An optical interconnect system and signal transmission method based on an RC Micro-LED array
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- FUDAN UNIVERSITY
- Filing Date
- 2026-03-14
- Publication Date
- 2026-06-26
Smart Images
Figure CN122293202A_ABST
Abstract
Description
Technical Field
[0001] This application relates to an optical interconnect system and signal transmission method based on an RC Micro-LED array for the field of signal transmission. Background Technology
[0002] With the surge in demand for high-speed, short-range data transmission in scenarios such as data centers and AI clusters, the performance requirements for signal interconnect systems are also constantly increasing. Optical interconnect systems offer advantages such as ultra-high bandwidth, high transmission speed, low latency, low power consumption and heat dissipation, and high resistance to electromagnetic interference. They solve the performance bottlenecks of electrical interconnects in terms of bandwidth, power consumption, latency, and information density, and represent a key development direction for next-generation high-speed interconnects, directly determining the overall communication quality and operational efficiency of information systems.
[0003] Existing optical interconnect systems are mainly divided into laser-based solutions represented by VCSELs (Vertical-Cavity Surface-Emitting Lasers) and diode-based solutions represented by LEDs and their improved versions. VCSELs, as a mature light source, offer advantages such as high modulation rates, narrow spectral density, and high fiber purity. However, they suffer from inherent technical bottlenecks: high-speed driving requires a large bias current to maintain bandwidth, leading to a significant increase in power consumption; they are also extremely sensitive to temperature changes, with thermo-optical effects easily causing resonant wavelength drift, necessitating complex temperature control mechanisms for stabilization; furthermore, their manufacturing process is complex and costly, and large-scale array integration presents channel crosstalk issues. Diode-based optical interconnect systems, on the other hand, exhibit relatively lower temperature sensitivity, better linearity, higher integration density, and greater cost potential, making them a promising direction for the development of optical interconnect systems.
[0004] Existing LED optical interconnect systems are limited by the light source (such as Micro-LED), which has a wide spectral linewidth and is prone to severe dispersion effects. This leads to a decrease in signal integrity during high-speed transmission, poor light emission directionality, and high coupling loss with optical coupling elements, resulting in low transmission bandwidth. When pursuing high bandwidth and high-speed transmission, the system needs to compensate for the performance shortcomings by increasing power consumption or increasing the complexity of digital signal processing. It is impossible to achieve synergistic optimization of low power consumption, high bandwidth, and high stability, making it difficult to meet the stringent requirements of high-end optical interconnect scenarios for comprehensive performance. Summary of the Invention
[0005] The purpose of this application is to overcome the shortcomings of the prior art and provide an optical interconnect system and signal transmission method based on RC Micro-LED array, which can realize low power consumption, high bandwidth and high speed optical interconnect communication.
[0006] Firstly, this application provides an optical interconnect system based on an RC Micro-LED array, which adopts the following technical solution: An optical interconnect system includes an optical transmitting module, an optical receiving module, an optical path, an optical coupling module, and an optical decoupling module; The light emitting module includes a signal modulation module and a light source module. The signal modulation module modulates the data signal into a light source control signal to control the light emission of the light source module. The light source module includes at least one set of RC Micro-LED components. The RC Micro-LED components are composed of several RC Micro-LED light-emitting units arranged in sequence. Each RC Micro-LED light-emitting unit outputs a light signal based on the light source control signal of the signal modulation module. The optical coupling module corresponds to the RC Micro-LED component and includes a coupling element. The coupling element is interconnected with the RC Micro-LED light-emitting unit and couples the light signal of the RC Micro-LED light-emitting unit to couple the light signals of each RC Micro-LED light-emitting unit of the same RC Micro-LED component into the input end of the same optical path to form a composite light signal. The optical path corresponds to the RC Micro-LED component and transmits the composite optical signal; The optical decoupling module is connected to the output end of the optical path, and separates and outputs the composite optical signal according to the wavelength of the optical signal through the decoupling element; The optical receiving module includes a photodetector assembly, a demodulation module, and a data processing module. The photodetector assembly consists of photodetector units that correspond one-to-one with the RC Micro-LED light-emitting units. The photodetector units acquire the optical signal of the corresponding wavelength output by the decoupling element and convert it into an electrical signal. The demodulation module is connected to each of the photodetector units, demodulates the electrical signal into a data signal, and inputs it into the data processing module. The data processing module acquires the data signal from the demodulation module, integrates all the data signals, and outputs integrated data.
[0007] By adopting the above technical solution, the optical interconnect system uses RC Micro-LED light-emitting units as the light source. Taking advantage of their narrow emission spectrum and convenient spectrum modulation, multiple RC Micro-LED light-emitting units can be used simultaneously to emit light signals with different wave properties. The light signals are coupled into the same optical path for signal transmission, and the signals are separated at the output end of the optical path by optical decoupling elements. This achieves optical path multiplexing for signal transmission, thereby increasing the bandwidth of signal transmission many times over.
[0008] Preferably, the light emitting module further includes a serial-to-parallel conversion module, and the signal modulation module is a CMOS driving circuit corresponding one-to-one with each of the RC Micro-LED light-emitting units. The emission wavelengths of each of the RC Micro-LED light-emitting units are the same, partially the same, or different. The serial-to-parallel conversion module splits the total data stream into several parallel sub-data streams. The number of channels in the sub-data streams is consistent with the number of RC Micro-LED light-emitting units. The CMOS driving circuit modulates the electrical signal into a light source control signal based on the sub-data streams to control the emission of the RC Micro-LED light-emitting units connected to it.
[0009] By adopting the above technical solution, the total data of one channel can be transmitted synchronously through multiple parallel RC Micro-LED optical signal transmission paths of different wavelengths, thereby effectively improving the data transmission speed.
[0010] As a priority, a grounding shielding structure is provided between the CMOS driving circuits of any two adjacent RC Micro-LED light-emitting units, and an optical isolation structure is provided between any two adjacent RC Micro-LED light-emitting units.
[0011] By adopting the above technical solutions, electromagnetic coupling between CMOS driving circuits in a highly integrated state is avoided through the grounding shielding structure, and the optical isolation structure is used to prevent the light signal of the RC Micro-LED light-emitting unit in a highly integrated state from being accidentally captured by adjacent devices or optical paths through the substrate or packaging material, thereby avoiding signal crosstalk.
[0012] Preferably, the RC Micro-LED light-emitting unit array is disposed on the substrate of the light-emitting module, located at the edge of the substrate, and outputs light signals to the side of the substrate through the optical coupling module.
[0013] As a preferred embodiment, the RC Micro-LED light-emitting unit array is disposed on the top or bottom of the substrate of the light-emitting module, and outputs light signals to the top or bottom of the substrate through the optical coupling module.
[0014] By adopting the above technical solutions and using different configurations of RC Micro-LEDs on the substrate of the light emitting module, on-chip same-layer communication or inter-chip heterogeneous communication of the optical interconnect system can be realized.
[0015] Preferably, the specific structure of the RC Micro-LED light-emitting unit is as follows: based on the Micro-LED device, a reflective surface structure is set at the bottom and top of the device to form an FP resonant cavity. By controlling the epitaxial layer thickness of the two reflective surfaces to be equal to an integer multiple of the wavelength of the target light signal, the resonant gain filtering light emission of the target wavelength is achieved.
[0016] By adopting the above technical solution, the wavelength of the optical signal of the RC Micro-LED light-emitting unit can be effectively modulated according to the band configuration requirements of the optical signal, and a high-purity specific wavelength optical signal can be sent. The density of states of photons is changed through the resonant cavity, which significantly enhances the rate of spontaneous emission and improves the collimation and light extraction efficiency of the light emission.
[0017] Preferably, the coupling element is an arrayed waveguide grating or a microring resonator array; the optical path is an optical fiber, an optical waveguide, or spatial light propagation; the decoupling element is the same as the coupling element; and the photodetector is a silicon-based PIN photodiode.
[0018] By adopting the above technical solution, the coupling and decoupling of multi-wavelength optical signals are realized through coupling elements and decoupling elements consistent with the coupling elements, the propagation of optical signals is realized through optical paths, and photoelectric conversion is realized through silicon-based PIN photodiodes.
[0019] Preferably, the light emitting module includes several groups of RC Micro-LED components, and the light receiving module includes several groups of photodetector components corresponding to the RC Micro-LED components. The RC Micro-LED components and the photodetector components are arranged at intervals, and each RC Micro-LED light-emitting unit and each photodetector unit are arranged sequentially.
[0020] By adopting the above technical solution, multiple composite optical signal paths can be formed by multiple arrays of RC Micro-LED components and a corresponding number of photodetector components, further increasing the signal transmission bandwidth; the RC Micro-LED components and photodetector components are spaced apart to avoid crosstalk between adjacent composite optical signal paths.
[0021] Secondly, this application provides a signal transmission method based on an RC Micro-LED array, implemented using the aforementioned optical interconnect system, and the technical solution includes the following steps: S100, the data stream drive channel is configured according to the number of RC Micro-LED light-emitting units; S200, splits the total data stream into sequentially arranged data packets, adds a data header to each data packet, and the data header includes the corresponding data stream driver channel information; S300 allocates data packets to the corresponding data stream drive channel, modulates electrical signals into light source control signals within the data stream drive channel, and outputs light signals with different wave properties through the RC Micro-LED light-emitting unit. The wave properties include wavelength, phase, polarization, and spatial distribution. S400 couples the light signals output from each RC Micro-LED light-emitting unit into the input end of the same optical path to form a composite light signal for transmission. The S500 decouples the composite optical signal at the output of the optical path to obtain optical signals with different wave properties, which are then input into the photodetector to be converted into electrical signals. The S600 converts electrical signals into data packets and integrates these data packets into a total data stream based on the data header.
[0022] Preferably, in S100, the data stream driving channel configuration based on the number of RC Micro-LED light-emitting units specifically includes: S101, when configuring the data stream drive channel, sends configuration data packets and receives feedback signals through the optical interconnect system; S102, based on the feedback signal, confirm whether the RC Micro-LED light-emitting unit and its corresponding data stream drive channel are in normal working condition; S103, configure the number of data stream drive channels according to the RC Micro-LED light-emitting unit in normal working state and its corresponding data stream drive channel.
[0023] In summary, this application includes at least one of the following beneficial technical effects: 1. The optical interconnect system based on RC Micro-LED array of this application can achieve low voltage driving, significantly reduce the power consumption of the signal transmission system, and ensure the stability of the light source output signal.
[0024] 2. The optical interconnect system fully utilizes the narrow emission spectrum and small divergence angle of RC Micro-LED devices to achieve coupling transmission and decoupling identification of optical signals of different wavelengths within the same optical path. It supports wavelength division multiplexing of optical signals in different wavelength bands, significantly increasing channel bandwidth. Combined with a serial-to-parallel conversion module, it enables synchronous data transmission based on different wavelength optical signal channels, further improving overall data transmission efficiency. Due to its resonant cavity structure, RC Micro-LED devices, compared to ordinary LED devices, generate standing wave gain and optimized light output, significantly reducing carrier lifetime and noticeably increasing bandwidth and communication speed. The devices themselves possess high-speed communication potential; through array distribution, even higher-speed optical communication interconnect systems can be achieved.
[0025] 3. The failure of a single RC Micro-LED light-emitting unit in the light-emitting module of this application will not lead to the overall failure of the channel transmission, but will only reduce part of the channel bandwidth accordingly, thereby improving the overall reliability of large-scale applications of optical interconnect systems. Attached Figure Description
[0026] Figure 1This is a schematic diagram of the structure of an optical interconnect system based on an RC Micro-LED array, as described in an embodiment of this application. Figure 2 This is a top view of the optical interconnect system based on an RC Micro-LED array in this embodiment of the application, which uses a serial-to-parallel conversion module. Figure 3 This is a schematic diagram of a horizontally stacked RC Micro-LED light-emitting unit structure in an embodiment of this application; Figure 4 This is a schematic diagram of another vertically stacked RC Micro-LED light-emitting unit structure in an embodiment of this application; Figure 5 This is a schematic diagram of the inter-chip communication structure of the optical interconnect system based on RC Micro-LED array in the embodiments of this application; Figure 6 This is a schematic diagram of the optical interconnect system comprising multiple sets of RC Micro-LED components in an embodiment of this application; Figure 7 This is a schematic flowchart of a signal transmission method based on an RC Micro-LED array in an embodiment of this application. Detailed Implementation
[0027] This specific embodiment is merely an explanation of this application and is not intended to limit it. After reading this specification, those skilled in the art can make modifications to this embodiment without contributing any inventive step, but such modifications are protected by patent law as long as they are within the scope of this application.
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. It should be noted that in the optional embodiments of this application, the object information and other related data involved require the permission or consent of the object when the embodiments of this application are applied to specific products or technologies, and the collection, use, and processing of related data must comply with the relevant laws, regulations, and standards of the relevant countries and regions. That is to say, if the embodiments of this application involve data related to the object, it needs to be obtained with the authorization and consent of the object, the authorization and consent of the relevant departments, and in compliance with the relevant laws, regulations, and standards of the country and region. If personal information is involved in the embodiments, the acquisition of all personal information requires the consent of the individual. If sensitive information is involved, the separate consent of the information subject is required, and the embodiments also need to be implemented with the authorization and consent of the object.
[0029] The embodiments of this application will now be described in further detail with reference to the accompanying drawings. Example 1
[0030] Please see Figure 1 This application discloses an optical interconnect system based on an RC Micro-LED array, comprising a light emitting module 1, an optical coupling module 2, an optical path 3, an optical decoupling module 4, a light receiving module 5, a PCB substrate 6, and a substrate 7. The PCB substrate 6 provides mechanical support for the substrate 7 and supplies power to the various devices on the substrate 7 through a power distribution network. It also houses other components such as control chips, memory, decoupling capacitors, resistors, and heat sinks. The substrate 7 integrates various optical interconnect devices and integrates CMOS circuitry for signal transmission control.
[0031] The optical transmitting module 1 includes a signal modulation module 11 connected to the data receiving chip, and a light source module 12 connected to the signal modulation module 11. The data receiving chip, which can be a control chip such as a SOC / MCU / ASIC, is mounted on the PCB substrate 6 to receive input data transmission tasks and distribute these tasks to the signal modulation module 11 via circuitry. The signal modulation module 11 outputs a modulated drive current based on the data transmission task, and the strength of this drive current forms the light source control signal for the light source module 12. More specifically, the signal modulation module 11 uses a CMOS driver circuit integrated on the optical interconnect system substrate, which, together with the CMOS circuit, controls the signal transmission control network. This signal modulation scheme eliminates the need for a separate signal modulation device, greatly simplifying the structure of the optical interconnect system.
[0032] The light source module 12 includes a set of RC Micro-LED components. The RC Micro-LED components are composed of several RC Micro-LED light-emitting units with different emission wavelengths arranged in sequence. Each RC Micro-LED light-emitting unit outputs a light signal based on the light source control signal of the signal modulation module 11.
[0033] It should be noted that the RC Micro-LED module is composed of several RC Micro-LED light-emitting units with different emission wavelengths arranged sequentially, which is a specific embodiment of this application. The purpose is to ensure that the light signals emitted by different RC Micro-LED light-emitting units have different wave properties, and to achieve channel-specific signal transmission within the same optical path based on these different wave properties and signal coupling and decoupling. Wave properties include wavelength, phase, polarization, and spatial distribution. In other embodiments, optical devices such as phase gratings and polarizers can be placed at the light source to increase the wave property dimension of the light signal. In the above cases, the emission wavelengths of the RC Micro-LED light-emitting units constituting the RC Micro-LED module can be the same, partially the same, or completely different; preferably, the emission wavelengths of the RC Micro-LED light-emitting units are all different.
[0034] The specific structure of the RC Micro-LED light-emitting unit is as follows: based on the Micro-LED device, reflective surface structures are set at the bottom and top of the device to form an FP resonant cavity. By controlling the thickness of the epitaxial layer of the two reflective surfaces to be an integer multiple of the target light signal wavelength, resonant gain filtering of the target wavelength is achieved. Simultaneously, RC Micro-LEDs also possess the performance advantage of low carrier lifetime, which can further improve the bandwidth of optical interconnect systems. Based on the resonant cavity characteristics of RC Micro-LEDs, a single device can generate a low-power, narrow-spectrum, high-efficiency, and high-bandwidth optical signal through resonant standing wave gain.
[0035] It should be noted that although RC Micro-LED light-emitting units have a narrower spectrum (typically around 2-5 nm) compared to the spectral width of traditional LED spontaneous emission (20-50 nm), they are still essentially cavity-enhanced spontaneous emission, and their spectral width performance is difficult to match that of stimulated emission VCSEL lasers. Therefore, it is necessary to plan and design the channel spectrum of each RC Micro-LED light-emitting unit and modulate it accordingly to avoid spectral overlap that could lead to signal crosstalk.
[0036] In the embodiments of this application, a set of RC Micro-LED components employs four RC Micro-LED light-emitting units, with each unit emitting light at wavelengths of 375nm, 450nm, 520nm, and 630nm, respectively. This ensures sufficient isolation between different wavelengths, achieving wavelength division multiplexing while avoiding crosstalk. Those skilled in the art will understand that the above-mentioned wavelength selection does not constitute a limitation on the technical solution of this application. They can select appropriate channel numbers and wavelengths while ensuring signal transmission quality and avoiding crosstalk. In practical applications, RC Micro-LED components are composed of an array of RC Micro-LED light-emitting units, and multiple RC Micro-LED components are arranged in a column to form optical signal matrix channels ranging from several to hundreds.
[0037] The optical coupling module 2 includes a coupling element, which is an arrayed waveguide grating (AWG) or a microring resonator array. Each coupling element corresponds one-to-one with a specific RC Micro-LED light-emitting unit in the RC Micro-LED assembly, coupling the optical signals from each RC Micro-LED light-emitting unit into the input of the same optical path 3 to form a composite optical signal. In this embodiment, the coupling element is a multiplexer for different wavelength optical signals from different RC Micro-LED light-emitting units; the wavelength serves as a label to distinguish different source signal channels.
[0038] Preferably, an optical waveguide channel is used as optical path 3 for optical signal propagation, which has a high compatibility with the coupling elements used. In other embodiments, other coupling methods and coupling devices can be combined, such as chip edge coupling or grating couplers, to couple optical signals into the optical fiber, thereby realizing the use of optical fiber as optical path 3 for optical signal coupling and transmission, or, under the condition of ensuring precise control of the collimation of optical transmitting module 1 and optical receiving module 5, as well as the collimation of optical coupling module 2 and optical decoupling module 4, spatial optical signal propagation can be used over a very short transmission distance. Various types of optical fibers can realize the optical signal transmission of this application. In particular, in order to adapt to the feature of multiple optical signal channels of multiple RC Micro-LED light-emitting units in this application, a multi-aperture imaging fiber can be used, which has a number of channels adapted to the RC Micro-LED light-emitting units. Each channel can realize independent signal transmission, avoiding crosstalk, and enabling independent channel communication of multiple light source devices in space.
[0039] The optical decoupling module 4 is connected to the output end of the optical waveguide channel. It separates and outputs the composite optical signal according to its wavelength using a decoupling element. The decoupling element and the coupling element are of the same type. In the embodiments of this application, an arrayed waveguide grating (AWG) or a microring resonator array is used. Based on the reciprocity of coupling and decoupling, the decoupling element uses a device of the same type as the coupling element as a demultiplexer, which can achieve wavelength channel alignment, reduce crosstalk, and reduce channel interference caused by performance drift of the optical interconnect system due to environmental factors such as temperature and stress through the relative matching of the decoupling element and the coupling element.
[0040] Taking an arrayed waveguide grating (AWG) as an example, this paper explains the multiplexing and demultiplexing of optical signals of different wavelengths in an optical interconnect system. The arrayed waveguide consists of a series of waveguides whose lengths increase by a fixed difference ΔL. Optical signals of different wavelengths, after passing through the waveguide with this length difference, will experience different phase delays. For a specific wavelength, the phase delay difference is exactly an integer multiple of 2π, causing constructive interference and creating a focal point in the waveguide propagation region. When a composite optical signal containing multiple wavelengths is focused at the output of the waveguide and then input to a decoupling element (i.e., an inverting input multiplexer), the optical signals of each wavelength are dispersed to different outputs, separated, and guided to their corresponding photodetectors.
[0041] Additionally, it should be noted that, besides wavelength coupling, if the optical coupling module also involves coupling optical signals based on other optical devices to increase bandwidth by addressing various wave properties such as frequency, phase, and spatial distribution, then the optical decoupling module 4 needs to perform corresponding decoupling and separation of the aforementioned signal characteristics. For example, diffraction gratings and metasurface gratings can be used to generate optical signals with different polarization states to achieve polarization multiplexing.
[0042] The optical receiving module 5 includes a photodetector assembly 41, a demodulation module 52, and a data processing module 53. The photodetector assembly 41 consists of photodetector units corresponding one-to-one with the RC Micro-LED light-emitting units, and these photodetector units are silicon-based PIN photodiodes. The silicon-based PIN photodiodes acquire the optical signal of the corresponding wavelength output by the decoupling element and convert it into an electrical signal. The demodulation module 52 is connected to each silicon-based PIN photodiode, acquires the electrical signal, and demodulates it into a data signal through signal processing circuits such as a TIA transimpedance amplifier and an LA limiting amplifier, before inputting it into the data processing module 53. The data processing module 53 corresponds to the data receiving chip and can use a control chip such as a SOC / MCU / ASIC. It acquires the data signal from the demodulation module 52, integrates all the data signals, and outputs the restored transmission signal data.
[0043] During the operation of the aforementioned system, various control and auxiliary feedback systems are required to coordinate and regulate the modulation, coupling, transmission, decoupling, and demodulation of signals, as well as the system's operating environment. Specifically, automatic power control is achieved through APC circuits to provide continuous and stable output power to the RC Micro-LED light source module; power detectors are installed at the RC Micro-LED light source end to dynamically monitor the output power and output status of the RC Micro-LED array devices in real time, optimize power consumption, and perform fault reporting; auxiliary control units such as the TEC temperature control unit, power management unit, and DDM / DOM digital diagnostic interface unit are used to monitor and interact with the operating environment of the optical interconnect system.
[0044] The above technical solution is based on an optical interconnect system of RC Micro-LED arrays, which achieves high-bandwidth data transmission through wavelength division multiplexing optical signal paths. Example 2
[0045] In the technical solution provided in Example 1, each RC Micro-LED light-emitting unit serves as a component of the channel path and can transmit data independently, thereby enabling the optical signal transmission path to have a high bandwidth and simultaneously transmit multiple data stream signals.
[0046] Please see Figure 2 Based on Embodiment 1, the light emitting module 1 further includes a serial-to-parallel conversion module 13. The serial-to-parallel conversion module 13 splits a single total data stream into several parallel sub-data streams, the number of channels in each sub-data stream being the same as the number of RC Micro-LED light-emitting units. The CMOS driving circuit modulates the electrical signal into a light source control signal based on the sub-data streams, controlling the light emission of the RC Micro-LED light-emitting units connected to it.
[0047] The above technical solution enables a single data stream to be split and transmitted synchronously through the optical signal channels of all RC Micro-LED light-emitting units. Then, on the receiving side, the data stream is decoupled, photoelectrically converted, demodulated, and reassembled. This allows the single data stream to fully utilize the maximum bandwidth of the RC Micro-LED optical interconnect system, thereby greatly improving the speed and efficiency of data transmission. Example 3
[0048] The individual RC Micro-LED light-emitting units 121 of the RC Micro-LED assembly can be implemented in different stacking ways according to structural design requirements.
[0049] Please see Figure 3RC Micro-LED light-emitting units 121 are arranged in a horizontal array at certain intervals on the surface of substrate 7 and connected to signal modulation module 11 through CMOS driving circuit network. The light signals output by each RC Micro-LED light-emitting unit 121 are coupled into the same optical path through optical coupling module 2 disposed at the edge of substrate for transmission of optical composite signal.
[0050] A grounding shield is provided between the CMOS driving circuits of any two adjacent RC Micro-LED light-emitting units to reduce electromagnetic coupling between different signal paths; an optical isolation structure is provided between any two adjacent RC Micro-LED light-emitting units. The optical isolation structure can use deep trenches or metal gratings to absorb or reflect lateral leakage light. The above scheme realizes the anti-crosstalk design for the transmission of optical signals of different wavelengths, and enhances the anti-crosstalk performance of the system when transmitting and receiving different optical signals.
[0051] Please see Figure 4 In another embodiment, the RC Micro-LED light-emitting units 121 can be arranged in a vertically stacked manner on the substrate surface. The CMOS driving circuit needs to be arranged in three dimensions by constructing vias including metal layers in the vertical direction of the dielectric layer, thereby realizing the connection between the RC Micro-LED light-emitting units 121 and the signal modulation module 11. This stacked layout of the RC Micro-LED light-emitting units 121 can save on-chip space of the optical interconnect system as much as possible, which is beneficial to the structural design of optical interconnect systems with multiple RC Micro-LED components.
[0052] Since the light signal of the RC Micro-LED light-emitting unit 121 needs to be coupled into the optical path through the optical coupling module 2, and then transmitted to the photodetector unit through the decoupling element at the output end after propagation through the optical path, the specific arrangement of the photodetector unit can be the same as that of the RC Micro-LED light-emitting unit, or it can be different from that of the RC Micro-LED light-emitting unit, depending on the layout of the optical path and the decoupling element. Example 4
[0053] In one specific implementation, an RC Micro-LED light-emitting unit array is disposed on the top or bottom of the substrate of the light-emitting module, and outputs light signals to the top or bottom of the substrate through an optical coupling module.
[0054] Specifically, this is achieved by etching an inclined reflective surface or fabricating a diffraction grating on the substrate of the RC Micro-LED, causing the light signal emission direction of the RC Micro-LED to be directly upward or downward. The signal is then guided into an optical waveguide located on the upper or lower layer of the chip via integrated coupling elements, achieving vertical light signal transmission perpendicular to the substrate surface. The optical waveguide can be integrated into a transparent polymer substrate to achieve vertical signal transmission, or more simply, such as… Figure 5 As shown, the PCB substrate is inverted so that the substrates of the optical interconnect system between different layers are positioned opposite each other. After collimation, the optical signal is transmitted through an optical waveguide. The above technical solution can realize chip-level inter-chip communication and can utilize vertical space to realize chip-level three-dimensional optical path connection. Example 5
[0055] Please see Figure 6 In the embodiments of this application, the light source module 12 of the same light emitting module 1 includes two sets of RC Micro-LED components, and the light receiving module 5 includes two sets of photodetector components corresponding to the RC Micro-LED components. In practical applications, the number of RC Micro-LED components is adjusted according to bandwidth requirements and spatial layout conditions.
[0056] Since RC Micro-LED light-emitting units with different wavelengths of light signals are coupled into the same optical path for signal transmission, space between chips is saved and integration is improved. Therefore, the optical interconnect system can simultaneously deploy multiple sets of RC Micro-LED components and photodetector components to achieve spatial multiplexing of signal transmission and further improve channel bandwidth.
[0057] For each side of the signal transmission in the optical interconnect system, a corresponding set of photodetectors is required for each group of RC Micro-LED components to exchange signals, obtain feedback signals, and avoid channel crosstalk. Therefore, the RC Micro-LED components and photodetectors are spaced apart to isolate them from each other, ensuring that no channel crosstalk occurs between adjacent groups of RC Micro-LED components or adjacent groups of photodetectors.
[0058] Each RC Micro-LED light-emitting unit and each photodetector unit are arranged sequentially. For example, when the RC Micro-LED light-emitting units are arranged in a horizontal array, they are uniformly arranged in ascending order of wavelength, so that the distance between each group of RC Micro-LED light-emitting units with the same optical signal wavelength in adjacent RC Micro-LED light-emitting components is constant, further improving the channel isolation of adjacent RC Micro-LED light-emitting components.
[0059] The specific stacking method of the RC Micro-LED light-emitting units of each group of RC Micro-LED components, as well as the specific arrangement of the optical signal path, can be referred to the schemes of Embodiments 3 and 4, and will not be repeated here.
[0060] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is used as an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the device can be divided into different functional units or modules to complete all or part of the functions described above. Example 6
[0061] Please see Figure 7 An embodiment of this application provides a signal transmission method based on an RC Micro-LED array, comprising the following steps: S100 configures the data stream drive channel according to the number of RC Micro-LED light-emitting units.
[0062] More specifically, in S100, the data stream drive channels configured according to the number of RC Micro-LED light-emitting units specifically include: S101, when configuring the data stream drive channel, sends configuration data packets and receives feedback signals through the optical interconnect system.
[0063] S102 confirms whether the RC Micro-LED light-emitting unit and its corresponding data stream drive channel are in normal working condition based on the feedback signal.
[0064] S103, configure the number of data stream drive channels according to the RC Micro-LED light-emitting unit in normal working state and its corresponding data stream drive channel.
[0065] By pre-checking and configuring the data stream drive channel before data transmission, it can be ensured that the signal channels corresponding to the wavelengths of each RC Micro-LED light-emitting unit are in normal working condition, preventing signal loss or bit errors. If the signal channel corresponding to the wavelength of a single Micro-LED light-emitting unit is found to be faulty, the bandwidth of the channel is reduced accordingly after excluding the channel corresponding to that optical signal wavelength, without causing the overall failure of the optical interconnect system channel, thus avoiding the impact of a single point of failure on the overall signal transmission.
[0066] S200 splits the total data stream into sequentially arranged data packets and adds a data header to each data packet, which includes the corresponding data stream driver channel information.
[0067] The S300 distributes data packets to the corresponding data stream drive channel, modulates electrical signals into light source control signals within the data stream drive channel, and outputs light signals with different wave properties through the RC Micro-LED light-emitting unit. Wave properties include wavelength, phase, polarization, and spatial distribution.
[0068] The S400 couples the light signals output from each RC Micro-LED light-emitting unit into the input end of the same optical path to form a composite light signal for transmission.
[0069] The S500 decouples the composite optical signal at the output of the optical path to obtain optical signals with different wave properties. These signals are then input into a photodetector and converted into electrical signals.
[0070] The S600 converts electrical signals into data packets and integrates these data packets into a total data stream based on the data header.
[0071] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.
[0072] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working process of the signal transmission method based on the RC Micro-LED array described above can be referred to the corresponding description in the aforementioned optical interconnect system embodiments, and will not be repeated here.
[0073] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.
Claims
1. A light interconnect system based on an RC Micro-LED array, comprising a light emitting module, a light receiving module, and an optical path, characterized in that: It also includes an optical coupling module and an optical decoupling module; The light emitting module includes a signal modulation module and a light source module. The signal modulation module modulates the data signal into a light source control signal to control the light emission of the light source module. The light source module includes at least one set of RC Micro-LED components. The RC Micro-LED components are composed of several RC Micro-LED light-emitting units arranged in sequence. Each RC Micro-LED light-emitting unit outputs a light signal based on the light source control signal of the signal modulation module. The optical coupling module corresponds to the RC Micro-LED component and includes a coupling element. The coupling element is interconnected with the RC Micro-LED light-emitting unit and couples the light signal of the RC Micro-LED light-emitting unit to couple the light signals of each RC Micro-LED light-emitting unit of the same RC Micro-LED component into the input end of the same optical path to form a composite light signal. The optical path corresponds to the RC Micro-LED component and transmits the composite optical signal; The optical decoupling module is connected to the output end of the optical path, and separates and outputs the composite optical signal according to the wavelength of the optical signal through the decoupling element; The optical receiving module includes a photodetector assembly, a demodulation module, and a data processing module. The photodetector assembly consists of photodetector units that correspond one-to-one with the RC Micro-LED light-emitting units. The photodetector units acquire the optical signal of the corresponding wavelength output by the decoupling element and convert it into an electrical signal. The demodulation module is connected to each of the photodetector units, demodulates the electrical signal into a data signal, and inputs it into the data processing module. The data processing module acquires the data signal from the demodulation module, integrates all the data signals, and outputs integrated data.
2. The optical interconnect system based on an RC Micro-LED array according to claim 1, characterized in that, The light emitting module also includes a serial-to-parallel conversion module. The signal modulation module is a CMOS driving circuit that corresponds one-to-one with each of the RC Micro-LED light-emitting units. The emission wavelengths of each of the RC Micro-LED light-emitting units are the same, partially the same, or different. The serial-to-parallel conversion module splits the total data stream into several parallel sub-data streams. The number of channels in the sub-data streams is the same as the number of RC Micro-LED light-emitting units. The CMOS driving circuit modulates the electrical signal into a light source control signal based on the sub-data streams to control the emission of the RC Micro-LED light-emitting units connected to it.
3. The optical interconnect system based on an RC Micro-LED array according to claim 2, characterized in that, A grounding shielding structure is provided between the CMOS driving circuits of any two adjacent RC Micro-LED light-emitting units, and an optical isolation structure is provided between any two adjacent RC Micro-LED light-emitting units.
4. The optical interconnect system based on an RC Micro-LED array according to claim 3, characterized in that, The RC Micro-LED light-emitting unit array is disposed on the substrate of the light-emitting module, located at the edge of the substrate, and outputs light signals to the side of the substrate through the optical coupling module.
5. The optical interconnect system based on an RC Micro-LED array according to claim 3, characterized in that, The RC Micro-LED light-emitting unit array is disposed on the top or bottom of the substrate of the light-emitting module, and outputs light signals to the top or bottom of the substrate through the optical coupling module.
6. The optical interconnect system based on an RC Micro-LED array according to claim 1, characterized in that, The specific structure of the RC Micro-LED light-emitting unit is as follows: based on the Micro-LED device, a reflective surface structure is set at the bottom and top of the device to form an FP resonant cavity. By controlling the epitaxial layer thickness of the two reflective surfaces to be equal to an integer multiple of the wavelength of the target light signal, the resonant gain filtering light emission of the target wavelength is achieved.
7. The optical interconnect system based on an RC Micro-LED array according to claim 1, characterized in that, The coupling element is an arrayed waveguide grating or a microring resonator array; the optical path is an optical fiber, an optical waveguide, or spatial light propagation; the decoupling element is the same as the coupling element; and the photodetector is a silicon-based PIN photodiode.
8. The optical interconnect system based on an RC Micro-LED array according to claim 1, characterized in that, The light emitting module includes several groups of RC Micro-LED components, and the light receiving module includes several groups of photodetector components corresponding to the RC Micro-LED components. The RC Micro-LED components and the photodetector components are arranged at intervals, and each RC Micro-LED light-emitting unit and each photodetector unit are arranged sequentially.
9. A signal transmission method based on an RC Micro-LED array, implemented using the optical interconnect system according to any one of claims 1-8, characterized in that, Includes the following steps: S100, the data stream drive channel is configured according to the number of RC Micro-LED light-emitting units; S200, splits the total data stream into sequentially arranged data packets, adds a data header to each data packet, and the data header includes the corresponding data stream driver channel information; S300 allocates data packets to the corresponding data stream drive channel, modulates electrical signals into light source control signals within the data stream drive channel, and outputs light signals with different wave properties through the RC Micro-LED light-emitting unit. The wave properties include wavelength, phase, polarization, and spatial distribution. S400 couples the light signals output from each RC Micro-LED light-emitting unit into the input end of the same optical path to form a composite light signal for transmission. The S500 decouples the composite optical signal at the output of the optical path to obtain optical signals with different wave properties, which are then input into the photodetector to be converted into electrical signals. The S600 converts electrical signals into data packets and integrates these data packets into a total data stream based on the data header.
10. A signal transmission method based on an RC Micro-LED array according to claim 9, characterized in that, In S100, the data stream drive channel configuration based on the number of RC Micro-LED light-emitting units specifically includes: S101, when configuring the data stream drive channel, sends configuration data packets and receives feedback signals through the optical interconnect system; S102, based on the feedback signal, confirm whether the RC Micro-LED light-emitting unit and its corresponding data stream drive channel are in normal working condition; S103, configure the number of data stream drive channels according to the RC Micro-LED light-emitting unit in normal working state and its corresponding data stream drive channel.