Miniaturized perovskite solar cell packaging structure and packaging method

By setting up an encapsulation isolation area on the perovskite film and connecting the electrodes with through holes, the compatibility problem between miniaturized perovskite solar cells and PCB boards was solved, achieving controllability and packaging stability in the mass production process and simplifying the production process.

CN120981081APending Publication Date: 2025-11-18太原慕光薄膜科技有限责任公司
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202511409249.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-29
Publication Date
2025-11-18

AI Technical Summary

Technical Problem

Existing technologies make it difficult to adapt the lead electrodes of miniaturized perovskite solar cells to PCB-type electronic products, and mass production processes suffer from problems such as glue overflow, uneven pressure, and difficulties in laser cutting.

Method used

An encapsulation isolation area is set on the perovskite film layer, and spring-type probes, copper pillars or conductive silicone rods are embedded in the through holes in the cover plate material as connecting electrodes. The electrode lead-out and encapsulation are achieved by combining laser edge cleaning and encapsulation adhesive.

Benefits of technology

This technology enables electrode and PCB compatibility, reduces dead zone area, ensures packaging uniformity and controllability, simplifies mass production process, and improves product yield and packaging stability.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120981081A_ABST
    Figure CN120981081A_ABST
Patent Text Reader

Abstract

The invention relates to a miniaturized perovskite solar cell packaging structure and a packaging method. The miniaturized perovskite solar cell packaging structure is characterized by comprising a solar cell substrate, a cover plate material and a connecting electrode, the electrodes are concentrated on one side of the miniaturized perovskite solar cell, so that the dead zone area can be reduced; the substrate and the cover plate are the same in material size, so that the condition of non-uniform pressure is avoided; the glue overflow areas only exist on the four edges of the perforated cover plate material, the product mass production procedure and electrodes are not affected, each single miniaturized assembly cut from a large sample shares the same pressure, glue packaging is uniform, and glue removal is not needed; the situation that the glue or the glass is independently cut by laser is avoided; pCB standard elements such as a spring type probe, a copper column or a conductive silica gel rod are used as electrode leading-out and are matched with standard Vin and Vout of the PCB, so that the design and assembly process is simplified, and meanwhile, the conductive performance is ensured; the whole production process can be completed by a machine, and the problem of mass production can be solved.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cells, in particular to a miniaturized perovskite solar cell packaging structure and packaging method. BACKGROUND

[0002] We will classify the photovoltaic components containing lead elements, iodine elements, cesium elements, carbon elements or hydrogen elements in the battery components, or the lattice structure of one layer in the photovoltaic component belongs to the perovskite (ABX3) as the perovskite solar cell.

[0003] The packaging means of the traditional perovskite solar cell is part of the preparation process, and the purpose of the packaging is mainly to isolate water and oxygen. The glass with little difference in size from the substrate is usually used to complete the packaging, and the general feature is to use glue to bond the cover plate material and the packaging substrate. Finally, the decoration and other means are used to complete the component.

[0004] The application of photovoltaic cells to electronic devices usually adopts an integrated scheme, that is, the photovoltaic cell is directly connected with the electronic device, which requires the photovoltaic manufacturer and the electronic device manufacturer to be deeply bound and the production line to be integrated to a certain extent. The traditional crystalline silicon component adopts a scheme of glass opening, and the lead wire is led out to the junction box through the opening. However, this scheme needs to occupy a large design space and needs special equipment for electrode coating, which is difficult to adapt to small-size components. In the prior art, designs such as leaving electrode area are adopted, such as perovskite with ITO substrate. The ITO part can be left out to achieve the purpose of contact type conduction. However, this scheme requires high precision, and obvious glue overflow phenomenon will occur in the mass production process. The overflow glue will cover the electrode, which is difficult to produce to meet the needs of electronic product customers. At the same time, the method of leaving ITO will cause edge pressure concentration effect during laminating, resulting in glass breakage, which is difficult to mass produce.

[0005] At present, there is no innovative technology to solve these problems. More choices are to use solder to lead out the electrode using lead wire. However, even if this scheme is adopted, the mass production is also extremely difficult. SUMMARY

[0006] The technical problem to be solved by the present application is to provide a miniaturized perovskite solar cell packaging structure and packaging method, which can solve the problem that the lead electrode of the general miniaturized perovskite battery is difficult to adapt to the PCB type electronic product.

[0007] To solve the above technical problems, the technical scheme of the present application is as follows: a miniaturized perovskite solar cell packaging structure, the innovation point of which is that it comprises a solar cell substrate, a cover plate material and a connecting electrode. The surface of the solar cell substrate is provided with at least one piece of perovskite film layer; the perovskite film layer has at least one side edge with a distance from the edge of the solar cell substrate forming an encapsulation isolation area not less than 0.1 mm; The cover plate material covers the perovskite film layer of the solar cell substrate, and the perovskite film layer is encapsulated by the cover plate material; at least one through hole is formed on the surface of the cover plate material; The connecting electrode is embedded in the through hole on the cover plate material.

[0008] Further, the connecting electrode is a spring probe, a copper column or a conductive silicone rod.

[0009] Further, the through hole structure on the cover plate material is a cylindrical hole or a trapezoidal hole.

[0010] A packaging method of a miniaturized perovskite solar cell packaging structure, the innovation point of which is as follows: S1: Packaging environment requirements: atmospheric environment parameters: environmental temperature 5-350℃; environmental humidity <80%; atmospheric pressure <500kPa; dust particle concentration: the allowable particle concentration of 0.5 microns is less than 35200000 (pc / m3), and the allowable particle concentration of 5 microns is less than 2930000 (pc / m3); with or without light; wind speed and direction are not limited; inert gas parameter range is consistent with atmospheric environment, the difference is that the gas contained in air is replaced by inert gas; vacuum parameter range: vacuum air pressure <1×103 Pa; S2: Perovskite solar cell production: produce perovskite solar cells according to any standard or non-standard procedure, and define any cell with completed perovskite film layer production as a completed perovskite solar cell; S3: Laser edge cleaning: according to the size requirement of the battery assembly, a pulse laser is used to perform laser edge cleaning operation on the perovskite solar cell, and the width of the edge cleaning area is not less than 0.1 mm; S4: Cover plate material hole opening: take out the cover plate material, and use a hole opening machine to open at least one hole with a diameter less than 5 mm on the surface thereof; S5: Electrode placement: place the spring probe, copper column or conductive silicone rod with the size of the cover plate material hole opening into the hole of the cover plate material; S6: Electrode packaging: place the hole opening cover plate material with the spring probe, copper column or conductive silicone rod in the hole opening cover plate material on the surface of the dispensing machine platform, and apply encapsulation glue or cover encapsulation glue film, the glue can be selected to avoid or not to avoid the hole opening area; S7: Piece combining: transfer the hole opening glass with applied glue or glue film to the piece combining machine, and prepare the perovskite solar cell with completed edge cleaning; use the piece combining machine to combine the perovskite solar cell with the hole opening glass. S8: curing: transfer the completed perovskite solar cell to the machine for curing glue; cure the encapsulation glue and get the large-area mass production completed product; place the large-area mass production completed product on the test machine for testing and mark the defective products; S9: cutting: transfer the cured and sorted product to a laser cutting machine and cut according to the required size; S10: detection and packaging: send the small-sized components obtained after cutting to the detection machine to remove defective products and then sort and package.

[0011] The advantages of the present application are: 1) In the present application, the electrodes are concentrated on one side of the miniaturized perovskite solar cell, which is suitable for most PCB components and can reduce the dead area; during encapsulation, the base and cover plate materials have the same size, so there is no uneven pressure, and the height error around can be controlled; the glue overflow area only exists on the four edges of the perforated cover plate material, which does not affect the product, so the mass production process is controllable, and each piece of the single small-sized component cut from the large sample shares the same pressure, which does not cause the problem of uniformity of encapsulation glue, and there is no need to remove the glue.

[0012] 2) In the present application, the combination scheme of edge cleaning base + perforated glass is adopted, which can complete the encapsulation of all single small-sized components at one time, and there is no difference in yield of small-sized components produced from the same large piece due to batch encapsulation; the sample obtained after encapsulation is uniform in texture and consists of glass + glue + glass, which has consistent overall thickness and is a whole, which is more conducive to laser cutting; there is no case of laser cutting glue or glass alone.

[0013] 3) In the present application, spring probes, copper pillars or conductive silicone rods, which are standard PCB components, are used as electrode leads, which are matched with standard Vin and Vout of PCB, simplifying the design and assembly process, and ensuring the conductivity; the production process can be completed by machine throughout, without manual intervention, so the problem of mass production can be solved.

[0014] 4) The perforated electrode lead-out scheme adopted in the present application can guide the encapsulation glue to cover the perforated part by capillary effect, which ensures that the electrode position has a longer encapsulation area, which ensures that the electrode position has stronger ability to resist external erosion than other areas.

[0015] 5) In the present application, the trapezoidal hole design is adopted on the cover plate material, and the connecting electrode can better fit in the trapezoidal hole under the action of gravity, the cover plate material with the connecting electrode can be moved freely, and closer electrode contact can be provided in the subsequent encapsulation process. BRIEF DESCRIPTION OF DRAWINGS

[0016] The application will be described in further detail below in conjunction with the accompanying drawings and specific embodiments.

[0017] Fig. 1 A packaging structure design scheme of a miniaturized perovskite solar cell packaging isolation area of the application.

[0018] Fig. 2 A production design state diagram of a miniaturized perovskite solar cell packaging structure of the application.

[0019] Fig. 3 A cover plate material opening schematic diagram of a miniaturized perovskite solar cell packaging structure of the application.

[0020] Fig. 4 A motor insertion schematic diagram of a miniaturized perovskite solar cell packaging structure of the application. DETAILED DESCRIPTION

[0021] To make the objectives, technical solutions, and advantages of the embodiments of the application clearer, the technical solutions in the embodiments of the application will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the application. Obviously, the described embodiments are only some, but not all of the embodiments of the application. The components of the embodiments of the application described and shown in the accompanying drawings herein can be arranged and designed in various different configurations.

[0022] Therefore, the following detailed description of the embodiments of the application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but only represents selected embodiments of the application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the application without creative efforts fall within the scope of the protection of the application.

[0023] As shown in a miniaturized perovskite solar cell packaging structure, comprising a solar cell substrate 1, a cover plate material 2, and a connecting electrode 4. Figs. 1 to 4

[0024] The surface of the solar cell substrate 1 is provided with at least one piece of perovskite film layer 3; the perovskite film layer 3 has at least one side edge with a distance from the edge of the solar cell substrate forming a packaging isolation area not less than 0.1 mm.

[0025] The cover plate material 2 covers the perovskite film layer 3 of the solar cell substrate, and the perovskite film layer 3 is packaged by the cover plate material 2; the surface of the cover plate material 2 is provided with at least one through hole penetrating the cover plate material; the through hole is a cylindrical hole or a trapezoidal hole structure.

[0026] The connecting electrode 4 is embedded in the through hole on the cover plate material 2; the connecting electrode 4 is a spring probe, a copper column, or a conductive silicone rod.​

[0027] Example 1: A packaging method of a miniaturized perovskite solar cell packaging structure, and the specific packaging method is as follows: The environment is selected as an atmospheric environment, the temperature is set to 27°C, the humidity is set to 40% to 45%, the atmospheric pressure is the local normal pressure, the dust particle concentration is set to less than 352000 (pc / m 3 ) for a permissible particle concentration of 0.5 microns, less than 29300 (pc / m 3 ) for a permissible particle concentration of 5 microns, indoor lighting, and a wind speed of 0 m / s.

[0028] The laser is selected as a pulse laser, the evaporation equipment is selected as PVD, the gluing equipment is selected as a dispenser, the packaging equipment is selected as a laminator and a laminator, and the packaging glue is selected as butyl glue.

[0029] First, a completed perovskite solar cell is prepared using any equipment, the base glass size is 300mm*300mm, and the thickness is 1mm; edge cleaning is performed using a laser with a wavelength of 350nm, and the edge cleaning width is 0.5mm; a cover plate material for packaging is taken out, the size is 300mm*300mm, and the thickness is 0.9mm; a laser puncher is used to punch holes on the surface of the cover plate material, the holes are circular, the holes are trapezoidal, the upper side of the hole is 1.5mm, and the lower side is 1.2mm; the pre-prepared conductive silicone rod is taken out, and the conductive silicone rod is placed in the opening of the cover plate material; the opening cover plate material with the conductive silicone rod is placed on the surface of the dispenser platform, butyl glue is uniformly coated on the surface of the opening cover plate material, and the butyl glue is coated while avoiding the opening area; the opening glass coated with butyl glue is transferred to the conveying platform, the laminator laminates the perovskite solar cell with the opening glass; then the laminated perovskite solar cell with the opening glass is transferred to the laminator, the temperature is set to 130°C, the pressure is set to -50MPa, and the time is set to 10min; the large-area mass production completed product is taken out from the laminator; the large-area mass production completed product is placed in the testing machine for performance testing and the defective product is marked with a label pen; the marked product is transferred to a laser cutting machine for laser cutting according to the size required by the customer; the small-sized assembly obtained by laser cutting is sent to a detection machine, and the defective product is sorted out; the good product is packaged and shipped.

[0030] Example 2: A packaging method of a miniaturized perovskite solar cell packaging structure, and the specific packaging method is as follows: The environment is selected as an atmospheric environment, the temperature is set to 27°C, the humidity is set to 40% to 45%, the atmospheric pressure is the local normal pressure, the dust particle concentration is set to less than 352000 (pc / m 3The permissible particle concentration for 5 micrometers is less than 29,300 (pc / m³). 3 ), indoor lighting, and wind speed of 0 m / s.

[0031] For laser selection, a pulsed laser is chosen; for evaporation equipment, PVD is selected; for coating equipment, a dispensing machine is selected; for encapsulation equipment, a wafer assemblies and UV lamps are selected; and for encapsulation adhesive, UV adhesive is selected. First, a perovskite solar cell was fabricated using any equipment. The substrate glass was 300mm x 300mm in size and 1mm thick. A 350nm laser was used to clean the edges, with a cleaning width of 0.5mm. A cover plate material for encapsulation, 300mm x 300mm in size and 0.9mm thick, was then removed. A laser drilling machine was used to drill holes in the surface of the cover plate material. The holes were round and rectangular, with a top and bottom diameter of 1.2mm. The cleaned perovskite solar cell was placed on a dispensing machine platform, and UV adhesive was evenly applied to its surface. The UV adhesive was applied over the entire surface without avoiding the holes. The perovskite solar cell with the UV adhesive applied was then... The perovskite solar cells are transferred to a conveyor platform, where a laminator combines the perforated glass with the UV-coated perovskite solar cells. After lamination, a spring-loaded probe is inserted into the perforated glass. Pressure is applied from the spring-loaded probe using the laminator, and the cells are irradiated with a UV lamp. The product is then allowed to cure. The mass-produced product is removed from the laminator and placed in a testing machine for performance testing. Defective products are marked with a label. The marked products are then transferred to a laser cutting machine for laser cutting to the dimensions required by the customer. The miniaturized components obtained from laser cutting are sent to an inspection machine to sort out defective products. Good products are then packaged and shipped.

[0032] Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the present invention. Various changes and modifications can be made to the present invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed.

Claims

1. A miniaturized perovskite solar cell encapsulation structure, characterized in that: This includes the solar cell substrate, cover material, and connecting electrodes; At least one perovskite film layer is disposed on the surface of the solar cell substrate; the perovskite film layer has at least one side edge forming an encapsulation isolation area of ​​not less than 0.1 mm from the edge of the solar cell substrate; The cover plate material covers the perovskite film layer of the solar cell substrate, and encapsulates the perovskite film layer through the cover plate material; at least one through hole is opened on the surface of the cover plate material; The connecting electrode is embedded in a through hole in the cover plate material.

2. The miniaturized perovskite solar cell encapsulation structure according to claim 1, characterized in that: The connecting electrode is a spring-loaded probe, a copper pillar, or a conductive silicone rod.

3. The miniaturized perovskite solar cell encapsulation structure according to claim 1, characterized in that: The through-hole structure on the cover plate material is a cylindrical hole or a trapezoidal hole.

4. A packaging method for the miniaturized perovskite solar cell packaging structure according to claim 1, characterized in that: The specific encapsulation method is as follows: S1: Perovskite Solar Cell Fabrication: Under set environmental conditions, perovskite solar cells are fabricated according to any standard or non-standard procedure. Any cell with completed perovskite film fabrication is defined as a completed perovskite solar cell. S2: Laser edge cleaning: According to the size requirements of the battery module, laser edge cleaning is performed on the perovskite solar cells, and the width of the cleaned area is not less than 0.1mm; S3: Opening holes in cover plate material: Take out the cover plate material and use a hole opener to open at least one hole with a diameter of less than 5 mm on its surface; S4: Electrode Placement: Place the spring-loaded probe, copper pillar, or conductive silicone rod, with the prepared opening size for the cover plate material, into the hole of the cover plate material. S5: Electrode encapsulation: Place the opening cover material containing the spring probe, copper pillar or conductive silicone rod on the surface of the dispensing machine platform, apply encapsulation glue or cover with encapsulation film. S6: Lamination: Transfer the perforated glass with the adhesive or film applied to it to the lamination machine, and prepare the perovskite solar cells with the edge-cleaned edges; use the lamination machine to assemble the perovskite solar cells with the perforated glass; S7: Curing: Transfer the assembled perovskite solar cell and the perforated glass to a machine for curing adhesive; cure the encapsulating adhesive to obtain a mass-produced product; place the mass-produced product on a testing machine for testing and mark the defective products. S8: Cutting: Transfer the solidified and sorted products to the laser cutting machine and cut them according to the required dimensions; S9: Inspection and Packaging: The miniaturized components obtained after cutting are sent to the inspection machine to remove defective products and then sorted and packaged.

5. The packaging method for a miniaturized perovskite solar cell packaging structure according to claim 4, characterized in that: The environmental conditions set in S1 are as follows: ambient temperature 5℃~350℃; ambient humidity <80%; atmospheric pressure <500kPa; dust particle concentration: the allowable particle concentration of 0.5 micrometers is less than 35,200,000 (pc / m3), and the allowable particle concentration of 5 micrometers is less than 2,930,000 (pc / m3); light is not required; wind speed and wind direction are not limited; the inert gas parameter range is the same as that of the atmospheric environment, except that the gas contained in the air is replaced with an inert gas; vacuum parameter range: vacuum pressure <1×103 Pa.

6. The encapsulation method for a miniaturized perovskite solar cell encapsulation structure according to claim 4, characterized in that: The laser edge clearing in S2 uses a pulsed laser.

7. The packaging method for a miniaturized perovskite solar cell packaging structure according to claim 4, characterized in that: In the S5 electrode encapsulation, the adhesive may or may not avoid the opening area.