A resistive element and an electronic device

Abstract

This application relates to the field of resistive element technology, and more particularly to a resistive element and an electronic device. The resistive element includes a ceramic body, two external electrodes, and lead-out electrodes. The ceramic body has two end faces disposed opposite each other along a first direction, and two side faces disposed opposite each other along a second direction. Each external electrode is disposed on one of the end faces, and each external electrode extends to one of the side faces along the second direction. Lead-out electrodes are disposed within the ceramic body. Each lead-out electrode has a lead-out end connected to one of the external electrodes, and an electrode body portion connected to the lead-out end. The electrode body portion extends along the first direction away from the connected lead-out end, and is spaced apart from the other external electrode. The width of the ceramic body is W1, the width of the lead-out end is W2, and the width of the electrode body portion is W3, where W1 > W2 > W3. The lead-out end is spaced apart from the external electrodes on each side face along the second direction to reduce the risk of false connections.

Description

Technical Field

[0001] This application relates to the field of resistive element technology, and in particular to a resistive element and electronic device. Background Technology

[0002] For resistive elements with leads, the leads need to be connected to external electrodes to achieve electrical connection with the outside world. However, there is a high risk of loose connections at the connection point between the leads and the external electrodes. When loose connections occur, the resistive element is prone to electrical malfunctions during use. Summary of the Invention

[0003] This application discloses a resistive element and electronic device that can reduce the risk of false connections.

[0004] To achieve the above objectives, in a first aspect, embodiments of this application disclose a resistive element, comprising: A ceramic body having two end faces disposed opposite each other along a first direction and two side faces disposed opposite each other along a second direction, the second direction intersecting the first direction; Two external electrodes, each external electrode being disposed on each of the said end faces, and each external electrode extending from its end along the second direction to each of the said side faces; and An electrode is provided in the ceramic body; the electrode has an outlet end connected to the external electrode and an electrode body portion connected to the outlet end, the electrode body portion extending away from the connected outlet end along the first direction, and the electrode body portion being spaced apart from another external electrode. Wherein, along the second direction, the width of the ceramic body is W1, the width of the lead-out end is W2, and the width of the electrode body is W3, satisfying the following relationship: W1 > W2 > W3; the lead-out end is spaced apart from each of the side surfaces along the second direction. In a possible implementation of the first aspect, W2 and W3 also satisfy the following relationship: W2 / W3 = 1.2~2.0.

[0005] In a possible implementation of the first aspect, W1 and W2 also satisfy the following relationship: W2 / W1 = 20%~80%.

[0006] In a possible implementation of the first aspect, the number of electrode body portions in the lead-out electrode is two, the two electrode body portions are spaced apart along the first direction, and the ends of the two electrode body portions away from each other each have lead-out ends, and each lead-out end is connected to each of the external electrodes.

[0007] In a possible implementation of the first aspect, the resistive element further includes: An inner electrode is disposed within the ceramic body, the inner electrode extends along the first direction, and both ends of the inner electrode along the first direction are spaced apart from the outer electrode; Along the third direction, the inner electrode and the lead-out electrode are spaced apart, the ceramic body has a top surface and a bottom surface that are arranged opposite to each other, and the orthographic projection of the inner electrode on the bottom surface coincides with the orthographic projection of the two electrode bodies of the same lead-out electrode on the bottom surface; The first direction, the second direction, and the third direction intersect each other.

[0008] In a possible implementation of the first aspect, the number of lead electrodes is multiple layers, the multiple layers of lead electrodes are spaced apart along the third direction, and the inner electrode is disposed between two adjacent layers of lead electrodes.

[0009] In a possible implementation of the first aspect, the width W4 of the inner electrode along the second direction satisfies the following relationship: W4 ≠ W3; and / or, The height H of the ceramic body along the third direction is 100 μm to 800 μm.

[0010] In one possible implementation of the first aspect, along the second direction, each side end of the lead-out end protrudes relative to each side end of the electrode body portion.

[0011] In a possible implementation of the first aspect, the W3 is 50 μm to 250 μm; and / or, The W1 is 100 μm to 800 μm; and / or, The ceramic body has a length L1 of 200 μm to 1600 μm along the first direction; and / or, The length of the lead-out electrode along the first direction is 100 μm to 1500 μm.

[0012] In a possible implementation of the first aspect, the ceramic body comprises any one of Co3O4 ceramic body, Mn3O4 ceramic body, NiO ceramic body, Al2O3 ceramic body, or Fe2O3 ceramic body; and / or, The lead-out electrode comprises at least one of a silver-palladium alloy layer or a silver-platinum alloy layer; and / or, The external electrode includes at least one of a gold layer, a silver layer, a copper layer, a nickel layer, or a zinc layer.

[0013] Secondly, embodiments of this application disclose an electronic device including a resistive element as described in the first aspect.

[0014] Compared with the prior art, the beneficial effects of this application are: In this application, the width W2 of the lead-out end is greater than the width W3 of the electrode body. In this way, the lead-out electrode can be connected to the external electrode through the widened lead-out end, which helps to increase the contact area at the connection between the external electrode and the lead-out electrode, thereby reducing the risk of false connection between the external electrode and the lead-out electrode.

[0015] Based on this, the width W2 of the lead-out end is smaller than the width W1 of the ceramic body, and the lead-out end is spaced apart from each side along the second direction. Even if the electroplating solution seeps between the outer electrode and the side, the risk of the lead-out end coming into contact with the electroplating solution is low, thereby avoiding the phenomenon of false connection caused by the electroplating solution bursting.

[0016] In this way, the risk of false connection between the lead-out electrode and the external electrode is significantly reduced, thereby reducing the electrical malfunction problem of the resistor element. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of a resistive element; Figure 2 This is a schematic diagram of another type of resistive element; Figure 3 This is a schematic diagram of the structure of the resistive element disclosed in the embodiments of this application; Figure 4 for Figure 3 The AA cross-section shown in the figure; Figure 5 for Figure 3 The BB cross-section shown in the figure.

[0019] Explanation of reference numerals in the attached figures: 10. Resistive element; 11. Ceramic body; 111. End face; 112. Side face; 113. Top face; 114. Bottom face; 12. External electrode; 13a. Lead-out electrode; 131. Lead-out end; 132. Electrode body; 13b. Internal electrode; X, first direction; Y, second direction; Z, third direction; Z, third direction. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0021] In this application, the terms "upper," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0022] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0023] Furthermore, the terms "set up," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0024] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0025] In recent years, with the increasing demands for reliability in industries such as electronics and automobiles, improving the reliability of resistors has become an urgent priority. However, resistors are prone to poor connection, which seriously affects their reliability.

[0026] Current resistive elements use a dip-end process to connect the lead-in electrodes and the external electrode. This process involves immersing the exposed lead-in ends of a ceramic body sequentially into a container filled with a metal paste, such as silver paste, coating both ends of the ceramic body. After drying and sintering, the metal paste forms the external electrode that connects to the lead-in electrodes.

[0027] Reference Figure 1 Considering design factors such as resistance value, the width of the lead electrode 13a of the resistor element 10 is often relatively narrow. Furthermore, the shape of the lead electrode 13a is mostly rectangular, meaning the width is uniform throughout. In other words, the width of the lead end 131 of the lead electrode 13a is also relatively narrow. The narrower lead end 131 has a smaller contact area with the external electrode 12, which can easily lead to loose connections.

[0028] In this regard, refer to Figure 2 The inventors improved the lead electrode 13a by increasing the width of the lead end 131, thereby increasing the contact area between the lead end 131 and the external electrode 12, but the problem of loose connection was not significantly reduced.

[0029] Further research by the inventors revealed that the external electrode 12, manufactured using a dip-end process, extends from the end face 111 of the ceramic body 11 to the two sides 112 of the ceramic body 11. Due to the characteristics of the dip-end process, the thickness T1 of the external electrode 12 on the side 112 is thinner than the thickness T2 of the external electrode 12 on the end face 111. When the width of the lead-out terminal 131 is too large, the lead-out terminal 131 will connect with the side 112. After sintering, the external electrode 12 requires an electroplating process. Because the portion of the external electrode 12 extending onto the side 112 is relatively thin, the electroplating solution easily enters the connection between the external electrode 12 and the side 112. Since the lead-out terminal 131 connects to the side 112, the electroplating solution will also gradually seep in along the edge of the lead-out terminal 131 and explode due to heat during subsequent reflow soldering and other processes, resulting in a loose connection problem between the lead-out terminal 131 and the external electrode 12. Ultimately, the contact area between the lead-out terminal 131 and the external electrode 12 is smaller than before the improvement, and it is even possible that the lead-out terminal 131 and the external electrode 12 will be completely disconnected.

[0030] Based on this, embodiments of this application provide a resistive element in which the lead electrode is connected to the external electrode using a wider lead end, thereby increasing the contact area between the lead electrode and the external electrode and reducing the risk of false connections. Furthermore, the lead end is spaced apart from the external electrode on the side along at least one side in the second direction, thereby reducing false connections caused by the electroplating solution.

[0031] The technical solution of the present invention will now be described in conjunction with the embodiments and accompanying drawings.

[0032] Please refer to the above as well. Figure 3 and Figure 4 This application discloses a resistive element 10, which includes a ceramic body 11, two external electrodes 12 and a lead-out electrode 13a.

[0033] The ceramic body 11 has two end faces 111 disposed opposite to each other along a first direction X, and two side faces 112 disposed opposite to each other along a second direction Y, wherein the second direction Y intersects the first direction X.

[0034] Each external electrode 12 is disposed on each end face 111, and each end of each external electrode 12 extends to each side face 112 along the second direction Y.

[0035] Lead-out electrode 13a is disposed inside ceramic body 11. Lead-out electrode 13a has lead-out end 131 connected to external electrode 12 and electrode body portion 132 connected to lead-out end 131. Electrode body portion 132 extends away from connected lead-out end 131 along first direction X, and electrode body portion 132 is spaced apart from another external electrode 12.

[0036] Along the second direction Y, the width of the ceramic body 11 is W1, the width of the lead-out terminal 131 is W2, and the width of the electrode body 132 is W3, satisfying the following relationship: W1 > W2 > W3. The lead-out terminal 131 is spaced apart from each other on each side 112 along the second direction Y. In this application, the width W2 of the lead-out terminal 131 is greater than the width W3 of the electrode body 132. This allows the lead-out electrode 13a to connect to the external electrode 12 via the widened lead-out terminal 131, which increases the contact area between the external electrode 12 and the lead-out electrode 13a, thereby reducing the risk of false connections between them. Simultaneously, the smaller width W3 of the electrode body compared to the lead-out terminal width W2 also saves on material costs.

[0037] Considering that the outer electrode 12 is thicker in the middle and thinner at both corners along the second direction Y, the electroplating solution easily seeps in from the corners during electroplating. Therefore, the width W2 of the lead-out end is smaller than the width W1 of the ceramic body, so that the lead-out end 131 is spaced apart from each of the side surfaces 112 along the second direction Y. Even if the electroplating solution seeps between the outer electrode 12 and the side surfaces 112, the risk of the lead-out end 131 contacting the electroplating solution is low, and the electroplating solution will not continue to seep in along the lead-out end 131, thereby reducing the phenomenon of loose connections caused by the electroplating solution breaking open.

[0038] In this way, the risk of false connection between lead-out electrode 13a and external electrode 12 is significantly reduced, thereby reducing the electrical malfunction problem of the resistive element 10.

[0039] Optionally, W2 and W3 also satisfy the following relationship: W2 / W3 = 1.2~2.0, for example, 1.2, 1.4, 1.6, 1.8, or 2.0. This application controls the proportional relationship between W2 and W3 to ensure that the width W2 of the lead-out terminal 131 is sufficiently large, effectively increasing the contact area at the connection between the lead-out electrode 13a and the external electrode 12, thereby reducing the risk of false connections between the external electrode 12 and the lead-out electrode 13a. Furthermore, the width of the lead-out terminal 131 is not excessively large, to prevent the lead-out terminal 131 from connecting to the external electrode 12 on the side 112 due to excessive width.

[0040] Optionally, W1 and W2 also satisfy the following relationship: W2 / W1 = 20%~80%, for example, 20%, 40%, 60%, or 80%. This application controls the ratio of W1 to W2 to ensure that the distance between the lead-out terminal 131 and the external electrode 12 on the side 112 is sufficiently large, thereby effectively reducing the phenomenon of loose connections caused by the electroplating solution. Furthermore, the width W2 of the lead-out terminal 131 is not too small to avoid affecting the contact area at the connection between the lead-out electrode 13a and the external electrode 12.

[0041] In some embodiments, refer to Figure 4 The number of electrode body portions 132 in the lead-out electrode 13a is two. The two electrode body portions 132 are arranged at intervals along the first direction X, and the ends of the two electrode body portions 132 away from each other have lead-out ends 131, and each lead-out end 131 is connected to each external electrode 12.

[0042] It is understandable that for a lead electrode 13a with two leads 131, a loose connection in either lead electrode 13a will affect the performance of the resistive element. Based on this, this application widens both leads 131 of the lead electrode 13a, thereby effectively reducing the loose connection phenomenon caused by the plating solution breaking open.

[0043] Of course, the number of electrode body portions 132 in the lead-out electrode 13a can be one or three, and the number of lead-out terminals 131 can also be one.

[0044] Furthermore, please refer to the following: Figure 3 and Figure 4 The resistive element 10 also includes an inner electrode 13b, which is disposed inside the ceramic body 11. The inner electrode 13b extends along the first direction X, and both ends of the inner electrode 13b along the first direction X are spaced apart from the outer electrode 12.

[0045] Along the third direction Z, the inner electrode 13b and the lead-out electrode 13a are spaced apart. The ceramic body 11 has a top surface 113 and a bottom surface 114 that are arranged opposite to each other. The orthographic projection of the inner electrode 13b on the bottom surface 114 coincides with the orthographic projection of the two electrode body parts 132 of the same lead-out electrode 13a on the bottom surface 114.

[0046] Among them, the first direction X, the second direction Y, and the third direction Z intersect each other in pairs.

[0047] For example, when the ceramic body 11 is a cuboid, the first direction X refers to the length direction of the ceramic body 11, the second direction Y refers to the width direction of the ceramic body 11, and the third direction Z refers to the height direction of the ceramic body 11. That is, the first direction X, the second direction Y, and the third direction Z can be perpendicular to each other.

[0048] In this way, the inner electrode 13b and the lead electrode 13a partially overlap to form a unit resistor, and the resistance value can be flexibly adjusted by adjusting the facing area of ​​adjacent inner electrodes 13b and lead electrodes 13a.

[0049] It should be noted that, in this application, the area of ​​the opposite side refers to the area of ​​the region where the orthographic projections of the inner electrode 13b and the lead-out electrode 13a coincide on the bottom surface 114.

[0050] Based on this, when the lead-out electrode 13a and the inner electrode 13b are offset along the first direction X, for the same lead-out electrode 13a, although the area of ​​the inner electrode 13b facing one of the electrode body portions 132 decreases, the area of ​​the inner electrode 13b facing the other electrode body portion 132 increases. This ensures that the area of ​​the inner electrode 13b facing the lead-out electrode 13a does not fluctuate significantly. As a result, the resistive element 10 has low sensitivity to the offset of the inner electrode 13b and the lead-out electrode 13a, and its electrical performance is more consistent.

[0051] Furthermore, the number of lead-out electrodes 13a is multi-layered, and the multi-layered lead-out electrodes 13a are spaced apart along the third direction Z. The inner electrode 13b is disposed between two adjacent layers of lead-out electrodes 13a, so that the resistance value of the resistive element 10 can be adjusted more flexibly.

[0052] Optionally, refer to Figure 5 The width W4 of the inner electrode 13b along the second direction Y satisfies the following relationship: W4 ≠ W3. W4 and W3 are not equal, W4 > W3 or W4 < W3. That is, one of the lead-out electrode 13a and the inner electrode 13b is wider, and the other is narrower. When the lead-out electrode 13a and the inner electrode 13b are offset along the second direction Y, the area of ​​the inner electrode 13b facing the lead-out electrode 13a will not fluctuate much. In this way, the resistive element 10 has low sensitivity to the offset of the inner electrode 13b and the lead-out electrode 13a, and its electrical performance is more consistent.

[0053] Of course, the width W4 of the inner electrode 13b can also be the same as the width W3 of the electrode body 132. Both the inner electrode 13b and the electrode body 132 are non-widened designs to reduce the amount of slurry consumed during their production.

[0054] Optionally, refer to the return Figure 4 Along the second direction Y, each side of the lead-out terminal 131 protrudes relative to each side of the electrode body 132. That is, the orthographic projection of the lead-out electrode 13a onto the bottom surface 114 is a "T" shape.

[0055] In this way, when the current is conducted from the lead-out end 131 to the electrode body 132, the current distribution is more uniform, avoiding the problem of current concentration and thus avoiding local overheating of the lead-out electrode 13a.

[0056] Optionally, the width W3 of the electrode body portion 132 along the second direction Y is 50 μm to 250 μm, for example, 50 μm, 150 μm, or 250 μm. This application adjusts the resistance value of the resistive element 10 by controlling the width W3 of the electrode body portion 132 along the second direction Y, and also ensures that the electrode body portion 132 has good current carrying capacity. Furthermore, the electrode body portion 132 is not excessively wide, thus providing a larger margin for the width design of the lead-out terminal 131.

[0057] Optionally, the length of the lead-out electrode 13a along the first direction X is 100 μm to 1500 μm, for example, 100 μm, 500 μm, 1000 μm, or 1500 μm. Figure 4 In this context, the length of the lead-out electrode 13a along the first direction X is equal to L2 + L3. For the lead-out electrode 13a, its length along the first direction X refers to the sum of the lengths of the two leads 131 along the first direction X.

[0058] Optionally, the length L4 of the inner electrode 13b along the first direction X is 100 μm to 1500 μm, for example, 100 μm, 500 μm, 1000 μm or 1500 μm.

[0059] This application adjusts the resistance value of the resistive element 10 by controlling the lengths of the lead-out electrode 13a and the inner electrode 13b along the first direction X.

[0060] Optionally, the lead electrode 13a includes at least one of a silver-palladium alloy layer or a silver-platinum alloy layer.

[0061] Optionally, the internal electrode 13b includes at least one of a silver-palladium alloy layer or a silver-platinum alloy layer.

[0062] The silver-palladium alloy layer exhibits good electrical conductivity, anti-migration properties, and high-temperature resistance, and has strong adhesion to the ceramic body 11. The silver-platinum alloy layer exhibits good electrical conductivity and chemical stability.

[0063] The external electrode 12 of this application will be described in detail below.

[0064] Please refer to the following in this application: Figure 3 and Figure 4 Each external electrode 12 covers each end face 111. The external electrode 12 not only extends to both sides 112, but also extends to the bottom surface 114 and the top surface 113 respectively at both ends along the third direction Z.

[0065] Optionally, the external electrode 12 includes at least one of a gold layer, a silver layer, a copper layer, a nickel layer, or a zinc layer. The gold layer possesses good electrical conductivity and oxidation resistance. The silver layer possesses good electrical conductivity and sealing properties, effectively preventing the electroplating solution from penetrating. The copper layer possesses good electrical conductivity and chemical stability. The nickel layer acts as a buffer, improving both the heat resistance of the external electrode 12 and the bonding strength between the layers of the external electrode 12. The zinc layer has good solderability.

[0066] Furthermore, the external electrode 12 may include multiple layers selected from gold, silver, copper, nickel, or zinc. For example, the external electrode 12 may include silver, nickel, and zinc layers stacked sequentially from the inside out, so that the external electrode 12 has both good conductivity and solderability.

[0067] The ceramic body of this application will be described in detail below.

[0068] Please refer to the above as well. Figure 3 and Figure 4 The ceramic body 11 includes any one of Co3O4 (cobalt oxide) ceramic body, Mn3O4 (manganese oxide) ceramic body, NiO (nickel oxide) ceramic body, Al2O3 (alumina) ceramic body, or Fe2O3 (iron oxide) ceramic body. These ceramic bodies 11 all meet the temperature-sensitive response requirements of the thermistor, meaning that the resistive element 10 is a thermistor element 10.

[0069] Optionally, the height H of the ceramic body 11 along the third direction Z is 100 μm to 800 μm, for example, 100 μm, 500 μm, or 800 μm. By controlling the height H of the ceramic body 11 along the third direction Z, this application ensures that when arranging multiple layers of lead electrodes 13a, the spacing between each layer of lead electrodes 13a along the third direction Z still has sufficient adjustment space, so as to adjust and optimize the electrical performance of the resistive element 10.

[0070] Optionally, the width W1 of the ceramic body 11 along the second direction Y is 100 μm to 800 μm, for example, 100 μm, 500 μm or 800 μm. This application controls the width W1 of the ceramic body 11 along the second direction Y to adapt to the layout of the lead electrode 13a and avoid the distance between the side 112 and the lead end 131 being too narrow.

[0071] Optionally, the length L1 of the ceramic body 11 along the first direction X is 200 μm to 1600 μm, for example, 200 μm, 900 μm, or 1600 μm. This application controls the length L1 of the ceramic body 11 along the first direction X to make the ceramic body 11 sufficiently short, thereby reducing the volume of the resistive element 10 and facilitating its miniaturization. Furthermore, the length of the resistive element 10 remains sufficiently large to accommodate the layout of the lead electrodes 13a and to provide a sufficiently large surface area to improve its heat dissipation.

[0072] This application discloses an electronic device including the resistive element described in any of the above embodiments. This electronic device may be, for example, a mobile phone, computer, home appliance, or automobile.

[0073] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A resistive element, characterized in that, include: A ceramic body having two end faces disposed opposite each other along a first direction and two side faces disposed opposite each other along a second direction, the second direction intersecting the first direction; Two external electrodes, each external electrode being disposed on each of the said end faces, and each external electrode extending from its end along the second direction to each of the said side faces; and An electrode is provided in the ceramic body; the electrode has an outlet end connected to the external electrode and an electrode body portion connected to the outlet end, the electrode body portion extending away from the connected outlet end along the first direction, and the electrode body portion being spaced apart from another external electrode. Wherein, along the second direction, the width of the ceramic body is W1, the width of the lead-out end is W2, and the width of the electrode body is W3, satisfying the following relationship: W1 > W2 > W3; the lead-out end is spaced apart from each of the side surfaces along the second direction.

2. The resistive element according to claim 1, characterized in that, The W2 and W3 also satisfy the following relationship: W2 / W3 = 1.2~2.

0.

3. The resistive element according to claim 1, characterized in that, The W1 and W2 also satisfy the following relationship: W2 / W1 = 20%~80%.

4. The resistive element according to claim 1, characterized in that, The number of electrode body portions in the lead-out electrode is two, the two electrode body portions are arranged at intervals along the first direction, and the ends of the two electrode body portions away from each other are respectively provided with lead-out ends, and each lead-out end is respectively connected to each of the external electrodes.

5. The resistive element according to claim 4, characterized in that, The resistive element further includes: An inner electrode is disposed within the ceramic body, the inner electrode extends along the first direction, and both ends of the inner electrode along the first direction are spaced apart from the outer electrode; Along the third direction, the inner electrode and the lead-out electrode are spaced apart, the ceramic body has a top surface and a bottom surface that are arranged opposite to each other, and the orthographic projection of the inner electrode on the bottom surface coincides with the orthographic projection of the two electrode bodies of the same lead-out electrode on the bottom surface; The first direction, the second direction, and the third direction intersect each other.

6. The resistive element according to claim 5, characterized in that, The number of lead-out electrodes is multi-layered, and the multi-layered lead-out electrodes are spaced apart along the third direction. The inner electrode is disposed between two adjacent layers of lead-out electrodes.

7. The resistive element according to claim 5, characterized in that, The width W4 of the inner electrode along the second direction satisfies the following relationship: W4 ≠ W3; and / or, The height H of the ceramic body along the third direction is 100 μm to 800 μm.

8. The resistive element according to any one of claims 1 to 7, characterized in that, Along the second direction, each side of the lead-out end protrudes relative to each side of the electrode body.

9. The resistive element according to any one of claims 1 to 7, characterized in that, The W3 is 50 μm to 250 μm; and / or, The W1 is 100 μm to 800 μm; and / or, The length L1 of the ceramic body along the first direction is 200 μm to 1600 μm; And / or, The length of the lead-out electrode along the first direction is 100 μm to 1500 μm; And / or, The ceramic body includes any one of Co3O4 ceramic body, Mn3O4 ceramic body, NiO ceramic body, Al2O3 ceramic body, or Fe2O3 ceramic body; and / or, The lead-out electrode comprises at least one of a silver-palladium alloy layer or a silver-platinum alloy layer; and / or, The external electrode includes at least one of a gold layer, a silver layer, a copper layer, a nickel layer, or a zinc layer.

10. An electronic device, characterized in that, Includes a resistive element as described in any one of claims 1 to 9.

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