PCB solder mask processing method and PCB solder mask processing system
By spraying solder resist ink onto a pre-defined area of the PCB board and then printing it after determining the copper edge, the problem of thin ink at the circuit edge is solved, thus improving the solder resist processing quality of the PCB board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HANS CNC SCI & TECH
- Filing Date
- 2026-04-30
- Publication Date
- 2026-07-14
AI Technical Summary
The solder resist ink applied at the edges of the circuit lines on the PCB board is often too thin, which can lead to substandard solder resist processing and affect the overall quality of the PCB board.
By applying a low-pressure spray of solder resist ink to a preset area of the target PCB board and determining the copper edge of the non-soldering copper-clad area, solder resist ink is then printed on the copper-clad edge to increase the thickness of the solder resist ink layer at the edge of the copper-clad line.
It effectively suppressed the problem of thin ink at the edges of copper-clad circuits, and improved the quality of PCB solder mask processing.
Smart Images
Figure CN122395846A_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of printed circuit board manufacturing technology, and in particular relates to a PCB board solder mask processing method and a PCB board solder mask processing system. Background Technology
[0002] With the continuous development of the PCB (Printed Circuit Board) industry, PCBs are widely used in consumer electronics, servers, automotive and medical equipment, and other fields. The solder mask layer of a PCB is an important component used to protect the circuitry on the board and prevent accidental short circuits or current leakage caused by contact between different parts of the circuit. The solder mask layer is usually processed using a low-pressure spray coating method.
[0003] However, during low-pressure spraying of the solder mask layer, the sprayed solder mask ink is prone to being too thin at the edges of the PCB circuits, resulting in substandard solder mask processing and reduced quality of the PCB solder mask. Summary of the Invention
[0004] In view of the above, this application provides a PCB board solder mask processing method and a PCB board solder mask processing system to overcome the problems of the prior art.
[0005] In a first aspect, embodiments of this application provide a method for solder mask processing on a PCB board, including: A solder resist ink layer is sprayed under low pressure onto a predetermined area of the target PCB board to obtain a first processed PCB board. The predetermined area includes a non-soldering copper-clad area and a non-copper-clad area. Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board; Solder resist ink is printed on the copper-clad edges to obtain the second processed PCB board.
[0006] In some optional embodiments, determining the copper edge of the non-soldering copper-clad area of the first processed PCB board includes: Obtain the drawing file of the target PCB board; The copper-clad edge is determined based on the drawing file.
[0007] In some optional embodiments, the drawing file includes drawing coordinates corresponding to the copper-clad edge; determining the copper-clad edge based on the drawing file includes: Based on the origin of the first coordinate system in the drawing file, the origin of the second coordinate system of the first processed PCB board is determined. The origin of the first coordinate system corresponds to the coordinate system in the drawing file, and the origin of the second coordinate system corresponds to the coordinate system of the solder resist ink printer table. The copper-clad edge is determined based on the origin of the first coordinate system, the coordinates of the drawing, and the origin of the second coordinate system.
[0008] In some optional embodiments, the low-pressure spraying of a solder resist ink layer onto a predetermined area of the target PCB board to obtain a first processed PCB board includes: A low-pressure spraying machine is controlled to spray the solder resist ink onto the surface of the target PCB board to obtain a sprayed PCB board. The non-preset areas of the spray-coated PCB board are exposed and developed to obtain the first processed PCB board, wherein the non-preset areas include copper-plated solder areas.
[0009] In some optional embodiments, before exposing and developing the non-preset areas of the sprayed PCB board to obtain the first processed PCB board, the PCB board solder mask processing method further includes: Obtain the area to be drilled on the sprayed PCB board; The step of exposing and developing the non-preset areas of the spray-coated PCB board to obtain the first processed PCB board includes: The non-preset area and the area to be drilled are exposed and developed to obtain an exposed and developed PCB board. Drilling is performed on the area to be drilled on the exposed and developed PCB board to obtain the first processed PCB board.
[0010] In some optional embodiments, before applying a low-pressure solder resist ink layer to a preset area of the target PCB board to obtain the first processed PCB board, the PCB board solder resist processing method further includes: The surface of the target outer circuit board is roughened to obtain a roughened outer circuit board, wherein the target outer circuit board is a circuit board that has completed copper circuit processing; The rough outer circuit board is washed and dried to obtain the target PCB board.
[0011] In some optional embodiments, printing solder resist ink on the copper-clad edges to obtain a second processed PCB board includes: A solder resist ink of a preset thickness is printed onto the copper-clad edge to obtain a printed PCB board; The printed PCB board is cured to obtain the second processed PCB board.
[0012] In some optional embodiments, the step of curing the printed PCB board to obtain the second processed PCB board includes: The printed PCB board is cured by controlling the ultraviolet light source to obtain the second processed PCB board.
[0013] In some optional embodiments, before printing solder resist ink of a preset thickness onto the copper-clad edge to obtain the printed PCB board, the PCB board solder resist processing method further includes: Obtain the copper layer thickness of the non-welded copper-clad area; The preset thickness is determined based on the thickness of the copper layer.
[0014] Secondly, embodiments of this application provide a PCB board solder mask processing apparatus, comprising: The spraying module is used to spray a solder resist ink layer onto a preset area of the target PCB board under low pressure to obtain a first processed PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. An edge determination module is used to determine the copper edge of the non-soldered copper-clad area of the first processed PCB board; A printing module is used to print solder resist ink on the copper-clad edges to obtain a second processed PCB board.
[0015] Thirdly, embodiments of this application provide a PCB board solder resist processing system, including a solder resist ink printer and electronic equipment, wherein the electronic equipment is configured as follows: A solder resist ink layer is sprayed under low pressure onto a predetermined area of the target PCB board to obtain a first processed PCB board. The predetermined area includes a non-soldering copper-clad area and a non-copper-clad area. Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board; The solder resist ink printer is controlled to print solder resist ink on the copper-clad edge to obtain a second processed PCB board.
[0016] Fourthly, embodiments of this application provide a computer-readable storage medium storing program code, which can be invoked by a processor to execute the PCB board solder mask processing method provided in the first aspect above.
[0017] Fifthly, embodiments of this application provide a computer program product that, when run on a computer device, causes the computer device to perform the PCB board solder mask processing method as described in the first aspect above.
[0018] The solution provided in this application obtains a first processed PCB board by low-pressure spraying a solder resist ink layer onto a preset area of a target PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. The solution also determines the copper-clad edge of the non-soldering copper-clad area of the first processed PCB board and prints solder resist ink onto the copper-clad edge to obtain a second processed PCB board. This solution achieves the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with a low-pressure sprayed solder resist ink layer, thereby increasing the thickness of the solder resist ink layer at the edge of the copper-clad lines on the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to the ink being too thin at the edge of the copper-clad lines during the solder resist processing, and is conducive to improving the quality of PCB board solder resist processing. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 A schematic flowchart of a PCB board solder mask processing method provided in an embodiment of this application is shown.
[0021] Figure 2 This paper illustrates another flowchart of the PCB board solder mask processing method provided in an embodiment of this application.
[0022] Figure 3 This illustration shows another schematic flowchart of the PCB board solder mask processing method provided in the embodiments of this application.
[0023] Figure 4 This illustration shows another schematic flowchart of the PCB board solder mask processing method provided in the embodiments of this application.
[0024] Figure 5 A structural block diagram of a PCB board solder mask processing apparatus provided in an embodiment of this application is shown.
[0025] Figure 6 A functional block diagram of a PCB board solder mask processing system provided in an embodiment of this application is shown.
[0026] Figure 7 This application illustrates a computer-readable storage medium for storing or carrying program code that implements the PCB board solder mask processing method provided in this application.
[0027] Figure 8This application illustrates a computer program product for storing or carrying program code that implements the PCB board solder mask processing method provided in the embodiments of this application. Detailed Implementation
[0028] To make the inventive objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0029] It should be understood that, when used in this specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.
[0030] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.
[0031] It should also be further understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.
[0032] Furthermore, in the description of this application, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0033] With the continuous development of the PCB (Printed Circuit Board) industry, PCBs are widely used in consumer electronics, servers, automotive and medical equipment, and other fields. The solder mask layer of a PCB is an important component used to protect the circuitry on the board and prevent accidental short circuits or current leakage caused by contact between different parts of the circuit. The solder mask layer is usually processed using a low-pressure spray coating method.
[0034] However, during low-pressure spraying of the solder mask layer, the sprayed solder mask ink is prone to being too thin at the edges of the PCB circuits, resulting in substandard solder mask processing and reduced quality of the PCB solder mask.
[0035] To address the aforementioned issues, the PCB solder mask processing method and system provided in this application obtain a first processed PCB board by low-pressure spraying a solder mask ink layer onto a preset area of the target PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. The copper-clad edge of the non-soldering copper-clad area of the first processed PCB board is determined, and solder mask ink is printed onto the copper-clad edge to obtain a second processed PCB board. This achieves the printing of solder mask ink on the edge area of the copper-clad lines of the PCB board with a low-pressure sprayed solder mask ink layer, increasing the thickness of the solder mask ink layer at the edge of the copper-clad lines of the PCB board. This can suppress the problem of unqualified PCB board solder mask processing due to thin ink at the edge of the copper-clad lines during the solder mask processing, and is beneficial to improving the quality of PCB board solder mask processing.
[0036] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings.
[0037] The PCB board solder resist processing method provided in this application embodiment can be applied to electronic devices in a PCB board solder resist processing system. The PCB board solder resist processing system may also include a solder resist ink printer. The electronic devices can control the solder resist ink printer to perform solder resist processing on the PCB board based on the PCB board solder resist processing method.
[0038] Electronic devices can be terminal devices or servers, etc. The type of electronic device is not limited here, and can be set according to actual needs.
[0039] The terminal device can be a mobile terminal device (such as a mobile phone, PDA, tablet PC, laptop, smartwatch, smart bracelet or wearable device, etc.) or a fixed terminal device (desktop computer, smart panel, etc.), etc., without limitation.
[0040] The server can be a standalone physical server, a server cluster or distributed system composed of multiple physical servers, or any of the following: cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, content delivery networks (CDN), big data or artificial intelligence platforms, etc. There are no restrictions here.
[0041] In some implementations, the electronic device can be integrated into the solder resist ink printer, forming a single structure with the solder resist ink printer; alternatively, the electronic device can be separate from the solder resist ink printer, etc., without limitation.
[0042] Please see Figure 1 This document illustrates a flowchart of a PCB board solder mask processing method according to an embodiment of this application. In a specific embodiment, the PCB board solder mask processing method can be applied to electronic devices within a PCB board solder mask processing system. The following will use an electronic device as an example to illustrate this method. Figure 1 The process shown is described in detail. The PCB board solder mask processing method may include the following steps 101 to 103.
[0043] Step 101: Apply a low-pressure solder resist ink layer to a preset area of the target PCB board to obtain the first processed PCB board.
[0044] In this embodiment of the application, when a user needs to perform solder resist processing on a target PCB board, a processing instruction can be sent to an electronic device. After receiving the processing instruction, the electronic device will spray a solder resist ink layer onto a preset area of the target PCB board under low pressure to obtain the first processed PCB board.
[0045] The preset area can include non-soldered copper clad areas and non-copper clad areas on the target PCB board. The non-soldered copper clad areas are the non-soldered copper clad circuit layers of the target PCB board.
[0046] Specifically, the PCB solder mask processing system may also include a low-pressure sprayer and an exposure and development machine, which can be communicatively connected to electronic devices and exchange data with them.
[0047] When a user needs to perform solder resist processing on a target PCB board, they can send a processing command to an electronic device. Upon receiving the command, the electronic device can send a spraying command to a low-pressure sprayer. The low-pressure sprayer, upon receiving the command, sprays solder resist ink onto the surface of the target PCB board, obtaining a sprayed PCB board. It then sends an exposure and development command to an exposure and development machine. Upon receiving the exposure and development command, the machine exposes and develops non-preset areas of the sprayed PCB board, obtaining the first processed PCB board. By applying solder resist ink to the target PCB board under low pressure and then exposing and developing non-preset areas after ink application to remove the solder resist ink, the processing accuracy of the first processed PCB board is improved.
[0048] The non-preset area can include the solder copper-clad area on the target PCB board, that is, the solder copper-clad circuit layer of the target PCB board.
[0049] The solder resist ink can be any of the following: thermosetting solder resist ink or ultraviolet (UV) curing solder resist ink. No limitation is made here.
[0050] The developing temperature during the developing process is related to the degree of removal of solder resist ink. The developing temperature can be set by the user based on the results of the pre-developing experiment. For example, the developing temperature can be 38~42 degrees Celsius (°C).
[0051] Regarding the process of receiving processing instructions by the aforementioned electronic device, in some embodiments, the electronic device can detect the user's operation. When it is determined from the detected user operation that the user has input an instruction to perform solder mask processing on the PCB board, the processing instruction is received.
[0052] For example, when a user needs to perform solder mask processing on a PCB board, they can perform a touch operation on the operation panel of the electronic device. The electronic device responds to the user's touch operation, generates a corresponding touch signal, and analyzes the touch signal. When it is determined that the touch signal is a preset signal used to characterize the solder mask processing of the PCB board, it is determined that the processing instruction has been received.
[0053] Regarding the process of receiving processing instructions by the aforementioned electronic device, in some embodiments, the electronic device may be equipped with a voice recognition module. When a user needs to perform solder resist processing on a PCB board, the user can send voice information within the voice acquisition range of the voice recognition module. The voice recognition module collects the voice information sent by the user and performs voice recognition on the collected voice information to obtain the recognition result. When it is determined that the recognition result contains keywords used to indicate solder resist processing on the PCB board, such as "solder resist processing", it is determined that the processing instruction has been received.
[0054] As an example, if the user's voice message is: "Perform solder resist processing on the PCB board", and the voice recognition result contains the keyword "solder resist processing", then it is determined that the processing instruction has been received.
[0055] Regarding the process of the aforementioned electronic device receiving processing instructions, in some embodiments, the PCB board solder mask processing system may also include a client. The client can be connected to the electronic device via a network and interact with the electronic device through the network.
[0056] When a user needs to perform solder mask processing on a PCB board, they can send a processing instruction to the client. After receiving the processing instruction, the client can forward the processing instruction to an electronic device via the network, and the electronic device receives the processing instruction forwarded by the client.
[0057] The client can be any of the following: a mobile client (e.g., a mobile phone client, a PDA client, a Tablet PC client, a laptop client, a smartwatch client, a smart bracelet client, or a wearable client) or a fixed client (e.g., a desktop computer client, a smart panel client). The type of client is not limited here and can be set according to actual needs.
[0058] Step 102: Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board.
[0059] In this embodiment of the application, after the electronic device sprays a solder resist ink layer onto a preset area of the target PCB board under low pressure to obtain the first processed PCB board, the copper edge of the non-soldering copper-clad area of the first processed PCB board can be determined.
[0060] The copper edge of the non-soldered copper-clad area of the first processed PCB board is the edge of the non-soldered copper-clad circuit layer of the first processed PCB board.
[0061] Electronic devices can acquire the drawing files of the target PCB board and determine the copper edge of the non-soldering copper-clad area of the first processed PCB board based on the drawing files. Identifying the copper edge of the non-soldering copper-clad area of the first processed PCB board based on the drawing files of the target PCB board improves the accuracy of copper edge identification of the first processed PCB board.
[0062] The drawing file can include drawing coordinates corresponding to the copper plating edge. The electronic device can determine the origin of the second coordinate system of the first processed PCB board based on the origin of the first coordinate system in the drawing file, and determine the copper plating edge of the non-soldering copper plating area of the first processed PCB board based on the origin of the first coordinate system, the drawing coordinates, and the origin of the second coordinate system. Based on the correspondence between the drawing coordinate system corresponding to the drawing file and the coordinate system of the solder resist printer table corresponding to the first processed PCB board, the copper plating edge of the non-soldering copper plating area of the first processed PCB board is identified, improving the accuracy of copper plating edge identification for the first processed PCB board.
[0063] The origin of the first coordinate system can correspond to the coordinate system of the drawing, and the origin of the second coordinate system can correspond to the coordinate system of the solder resist ink printer table.
[0064] The electronic device can move the PCB board identifier on the first processed PCB board to the origin of the solder resist ink printer table coordinate system according to the PCB identifier corresponding to the origin of the first coordinate system in the drawing file. That is, the origin of the first coordinate system is aligned with the origin of the second coordinate system. Based on the coordinate components of the copper-clad edge in the first coordinate system, the coordinate region corresponding to the coordinate components in the second coordinate system is determined, thus obtaining the copper-clad edge of the non-soldering copper-clad area of the first processed PCB board.
[0065] Step 103: Print solder resist ink on the copper-clad edges to obtain the second processed PCB board.
[0066] In this embodiment, after the electronic device determines the copper edge of the non-soldering copper-clad area of the first processed PCB board, it can print solder resist ink on the copper edge of the non-soldering copper-clad area of the first processed PCB board to obtain the second processed PCB board. This realizes the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with low-pressure sprayed solder resist ink layer, which thickens the solder resist ink layer at the edge of the copper-clad lines of the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to the ink being too thin at the edge of the copper-clad lines during the solder resist processing, and is conducive to improving the quality of PCB board solder resist processing.
[0067] The electronic device can print solder resist ink of a preset thickness on the copper-clad edge to obtain a printed PCB board, and then cure the printed PCB board to obtain a second processed PCB board. This realizes the printing and curing of solder resist ink on the non-soldering copper-clad area of the first processed PCB board, which increases the thickness of the solder resist ink layer at the edge of the copper-clad line on the PCB board and improves the adhesion of the solder resist ink on the PCB board.
[0068] The preset thickness of the solder resist ink can be related to the copper layer thickness of the non-soldering copper-clad area of the first processed PCB board. For example, the preset thickness of the solder resist ink can be 15~25 micrometers (μm), which is not limited here.
[0069] The curing process can be any of the following: heat curing or UV curing. No specific method is specified here.
[0070] As an example, the solder resist ink can be a UV-curable solder resist ink, and the curing process can be a UV curing process. The PCB board solder resist processing system can also include a UV light source, which can be communicatively connected to electronic devices and interact with the electronic devices for data exchange.
[0071] Electronic devices can send curing instructions to a UV light source. After receiving the curing instructions, the UV light source can perform UV curing on the printed PCB board to obtain a second processed PCB board. This realizes the curing of solder resist ink on the PCB board based on a UV light source, which can improve the efficiency of PCB board solder resist processing.
[0072] Among them, the UV energy density of the UV light source for UV curing the printed PCB board can be 200~300 millijoules / square centimeter (mJ / cm²). 2 ).
[0073] The solution provided in this application obtains a first processed PCB board by low-pressure spraying a solder resist ink layer onto a preset area of a target PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. The solution also determines the copper-clad edge of the non-soldering copper-clad area of the first processed PCB board and prints solder resist ink onto the copper-clad edge to obtain a second processed PCB board. This solution achieves the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with a low-pressure sprayed solder resist ink layer, thereby increasing the thickness of the solder resist ink layer at the edge of the copper-clad lines on the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to the ink being too thin at the edge of the copper-clad lines during the solder resist processing, and is conducive to improving the quality of PCB board solder resist processing.
[0074] Please see Figure 2 This document illustrates a flowchart of a PCB board solder mask processing method according to another embodiment of this application. In a specific embodiment, the PCB board solder mask processing method can be applied to electronic devices within a PCB board solder mask processing system. The following will use an electronic device as an example to illustrate this method. Figure 2 The process shown is described in detail. The PCB board solder mask processing method may include the following steps 201 to 206.
[0075] Step 201: Control the low-pressure sprayer to spray solder resist ink onto the surface of the target PCB board to obtain a sprayed PCB board.
[0076] In this embodiment, step 201 can refer to the content of the corresponding steps in the previous embodiments, and will not be repeated here.
[0077] Step 202: Obtain the area to be drilled on the PCB board to be sprayed.
[0078] In this embodiment, an electronic device controls a low-pressure sprayer to spray solder resist ink onto the surface of the target PCB board. After obtaining the sprayed PCB board, the area to be drilled on the sprayed PCB board can be obtained.
[0079] The area to be drilled can be a region at a preset distance from a non-plated through hole (NPTH). The preset distance can be a distance set by the user, such as 0.2 mm or 0.25 mm, etc. There is no limitation here.
[0080] Step 203: Expose and develop the non-preset area and the area to be drilled to obtain the exposed and developed PCB board.
[0081] In this embodiment, after the electronic device obtains the area to be drilled on the sprayed PCB board, it can perform exposure and development processing on the non-preset area and the area to be drilled to obtain an exposed and developed PCB board.
[0082] Among them, electronic devices can remove solder resist ink in non-preset areas and areas to be drilled through exposure and development processes, so as to expose the solder copper-clad circuit layer and NPTH of the PCB board, which helps to improve the quality of PCB board solder resist processing.
[0083] Step 204: Drill holes in the areas to be drilled on the exposed and developed PCB board to obtain the first processed PCB board.
[0084] In this embodiment, the electronic device exposes and develops the non-preset area and the area to be drilled to obtain an exposed and developed PCB board. Then, it can drill the area to be drilled on the exposed and developed PCB board to obtain the first processed PCB board. This allows the solder resist ink to be removed from the area to be drilled before drilling, which can avoid the solder resist ink from contaminating the sidewall of the drilled hole during the drilling process and is conducive to further improving the quality of the solder resist processing of the PCB board.
[0085] The PCB solder mask processing system may also include drilling equipment, which can be communicatively connected to electronic devices and interact with them for data exchange.
[0086] The electronic device exposes and develops non-preset areas and areas to be drilled to obtain an exposed and developed PCB board. Then, it can send a drilling command to the drilling equipment. After receiving the drilling command, the drilling equipment can drill the areas to be drilled on the exposed and developed PCB board to obtain the first processed PCB board.
[0087] Step 205: Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board.
[0088] Step 206: Print solder resist ink on the copper-clad edges to obtain the second processed PCB board.
[0089] In this embodiment, steps 205 and 206 can be found in the corresponding steps in the previous embodiments, and will not be repeated here.
[0090] The solution provided in this embodiment controls a low-pressure spraying machine to spray solder resist ink onto the surface of a target PCB board, obtaining a sprayed PCB board. The area to be drilled on the sprayed PCB board is then identified, and the non-preset area and the area to be drilled are exposed and developed to obtain an exposed and developed PCB board. Drilling is then performed on the area to be drilled on the exposed and developed PCB board to obtain a first processed PCB board. The copper edge of the non-soldering copper-clad area of the first processed PCB board is determined, and solder resist ink is printed on the copper edge to obtain a second processed PCB board. This achieves the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with a low-pressure sprayed solder resist ink layer, increasing the thickness of the solder resist ink layer at the edge of the copper-clad lines. This can suppress the problem of unqualified solder resist processing of the PCB board due to thin ink at the edge of the copper-clad lines during the solder resist processing, thus improving the quality of PCB board solder resist processing.
[0091] Furthermore, removing the solder resist ink from the area to be drilled before drilling can prevent the solder resist ink from contaminating the sidewalls of the drilled hole during the drilling process, which is beneficial to further improve the quality of PCB board solder resist processing.
[0092] Please see Figure 3 This document illustrates a flowchart of a PCB board solder mask processing method according to another embodiment of this application. In a specific embodiment, the PCB board solder mask processing method can be applied to electronic devices within a PCB board solder mask processing system. The following will use an electronic device as an example to illustrate this method. Figure 3 The process shown is described in detail. The PCB board solder mask processing method may include the following steps 301 to 305.
[0093] Step 301: Roughen the surface of the target outer circuit board to obtain a roughened outer circuit board.
[0094] In this embodiment, when a user needs to perform solder mask processing on the target PCB board, he / she can send a processing instruction to the electronic device. After receiving the processing instruction, the electronic device performs roughening processing on the surface of the target outer circuit board to obtain a rough outer circuit board.
[0095] The target outer circuit board can be a circuit board with completed copper circuit processing, and the roughness of the rough outer circuit board can be a preset roughness, for example, the preset roughness can be 0.2~0.5μm, which is not limited here.
[0096] Roughness treatment can be any of the following: chemical etching or physical abrasion. No particular method is specified here.
[0097] Specifically, the PCB solder mask processing system may also include a roughness treatment device, which can be communicatively connected to electronic devices and interact with them for data exchange.
[0098] When a user needs to perform solder mask processing on a target PCB board, they can send a processing instruction to an electronic device. After receiving the processing instruction, the electronic device sends a roughening instruction to a roughening processing device. After receiving the roughening instruction, the roughening processing device roughens the surface of the target outer circuit board to obtain a roughened outer circuit board.
[0099] Step 302: Wash and dry the rough outer circuit board to obtain the target PCB board.
[0100] In this embodiment, the electronic device roughens the surface of the target outer circuit board to obtain a roughened outer circuit board. After obtaining the roughened outer circuit board, it can be washed and dried to obtain the target PCB board. By roughening, washing and drying the surface of the outer circuit board, the surface roughness of the PCB board is increased, which is beneficial to improving the adhesion of solder resist ink to the PCB board.
[0101] Step 303: Apply a low-pressure solder resist ink layer to a preset area of the target PCB board to obtain the first processed PCB board.
[0102] Step 304: Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board.
[0103] Step 305: Print solder resist ink on the copper-clad edges to obtain the second processed PCB board.
[0104] In this embodiment, steps 303, 304, and 305 can be found in the corresponding steps of the aforementioned embodiments, and will not be repeated here.
[0105] The solution provided in this embodiment roughens the surface of the target outer circuit board to obtain a roughened outer circuit board. This roughened outer circuit board is then washed and dried to obtain the target PCB board. A solder resist ink layer is then applied to a predetermined area of the target PCB board under low pressure to obtain a first processed PCB board. The copper edge of the non-soldering copper-clad area of the first processed PCB board is determined, and solder resist ink is printed onto the copper edge to obtain a second processed PCB board. This achieves the printing of solder resist ink on the copper-clad line edge area of the PCB board with a low-pressure applied solder resist ink layer. This thickens the solder resist ink layer at the copper-clad line edge of the PCB board, suppressing the problem of unqualified solder resist processing due to insufficient ink application at the copper-clad line edge during the solder resist processing, thus improving the quality of PCB board solder resist processing.
[0106] Furthermore, the surface of the target outer circuit board is roughened by water washing and drying to increase the surface roughness of the PCB board, which is beneficial to improving the adhesion of solder resist ink to the PCB board.
[0107] Please see Figure 4 This document illustrates a flowchart of a PCB board solder mask processing method according to another embodiment of this application. In a specific embodiment, the PCB board solder mask processing method can be applied to electronic devices within a PCB board solder mask processing system. The following will use an electronic device as an example to illustrate this method. Figure 4 The process shown is described in detail. The PCB board solder mask processing method may include the following steps 401 to 406.
[0108] Step 401: Apply a low-pressure solder resist ink layer to a preset area of the target PCB board to obtain the first processed PCB board.
[0109] Step 402: Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board.
[0110] In this embodiment, steps 401 and 402 can be referred to the corresponding steps in the previous embodiments, and will not be repeated here.
[0111] Step 403: Obtain the copper layer thickness in the non-soldering copper-clad area.
[0112] In this embodiment, after the electronic device determines the copper edge of the non-soldering copper-clad area of the first processed PCB board, it can obtain the copper layer thickness of the non-soldering copper-clad area of the first processed PCB board.
[0113] In some implementations, after the electronic device determines the copper edge of the non-soldering copper-clad area of the first processed PCB board, it can generate a prompt message and receive the copper layer thickness of the non-soldering copper-clad area of the first processed PCB board input by the user based on the prompt message.
[0114] The prompt information can be used to prompt the user to input the copper layer thickness of the non-soldered copper-clad area of the first processed PCB board into the electronic device.
[0115] The prompt message can be any one of the following: text prompt message, sound prompt message, or light prompt message, etc., without any limitation here.
[0116] In some embodiments, the PCB solder mask processing system may also include a film thickness measuring instrument, which can be communicatively connected to an electronic device and interact with the electronic device for data exchange. The film thickness measuring instrument can be used to measure the copper layer thickness in the non-soldering copper-clad area of the first processed PCB board.
[0117] After the electronic device determines the copper edge of the non-soldering copper-clad area of the first processed PCB board, it can send a measurement command to the film thickness measuring instrument. After receiving the measurement command, the film thickness measuring instrument can measure the copper layer thickness of the non-soldering copper-clad area of the first processed PCB board and send the copper layer thickness to the electronic device. The electronic device receives the copper layer thickness returned by the film thickness measuring instrument.
[0118] Step 404: Determine the preset thickness based on the copper layer thickness.
[0119] In this embodiment, after the electronic device obtains the copper layer thickness of the non-soldering copper-clad area, it can look up the thickness table based on the copper layer thickness to obtain the preset thickness of the solder resist ink to be printed.
[0120] The thickness table can be used to characterize the correspondence between the copper layer thickness and the thickness of the solder resist ink to be printed. Based on the preset correspondence between the copper layer thickness and the thickness of the solder resist ink to be printed, the thickness of the solder resist ink to be printed in the non-soldering copper-clad area of the first processed PCB board is obtained, i.e., the preset thickness, which improves the accuracy of the preset thickness.
[0121] Step 405: Print solder resist ink of a preset thickness onto the copper-clad edges to obtain a printed PCB board.
[0122] Step 406: Curing the printed PCB board to obtain the second processed PCB board.
[0123] In this embodiment, steps 405 and 406 can be found in the corresponding steps in the previous embodiments, and will not be repeated here.
[0124] The solution provided in this embodiment obtains a first processed PCB board by low-pressure spraying a solder resist ink layer onto a preset area of the target PCB board. It then determines the copper edge of the non-soldering copper-clad area of the first processed PCB board, obtains the copper layer thickness of the non-soldering copper-clad area, determines a preset thickness based on the copper layer thickness, and prints solder resist ink of the preset thickness onto the copper-clad edge to obtain a printed PCB board. Finally, it cures the printed PCB board to obtain a second processed PCB board. This method achieves the printing of solder resist ink on the copper-clad line edge area of the PCB board with a low-pressure sprayed solder resist ink layer, increasing the thickness of the solder resist ink layer at the copper-clad line edge of the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to insufficient ink at the copper-clad line edge during the solder resist processing, thus improving the quality of PCB board solder resist processing.
[0125] Furthermore, based on the preset correspondence between the copper layer thickness and the thickness of the solder resist ink to be printed, the thickness of the solder resist ink to be printed in the non-soldering copper-clad area of the first processed PCB board is obtained, i.e., the preset thickness, which improves the accuracy of the preset thickness.
[0126] Please see Figure 5 This document illustrates a PCB board solder mask processing apparatus 500 according to an embodiment of this application. The PCB board solder mask processing apparatus 500 can be applied to electronic devices within a PCB board solder mask processing system. The following will use an electronic device as an example to illustrate... Figure 5 The PCB board solder mask processing apparatus 500 shown is described in detail. The PCB board solder mask processing apparatus 500 may include a spraying module 501, an edge determination module 502, and a printing module 503.
[0127] The spraying module 501 can be used to spray a solder resist ink layer on a preset area of the target PCB board under low pressure to obtain a first processed PCB board. The preset area may include a non-soldering copper-clad area and a non-copper-clad area. The edge determination module 502 can be used to determine the copper-clad edge of the non-soldering copper-clad area of the first processed PCB board. The printing module 503 can be used to print solder resist ink on the copper-clad edge to obtain a second processed PCB board.
[0128] In some implementations, the edge determination module 502 may include an acquisition unit and a determination unit.
[0129] The acquisition unit can be used to acquire the drawing file of the target PCB board; the determination unit can be used to determine the copper-clad edge based on the drawing file.
[0130] In some implementations, the drawing file may include drawing coordinates corresponding to the copper-clad edge; the determining unit may include a first determining subunit and a second determining subunit.
[0131] The first determining subunit can be used to determine the second coordinate system origin of the first processed PCB board based on the first coordinate system origin of the drawing file. The first coordinate system origin can correspond to the drawing coordinate system, and the second coordinate system origin can correspond to the solder resist ink printer table coordinate system. The second determining subunit can be used to determine the copper-clad edge based on the first coordinate system origin, the drawing coordinate system, and the second coordinate system origin.
[0132] In some embodiments, the spraying module 501 may include a control unit and a processing unit.
[0133] The control unit can be used to control a low-pressure spraying machine to spray the solder resist ink onto the surface of the target PCB board to obtain a sprayed PCB board; the processing unit can be used to expose and develop non-preset areas of the sprayed PCB board to obtain the first processed PCB board, wherein the non-preset areas may include solder copper-clad areas.
[0134] In some embodiments, the PCB board solder mask processing apparatus 500 may further include a first acquisition module.
[0135] The first acquisition module can be used by the processing unit to expose and develop the non-preset area of the sprayed PCB board to obtain the drilling area of the sprayed PCB board before obtaining the first processed PCB board.
[0136] In some implementations, the processing unit may include a first processing subunit and a second processing subunit.
[0137] The first processing subunit can be used to expose and develop the non-preset area and the area to be drilled to obtain an exposed and developed PCB board; the second processing subunit can be used to drill the area to be drilled on the exposed and developed PCB board to obtain the first processed PCB board.
[0138] In some embodiments, the PCB board solder mask processing apparatus 500 may further include a first processing module and a second processing module.
[0139] The first processing module can be used by the spraying module 501 to spray a solder resist ink layer onto a preset area of the target PCB board under low pressure. Before obtaining the first processed PCB board, the surface of the target outer circuit board is roughened to obtain a rough outer circuit board. The target outer circuit board can be a circuit board that has completed copper circuit processing. The second processing module can be used to wash and dry the rough outer circuit board to obtain the target PCB board.
[0140] In some implementations, the printing module 503 may include a printing unit and a curing unit.
[0141] The printing unit can be used to print solder resist ink of a preset thickness on the copper-clad edge to obtain a printed PCB board; the curing unit can be used to cure the printed PCB board to obtain the second processed PCB board.
[0142] In some implementations, the curing unit can be used to control the subunit.
[0143] The control subunit can be used to control the ultraviolet light source to cure the printed PCB board to obtain the second processed PCB board.
[0144] In some embodiments, the PCB board solder mask processing apparatus 500 may further include a second acquisition module and a thickness determination module.
[0145] The second acquisition module can be used by the printing unit to print solder resist ink of a preset thickness on the copper-clad edge, and to obtain the copper layer thickness of the non-soldering copper-clad area before obtaining the printed PCB board; the thickness determination module can be used to determine the preset thickness based on the copper layer thickness.
[0146] The solution provided in this embodiment obtains a first processed PCB board by low-pressure spraying a solder resist ink layer onto a preset area of the target PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. The copper-clad edge of the non-soldering copper-clad area of the first processed PCB board is determined, and solder resist ink is printed on the copper-clad edge to obtain a second processed PCB board. This achieves the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with low-pressure sprayed solder resist ink layer, thickening the solder resist ink layer at the edge of the copper-clad lines of the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to the ink being too thin at the edge of the copper-clad lines during the solder resist processing, and is conducive to improving the quality of PCB board solder resist processing.
[0147] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on its differences from other embodiments. Similar or identical parts between embodiments can be referred to interchangeably. For device embodiments, since they are basically similar to method embodiments, the description is relatively simple; relevant parts can be referred to in the descriptions of the method embodiments. Any processing method described in the method embodiments can be implemented in the device embodiments through corresponding processing modules, and will not be elaborated upon further in the device embodiments.
[0148] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.
[0149] Please see Figure 6 This diagram illustrates a functional block diagram of a PCB solder mask processing system 600 according to an embodiment of this application. The PCB solder mask processing system 600 may include the following components: a memory 601, one or more processors 602, a solder mask ink printer 603, and one or more application programs. One or more processors 602 may be coupled to the memory 601 and the solder mask ink printer 603. One or more application programs may be stored in the memory 601 and configured to be executed by one or more processors 602. The one or more application programs are configured to perform the methods described in the foregoing method embodiments.
[0150] The memory 601 may include random access memory (RAM) or read-only memory. The memory 601 may be used to store instructions, programs, code, code sets, or instruction sets. The memory 601 may include a program storage area and a data storage area. The program storage area may store instructions for implementing an operating system, instructions for implementing at least one function (e.g., low-pressure spraying, obtaining a first processed PCB board, determining the copper edge, printing solder resist ink, obtaining a second processed PCB board, acquiring drawing files, determining the origin of a second coordinate system, controlling a low-pressure spraying machine, surface spraying, obtaining a sprayed PCB board, exposure processing, development processing, acquiring the area to be drilled, obtaining an exposed and developed PCB board, drilling processing, roughening processing, obtaining a rough outer circuit board, water washing processing, drying processing, obtaining a target PCB board, obtaining a printed PCB board, curing processing, controlling an ultraviolet light source, acquiring copper layer thickness, and determining a preset thickness, etc.), and instructions for implementing the various method embodiments described below. The data storage area can also store data created during the use of the PCB solder mask processing system 600 (such as target PCB board, preset area, solder mask ink layer, first processed PCB board, non-soldering copper-clad area, non-copper-clad area, copper-clad edge, solder mask ink, second processed PCB board, drawing file, drawing coordinates, origin of the first coordinate system, origin of the second coordinate system, coordinate system of the solder mask ink printer, low-pressure sprayer, sprayed PCB board, non-preset area, soldering copper-clad area, area to be drilled, non-preset area, exposed and developed PCB board, target outer circuit board, rough outer circuit board, circuit board with completed copper circuit processing, preset thickness, printed PCB board, ultraviolet light source, and copper layer thickness), etc.
[0151] The processor 602 may include one or more processing cores. The processor 602 connects to various parts within the PCB solder mask processing system 600 using various interfaces and lines. It executes various functions and processes data within the PCB solder mask processing system 600 by running or executing instructions, programs, code sets, or instruction sets stored in the memory 601, and by calling data stored in the memory 601. Optionally, the processor 602 may be implemented using at least one hardware form of Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 602 may integrate one or more of the following: a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and a modem. The CPU primarily handles the operating system, user interface, and applications; the GPU is responsible for rendering and drawing the displayed content; and the modem handles wireless communication. It is understood that the modem may also not be integrated into the processor 602 and may be implemented separately using a communication chip.
[0152] Please refer to Figure 7 This diagram illustrates a structural block diagram of a computer-readable storage medium 700 provided in an embodiment of this application. The computer-readable storage medium 700 stores program code 701, which can be called by a processor to execute the methods described in the above method embodiments.
[0153] The computer-readable storage medium 700 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM. Optionally, the computer-readable storage medium 700 includes a non-transitory computer-readable storage medium. The computer-readable storage medium 700 has storage space for program code 701 that performs any of the method steps described above. This program code can be read from or written to one or more computer program products. The program code 701 may be compressed, for example, in a suitable form.
[0154] Please refer to Figure 8This diagram illustrates a structural block diagram of a computer program product 800 provided in an embodiment of this application. The computer program product 800 includes a computer program / instructions 801, which is stored in a computer-readable storage medium of a computer device. When the computer program product 800 runs on the computer device, the processor of the computer device reads the computer program / instructions 801 from the computer-readable storage medium, and executes the computer program / instructions 801, causing the computer device to perform the methods described in the above-described method embodiments.
[0155] The solution provided in this embodiment obtains a first processed PCB board by low-pressure spraying a solder resist ink layer onto a preset area of the target PCB board. The preset area includes a non-soldering copper-clad area and a non-copper-clad area. The solution also determines the copper-clad edge of the non-soldering copper-clad area of the first processed PCB board and prints solder resist ink onto the copper-clad edge to obtain a second processed PCB board. This solution achieves the printing of solder resist ink on the edge area of the copper-clad lines of the PCB board with low-pressure sprayed solder resist ink layer, thereby thickening the solder resist ink layer at the edge of the copper-clad lines of the PCB board. This can suppress the problem of unqualified solder resist processing of the PCB board due to the ink being too thin at the edge of the copper-clad lines during the solder resist processing, and is beneficial to improving the quality of PCB board solder resist processing.
[0156] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.
Claims
1. A method for solder mask processing on a PCB board, characterized in that, include: A solder resist ink layer is sprayed under low pressure onto a predetermined area of the target PCB board to obtain a first processed PCB board. The predetermined area includes a non-soldering copper-clad area and a non-copper-clad area. Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board; Solder resist ink is printed on the copper-clad edges to obtain the second processed PCB board.
2. The PCB board solder mask processing method according to claim 1, characterized in that, Determining the copper edge of the non-soldering copper-clad area of the first processed PCB board includes: Obtain the drawing file of the target PCB board; The copper-clad edge is determined based on the drawing file.
3. The PCB board solder mask processing method according to claim 2, characterized in that, The drawing file includes drawing coordinates corresponding to the copper-clad edge; determining the copper-clad edge based on the drawing file includes: Based on the origin of the first coordinate system in the drawing file, the origin of the second coordinate system of the first processed PCB board is determined. The origin of the first coordinate system corresponds to the coordinate system in the drawing file, and the origin of the second coordinate system corresponds to the coordinate system of the solder resist ink printer table. The copper-clad edge is determined based on the origin of the first coordinate system, the coordinates of the drawing, and the origin of the second coordinate system.
4. The PCB board solder mask processing method according to any one of claims 1 to 3, characterized in that, The process of applying a low-pressure solder resist ink layer to a predetermined area of the target PCB board to obtain a first processed PCB board includes: A low-pressure spraying machine is controlled to spray the solder resist ink onto the surface of the target PCB board to obtain a sprayed PCB board. The non-preset areas of the spray-coated PCB board are exposed and developed to obtain the first processed PCB board, wherein the non-preset areas include copper-plated solder areas.
5. The PCB board solder mask processing method according to claim 4, characterized in that, Before exposing and developing the non-preset areas of the sprayed PCB board to obtain the first processed PCB board, the PCB board solder mask processing method further includes: Obtain the area to be drilled on the sprayed PCB board; The step of exposing and developing the non-preset areas of the spray-coated PCB board to obtain the first processed PCB board includes: The non-preset area and the area to be drilled are exposed and developed to obtain an exposed and developed PCB board. Drilling is performed on the area to be drilled on the exposed and developed PCB board to obtain the first processed PCB board.
6. The PCB board solder mask processing method according to any one of claims 1 to 3, characterized in that, Before obtaining the first processed PCB board by low-pressure spraying of solder resist ink layer onto a preset area of the target PCB board, the PCB board solder resist processing method further includes: The surface of the target outer circuit board is roughened to obtain a roughened outer circuit board, wherein the target outer circuit board is a circuit board that has completed copper circuit processing; The rough outer circuit board is washed and dried to obtain the target PCB board.
7. The PCB board solder mask processing method according to any one of claims 1 to 3, characterized in that, The process of printing solder resist ink on the copper-clad edges to obtain a second processed PCB board includes: A solder resist ink of a preset thickness is printed onto the copper-clad edge to obtain a printed PCB board; The printed PCB board is cured to obtain the second processed PCB board.
8. The PCB board solder mask processing method according to claim 7, characterized in that, The step of curing the printed PCB board to obtain the second processed PCB board includes: The printed PCB board is cured by controlling the ultraviolet light source to obtain the second processed PCB board.
9. The PCB board solder mask processing method according to claim 7, characterized in that, Before printing solder resist ink of a preset thickness onto the copper-clad edge to obtain the printed PCB board, the PCB board solder resist processing method further includes: Obtain the copper layer thickness of the non-welded copper-clad area; The preset thickness is determined based on the thickness of the copper layer.
10. A PCB board solder mask processing system, characterized in that, Includes a solder resist ink printer and electronic equipment, the electronic equipment being configured to: A solder resist ink layer is sprayed under low pressure onto a predetermined area of the target PCB board to obtain a first processed PCB board. The predetermined area includes a non-soldering copper-clad area and a non-copper-clad area. Determine the copper edge of the non-soldering copper-clad area of the first processed PCB board; The solder resist ink printer is controlled to print solder resist ink on the copper-clad edge to obtain a second processed PCB board.