may be a surface opposite to the inner surface 240) and an external sealing member body 241. In various embodiments, the outer surface 242 may define one or more contours or tapers.

[0042] For example, refer to Figure 2B At the inner annular radius, the inner sidewall 237 may define the height of the outer sealing member 230 between the inner surface 240 and the outer surface 242. In some embodiments, the outer sealing member 230 may be characterized by a height corresponding to the thickness of the outer sealing member 230 / outer sealing member body 241 at the inner radius, which is less than or about 1 cm. In embodiments, the height of the inner sidewall 237 may be less than or about 9 mm, less than or about 8 mm, less than or about 7 mm, less than or about 6 mm, less than or about 5 mm, less than or about 4 mm, less than or about 3 mm, less than or about 2 mm, less than or about 1 mm, less than or about 0.5 mm, or even smaller in some embodiments.

[0043] However, a first portion 243 of the outer surface 242, which is near or extends from the inner wall 237 toward the outer wall 239, may extend along a ramp profile (e.g., along a portion of the outer surface 242 that includes one or more points not collinear with one or more other portions of the outer surface 242, such as the second portion 247). For example, although it should be clear that a cone as a ramp profile may be generally straight (e.g., with a generally consistent slope) throughout the cone portion, such as the first portion 243 of the outer surface 242 near the inner wall 237, the cone portion includes one or more points on a line not collinear with one or more points on the second portion of the outer surface. Furthermore, a portion having a profile ramp profile (e.g., a third portion 249) may exhibit variations in slope at various points within that portion, defining one or more tangents that are not collinear with each other and / or not collinear with one or more other portions of the outer surface 242, such as the second portion 247.

[0044] Nevertheless, in various embodiments, the ramp profile or first portion 243 may terminate in a plane substantially aligned with the apexes of one or more contact pins 220. Therefore, in various embodiments, the thickness of the outer sealing member body 241 at the distal end of the first portion 243 (e.g., the end aligned with the apexes of one or more contact pins 220) may be greater than the thickness at the inner sidewall 237. However, in various embodiments, the outer sealing member body 241 may have a substantially uniform thickness in the first portion 243, the second portion 247, and / or the third portion 249, which may be any portion between the first portion near the inner sidewall 237 and the third portion near the outer sidewall 239. It should be understood, of course, that in various embodiments, the outer sealing member 230 may have any number of portions that may vary in thickness. However, in various embodiments, the thickness may increase in the first portion 243 and the second portion 247 as it travels along the outer surface 242 from the inner sidewall 237 to the outer sidewall 239 until encountering at least one second tapered or profiled third portion 249. In various embodiments, the outer surface may not be limited to a second cone or profile, or may be limited to two or more additional cones or profiles.

[0045] In any case, it should be understood that the outer surface 242 may define one or more ramp profiles at one or more cones or profiles, and further, such cones or profiles may have a uniform slope throughout the entire range of the respective profile, or may have a slope that increases or decreases along the profile or cone. This is merely by way of example, as the cones and profiles discussed herein can have any number of shapes and slopes. Figure 2BThe cone shape illustrated near the inner wall 237 in the first part 243 may have a generally uniform slope, while the cone shape or profile provided near the outer wall 239 in the third part 249 may define a first end and a second end of the cone shape or profile portion, which have a relatively small slope that gradually increases to the midpoint and then decreases toward the original slope.

[0046] The external sealing member 230 may include features to receive the busbar 215. For example, the external sealing member 230 may be characterized as a profile along the inner surface 240, configured to receive a component of the system seal 200. In one embodiment, having some aspects illustrated, the inner surface 240 may be characterized as a sloped profile extending radially outward from the inner sidewall 237, which may be similar to the slope angle of the contact pin 220. As will be described below, in some embodiments, the initial portion of the inner surface 240 of the external sealing member 230 may extend straight, while the inner sealing member 235 may form the initial sloped profile of the sealing member 210. Then, as the pin extends back toward the busbar 215, the inner surface 240 may be characterized as a reverse slope similar to that of the contact pin 220.

[0047] As the outer sealing member 230 extends beyond the neck 219 portion of the manifold 215 to the lateral base 214, the inner surface 240 of the outer sealing member 230 may extend vertically toward the recessed flange formed by the manifold 215 between the neck 219 portion and the base 214 portion. The inner surface 240 of the outer sealing member 230 may be parallel to the outer side wall 217 of the manifold 215 or may also extend radially outward beyond the outer side wall in a relatively lateral direction. As will be further explained below, a channel may be formed within such an intermediate portion of the outer sealing member, and a separator 245 may extend through or intersect the channel at a radial position surrounding the channel. However, in various embodiments, the channel or separator may be absent. The outer sealing member 230 may then extend vertically beyond the manifold 215 and continue to extend beyond a height equivalent to that of the backplate 205. Because the external sealing member 230 can extend vertically beyond the conductive components and other components of the system seal 200, the external sealing member 230 can ensure that the electrolyte cannot come into contact with these components during the plating operation.

[0048] Furthermore, the internal sealing member 235 may be integrally formed with the inner portion of the outer sealing member 230, close to the inner sidewall 237. That is, in various embodiments, the internal sealing member 235 may form the entire inner sidewall 237, or may be combined with the outer sealing member 230 to form a part of the inner sidewall 237. The internal sealing member 235 has a top surface 234 formed near the inner surface 240 and a lower surface forming a seal, or a lower surface 236 formed near the contact pin 220 when it is part of a system seal. As discussed above, the internal sealing member 235 may have a ramp profile at the lower surface 236 opposite the inner surface 240 of the outer sealing member 230. That is, the internal sealing member 235 near the inner sidewall 237 may have a greater thickness, which decreases as it extends toward the outer sidewall 239 (the height between the top surface 234 and the lower surface 236). Although a ramp profile is illustrated for the internal sealing member 235, it should be understood that other slopes may be used for the ramp profile, including stepped profiles and tapered profiles. As shown in the figures, in various embodiments, whether formed by an outer sealing member 230, an inner sealing member 235, or a combination thereof, the inner sidewall 237 may have a generally straight profile and extend perpendicular to a planar portion of the outer surface 242 (such as the second portion 247). However, it should be understood that in various embodiments, the inner sidewall 237 may also have one or more portions including a curved or tapered profile (a plane relative to a coplanar portion perpendicular to the outer surface 242, different from the profile of the outer surface 242 discussed above).

[0049] Figure 2C A detailed partial cross-sectional schematic diagram of an electroplating system seal 200 according to some embodiments of the present technology is shown. The system seal 200 may include some or all of the components described above, including a portion 207 of the backplate described above, on which a substrate may be at least partially supported. A bus 215 may support a contact pin 220 from a neck portion of the bus 215, the neck portion being positioned within a volume defined by an outer sealing member 230. As previously described, the outer sealing member 230 may include an inner surface 240 and an outer surface 242 (also referred to as a contact surface). An inner sealing member 235 may be integrally formed with the outer sealing member 230 adjacent to an inner sidewall 237 of the outer sealing member 230. The inner sealing member 235 may be positioned between the outermost radially inner portion of the outer sealing member 230 and the contact pin 220. The internal sealing member 235 may extend partially from the inner sidewall 237 along the inner surface 240 of the external sealing member 230 by a first distance, which may be less than or about 3 cm, and in some embodiments may be less than or about 2 cm, less than or about 1 cm, less than or about 9 mm, less than or about 8 mm, less than or about 7 mm, less than or about 6 mm, less than or about 5 mm, less than or about 4 mm, less than or about 3 mm, less than or about 2 mm or smaller.

[0050] As illustrated, the inner sealing member 235 may be characterized as a tapered shape extending from the inner sidewall 237. The angle of the tapered shape may be less than or approximately the angle of the end portion of the contact pin 220. However, in various embodiments, other ramp profiles, such as stepped or tapered shapes, may be utilized to form a seal with the contact pin 220. Due to this configuration, in some embodiments, the inner surface 240 of the outer sealing member 230 may extend laterally from the inner sidewall 237, and the feature at the location where the inner sealing member 235 may be located may not be a slope. Additionally, a recessed flange 238 may be formed in the outer sealing member 230 at the edge of the coupling location. However, due to the improved adhesion achieved using this technique, a recessed flange may not be required in some embodiments. The inner surface 240 of the outer sealing member 230 may continue laterally, or may continue the slope formed radially inward by the inner sealing member 235. The slope may continue to a position configured to maintain the gap spacing to support the substrate on the apex formed by the contact pin 220. For example, contact pin 220 may include a curved structure characterized by a vertex location at which the substrate may be positioned. The radially outer edge of the substrate may extend slightly beyond the contact pin, and the external sealing member 230 may maintain a gap spacing to accommodate the substrate that may extend slightly radially outward beyond the highest position of the contact pin 220.

[0051] The internal sealing member may be or comprise a deformable or compressible material and may be configured to support a substrate between the internal sealing member and a plurality of contact pins 220. Upon compression or deformation, the internal sealing member may form a substantial, substantially, or otherwise complete seal between the internal sealing member 235 and the supported substrate, which ensures that electrolyte fluid cannot flow within the system seal 200 or interact with the contact pins 220, busbar 215, or other internal components of the head assembly where the system seal 200 may reside.

[0052] As illustrated, in some embodiments, the inner sealing member 235 may extend radially inward beyond the outer sealing member 230. However, in various embodiments, this extension may not be necessary due to the improved adhesion of the monolithic body. Therefore, the inner sealing member 235 may have an inner surface substantially coplanar with the inner sidewall 237 of the outer sealing member 230. In embodiments, the inner sealing member 235 may also extend vertically along the inner sidewall 237 and may extend along the entire height of the inner sidewall 237. Although in some embodiments the inner sealing member 235 may extend along the outer surface 242 of the outer sealing member 230, in some embodiments, the outer sealing member may be maintained substantially free of inner sealing member material on the outer surface of the outer sealing member 230 and / or on the inner sidewall 237 of the outer sealing member 230.

[0053] Figure 3 A schematic bottom plan view of an electroplated sealing member 210 according to some embodiments of the present technology is shown. The sealing member 210 may include any of the components described above, and a view of the manifold 215 removed may be illustrated. Views of an outer sealing member 230 and an inner sealing member 235 may be illustrated for the sealing member 210. As previously noted, a channel 402 may be formed radially along the middle portion of the outer sealing member 230, such as at a location where the outer sealing member 230 extends vertically toward the base of the manifold, which may have transitioned from the neck region. This may result in an increase in thickness in the middle portion. Forming the channel 402 may maintain a more controlled thickness on the outer sealing member.

[0054] Turning Figure 4 This diagram illustrates a partial cross-sectional schematic of an electroplating system seal 400 according to some embodiments of the present technology. The system seal 400 may be similar to the system seal 200 described above and may include any of the components, materials, or features described above. The system seal 400 may also exemplify a seal that can be incorporated into a system with additional or external retaining members. The system seal 200 may exemplify a single seal design in which an external sealing member 230 completely surrounds or extends around a busbar 215. Thus, the electrolyte inlet position of the seal can be maintained at the substrate and at the internal sealing member 235. In other designs, the external sealing member may not extend around the associated busbar, such as... Figure 5 As illustrated in the example. Therefore, the location of additional seals can be incorporated into the design.

[0055] As indicated, the system seal 400 may include components similar to those described above, and may include a sealing member 410 and a bus 415. Contact pins 420 may extend from the upper surface of the bus 415. As previously described, the sealing member 410 may include an outer sealing member 430 and an inner sealing member 435. In some embodiments, the sealing member 410 may not extend radially outward beyond the bus 515 and may extend around the bus. Therefore, during plating operations, the radially outer edge of the bus 415 may be exposed to the electrolyte. An external retaining member 450 may be included to provide an additional seal to prevent the electrolyte from contacting the bus 415.

[0056] The external retaining member 450 may be made of a variety of materials compatible with the electrolyte used in the electroplating operation and may be insulating as previously described. The external retaining member 450 may be any of the materials indicated above. However, in various embodiments, the external retaining member 450 may be formed of a polymer material and / or may be integrally formed with the sealing member 410. That is, as noted above, the method and process according to this technology provides the formation of an integral seal, eliminating the need for adhesives and metal supports (such as conventional metal and / or metal-coated retaining rings).

[0057] To form a seal to protect the outer edge of the manifold 415, a similar sealing material may be used at an outer location at a location within a locatable inner location on the substrate. As illustrated, material 455 may be formed on the outer sealing member 430 to provide a sealing location for the outer retaining member 450. The outer sealing member 430 may include an inner sealing member 435 at least partially located on its lateral inner surface 440. The outer sealing member 430 may also include an outer surface 442. The outer sealing member 430 may define a recessed flange 444 along its outer surface. A quantity of material 455 may be formed or disposed within the recessed location and configured to form a liquid seal with the outer retaining member 450. Material 455 may be the same or different material used in the inner sealing member 435, and may be any of the materials described above. When similar to the material of the inner sealing member 435, material 455 may be similarly integrally formed with the outer sealing member 450.

[0058] Nevertheless, it should be clear that this technology envisions other orientations of the seals, busbars and retaining rings, as well as the omission of the retaining ring, and other seals and semiconductor components with contact surfaces.

[0059] That is, as discussed above, this technology surprisingly discovers that by utilizing additive manufacturing and printing at least a first layer on a platen with a desired ramp surface profile and surface features, a working surface (such as the outer surface 242) can be formed with excellent surface properties. Specifically, unlike conventional additive manufacturing processes and products, the outer surface 242 exhibits a finish that is closely mirror-image of the platen surface. Therefore, by carefully selecting the platen material and ramp surface profile, as well as the manufacturing temperature and materials, seals or components with excellent surface finishes (such as low porosity) can be formed via additive manufacturing.

[0060] For example, in various embodiments, the outer surface of one or more layers, as discussed in more detail below, may have a porosity of about 10% by volume or less, such as about 9% by volume or less, such as about 8% by volume or less, such as about 7% by volume or less, such as about 6% by volume or less, such as about 5% by volume or less, such as about 4% by volume or less, such as about 3% by volume or less, such as about 2% by volume or less, such as about 1% by volume or less, such as about 0.5% by volume or less, such as about 0.1% by volume or less, or any range or value between them. Furthermore, in various embodiments, the outer surface layer may be substantially free of pores. As used herein, porosity may be defined by the volume of pores or voids based on the volume of the layer. For example, pores may define voids in the layer, where void spaces have a volume that is not occupied by the layer material. Thus, when present, one or more pores occupy a portion of the layer volume.

[0061] Typically, an additive manufacturing system may include a stage for receiving feed, a feed distributor, and one or more heat sources for heating the feed. The heat sources may include a beam source, an array of heating lamps, and / or resistance heating coils embedded in the stage. The components of the additive manufacturing system may move relative to each other or move cooperatively with each other (i.e., remain stationary relative to each other during operation) as they move across the stage to deposit, fuse, and cool the feed, respectively.

[0062] For example, Figure 5 A side view of an exemplary additive manufacturing system 500 is illustrated. In an exemplary embodiment, the fabrication of a seal or other polymer semiconductor component discussed herein may begin with creating a three-dimensional version of a CAD model or other computer model of the seal or component. An output file is generated and rendered via controller 195, and the 3D model is then “sliced” into a series of 2D data bitmaps or pixel maps. The 2D bitmaps or pixel maps are used to define the locations on the X and Y planes upon which layers in a heat exchanger will be constructed. In this configuration, the additive manufacturing process will use these locations to define the locations where lasers will be applied to form desired layer features. Based on the pixel maps, each coordinate will define the X and Y positions and the Z-platform position of a given heat exchanger support. By combining the pixel maps in each formed layer, the additive manufacturing system 500 can print components with desired shapes and structural configurations.

[0063] Nevertheless, the additive manufacturing system 500 includes a printhead 502 with a heater 503 and a build platform 504 (e.g., a platform) with one or more features 506. In various embodiments, both the printhead 502 and the platform 504 may be enclosed in a housing 530, which forms a sealed chamber 536 (e.g., a vacuum chamber) that provides a controlled operating environment. The chamber 536 may include an inlet 532 coupled to a gas source and an outlet 534 coupled to an exhaust system (e.g., a pump). However, in various embodiments, the chamber or the controlled operating environment may not be required or utilized. If the chamber is utilized, regardless of whether it is a controlled environment, a loading door 538 may provide access to the platform 504, such as via a guide rail 539.

[0064] As discussed above, this disclosure surprisingly reveals that by utilizing a platform 504 having one or more ramp features 506, the first deposited material layer forming the outer surface or contact surface of a finished part can have surface properties significantly different from those of conventional seals or parts formed by additive manufacturing. For example, in various embodiments, the platform 504 including the ramp feature 506 can be formed of a material having high smoothness and low to no porosity (such as any porosity value discussed above) to impart such a surface on the outer layer of the seal or part. Thus, in various embodiments, the platform 504 and / or feature 506 can be formed of an inert material having high smoothness and low to no porosity, such as ceramics, glass, metals, or combinations thereof.

[0065] Furthermore, although the two ramp features 506 are shown in a spaced-apart orientation, it should be clear that in various embodiments, only one feature may be utilized, or the platform 504 may contain more than two features, such as more than or about three, more than or about four, more than or about five, more than or about seven, more than or about ten, more than or about fifteen, more than or about twenty, or any range or value between them. Additionally or alternatively, although Figure 5 A cross-sectional view is shown, but it should be clear that feature 506 may extend annularly around the platform 504 to form annular lines, grooves, ridges, etc. Therefore, in various embodiments, Figure 5 The features illustrated herein may form an annular ridge around the platform 504, the width or diameter of which corresponds to the inner sidewall 237 and / or the outer sidewall 239. Furthermore, it should be understood that in various embodiments, features 506 of any number, shape, and size may be used to form [the relevant information]. Figure 2A-2C The discussion covers any one or more ramp profiles. Additionally, feature 506 can extend to different horizontal lengths and incorporate variations in slope to form one or more portions of a component with various ramp profiles.

[0066] As is clear from the foregoing discussion, the feed utilized herein is applied to the platform 504 in a molten or liquid state. That is, the application of a molten feed is necessary for the deposited feed to closely mirror the profile and surface properties of the platform 504. Therefore, in various embodiments, at least a first layer of the feed (e.g., one or more layers deposited on the platform 504 containing feature 506) of this technology may be applied at a temperature above, but not significantly above, the melting point of the feed to avoid material flow, such as temperatures at least about 5°C higher than the melting point of the selected feed, such as greater than or about 7.5°C, such as greater than or about 10°C, such as greater than or about 12.5°C, such as greater than or about 15°C, such as greater than or about 20°C, such as greater than or about 25°C, such as greater than or about 30°C, or any range or value between these.

[0067] Furthermore, it should be understood that one or more first layers are applied in one or more layers that mirror the surface profile of feature 506 of platform 504. That is, conventional additive manufacturing processes form a continuous horizontal layer on top of a previous layer. As a result, due to the printing limitations of the additive manufacturing nozzle, the outer edges of the part exhibit a granular or pixelated surface. In contrast, this technology has found that by printing a first layer across the entire surface with a ramp profile in a molten state (see, for example, one or more first layers 508 printed to mirror the feature 506 of platform 504, including the ramp profile, rather than constructing the shape using multiple horizontal layers of varying widths), one or more first layers form the outer surface of the part, which has superior properties across the entire outer surface.

[0068] Additionally, in various embodiments, the platform 504 and one or more features 506 may be heated to allow the formation of a smooth layer prior to feed cooling. Therefore, in various embodiments, the platform 504 and features 506 may be heated to temperatures greater than or about 30°C, such as greater than or about 40°C, such as greater than or about 50°C, such as greater than or about 60°C, such as greater than or about 70°C, or any range or value between them.

[0069] Surprisingly, this specification reveals that by utilizing compatible materials in conjunction with the processes and methods described herein, two or more different materials can be used in the printing of seals or components. Therefore, unlike conventional seals, integral seals with improved properties, such as improved surface uniformity and strength, can be formed from two or more compatible materials.

[0070] For example, Figure 6 The operation of an exemplary method 600 for forming a seal or component according to an embodiment of the present technology is illustrated. Method 600 may also include one or more operations prior to the commencement of the method. The method may further include a plurality of optional operations, which may or may not be specifically associated with some embodiments of the method according to the present technology. For example, many operations are described to provide a broader range of processes performed, but are not critical to the technology, or may be performed by alternative methods, as will be discussed further below.

[0071] Method 600 may include, as discussed herein, Figure 5The operation described in the device. For example, in various embodiments, at operation 600, the print head 502 dispenses a first feed to form one or more first layers 508 on the top surface 505 of the platform 504 and feature 506. In various embodiments, the print head 502 is configured to move across the platform 504 (indicated by arrow A). For example, the additive manufacturing system 500 may include a support (e.g., a linear guide or a pair of linear guides 519) along which the print head can be moved by a linear actuator and / or a motor. This allows the print head 502 to move across the platform 504 along one or more horizontal axes. The print head 502 may also move along a vertical axis (indicated by arrow B) to deposit one or more first layers following a profile contour. Specifically, the print head 502 may rise by an amount equal to the height change of the platform 504 and / or feature 506 to deposit a uniform layer having a surface profile matching the platform 504 and feature 506. This maintains a constant height difference between the dispenser on the printhead and the top of the platform 504, including feature 506, and / or the immediately preceding layer of deposited feed. A drive mechanism (e.g., a piston or linear actuator) may be connected to the printhead or a support that holds the printhead to control the height of the printhead. Alternatively, the printhead 502 may be held in a fixed vertical position, and the platform 504 may be raised and lowered.

[0072] Regardless of the number of features in the silhouette design and the orientation of such features, it should be clear from the above description that the features are limited in terms of slope and slope value variation in order to maintain a constant height difference. Therefore, in various embodiments, although one or more features may have multiple shapes, the maximum printing slope angle between adjacent layers does not exceed approximately 45°.

[0073] In various embodiments, one or more first layers 508 of the first feed material may be printed until a thickness greater than or about 0.01 inches is obtained, such as greater than or about 0.02 inches, such as greater than or about 0.03 inches, such as greater than or about 0.04 inches, such as greater than or about 0.05 inches, such as greater than or about 0.06 inches, such as greater than or about 0.07 inches, such as greater than or about 0.08 inches, such as greater than or about 0.09 inches, such as greater than or about 0.1 inches, such as greater than or about 0.25 inches, such as greater than or about 0.5 inches, or any range or value between them. At this point, it may be desirable to include one or more fillers in the first feed to form a second feed in order to provide strength and structure to the component while maintaining compatibility with a smooth, non-porous external surface.

[0074] Therefore, in various embodiments, one or more second layers 510 (or second layers) can be formed at operation 610 using a reinforcing feed. One or more second layers 510 can be formed within one or more first layers 508 as multiple horizontal layers, but it should be understood that in various embodiments, one or more second layers 510 can also be deposited along the shape of platform 504 / feature 506. In various embodiments, one or more second layers 510 can also utilize known printing geometries to include additional features. For example, one or more second layers 510 may include printed mounting holes, alignment pins, channels, etc., as discussed above. Additionally, although one or more second layers 510 show generally flat surfaces, it should be clear that the outer surface formed by one or more second layers 510 can have any one or more profiled surfaces discussed above with respect to lower surface 236 and inner surface 240. Furthermore, in various embodiments, as will be discussed below, one or more second layers 510 can alternatively utilize a feed different from the first feed, which is capable of forming a robust, monolithic interface with one or more first layers 508, regardless of whether any reinforcing filler is present. One or more second layers 510 may be printed until a desired thickness is achieved, such as the thickness of a seal or polymer part known in the art, or a thickness sufficient to “fill” the three-dimensional shape formed by the profile printing.

[0075] This disclosure also surprisingly reveals that, unlike conventional seals and components, the lip (such as the internal sealing member 235 discussed above) can be integrally formed with the monolithic seal. For example, a softer thermoplastic elastomer can be selected, which allows for the formation of a robust seal with the substrate, as discussed above, but is also compatible with one or more second layers 510 and / or one or more first layers 508. Thus, in various embodiments, a third feed can be applied at operation 615 to form one or more third layers 512 over one or more second layers 510 and / or one or more first layers 508. That is, based on the orientation of one or more ramp features 506, as discussed above, and as... Figure 2A-2CAs illustrated, one or more third layers may cover a portion of one or more first layers 508, one or more second layers 510, or combinations thereof. Although one or more third layers 512 are shown in a stepped configuration, it should be clear that one or more third layers 512 may have any of the constructions discussed above with respect to the internal sealing member 235, and any orientation that allows a tight seal to be formed between the contact pins 220 and the substrate 206 relative to the plating bath. Additionally, although one or more third layers 512 are illustrated as being deposited only on a portion of one or more first layers 508 and / or one or more second layers 510 (e.g., within a first portion 243 extending from the inner annular edge 537 of feature 506 toward the outer annular edge 538), in various embodiments, one or more third layers may be formed over the entirety of one or more second layers 510, or may be formed only over one or more first layers 508 at the inner annular edge 537.

[0076] In some embodiments, the first, second, and / or third feeds (e.g., the external sealing member 230 and the internal sealing member 235 in the embodiments) may be or comprise polymeric materials. In some embodiments, the first and / or second feeds (e.g., the external sealing member 230 in the embodiments) may be thermoplastic polymers, and the third feed (e.g., the internal sealing member 235 in the embodiments) may be thermoplastic elastomers. By utilizing such materials, a bonded structure can be formed. As previously explained, fluoroelastomers are commonly used in components that contact the substrate, similar to the internal sealing members of this technology. Fluoroelastomers may not readily bond with the structural components of the seal, therefore adhesives or other coupling mechanisms may be employed. In some embodiments of this technology, the internal sealing member 235 and / or the external sealing member 230 may be fluorine-free, and the internal sealing member 235 may be specifically configured to form a strong print bond with the external sealing member 230 during the formation of the sealing member 210 without the use of adhesives, as this technology provides the formation of an integral body.

[0077] The first feed, the second feed, or both the first feed and the second feed may comprise polymeric materials and may include organic repeating portions comprising carbon and hydrogen or composed of carbon and hydrogen. Some materials that may be used in the first feed, the second feed, or both the first feed and the second feed may include polyethylene, polypropylene, polybutene, polystyrene, or other polymeric components comprising thermoplastic polymeric materials.

[0078] To increase structural rigidity, the second feed may include a filler material. The filler material may be selected to be inert to the electrolyte material used in the plating operation, and may also be insulating to limit the conductivity of the seal, which could otherwise lead to plating on the outer sealing member 230. While any such compatible filler material may be included, in some embodiments the filler material may be or include glass, which can form a glass-filled polymeric material, such as glass-filled polypropylene, as a non-limiting example. The glass content may be adjusted to provide sufficient reinforcement, but not a weight percentage high enough to make the feed abrasive. Therefore, in various embodiments, based on the weight of the respective layer formed by the reinforcing feed, the amount of filler material present can be greater than or about 10% by weight, such as greater than or about 12.5% ​​by weight, such as greater than or about 15% by weight, such as greater than or about 17.5% by weight, such as greater than or about 20% by weight, such as greater than or about 22.5% by weight, such as greater than or about 25% by weight, such as greater than or about 27.5% by weight, such as greater than or about 30% by weight, but such as less than or about 50% by weight, such as less than or about 45% by weight, such as less than or about 40% by weight, or any range or value between them. However, in various embodiments, the first feed may be substantially filler-free in order to provide the desired surface finish.

[0079] The third feed may also include polymeric materials and may include any polymeric materials indicated above. In some embodiments, the third feed may be or include thermoplastic elastomers. Exemplary materials may include polyolefin thermoplastic elastomers and may include rubber-bonded materials, including ethylene-propylene-diene monomers, as non-limiting examples. In some embodiments, thermoplastic vulcanizates and styrene-ethylene-butene-styrene (SEBS) may be used as the third feed. In some embodiments, the operation of printing one or more third layers 512 onto one or more second layers 510 is performed at a temperature configured to create an interface between the first, second, and third layers. For example, polypropylene from glass-filled polypropylene may be characterized by solubility in materials of the inner sealing member, such as polypropylene when using thermoplastic vulcanizates or SEBS. Thus, a seal or component with an integral body can be formed.

[0080] The layers formed by the first, second, and third feeds may each be characterized by a hardness. For example, one or more layers formed by the first and / or second feeds may be characterized by a greater hardness to provide structural rigidity and support, while the third feed may be characterized by a lesser hardness to allow the formation of a seal around a substrate included within the seal. For example, one or more layers formed by the third feed may be characterized by a hardness between about 10 and about 80 on the Shore A hardness scale, such as between about 30A and about 70A, between about 40A and about 65A, between about 50A and about 65A, and any smaller range included in these ranges.

[0081] In the preceding description, numerous details have been set forth for illustrative purposes in order to provide an understanding of various embodiments of the present technology. However, it will be apparent to those skilled in the art that certain embodiments may be practiced without some of these details or with additional details.

[0082] With several embodiments already disclosed, those skilled in the art will recognize that various modifications, alternative constructions, and equivalents can be used without departing from the spirit of the embodiments. Additionally, many well-known processes and elements have not been described to avoid unnecessarily obscuring the scope of the art. Therefore, the above description should not be considered as limiting the scope of the art. Furthermore, methods or processes may be described as sequential or step-by-step, but it will be understood that operations may be performed simultaneously or in a different order than those listed.

[0083] When a range of values ​​is provided, it should be understood that, unless the context clearly specifies otherwise, the minimum fraction of a unit reaching the lower limit for each intermediate value between the upper and lower limits of that range is also specifically disclosed. This covers any narrower range between any stated or unstated intermediate value in the stated range and any other stated or intermediate value in that stated range. The upper and lower limits of those smaller ranges may be independently included or excluded from the range, and this technique also covers each range in which any limit value is included, excluded, or included, depending on any specifically excluded limit value in the stated range. Where the stated range includes one or both of these limits, ranges excluding any or both of the included limits are also included.

[0084] As used herein and in the appended claims, unless the context clearly specifies otherwise, the singular forms “a,” “an,” and “the” include plural indicators. Thus, for example, reference to “model 4a” includes multiple such models, and reference to “target property” includes reference to one or more properties and their equivalents known to those skilled in the art, and so on.

[0085] Furthermore, the terms “comprise(s)”, “including(ing)”, “contain(s)”, “including(ing)”, “include(s)”, and “including(ing)” are intended to specify the presence of a stated feature, integral, component, or operation when used in this specification and the appended claims, but they do not exclude the presence or addition of one or more other features, integrals, components, operations, actions, or groups.

Claims

1. An integral electroplated seal, the integral electroplated seal comprising: An external sealing member comprising an inner annular radius, an outer annular radius, and an external sealing member body defined between an outer surface and an inner surface opposite to the outer surface, the outer surface being formed of at least one polymer layer comprising a porosity of less than or about 10% by volume, and wherein the external sealing member body comprises a filler; and An internal sealing member, which is integrally formed with the external sealing member and extends from the inner annular radius toward the outer annular radius along at least a portion of the inner surface of the external sealing member, wherein the internal sealing member comprises a deformable thermoplastic elastomer.

2. The integral electroplated seal of claim 1, wherein a portion of the outer surface of the outer sealing member defines one or more ramp features.

3. The integral electroplated seal as claimed in claim 2, wherein the one or more ramp features have a slope of about 1° to about 45° relative to the second portion of the outer surface of the outer sealing member.

4. The integral electroplated seal as claimed in claim 2, wherein the integral electroplated seal is additively manufactured.

5. The integral electroplated seal of claim 1, wherein at least one polymer layer forming the outer surface comprises a thermoplastic polymer.

6. The integral electroplated seal of claim 1, wherein the outer sealing member body comprises a thermoplastic polymer and filler comprising about 10% to about 50% by weight of the outer sealing member body.

7. The integral electroplated seal as claimed in claim 1, wherein the integral electroplated seal is substantially free of adhesives and / or metal support members.

8. The integral electroplated seal of claim 1, wherein the outer surface of the outer sealing member comprises polypropylene, the body of the outer sealing member comprises glass-filled polypropylene, and the inner sealing member comprises thermoplastic vulcanized rubber or styrene-ethylene-butene-styrene.

9. A sealing element for an electroplating system, the sealing element comprising: An annular busbar, the annular busbar including an inner annular radius and an outer annular radius, wherein the annular busbar includes a plurality of contact extensions disposed along the inner annular radius; An external sealing member comprising an inner annular radius, an outer annular radius, and an external sealing member body defined between an outer surface and an inner surface opposite to the outer surface, the outer surface being formed of at least one polymer layer comprising a porosity of less than or about 10% by volume, and wherein the external sealing member body comprises a filler; and An internal sealing member is integrally formed with the external sealing member and extends from the inner annular radius toward the outer annular radius along at least a portion of the inner surface of the external sealing member.

10. The electroplating system seal of claim 9, wherein the internal sealing member and the external sealing member form an integral seal body.

11. The electroplating system seal of claim 10, wherein the integral seal body is formed by additive manufacturing.

12. The electroplating system seal of claim 9, wherein the electroplating system seal further comprises a back plate.

13. The electroplating system seal of claim 12, wherein the annular manifold is disposed between the back plate and at least a portion of the external sealing member.

14. A method of forming a polymer semiconductor system component, the method comprising: The first molten feed is printed along the top surface of the platen, thereby forming at least one first layer; as well as A second feed is printed on the at least one first layer to form at least one second layer; A portion of the top surface of the platform defines a ramp feature having a slope of about 1° to about 45° relative to a second portion of the top surface of the platform, and wherein the platform is formed of an inert material with a porosity of 10 vol% or less.

15. The method of claim 14, wherein the platform further includes a second ramp feature in a third portion spaced apart from the ramp feature, wherein the second ramp feature has a slope of about 1° to about 45° relative to the second portion of the top surface of the platform.

16. The method of claim 14, wherein the first feed and the second feed are formed from different polymers forming a compatible interface.

17. The method of claim 14, wherein the first feed and the second feed are formed of the same polymer, wherein the second feed further comprises filler.

18. The method of claim 14, wherein each first layer is printed such that each first layer includes one or more ramp features mirrored to the top surface of the platform.

19. The method of claim 14, wherein the molten first feed is printed at a temperature about 10° to about 70° higher than the melting point of the material forming the first feed.

20. The method of claim 14, wherein the polymer semiconductor system component is an electroplated seal, the method further comprising: A third feed is printed on the portion of the at least one second layer and / or the at least one first layer adjacent to the inner annular radius of the at least one second layer and / or the at least one first layer; in: The first feed comprises a thermoplastic polymer, and the at least one first layer comprises 10% by volume or less porosity. The second feed comprises a thermoplastic polymer and filler of about 10% to about 50% by weight based on the weight of each second layer, and The third feed includes thermoplastic vulcanized rubber or styrene-ethylene-butene-styrene.

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