An integrated embedding and encapsulation injection molding device for multi-material composite components

By using a multi-material composite component injection molding equipment with coaxial nesting design and induction heating, the problems of insert suspension deformation and low interface bonding strength have been solved. Stable molding and high-strength bonding under high-pressure injection molding conditions have been achieved, making it suitable for the manufacturing of modern automotive electronics, consumer electronics and high-end medical devices.

CN122401762APending Publication Date: 2026-07-17SHENZHEN BSC TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-05-09
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Traditional multi-step injection molding processes suffer from problems such as insert suspension deformation, low bonding strength at heterogeneous interfaces, and poor mold robustness when dealing with metal inserts and polymer matrix composites. In particular, it is difficult to achieve precision molding under high-pressure injection molding conditions.

Method used

An integrated injection molding equipment for embedding and sealing multi-material composite components is adopted. Through the coaxial nesting design of the fixed mold assembly and the moving mold assembly, the cavity reconstruction and support are synchronized by the middle layer logic molding sleeve. Combined with the induction heating coil, the interface is thermally activated to eliminate the frozen layer and improve the bonding strength.

Benefits of technology

It achieves stable positioning of inserts under high-pressure injection molding conditions and high-strength bonding at heterogeneous interfaces, improving the airtightness and mechanical peel strength of the product, simplifying the mold structure, and adapting to the needs of high-speed and precision production.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122401762A_ABST
    Figure CN122401762A_ABST
Patent Text Reader

Abstract

The application relates to the technical field of polymer forming and processing equipment, and discloses a multi-material composite part embedding and glue sealing integrated injection molding equipment, which comprises a fixed mold assembly and a movable mold assembly. An inner layer positioning core for bearing an embedded part is arranged in the movable mold assembly, and a middle layer logic forming sleeve is arranged outside the inner layer positioning core. The middle layer logic forming sleeve is driven by a driving unit to move along the outer wall of the inner layer positioning core. A fluid control circuit and an adaptive support mechanism connected with the fluid control circuit are arranged in the fixed mold assembly. A fluid interface is arranged on the matching surface of the fixed mold assembly and the movable mold assembly. The shearing flow channel logic hole in the sidewall of the middle layer logic forming sleeve serves as a physical switch, directly converts the cavity reconstruction action of the movable mold into a hydraulic trigger signal of the support pin of the fixed mold, and enables the mold system to maintain high operation robustness under harsh working conditions such as high temperature, high pressure and strong electromagnetic interference.
Need to check novelty before this filing date? Find Prior Art