An optical computing chip development board

Abstract

The application discloses a kind of optical computing chip development board, the optical computing chip development board is directly acted on phase change material using laser direct writing technology to realize reconfigurable optical waveguide network and custom direct writing device, and can realize laser accurate erasing, to more flexible, accurate realization of the line adjustment between different tunable application-specific integrated optical path module and custom direct writing device, or reconfiguration to custom direct writing device, to facilitate the required linear domain operation and nonlinear domain operation of collaborative execution.

Description

Technical Field

[0001] This invention belongs to the field of photonic chip technology, and specifically relates to a development board for an optical computing chip. Background Technology

[0002] With the rapid development of silicon-based photonics technology, optical computing chips have shown great potential as a new hardware technology for artificial intelligence. However, current optical computing chips are designed for specific application scenarios, resulting in a fixed architecture that limits chip functionality and makes them unable to adapt to multi-task switching or algorithm updates. Whenever the application scenario changes, a complete redesign, manufacturing, and packaging process is required. The entire development process of dedicated photonic link chips, from design and tape-out to multiple iterations, requires significant engineering resources and manufacturing costs, resulting in a development cycle of several months and high costs, hindering the rapid iteration and innovative application development of optical computing chips. Therefore, the development of optical computing chips requires a general-purpose photonic chip architecture with physical reconfigurability, capable of flexibly adjusting its module configuration according to actual needs after mass production, to quickly verify new overall functions, thereby significantly reducing the development threshold and accelerating the prototype verification and system innovation of photonic integrated chips. This invention proposes a novel optical computing chip development board architecture, a new photonic chip architecture solution that enables large-scale integration, non-volatile programming, low-power operation, and rapid reconfiguration. Summary of the Invention

[0003] This invention provides an optical computing chip development board that can efficiently construct reconfigurable optical waveguide networks, and can more flexibly realize the precise erasure and writing of optical waveguide networks and custom direct-write devices as needed. It can connect different tunable dedicated integrated optical path modules and custom direct-write devices as needed, thereby flexibly and efficiently realizing the coordinated execution of the set linear domain operations and nonlinear domain operations.

[0004] This invention provides an optical computing chip development board, comprising: Development board substrate; Arbitrary shape reconstruction region, which is located on the development board substrate, is made of phase change material. Under laser induction, the phase change material undergoes a reversible phase transition, thereby forming a reconfigurable optical waveguide network and a custom direct-write device on the arbitrary shape reconstruction region. A tunable dedicated integrated optical path module is fixed on the development board substrate. The tunable dedicated integrated optical path module is an integrated optical path with a fixed optical path structure but tunable optical parameters. Specifically, different tunable dedicated integrated optical path modules are connected through the reconfigurable optical waveguide network, or the tunable dedicated integrated optical path modules are connected to a custom direct-write device; the arbitrary morphology reconstruction region is reconstructed by laser erasing phase change material, the connection relationship between the tunable dedicated integrated optical path module and the custom direct-write device is adjusted, or the custom direct-write device is reconstructed, thereby realizing the coordinated execution of linear domain operations and nonlinear domain operations.

[0005] This invention achieves deep synergy between parameter fine-tuning and topology reconstruction through its "fixed module + reconfigurable region" architecture. The tunable dedicated integrated optical path module adjusts its internal optical parameters (such as phase and weights) to achieve fine-tuning during algorithm execution. Meanwhile, the arbitrary-shape reconfigurable region changes the phase state of the phase-change material through laser direct writing, enabling flexible switching of optical path interconnections, physical topology, or device logic functions. This allows the development board to utilize high-performance fixed modules manufactured with mature processes, and to quickly adapt to completely different algorithm architectures through the redefinition of physical links, greatly improving the versatility and development efficiency of optical computing chips.

[0006] Preferably, the tunable dedicated integrated optical path module is distributed around the arbitrary shape reconstruction area.

[0007] Preferably, the silicon structure of the tunable dedicated integrated optical path module and the arbitrary shape reconfiguration region is manufactured by standard wafer foundry processes, and the phase change material layer and protective layer on the arbitrary shape reconfiguration region are prepared by back-end compatible physical and chemical vapor deposition methods.

[0008] Preferably, it also includes an interface structure, wherein the tunable dedicated integrated optical path module includes a fixed waveguide; the interface structure includes a fully etched or partially etched tapered waveguide and a tapered phase change material located on the fully etched or partially etched tapered waveguide; the fully etched or partially etched tapered waveguide is connected to the fixed waveguide of the tunable dedicated integrated optical path module, and the tapered phase change material is connected to the reconfigurable optical waveguide network, thereby achieving efficient optical field coupling between the tunable dedicated integrated optical path module and the reconfigurable optical waveguide network; Alternatively, the interface structure is a horizontally coupled array port, and the custom direct-write device includes a horizontal coupler; the horizontally coupled array port is located at the edge of the tunable dedicated integrated optical path module, and is used to output or input optical signals from the tunable dedicated integrated optical path module; the horizontal coupler is located at the port position of the custom direct-write device, and the horizontal coupler is connected to the horizontally coupled array port to realize signal exchange between the tunable dedicated integrated optical path module and the custom direct-write device.

[0009] Preferably, the amorphous extinction coefficient of the phase change material is less than 0.01, and the difference in refractive index before and after the phase change is at least 0.6.

[0010] Preferably, the phase change material is Sb-Se, Sb-S, Ge-Sb-Se-Te, or Ge-Sb-Se.

[0011] Preferably, the reconfigurable optical waveguide network includes an end-to-end optical waveguide, which can realize a two-port line or a multi-port line.

[0012] Preferably, the optical computing chip development boards are interconnected.

[0013] Preferably, the tunable dedicated integrated optical path module includes an input-output coupling module, a light source module, a signal modulation module, a wave decomposition and multiplexing module, a linear calculation module, a nonlinear activation module, and a photodetector array module.

[0014] Preferably, the optical computing chip development board may have multiple reconfiguration areas of arbitrary shape, which can be cascaded as needed.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: Compared to existing technologies that attach phase change materials (PCMs) to etched optical waveguides and utilize PCMs for optical valve regulation, this invention utilizes laser direct writing technology to directly realize reconfigurable optical waveguide networks and custom direct-write devices on PCMs. It also enables precise laser erasing and writing, allowing for more flexible and accurate adjustment of circuits between different tunable dedicated integrated optical path modules and custom direct-write devices, or reconfiguration of custom direct-write devices to efficiently achieve the required coordinated execution of linear and nonlinear domain operations. This achieves physical-level flexible configuration with zero static power consumption, effectively solving the problems of single, fixed functionality, long development cycles, and high costs in optical computing chip prototype verification. It provides development board hardware for prototype design verification, education, and other application scenarios. Furthermore, while conventional optical routing scheduling can be achieved using optical switch arrays, photonic chip development boards require numerous dedicated functional modules, large channel scales, and diverse interconnection requirements. As the number of ports increases, the number of required switch units and cross waveguides grows exponentially, resulting in a massive chip physical layout and significantly increased insertion loss. This makes it difficult to meet the demands of agile development and prototype verification in the photonic integration field for high physical reconfiguration capabilities. This invention also provides a simple, low-energy-consumption method for scheduling and coordination among multiple modules in complex dedicated photonic links. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an optical computing chip development board provided in a specific embodiment of the present invention; Figure 2A longitudinal refractive index distribution diagram of the interface structure provided in a specific embodiment of the present invention; Figure 3 A top view of the interface structure provided in a specific embodiment of the present invention; Figure 4 The simulation diagrams of different regions of the interface structure provided in the specific embodiments of the present invention are shown. Figure 4 (a) is a simulation diagram of the mode field in the tapered fully etched waveguide region. Figure 4 (b) and Figure 4 (c) shows the model field simulation diagrams near the starting point of the conical transition section of the phase change material and near the ending point of the plate region. Figure 4 (d) is a model field simulation diagram of the reconfigurable flat plate region where the reconfigurable network is located; Figure 5 This is a schematic diagram of the structure of an optical computing chip development board provided in Embodiment 1 of the present invention; Figure 6 This is a schematic diagram of another optical computing chip development board provided in Embodiment 2 of the present invention. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0018] This invention provides a development board for an optical computing chip based on phase change materials. Unlike existing technologies that utilize photolithographic waveguides combined with phase change material optical valves, this invention proposes a novel hardware-software integrated architecture. Figure 1As shown, the development board mainly includes a development board substrate 300, an arbitrary shape reconstruction region 200 on the development board substrate 300, and tunable dedicated integrated optical path modules 100 distributed around the arbitrary shape reconstruction region 200. The arbitrary shape reconstruction region 200 is essentially a large-area phase change material layer. Using laser direct writing technology, a low-loss reconfigurable optical waveguide network 201 and custom direct-write devices can be directly defined on the phase change material. Utilizing the non-volatile reversible phase transition between the crystalline and amorphous states of the phase change material and the accompanying significant refractive index change, this invention achieves zero static power consumption operation of the programmable photonic link. This allows users to flexibly define optical path interconnections and logic functions. The tunable dedicated integrated optical path module 100 is manufactured using standard wafer foundry processes; its optical path structure is fixed at the factory, but its optical parameters are tunable. Using laser erasing technology, users can construct optical paths on the arbitrary-shaped reconstruction region 200, connecting different high-performance tunable dedicated integrated optical path modules 100, or constructing custom direct-write devices to work with the modules. This architecture supports the coordinated execution of linear and nonlinear domain operations, improving the flexibility and development efficiency of optical computing.

[0019] To achieve efficient transmission of optical signals between the tunable dedicated integrated optical path module 100 and the custom direct-write device, this embodiment designs a low-loss interface structure 202. For example... Figure 2 and Figure 3 As shown, the interface structure 202 is located between the tunable dedicated integrated optical path module and the arbitrary shape reconstruction region 200. It consists of a fully or partially etched tapered waveguide connecting the module side and a tapered phase change material covering it and connecting the arbitrary shape reconstruction region 200 side, with a protective layer on top. Figure 4 (a) Figure 4 (b) Figure 4 (c) and Figure 4 As shown in the mode field simulation results (d), when the optical field is transmitted from the fully etched or partially etched waveguide within the module to the conical region, it is gradually transferred to the phase change material waveguide defined by laser direct writing through evanescent wave coupling. This adiabatic coupling method achieves low-loss conversion of the optical mode field from the silicon waveguide to the phase change material waveguide. As an alternative, if the module and the arbitrary shape reconstruction region 200 are independent chips, signal exchange between chips can also be achieved through the horizontal coupling array ports at the edge in conjunction with horizontal couplers such as inverted cone or trident structures constructed at the edge of the arbitrary shape reconstruction region 200.

[0020] To ensure the performance of the direct-write waveguide, this embodiment prioritizes the phase change material, preferably using Sb-Se, Sb-S, Ge-Sb-Se-Te, or Ge-Sb-Se based materials, such as Sb₂Se₃. The amorphous extinction coefficient of the selected material should be less than 0.01 to ensure low transmission loss of the optical waveguide. Simultaneously, the refractive index difference before and after the phase transition should be at least 0.6 to ensure sufficient optical confinement capability for the laser-written waveguide, enabling precise optical path definition. Furthermore, in the arbitrary morphology reconstruction region 200, in addition to constructing point-to-point optical waveguides, custom direct-write devices can also be constructed, including but not limited to beam splitters, wave demultiplexing devices, or logic operation devices. The peripheral tunable dedicated integrated optical path module may include an input coupling module, a light source module, a signal modulation module, a linear calculation module, a nonlinear activation module, a photodetector array module, and a wave demultiplexing module. The development board of the present invention also supports expansion, which includes optical interconnection between multiple arbitrary-shaped reconstruction regions 200 on the same development board, as well as optical signal interconnection between boards or chips achieved through photonic wire bonding or end-face coupling technology.

[0021] Example 1 This embodiment utilizes the aforementioned optical computing chip development board to construct a performance comparison system for nonlinear activation operations in the electrical and optical domains. This embodiment fully demonstrates that the development board can flexibly construct test links, define logical topologies, and complete specific tasks by rewriting the optical routes in arbitrary reconfigurable regions without requiring re-fabrication.

[0022] like Figure 5 As shown, the hardware foundation used in this embodiment includes multiple tunable dedicated integrated optical path modules 100 distributed on the development board substrate 300, specifically including: a laser diode array module 101, a first linear calculation module 102, a photoelectric oscillator array module 103, and a photodetector array module 112. The first linear calculation module 102 is a calculation unit with a fixed optical path structure but adjustable parameters, constructed based on phase change materials and a checkerboard-style cross array.

[0023] The connection relationships between the various tunable dedicated integrated optical path modules 100 are not factory presets, but are entirely determined by the user through laser direct writing to define the reconfigurable optical waveguide network 201 on the arbitrary shape reconstruction area 200. In order to achieve the "dual path comparison" function required in this embodiment, the user uses laser direct writing technology to build a custom direct writing device on the arbitrary shape reconstruction area 200, specifically an MMI (multimode interference) beam splitter.

[0024] The specific signal flow and working principle of the system provided in this embodiment are as follows: The laser diode array module 101 generates a modulated optical signal, which is transmitted to the first linear calculation module 102 through the reconfigurable optical waveguide network 201. After the first linear calculation module 102 completes the optical convolution calculation operation, the output calculation result optical signal is guided to a custom direct-write device (MMI beam splitter) located in the arbitrary shape reconstruction region 200. The custom direct-write device splits the optical signal into two identical signals, which enter two different test paths: The first signal is transmitted to the photoelectric oscillator array module 103 through the reconfigurable optical waveguide network 201, where a nonlinear activation operation in the optical domain is performed. The processed optical signal is transmitted to the photodetector array module 112 and converted into an electrical signal, which is finally acquired as the "optical domain activation result". The second signal is directly transmitted to the photodetector array module 112 through the reconfigurable optical waveguide network 201, where the convolution result optical signal without activation operation is converted into an electrical signal, and then a nonlinear activation operation is performed in the electrical domain and saved as the "electrical domain activation result".

[0025] With the above configuration, this system can ultimately compare and analyze the performance and benefits (such as latency and power consumption) of the same computational task under optical domain activation and electrical domain activation modes. This process demonstrates the great flexibility of the development board: users do not need to find dedicated chips containing specific beam splitting structures; they only need to "write" a beam splitting device in any shape reconstruction area 200 and connect the relevant modules to quickly complete the construction and verification of a complex comparative test system.

[0026] Example 2 like Figure 6 As shown, this embodiment constructs a photonic convolution kernel system based on the aforementioned optical computing chip development board. Unlike Embodiment 1, this embodiment reconstructs the reconfigurable optical waveguide network 201 on the arbitrary shape reconstruction region 200 through laser erasing operations, connecting different tunable dedicated integrated optical path modules 100, thereby realizing functional switching at the physical topology level and demonstrating the application potential of the development board in the fields of image processing and feature extraction.

[0027] The tunable dedicated integrated optical path module 100 selected in this embodiment includes an input / output coupling module 107, a wavelength division multiplexing module 108, a signal modulation module 109, a second linear calculation module 110, a second nonlinear activation module 104, and a photodetector array module 112. The input / output coupling module 107 employs a grating coupler array to receive free-space optical signals. The wavelength division multiplexing module 108 receives the optical signals transmitted by the input / output coupling module 107 and separates the broadband optical signals into a certain number of specific wavelength carriers. The signal modulation module 109 employs a micro-ring modulator array to receive the separated specific wavelength optical signals and load data. The second linear calculation module 110 is a photonic convolution kernel module based on a micro-ring resonator, used to perform high-density multiply-accumulate operations. The second nonlinear activation module 104 specifically employs a linear rectification (ReLU) module.

[0028] The connection relationships and workflow of this embodiment are as follows: First, a reconfigurable optical waveguide network 201 connecting the above modules is defined by laser direct writing on the arbitrary shape reconstruction region 200. The optical signal enters the chip through the input / output coupling module 107, and after the signal channels of different wavelengths are separated by the wavelet decomposition and multiplexing module 108, it is modulated by the signal modulation module 109. The modulated optical signal is transmitted to the second linear calculation module 110 for optical convolution calculation, which follows the formula Y=W×X, where W is the weight matrix, which can be configured by the user by tuning the resonant wavelength or coupling coefficient of the microring. The calculated optical signal is transmitted to the second nonlinear activation module 104 for linear rectification operation in the optical domain. The ReLU function expression implemented by this module is f(x)=max(0,x). The processed optical signal is finally transmitted to the photodetector array module 112 to be converted into an electrical signal for acquisition by the acquisition device. This embodiment shows that through simple laser direct writing reconstruction, the same development board can be transformed from a nonlinear activation performance testing system (Example 1) into a high-performance photonic convolution calculation system.

[0029] Example 3 This embodiment utilizes the optical computing chip development board provided by this invention to implement a photonic computing system based on programmable linear transformation. Compared with Embodiment 2, this embodiment mainly replaces the core computing module, further demonstrating the development board's compatibility with different computing architectures.

[0030] The tunable dedicated integrated optical path module used in this embodiment includes an input-output coupling module 107, a wave decomposition and multiplexing module 108, a signal modulation module 109, a third linear calculation module, and a second nonlinear activation module 104. Specifically, the third linear calculation module employs a Mach-Zehnder interferometer network module. By precisely controlling the phase of each phase shifter, this module can achieve arbitrary unitary matrix transformations, thereby performing complex linear matrix operations in the optical domain.

[0031] When building the system, the user first erases the existing waveguide pattern on the arbitrary shape reconstruction area 200, and then draws a new reconfigurable optical waveguide network 201 using laser direct writing. The output port of the signal modulation module 109 is connected to the input port of the third linear calculation module, and the output port of the latter is connected to the second nonlinear activation module 104. If special phase preprocessing or mode conversion of the signal is required in matrix operations, the user can also build corresponding custom direct writing devices in the arbitrary shape reconstruction area 200. When the system is working, the modulated optical signal enters the third linear calculation module for linear matrix operations (Y=W×X), where the weight matrix W is programmed by the user through electronic control of the phase shifters in the network. The calculation result then enters the second nonlinear activation module 104 for ReLU operation, and is finally received by the photodetector array module 112. This embodiment verifies the versatility of the development board in application scenarios such as optical neural network inference and linear algebra acceleration.

[0032] Example 4 This embodiment proposes a multifunctional photonic computing cluster system based on multi-board interconnection. Given the limited number of tunable dedicated integrated optical path modules 100 and the limited area of ​​the arbitrary-shape reconfiguration region 200 on a single optical computing chip development board, this embodiment connects multiple optical computing chip development boards described in Embodiments 1, 2, or 3 above using interconnection technology to cope with ultra-large-scale optical computing tasks.

[0033] The specific implementation methods of interconnection include optical signal interconnection and electrical signal interconnection. For optical signal interconnection, this embodiment utilizes photonic wire bonding or a horizontal coupling array port on the edge of the development board in conjunction with a fiber optic array to achieve low-loss interconnection between different development boards. Users can build custom direct-write devices (such as optical routing structures) on the arbitrary shape reconstruction area 200 of the first development board to guide intermediate calculation results to the chip edge and transmit them to the second development board for further processing via the interconnection interface. For electrical signal interconnection, the high-speed electrical interface on the development board is used to achieve electrical connection path interconnection of tunable dedicated integrated optical path modules between different development boards. Specifically, the calculation result electrical signal or control electrical signal output by the first development board is transmitted to the electrical signal receiving end of the second development board through the interconnection interface to drive its internal photoelectric conversion elements, phase adjustment elements, or directly perform electrical domain logic analysis. This interconnection method not only supports "optical-electrical-optical" signal relay but also supports parameter synchronization and collaborative control across boards.

[0034] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise expressly defined.

[0035] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0036] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A development board for an optical computing chip, characterized in that, include: Development board substrate; Arbitrary shape reconstruction region, which is located on the development board substrate, is made of phase change material. Under laser induction, the phase change material undergoes a reversible phase transition, thereby forming a reconfigurable optical waveguide network and a custom direct-write device on the arbitrary shape reconstruction region. A tunable dedicated integrated optical path module is fixed on the development board substrate. The tunable dedicated integrated optical path module is an integrated optical path with a fixed optical path structure but tunable optical parameters. Specifically, different tunable dedicated integrated optical path modules are connected through the reconfigurable optical waveguide network, or the tunable dedicated integrated optical path modules are connected to a custom direct-write device; the arbitrary morphology reconstruction region is reconstructed by laser erasing phase change material, the connection relationship between the tunable dedicated integrated optical path module and the custom direct-write device is adjusted, or the custom direct-write device is reconstructed, thereby realizing the coordinated execution of linear domain operations and nonlinear domain operations.

2. The optical computing chip development board according to claim 1, characterized in that, The tunable dedicated integrated optical path module is distributed around the arbitrary shape reconstruction area.

3. The optical computing chip development board according to claim 1, characterized in that, The silicon structure of the tunable dedicated integrated optical path module and the arbitrary shape reconfiguration region is manufactured by standard wafer foundry processes, and the phase change material layer and protective layer on the arbitrary shape reconfiguration region are prepared by back-end compatible physical and chemical vapor deposition methods.

4. The optical computing chip development board according to claim 1, characterized in that, It also includes an interface structure, wherein the tunable dedicated integrated optical path module includes a fixed waveguide; the interface structure includes a fully etched or partially etched tapered waveguide and a tapered phase change material located on the fully etched or partially etched tapered waveguide; the fully etched or partially etched tapered waveguide is connected to the fixed waveguide of the tunable dedicated integrated optical path module, and the tapered phase change material is connected to the reconfigurable optical waveguide network, thereby achieving efficient optical field coupling between the tunable dedicated integrated optical path module and the reconfigurable optical waveguide network; Alternatively, the interface structure is a horizontally coupled array port, and the custom direct-write device includes a horizontal coupler; the horizontally coupled array port is located at the edge of the tunable dedicated integrated optical path module, and is used to output or input optical signals from the tunable dedicated integrated optical path module; the horizontal coupler is located at the port position of the custom direct-write device, and the horizontal coupler is connected to the horizontally coupled array port to realize signal exchange between the tunable dedicated integrated optical path module and the custom direct-write device.

5. The optical computing chip development board according to claim 1, characterized in that, The amorphous extinction coefficient of the phase change material is less than 0.01, and the difference in refractive index before and after the phase change is at least 0.

6.

6. The optical computing chip development board according to claim 1 or 4, characterized in that, The difference in extinction coefficient of the phase change material before and after the phase change in the optical band where the chip is working is less than 0.

01.

7. The optical computing chip development board according to claim 1, characterized in that, The reconfigurable optical waveguide network includes end-to-end optical waveguides, enabling dual-port or multi-port lines.

8. The optical computing chip development board according to claim 1, characterized in that, The reconfigurable optical waveguide network is non-volatile.

9. The optical computing chip development board according to claim 1, characterized in that, The tunable dedicated integrated optical path module includes an input / output coupling module, a light source module, a signal modulation module, a wave decomposition and multiplexing module, a linear calculation module, a nonlinear activation module, and a photodetector array module.

10. The optical computing chip development board according to claim 1, characterized in that, The optical computing chip development board can have multiple arbitrary-shape reconfiguration areas. Each arbitrary-shape reconfiguration area can connect to multiple different tunable dedicated integrated optical path modules, which can be selected and cascaded as needed.

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