Semiconductor equipment part shipment report generation method and system based on serial number

Abstract

The invention discloses a semiconductor equipment part shipment report generation method and system based on a serial number, and relates to the technical field of intelligent manufacturing, image information, helium detection information, granularity information, size detection information and order information are collected in real time through a data acquisition module which runs through a whole production process, and the information is packaged into a reference data set after integrity verification; a unique serial number is generated by fusing the customer identifier, the material number and the completion timestamp with the UUID, the unique serial number is bound with the reference data set and stored in a shipment database as a key value record, and an image link points to an independent file server; according to a client identifier, a template library is intelligently matched, a corresponding field is dynamically extracted, an image and a detection result are automatically embedded, a multi-language visual shipment report is generated according to needs, a storage path is returned, single-piece-level data tracing, quality inspection closed loop and personalized report second-level output are achieved, and delivery transparency and client satisfaction are improved.

Description

Technical Field

[0001] This invention belongs to the field of intelligent manufacturing technology, specifically relating to a method and system for generating shipment reports for semiconductor equipment components based on serial numbers. Background Technology

[0002] The explosive growth of emerging applications such as 5G, artificial intelligence, and new energy vehicles has driven the rapid expansion of chip production capacity, which in turn has created a massive demand for semiconductor equipment components.

[0003] Existing technologies for generating semiconductor equipment component shipment reports typically rely on decentralized and manual data management methods, leading to drawbacks such as incomplete data collection, inconsistent serial number management, and low report generation efficiency. Specifically, there is a lack of integrated data acquisition modules; image data, production process data, and order data are mostly obtained from independent systems or manually recorded, resulting in data silos and inconsistencies. For example, image data, relying on manual operator photography, is prone to omissions or distortion; production process data, such as helium testing results and particle size detection results, are stored in different devices and are difficult to synchronize; and order data requires multiple manual inputs, which is prone to errors. Furthermore, existing serial number generation methods are simple, such as relying solely on order numbers or dates, lacking uniqueness and mechanisms for binding data across the entire process, making component traceability difficult and hindering the rapid association of images or test results from specific production stages during quality issue investigations. Regarding report generation, fixed templates are often used, failing to flexibly adapt to the personalized needs of different customers. Manual customization and data filling are required, which is time-consuming, labor-intensive, and error-prone. Simultaneously, the lack of automatic integrity verification mechanisms allows defective products to potentially enter the shipment process due to missing data, affecting overall quality.

[0004] To address the aforementioned issues, this invention proposes a method and system for generating semiconductor equipment component shipment reports based on serial numbers. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a method and system for generating shipment reports for semiconductor equipment components based on serial numbers, solving the problems of data integrability, low reporting efficiency, and difficulty in quality traceability in existing technologies.

[0006] The objective of this invention can be achieved through the following technical solutions:

[0007] A method for generating a semiconductor equipment component shipment report based on a serial number, the method comprising:

[0008] Step 1: Determine the complete production line of any semiconductor equipment component, and collect the image data and production process data associated with the corresponding semiconductor equipment component during the production process based on the data acquisition module equipped in the complete production line, together with the order data of the corresponding semiconductor equipment component, to generate the reference data set associated with the corresponding semiconductor equipment component.

[0009] Step 2: Based on the identified semiconductor equipment components, construct a unique serial number associated with each component using a reference data set, bind the unique serial number to the reference data set, generate a storage record, and persistently store it in the pre-built shipping database.

[0010] Step 3: Based on the benchmark dataset, obtain the order data of the corresponding semiconductor equipment components, extract the customer identifier, use the customer identifier to extract the corresponding customer shipment report template from the pre-built customer shipment report template library, and combine it with the storage records of the corresponding semiconductor equipment components in the shipment database to generate a semiconductor equipment component shipment report.

[0011] As a further aspect of the present invention, in step one, the image data includes image data of the corresponding semiconductor equipment components after processing at each station in the entire production line:

[0012] Production process data includes helium emission test results, particle size test results, and size test results;

[0013] Order data includes order number, material number, customer identifier, and delivery order number. The delivery order number is added after all semiconductor equipment parts have been processed in the order data.

[0014] As a further aspect of the present invention, in step one, the data acquisition module includes an image acquisition unit, a process quality data acquisition interface, and a business data receiving interface.

[0015] The image acquisition unit is installed at the workstation in the entire production line. Through the integrated industrial camera, it automatically acquires image data of semiconductor equipment components under the control of the trigger signal. The trigger signal is linked to the production cycle of the entire production line. Each semiconductor equipment component is acquired after processing at any workstation.

[0016] The process quality data acquisition interface establishes a data communication connection with the testing equipment in the entire production line to receive helium testing results, particle size testing results, and size testing results from different workstations in parallel.

[0017] The business data receiving interface establishes a communication connection with the business system to actively capture order data for semiconductor equipment components in the current production batch.

[0018] As a further aspect of the present invention, the specific method for generating the reference data set associated with the corresponding semiconductor device components in step one is as follows:

[0019] Receive order data from the business data receiving interface, and construct a temporary data carrier based on the order number and material number in the order data;

[0020] According to the production sequence of the corresponding semiconductor equipment components, receive the production process data from the process quality data acquisition interface and store it in a temporary data carrier;

[0021] The system receives image data collected by the image acquisition unit at each workstation, associates the image data with the acquisition timestamp, and stores it in a temporary data carrier.

[0022] Once it is determined that the corresponding semiconductor equipment component has been processed in the entire production line, the integrity of all data in the temporary data carrier is verified.

[0023] Extract the total number of workstations and the total number of testing workstations for the entire production line;

[0024] Compare the total number of detection results in the production process data with the total number of detection stations. If they are equal, compare the total number of image data with the total number of stations. If they are equal, the integrity check has passed.

[0025] Conversely, if the quality is not up to standard, it will be considered a defective product and discarded.

[0026] After the integrity verification is passed, the order data, production process data and image data integrated in the temporary data carrier are packaged together to build a baseline data set.

[0027] As a further aspect of the present invention, in step two, the specific method for constructing the unique serial number associated with the determined semiconductor device component based on the reference data set is as follows:

[0028] Extract the customer identifier, part number, and timestamp of the image data taken when the corresponding semiconductor equipment component completes the last workstation processing from the baseline dataset;

[0029] Convert the timestamp to date encoding;

[0030] The customer identifier, material number, and date code are concatenated into strings to form the basic part of a unique serial number;

[0031] The prefix of a unique serial number is generated using UUID and concatenated with the base part to serve as the unique serial number associated with the corresponding semiconductor device component.

[0032] As a further aspect of the present invention, in step two, the specific method for binding the unique serial number with the baseline data set to generate a storage record and persistently storing it in the pre-built shipping database is as follows:

[0033] Extract the baseline data set that has passed the integrity verification and its corresponding unique sequence number;

[0034] Obtain the pre-built shipment database from the operators and create a storage record with a unique serial number as the primary key;

[0035] Order data, production process data, and image data from the baseline dataset are stored in key-value pairs into the corresponding fields of the storage record. The image data is stored as image links, and the image data itself is stored in a pre-prepared file server.

[0036] Establish a one-to-one mapping relationship between the unique serial number and all fields in the stored record to complete the binding;

[0037] The bound storage record is persistently saved to the shipping database, a storage success confirmation signal is generated, and the status of the unique serial number is marked as "inbound and ready for shipment".

[0038] As a further aspect of the present invention, the specific method for extracting the corresponding customer shipment report template from the pre-built customer shipment report template library using the customer identifier in step three is as follows:

[0039] Based on the baseline data set of any semiconductor equipment component, extract the corresponding order data and parse the customer identifier from the order data;

[0040] Based on customer identifiers, perform exact match queries in a library of customer shipment report templates pre-built by operators;

[0041] S1 performs precise matching based on customer identifiers; if the matching fails, the default general template preset by the operator is activated.

[0042] S2, after a successful exact match, extract the configuration parameters of the customer's shipment report template, including: a list of required fields, report format specifications, and language requirements;

[0043] A data extraction instruction set is generated based on the configuration parameters of the customer shipment report template. The data extraction instruction set includes extracting the corresponding fields from the shipment database and the order in which the corresponding fields are arranged.

[0044] As a further aspect of the present invention, the specific method for generating a semiconductor equipment component shipment report in step three by combining the storage records of the corresponding semiconductor equipment components in the shipment database is as follows:

[0045] Receive customer shipment report templates and corresponding data extraction instruction sets;

[0046] Extract the order number from the order data of the corresponding semiconductor equipment components, and query the shipping database based on the order number for all unique serial numbers marked as "in stock and ready for shipment" and all associated storage records.

[0047] Data is extracted from all stored records based on the data extraction instruction set to generate a standardized intermediate data set;

[0048] The intermediate data set is dynamically populated according to the data visualization rules of the customer shipment report template to generate a semiconductor equipment component shipment report. The image data is dynamically loaded from the file server and embedded in the specified location of the customer shipment report template through image links.

[0049] The system generates a report and sends a completion notification, along with the storage path of the generated semiconductor equipment component shipment report, back to the operator.

[0050] A serial number-based semiconductor equipment component shipment report generation system, the system comprising:

[0051] The data acquisition end determines the entire production line of any semiconductor equipment component, and collects the image data and production process data associated with the corresponding semiconductor equipment component during the production process based on the data acquisition module equipped in the entire production line, together with the order data of the corresponding semiconductor equipment component, to generate a set of reference data associated with the corresponding semiconductor equipment component.

[0052] At the sequence binding end, based on the determined semiconductor equipment components, a unique serial number associated with each component is constructed in combination with a reference data set. The unique serial number is then bound to the reference data set to generate a storage record, which is persistently stored in the pre-built shipping database.

[0053] On the report generation end, based on the benchmark dataset, order data for the corresponding semiconductor equipment components is obtained, customer identifiers are extracted, and the corresponding customer shipment report templates are extracted from the pre-built customer shipment report template library using the customer identifiers. Combined with the storage records of the corresponding semiconductor equipment components in the shipment database, a semiconductor equipment component shipment report is generated.

[0054] The beneficial effects of this invention are:

[0055] (1) This invention integrates data acquisition modules in the entire production line to comprehensively acquire image, production process and order data, forming a benchmark data set to ensure data integrity; it constructs a unique serial number for each component and binds it with the benchmark data to persistently store it in the shipment database, realizing accurate traceability and efficient management of the entire life cycle of the components, significantly improving supply chain transparency; it uses customer identifiers to extract customized report templates from the template library and automatically generates shipment reports by combining them with stored records, which not only greatly improves the efficiency and accuracy of report generation and reduces human intervention errors, but also flexibly meets customers' personalized needs and enhances customer satisfaction, thereby achieving an overall improvement in the automation and intelligence level of the semiconductor equipment component shipment process;

[0056] (2) This invention achieves comprehensive and accurate traceability and quality monitoring of semiconductor equipment component manufacturing process by constructing a multi-source data acquisition system covering the entire production process. Its advantages are that image data, process detection data and order business data are automatically associated and verified in a unified carrier according to the production time sequence. This not only ensures the integrity and consistency of the data chain, but also significantly improves the real-time performance and accuracy of data acquisition through triggered image acquisition and parallel data interface. It effectively avoids the omissions and errors that are easy to occur in traditional manual records. At the same time, it uses the integrity verification mechanism to automatically identify and remove defective products at the end of production, thereby improving the efficiency of quality control and providing a complete and reliable data foundation for process optimization and problem traceability.

[0057] (3) This invention generates a unique serial number by integrating customer identifier, material number and timestamp, and integrates UUID prefix to ensure absolute uniqueness, thus solving the problem of accurate traceability of semiconductor equipment parts in complex production processes; secondly, it adopts a key-value pair storage structure and stores image data separately, which not only ensures data integrity and system integrity, but also improves storage and access efficiency; the whole process realizes full-link traceability from production to shipment through primary key binding and status marking, which enhances management accuracy and provides a data foundation for quality control;

[0058] (4) This invention intelligently extracts customer shipment report templates from a pre-built template library based on customer identifiers and uses a multi-level matching mechanism to ensure the robustness and adaptability of the process, avoiding interruptions caused by missing customer information. Its advantages lie in its high degree of automation and standardization. By generating a data extraction instruction set through configuration parameters, it achieves efficient and accurate extraction and arrangement of data from the shipment database, reducing human intervention errors and improving the consistency and efficiency of report generation. In addition, the dynamic template filling and image data embedding functions optimize the visualization and performance of the report, shorten the processing time, and enhance the scalability of the operation while adapting to diverse customer needs. Attached Figure Description

[0059] The invention will now be further described with reference to the accompanying drawings.

[0060] Figure 1 This is a schematic diagram of the system described in this invention;

[0061] Figure 2 This is a flowchart illustrating the method described in Embodiment 2 of the present invention;

[0062] Figure 3 This is a flowchart illustrating the method described in Embodiment 3 of the present invention. Detailed Implementation

[0063] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0064] Example 1

[0065] A serial number-based semiconductor equipment component shipment report generation system, such as Figure 1 As shown, this system includes the following:

[0066] This system, the Serial Number-Based Semiconductor Equipment Component Shipment Report Generation System, aims to provide a comprehensive data management and traceability solution for semiconductor equipment components from production to shipment. The system mainly includes a data acquisition terminal, a serial number binding terminal, and a report generation terminal.

[0067] The data acquisition terminal determines the entire production line of any semiconductor equipment component and, based on the data acquisition modules equipped in the entire production line, collects image data and production process data associated with the corresponding semiconductor equipment component during the production process. This data, along with the order data of the corresponding semiconductor equipment component, generates a baseline data set associated with that semiconductor equipment component. Specifically:

[0068] The data acquisition module is composed of multiple modules, including an image acquisition unit, a process quality data acquisition interface, and a business data receiving interface.

[0069] The image acquisition unit consists of an industrial camera, which is installed at each station of the entire production line. The industrial camera automatically acquires image data of semiconductor equipment components under the control of a trigger signal. The trigger signal is linked to the production cycle, that is, when a component completes the processing of a station, the trigger signal automatically activates the industrial camera to acquire an image of the semiconductor equipment component.

[0070] The image data refers to the image data of the corresponding semiconductor equipment components after processing at each station in the entire production line:

[0071] The production process data includes helium detection results, particle size detection results, and size detection results;

[0072] The order data includes order number, material number, customer identifier, and delivery order number. The delivery order number is added after all semiconductor equipment parts have been processed in the order data.

[0073] The process quality data acquisition interface establishes data communication connections with various testing devices in the entire production line to receive helium detection results, particle size detection results, and size detection results in parallel. The helium detection results, particle size detection results, and size detection results are based on the helium detector, particle size detector, and size detector.

[0074] The business data receiving interface establishes a communication connection with the business system to actively capture order data for semiconductor equipment components in the current production batch. The business system is an ERP system or MES system used by the manufacturer.

[0075] In the sequence binding terminal, based on the determined semiconductor device component, a unique serial number associated with it is constructed in conjunction with a reference data set. The unique serial number is then bound to the reference data set to generate a storage record, which is persistently stored in a pre-built shipping database. Specifically:

[0076] After constructing the baseline data set for the corresponding semiconductor device component, it is also necessary to generate a unique serial number associated with this semiconductor device component based on the baseline data set. The unique serial number will serve as the unique identifier of this semiconductor device component and will be applied to subsequent operation procedures.

[0077] Then, based on the determined unique serial number, a storage record associated with this semiconductor device component is generated and persistently managed, stored in a pre-built shipping database by the operator.

[0078] In the report generation terminal, based on the benchmark dataset, order data for the corresponding semiconductor equipment components is obtained, customer identifiers are extracted, and corresponding customer shipment report templates are extracted from a pre-built customer shipment report template library using the customer identifiers. These templates are then combined with the stored records of the corresponding semiconductor equipment components in the shipment database to generate a semiconductor equipment component shipment report. Specifically:

[0079] This module is used to process semiconductor equipment components that are about to be shipped. First, it obtains the baseline data set of the semiconductor equipment components to be shipped from the shipping database (this step first obtains the order data and order number through the ERP system, and then queries the order data of the semiconductor equipment components to be delivered in the shipping database). Then, it further extracts the customer identifier from the order data of the corresponding semiconductor equipment components.

[0080] Using the customer identifier, the system queries whether the corresponding customer needs a specific customer shipment report template pre-built by the operator. If the query finds that the customer needs a specific customer shipment report, a semiconductor equipment component shipment report is generated based on the queried customer shipment report. Otherwise, a semiconductor equipment component shipment report is generated based on the operator's preset default template.

[0081] Example 2

[0082] This embodiment, based on Embodiment 1, further discloses a method for constructing a reference data set for corresponding semiconductor device components, such as... Figure 2 As shown, it specifically includes the following:

[0083] The benchmark dataset is a complete dataset that integrates order data, production process data, and image data. Its construction process mainly includes four steps.

[0084] A temporary data carrier is constructed to receive order data from the business data receiving interface. A temporary data carrier is constructed based on the order number and material number. The temporary data carrier can be a data structure or a temporary database table. This temporary data carrier is used as a temporary storage area to gradually collect all relevant data, avoiding frequent writing to the main database and causing excessive load on the main database.

[0085] Then, according to the production sequence of semiconductor equipment components, the system receives production process data from the process quality data acquisition interface and stores it in a temporary data carrier; at the same time, it receives image data collected by the image acquisition unit at each workstation, associates the image data with the acquisition timestamp, and stores it in a temporary data carrier.

[0086] By processing production process data and image data according to the production sequence of semiconductor equipment components, when quality problems occur, the entire processing history of the corresponding semiconductor equipment component can be traced back according to the production sequence, and the workstation where the problem first occurred can be accurately located.

[0087] Next, after the corresponding semiconductor equipment components have been processed in the entire production line, it is necessary to perform integrity verification on all the data temporarily stored in the temporary data carrier.

[0088] First, extract the total number of workstations and the total number of inspection workstations in the entire production line of the corresponding semiconductor equipment components. Then, extract the total number of inspection results in the production process data temporarily stored in the temporary data carrier and compare it with the total number of inspection workstations (to ensure that all necessary quality inspection steps have been performed and recorded). If they are equal, compare the total number of image data with the total number of workstations (to ensure that the components have physically passed through every processing workstation). If they are equal, it means that the integrity verification has passed.

[0089] If either of the above two conditions fails, the integrity check fails, and the corresponding semiconductor equipment component is considered a defective product and discarded.

[0090] The underlying logic of integrity verification is that if a component completes all production steps, it will inevitably generate corresponding data records at each workstation. Conversely, if the data records are incomplete, it is highly likely that the production process was not fully executed or an abnormal interruption occurred.

[0091] Once the corresponding temporary data carrier has passed integrity verification, the order data, production process data, and image data integrated in the temporary data carrier are packaged together to build a baseline data set, which is then stored in the shipping database.

[0092] Example 3

[0093] This embodiment further discloses a method for generating storage records associated with semiconductor device components, based on embodiment 2. Figure 3 As shown, it specifically includes the following:

[0094] Based on the content described in Example 2, a reference data set of corresponding semiconductor equipment components is obtained. The customer identifier and material number in the order data are extracted from the reference data set. Then, the timestamp of the image data taken when the corresponding semiconductor equipment component completes the last workstation processing is extracted from the image data, and the timestamp is converted into a date code.

[0095] It should be explained that the customer identifier and part number are used to identify the customer and the component type, respectively, while the timestamp is used to record the precise time when the semiconductor equipment component completes the last workstation processing, that is, the production time. Using these three data as the basic elements of the unique serial number ensures that the unique serial number is associated with a specific customer, material, and production time. Because in semiconductor manufacturing, semiconductor equipment components usually need to be traceable throughout the entire process, the customer identifier and part number provide the business-level association, while the timestamp provides the production time dimension. In this way, the semiconductor equipment component can be represented to the greatest extent with the most concise fields.

[0096] Next, the extracted customer identifier, material number, and date code are concatenated into a string in a fixed order to serve as the base part of the serial number. The concatenation order is usually consistent, i.e., the form of customer identifier + material number + date code is convenient for quick query.

[0097] Then, a globally unique random string is created for the corresponding semiconductor device component using a UUID (Universally Unique Identifier) ​​generation algorithm. This string is then concatenated with the base part to form a unique serial number associated with the corresponding semiconductor device component. In high-concurrency production environments, relying solely on the base part may not completely avoid conflicts. For example, if multiple components are processed in the same millisecond, it will lead to duplication. Adding a UUID as a prefix is ​​a best practice for defensive programming. Furthermore, UUIDs conform to international standards and are easy to integrate into various systems or databases.

[0098] Next, the generated unique serial number is bound to the reference data set of the corresponding semiconductor device components constructed in Example 2, and persistently stored in the shipping database.

[0099] The shipping database is pre-built by the operators. The structured data (i.e., order data, production process data, and image data) in the baseline data set is stored in the corresponding fields of the database table in the form of key-value pairs. The image data does not directly store the image itself, because the database cannot store the image in the form of a picture. The image data is stored as an image link pointing to the image data. The image data itself is stored on a pre-prepared file server, such as FTP.

[0100] In the database storage records, a unique serial number is used as the primary key, and a one-to-one mapping relationship is established with each field. That is, all field values ​​of the record can be retrieved through the unique serial number, realizing complete data association and traceability. All relevant information about semiconductor equipment components can be obtained through the unique serial number.

[0101] Finally, a storage success confirmation signal is generated, and the status field of the unique serial number is updated to "in stock and ready for shipment" based on the storage success confirmation signal.

[0102] Example 4

[0103] This embodiment further discloses a method for generating a semiconductor device component shipment report based on embodiment 3, specifically including the following:

[0104] First, based on a baseline dataset for any semiconductor equipment component, the corresponding order data is extracted, and the customer identifier is parsed from the order data. The principle is that each semiconductor equipment component has a stored record in the shipping database, and this stored record allows the acquisition of a baseline dataset, which includes order data. The order data contains the customer identifier, which can be automatically extracted using data parsing technology. This identifier is then matched with the orders to be delivered in the ERP system, thus determining which semiconductor equipment components need to be shipped.

[0105] Based on the identified customer identifier, perform an exact match query in the customer shipment report template library pre-built by the operator, using the customer identifier as the query condition to retrieve the characteristic template required by the customer;

[0106] If an exact match is found, the configuration parameters of the customer's shipment report template are extracted, including: a list of required fields, report format specifications, and language requirements, to meet the customer's need for a personalized shipment report.

[0107] If an exact match fails, the default general template preset by the operator will be used to retrieve the configuration parameters from the default general template.

[0108] Based on the configuration parameters, a series of data extraction instructions are generated to form a data extraction instruction set, which extracts the corresponding fields from the shipping database and specifies the order of these fields in the report.

[0109] For example, a list of fields is as follows:

[0110] ["serial_number", "ship_date"];

[0111] The data extraction command is a SQL query: SELECT serial_number, ship_date FROMshipments WHERE client_id = 'ClientA' ORDER BY serial_number.

[0112] Obtain the customer shipment report template and the corresponding data extraction instruction set for the customer shipment report template, and use them as input for generating semiconductor equipment component shipment reports;

[0113] Then, the order numbers are extracted from the order data of all semiconductor equipment components to be delivered from the ERP system, and a query is executed in the shipping database using the order numbers as the query conditions to determine the unique serial numbers of all items marked as "in stock and ready for shipment" and all associated storage records.

[0114] The determined data extraction instruction set is used to extract data from all stored records, and the extracted data is arranged into an intermediate data set according to the extraction order.

[0115] Next, the intermediate data set is dynamically populated according to the data visualization rules of the customer shipment report template. Generally, the data in the intermediate data set is populated into the corresponding report layout based on the reporting tool, thus obtaining the semiconductor equipment component shipment report. It should be noted that the image data is dynamically loaded from the file server through image links and embedded in the specified location of the customer shipment report template.

[0116] Once all the information in the customer shipment report template has been completed, the report will be generated, and the operator will be notified. The storage path of the generated semiconductor equipment component shipment report will also be returned to the operator.

[0117] All data in the formulas described above are numerical calculations performed with dimensions removed. Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0118] The above description is merely an example and illustration of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

[0119] It should be stated that all user data collected in this application was collected with the user's consent and authorization. Furthermore, the uses of user data are legal and compliant, and the use and processing of user data comply with the relevant laws, regulations, and standards of the relevant regions.

Claims

1. A method for generating a semiconductor equipment component shipment report based on serial number, characterized in that, The method includes: Step 1: Determine the complete production line of any semiconductor equipment component, and collect the image data and production process data associated with the corresponding semiconductor equipment component during the production process based on the data acquisition module equipped in the complete production line, together with the order data of the corresponding semiconductor equipment component, to generate the reference data set associated with the corresponding semiconductor equipment component. Step 2: Based on the identified semiconductor equipment components, construct a unique serial number associated with each component using a reference data set, bind the unique serial number to the reference data set, generate a storage record, and persistently store it in the pre-built shipping database. Step 3: Based on the benchmark dataset, obtain the order data of the corresponding semiconductor equipment components, extract the customer identifier, use the customer identifier to extract the corresponding customer shipment report template from the pre-built customer shipment report template library, and combine it with the storage records of the corresponding semiconductor equipment components in the shipment database to generate a semiconductor equipment component shipment report.

2. The method according to claim 1, characterized in that, In step one, the image data includes image data of the corresponding semiconductor equipment components after processing at each station in the entire production line: Production process data includes helium emission test results, particle size test results, and size test results; The order data includes the order number, material number, customer identifier, and delivery order number. The delivery order number is added after all semiconductor equipment parts have been processed in the order data.

3. The method according to claim 2, characterized in that, In step one, the data acquisition module includes an image acquisition unit, a process quality data acquisition interface, and a business data receiving interface. The image acquisition unit is installed at the workstation in the entire production line. Through the integrated industrial camera, it automatically acquires image data of semiconductor equipment components under the control of the trigger signal. The trigger signal is linked to the production cycle of the entire production line. Each semiconductor equipment component is acquired after processing at any workstation. The process quality data acquisition interface establishes a data communication connection with the testing equipment in the entire production line to receive helium testing results, particle size testing results, and size testing results from different workstations in parallel. The business data receiving interface establishes a communication connection with the business system to actively capture order data for semiconductor equipment components in the current production batch.

4. The method according to claim 3, characterized in that, In step one, the specific method for generating the reference data set associated with the corresponding semiconductor device components is as follows: Receive order data from the business data receiving interface, and construct a temporary data carrier based on the order number and material number in the order data; According to the production sequence of the corresponding semiconductor equipment components, receive the production process data from the process quality data acquisition interface and store it in a temporary data carrier; The system receives image data collected by the image acquisition unit at each workstation, associates the image data with the acquisition timestamp, and stores it in a temporary data carrier. Once it is determined that the corresponding semiconductor equipment component has been processed in the entire production line, the integrity of all data in the temporary data carrier is verified. Extract the total number of workstations and the total number of testing workstations for the entire production line; Compare the total number of detection results in the production process data with the total number of detection stations. If they are equal, compare the total number of image data with the total number of stations. If they are equal, the integrity check has passed. Conversely, if the quality is not up to standard, it will be considered a defective product and discarded. After the integrity verification is passed, the order data, production process data and image data integrated in the temporary data carrier are packaged together to build a baseline data set.

5. The method according to claim 4, characterized in that, In step two, the specific method for constructing the unique serial number associated with the determined semiconductor device component based on the reference data set is as follows: Extract the customer identifier, part number, and timestamp of the image data taken when the corresponding semiconductor equipment component completes the last workstation processing from the baseline dataset; Convert the timestamp to date encoding; The customer identifier, material number, and date code are concatenated into strings to form the basic part of a unique serial number; The prefix of a unique serial number is generated using UUID and concatenated with the base part to serve as the unique serial number associated with the corresponding semiconductor device component.

6. The method according to claim 5, characterized in that, In step two, the unique serial number is bound to the baseline data set to generate a storage record, which is then persistently stored in the pre-built shipping database. The specific method for this is as follows: Extract the baseline data set that has passed the integrity verification and its corresponding unique sequence number; Obtain the pre-built shipment database from the operators and create a storage record with a unique serial number as the primary key; Order data, production process data, and image data from the baseline dataset are stored in key-value pairs into the corresponding fields of the storage record. The image data is stored as image links, and the image data itself is stored in a pre-prepared file server. Establish a one-to-one mapping relationship between the unique serial number and all fields in the stored record to complete the binding; The bound storage record is persistently saved to the shipping database, a storage success confirmation signal is generated, and the status of the unique serial number is marked as "inbound and ready for shipment".

7. The method according to claim 6, characterized in that, In step three, the specific method for extracting the corresponding customer shipment report template from the pre-built customer shipment report template library using the customer identifier is as follows: Based on the baseline data set of any semiconductor equipment component, extract the corresponding order data and parse the customer identifier from the order data; Based on customer identifiers, perform exact match queries in a library of customer shipment report templates pre-built by operators; S1 performs precise matching based on customer identifiers; if the matching fails, the default general template preset by the operator is activated. S2, after a successful exact match, extract the configuration parameters of the customer's shipment report template, including: a list of required fields, report format specifications, and language requirements; A data extraction instruction set is generated based on the configuration parameters of the customer shipment report template. The data extraction instruction set includes extracting the corresponding fields from the shipment database and the order in which the corresponding fields are arranged.

8. The method according to claim 7, characterized in that, In step three, the specific method for generating a semiconductor equipment component shipment report by combining the storage records of the corresponding semiconductor equipment components in the shipment database is as follows: Receive customer shipment report templates and corresponding data extraction instruction sets; Extract the order number from the order data of the corresponding semiconductor equipment components, and query the shipping database based on the order number for all unique serial numbers marked as "in stock and ready for shipment" and all associated storage records. Data is extracted from all stored records based on the data extraction instruction set to generate a standardized intermediate data set; The intermediate data set is dynamically populated according to the data visualization rules of the customer shipment report template to generate a semiconductor equipment component shipment report. The image data is dynamically loaded from the file server and embedded in the specified location of the customer shipment report template through image links. The system generates a report and sends a completion notification, along with the storage path of the generated semiconductor equipment component shipment report, back to the operator.

9. A semiconductor equipment component shipment report generation system based on serial number, characterized in that, The system includes: The data acquisition end determines the entire production line of any semiconductor equipment component, and collects the image data and production process data associated with the corresponding semiconductor equipment component during the production process based on the data acquisition module equipped in the entire production line, together with the order data of the corresponding semiconductor equipment component, to generate a set of reference data associated with the corresponding semiconductor equipment component. At the sequence binding end, based on the determined semiconductor equipment components, a unique serial number associated with each component is constructed in combination with a reference data set. The unique serial number is then bound to the reference data set to generate a storage record, which is persistently stored in the pre-built shipping database. On the report generation end, based on the benchmark dataset, order data for the corresponding semiconductor equipment components is obtained, customer identifiers are extracted, and the corresponding customer shipment report templates are extracted from the pre-built customer shipment report template library using the customer identifiers. Combined with the storage records of the corresponding semiconductor equipment components in the shipment database, a semiconductor equipment component shipment report is generated.

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