A device and method for on-line detection of the rate of hemispherical resonator chemical polishing
By combining multi-wavelength white light interferometry and differential laser ranging in an online detection device, the problem of real-time monitoring of thickness and removal rate during the chemical polishing of hemispherical harmonic oscillators was solved, achieving high-precision, non-contact material removal rate detection and improving processing consistency and device performance stability.
CN122109571APending Publication Date: 2026-05-29BEIJING AUTOMATION CONTROL EQUIP INST
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING AUTOMATION CONTROL EQUIP INST
- Filing Date
- 2025-12-30
- Publication Date
- 2026-05-29
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Figure CN122109571A_ABST
Abstract
The application provides a kind of on-line detection device and method for hemispherical resonator chemical polishing rate, the device obtains the angular position signal of resonator rotation through motion synchronization module, constructs optical channel using protection and sealing structure, based on the angular position signal and optical channel, using multi-wavelength white light interference unit and differential laser ranging unit two measuring units are used for measuring thickness and instantaneous rate respectively, while using environmental compensation module to generate chemical polishing solution environmental compensation term, the polishing rate is obtained by fusing the thickness, instantaneous rate and chemical polishing solution environmental compensation term. The technical scheme of the application is used to solve the technical problem that the hemispherical resonator chemical polishing process lacks real-time, high-precision thickness and removal rate monitoring means in the prior art.
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