Metal stamping device with waste self-separation and anti-splashing buffering functions

Abstract

The present application relates to the field of metal stamping processing device, especially to a metal stamping processing device with waste self-separation and anti-splashing buffering function, comprising a workbench, a stamping unit vertically slidingly assembled on the workbench through a rack, a driving unit installed on the rack, the driving unit being used to drive the stamping unit to do vertical reciprocating motion, and an anti-splashing fence arranged on the front end cover of the workbench; in the present application, the rack, the driving unit, the stamping unit and the workbench cooperate with each other to form a complete and stable metal stamping processing main structure, and through the cooperative action of the anti-splashing fence, the transparent protective plate, the scrap collecting frame and the material guiding plate assembly, the falling waste generated in the stamping operation process is centrally received and buffered, the waste rebound and splashing are effectively avoided, and at the same time, the fine debris splashing everywhere in the stamping process can be guided and collected, realizing the integrated protection and collection effect of waste self-separation and debris anti-splashing.

Description

Technical Field

[0001] This invention relates to the field of metal stamping processing equipment, and in particular to a metal stamping processing equipment with waste self-separation and anti-splash buffer functions. Background Technology

[0002] Metal stamping processing equipment is a general term for a complete set of industrial processing equipment and supporting components that rely on the stamping process principle and use molds and power mechanisms to apply external force to blanks such as metal sheets, strips, and profiles, causing them to separate and plastically deform, thereby obtaining metal workpieces with preset shapes, sizes and properties.

[0003] Traditional stamping equipment typically only has a basic material drop hole and a simple chip collection box, without a dedicated elastic buffer structure. The hard metal scrap generated during stamping falls at high speed and easily bounces and ricochets after impacting the rigid chip collection structure, eventually splashing out from equipment gaps and operating openings. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the existing technology and to propose a metal stamping processing device with waste self-separation and anti-splash buffer functions.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A metal stamping processing device with waste self-separation and anti-splash buffer functions includes a worktable. A stamping unit is vertically slidably mounted on the worktable via a frame. A drive unit is mounted on the frame to drive the stamping unit to perform vertical reciprocating motion. An anti-splash barrier is provided at the front end of the worktable. An operation port for picking up and placing metal workpieces is opened at the front end of the anti-splash barrier. A transparent protective plate is vertically slidably mounted at the front end of the anti-splash barrier. A movable support plate is rotatably provided on one side of the front end of the anti-splash barrier. When the transparent protective plate slides upward and closes the operation port, the movable support plate can rotate to a horizontal state to support and limit the transparent protective plate. The workbench has a discharge hole in the middle corresponding to the punch of the stamping unit. The inner wall of the anti-splash enclosure has a limiting groove. The chip collection frame slides with the limiting groove to receive the waste material falling from the discharge hole. An elastic buffer pad is fixedly laid inside the chip collection frame to buffer the falling waste material and prevent it from rebounding and splashing. An inclined chip guide assembly is provided on the inner side of the anti-splash enclosure, above the chip collection frame and on the outer side of the workbench. The chip guide assembly guides the debris splashed during the operation into the chip collection frame.

[0006] Preferably, the front end of the splash guard has a groove for the movable support plate to move, and the front end of the splash guard has a sliding groove for the transparent protective plate to slide vertically.

[0007] Preferably, a rotating shaft is fixedly installed through one side of the movable support plate, and the two ends of the rotating shaft are rotatably connected to the top and bottom ends of the groove respectively through bearing assemblies. An auxiliary slot is opened on the top surface of the movable support plate, which is used to insert and cooperate with the bottom end of the raised transparent protective plate to achieve support and positioning.

[0008] Preferably, the anti-splash enclosure includes a base, C-shaped protective side panels, and a protective top plate. The base is located outside the workbench and is used to support the chip collection frame. The C-shaped protective side panels are vertically fixed on the base, with the openings of the C-shaped protective side panels facing the workpiece pick-up / placement side. The protective top plate is fixedly installed on the top of the C-shaped protective side panels. The base, C-shaped protective side panels, and protective top plate together form an integral protective cavity.

[0009] Preferably, the chip guiding assembly includes a first chip guiding plate and a second chip guiding plate. The second chip guiding plate is fixedly disposed inside the C-shaped protective side plate and located below the operating port. The first chip guiding plate is symmetrically installed at both ends of the inner side of the C-shaped protective side plate. The ends of the first chip guiding plate and the second chip guiding plate are connected. The first chip guiding plate has a first chip guiding surface that is inclined toward the second chip guiding plate, and the second chip guiding plate has a second chip guiding surface that is inclined toward the chip collecting frame.

[0010] Preferably, the elastic buffer pad is a rubber pad, which is fixed to the inner bottom surface and inner side wall of the chip collection frame in a full-coverage manner, and a push-pull handle is installed on the outer side wall of the chip collection frame.

[0011] The beneficial effects of this invention are as follows: In this invention, the frame, drive unit, stamping unit, and worktable work together to form a complete and stable main structure for metal stamping, enabling the stamping of workpieces. Simultaneously, the coordinated use of anti-splash barriers, transparent protective plates, chip collection frames, and guide plate assemblies provides centralized collection and buffering protection for falling waste generated during the stamping process, effectively preventing waste rebound and splashing. Furthermore, it guides and collects small debris that splashes around during the stamping process, achieving an integrated protection and collection effect of waste self-separation and debris anti-splashing, thus improving the safety of equipment operation. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the structure of a metal stamping processing device with waste self-separation and anti-splash buffer functions proposed in this invention; Figure 2 This is a partially disassembled structural diagram of a metal stamping processing device with waste self-separation and anti-splash buffer functions proposed in this invention; Figure 3 for Figure 2 Enlarged structural diagram at point A; Figure 4 A schematic diagram of the structure of the splash guard and chip collection frame; Figure 5 This is a schematic diagram of the chip collection frame. Figure 6 This is a partial structural diagram of the transparent protective panel.

[0013] In the diagram: 1. Frame; 2. Drive unit; 3. Stamping unit; 4. Anti-splash enclosure; 41. Slide groove; 42. Operating port; 43. Insert groove; 5. Transparent protective plate; 51. Guide slider; 52. Finger groove; 6. Chip collection frame; 7. Workbench; 8. Movable support plate; 9. First chip guide plate; 10. Second chip guide plate. Detailed Implementation

[0014] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0015] Reference Figure 1-6 A metal stamping processing device with waste self-separation and anti-splash buffer functions includes a worktable 7. A stamping unit 3 is vertically slidably mounted on the worktable 7 via a frame 1. A drive unit 2 is installed on the frame 1 to drive the stamping unit 3 to perform vertical reciprocating motion. An anti-splash barrier 4 is provided at the front end of the worktable 7. An operation port 42 for picking up and putting down metal workpieces is opened at the front end of the anti-splash barrier 4. A transparent protective plate 5 is vertically slidably mounted at the front end of the anti-splash barrier 4. The transparent material allows real-time observation of the internal processing status. The sliding design does not affect the normal picking up and putting down of workpieces. A movable support plate 8 is rotatably provided on one side of the front end of the anti-splash barrier 4. When the transparent protective plate 5 slides upward and closes the operation port 42, the movable support plate 8 can rotate to a horizontal state to support and limit the transparent protective plate 5. A finger groove 52 is opened in the middle of the bottom end of the transparent protective plate 5. Guide sliders 51 are symmetrically installed on both sides of the transparent protective plate 5.

[0016] The frame 1 is an open, tiltable C-shaped integral casting frame. The upper part of the frame 1 is the housing for mounting the drive unit 2, and the middle part has a guide rail surface for the vertical sliding of the stamping unit 3. The lower part is the bed supporting the worktable 7. The drive unit 2 includes a motor, pulleys, a flywheel, a crankshaft, and a connecting rod mechanism. The motor is connected to the flywheel via the pulley, the flywheel is coaxially assembled with the crankshaft, and the crankshaft is connected to the stamping unit 3 via the connecting rod mechanism, converting the rotational motion into the vertical reciprocating motion of the stamping unit 3. The stamping unit 3 includes a stamping slide, which slides vertically with the guide rail surface of the frame 1. The lower end of the stamping slide has a die shank hole for mounting the punch. The stamping slide has a closed height adjustment mechanism to adjust the distance between the slide and the worktable 7. The worktable 7 is a rectangular cast iron platform. The surface of the worktable 7 has a T-slot for fixing the stamping die, and the blanking hole in the middle of the worktable 7 is coaxially arranged with the punch of the stamping unit 3.

[0017] The workbench 7 has a blanking hole in the middle corresponding to the punch of the stamping unit 3. The inner wall of the anti-splash enclosure 4 has a limiting groove. The chip collection frame 6 slides with the limiting groove to receive the waste material falling from the blanking hole. An elastic buffer pad is fixedly laid inside the chip collection frame 6. The elastic buffer pad is used to buffer the falling waste material and prevent the waste material from rebounding and splashing. The elastic buffer pad is a rubber pad. The elastic buffer pad is fixed to the inner bottom surface and inner side wall of the chip collection frame 6. A push-pull handle is installed on the outer side wall of the chip collection frame 6.

[0018] An inclined chip guide assembly is provided on the inner side of the anti-splash enclosure 4, above the chip collection frame 6, and on the outer side of the workbench 7. The chip guide assembly guides the debris that splashes during the operation into the chip collection frame 6.

[0019] The front end of the anti-splash barrier 4 has a groove 43 for the movable support plate 8 to move, and the front end of the anti-splash barrier 4 also has a sliding groove 41 for the transparent protective plate 5 to slide vertically. The anti-splash barrier 4 includes a base, C-shaped protective side plates and a protective top plate. The base is set outside the workbench and is used to support the chip collection frame 6. The C-shaped protective side plates are vertically fixedly installed on the base, with the opening of the C-shaped protective side plates facing the workpiece picking and placing side. The protective top plate is fixedly installed on the top of the C-shaped protective side plates. The base, C-shaped protective side plates and protective top plate together form an integral protective cavity.

[0020] A rotating shaft is fixedly installed through one side of the movable support plate 8. The two ends of the rotating shaft are rotatably connected to the top and bottom ends of the groove 43 respectively through bearing assemblies. An auxiliary slot is opened on the top surface of the movable support plate 8. The auxiliary slot is used to insert and cooperate with the bottom end of the raised transparent protective plate 5 to achieve support and positioning.

[0021] The chip guiding assembly includes a first chip guiding plate 9 and a second chip guiding plate 10. The second chip guiding plate 10 is fixedly installed inside the C-shaped protective side plate and located below the operating port 42. The first chip guiding plate 9 is symmetrically installed at both ends of the inner side of the C-shaped protective side plate. The ends of the first chip guiding plate 9 and the second chip guiding plate 10 are connected. The first chip guiding plate 9 has a first chip guiding surface that is inclined toward the second chip guiding plate 10, and the second chip guiding plate 10 has a second chip guiding surface that is inclined toward the chip collecting frame 6.

[0022] In this embodiment, in the initial state, the transparent protective plate 5 is in a low position, opening the operation port 42 at the front end of the anti-splash enclosure 4; at the same time, the movable support plate 8 is manually moved so that it rotates around the rotating shaft and bearing assembly inside the groove 43 and is stored inside the groove 43, so as to avoid blocking the operation port 42 and leave sufficient space for workpiece loading and unloading.

[0023] The operator places the metal workpiece to be processed steadily on the stamping die of the worktable 7 through the open operating port 42. The operator holds the finger groove 52 in the middle of the bottom of the transparent protective plate 5 with their fingers and pulls the transparent protective plate 5 upward at a uniform speed. The transparent protective plate 5 slides vertically and steadily upward along the slide groove 41 at the front end of the anti-splash barrier 4 through the guide sliders 51 installed symmetrically on both sides until the operating port 42 at the front end is completely closed, blocking the channel for stamping debris and waste to splash.

[0024] After the transparent protective plate 5 is fully closed at the operating port 42, manually rotate the movable support plate 8 in the groove 43 so that the movable support plate 8 rotates horizontally around the pivot. Insert the auxiliary slot on the top surface of the movable support plate 8 into the bottom end of the transparent protective plate 5. The movable support plate 8 supports and limits the transparent protective plate 5, locking the protective plate in the closed state and preventing the protective plate from shaking, slipping, or shifting during operation.

[0025] The motor of drive unit 2 is started. The motor drives the flywheel to rotate through the pulley. The flywheel drives the coaxial crankshaft to rotate. The crankshaft, together with the connecting rod mechanism, converts the rotational motion into linear power, which drives the stamping slide of stamping unit 3 to make a stable vertical reciprocating stamping motion along the guide rail surface of frame 1. The punch moves down with the slide to perform stamping and punching processing on the metal workpiece on worktable 7.

[0026] Waste material generated during workpiece stamping and punching is separated from the workpiece body by the stamping force and falls vertically through the blanking hole in the middle of the worktable 7, directly into the chip collection frame 6 below. The falling waste material impacts the rubber elastic buffer pad inside the chip collection frame 6. The elastic deformation of the buffer pad absorbs the impact force of the falling waste material, effectively preventing the waste material from rebounding and splashing.

[0027] During the stamping process, fine iron filings and flying debris are generated and splashed outwards by the stamping vibration and impact force, which will come into contact with the chip guide assembly. The first chip guide plates 9 on both sides guide the side-splashed debris to the second chip guide plate 10 in the middle through the inclined first chip guide surface. The second chip guide plate 10 guides all the collected debris into the chip collection frame 6 through the inclined second chip guide surface, realizing the collection of debris without dead corners and avoiding the accumulation of debris in the workbench 7 or equipment gaps.

[0028] Throughout the stamping process, operators can observe the stamping status of the equipment and the processing of the workpiece in real time through the transparent protective plate 5, and promptly detect problems such as abnormal stamping pressure, workpiece displacement, and component jamming, so as to facilitate shutdown and maintenance at any time.

[0029] After a batch of workpieces is stamped, the motor of drive unit 2 is turned off. After the flywheel and crankshaft have completely stopped rotating, the stamping slide of stamping unit 3 is reset to the highest initial position to ensure that the equipment is completely stopped and there is no risk of dynamic operation. The horizontal movable support plate 8 is manually rotated to disengage from the auxiliary slot at the bottom of the transparent protective plate 5 and rotated back into the groove 43, releasing the support and limiting of the transparent protective plate 5.

[0030] Once the finger groove 52 at the bottom of the transparent protective plate 5 is engaged again, the transparent protective plate 5 is slid down and the guide slider 51 descends smoothly along the slide groove 41, fully opening the operating port 42, and the processed workpiece is smoothly removed from the lower mold of the worktable 7, completing a single batch processing cycle.

[0031] After multiple batches of operations are completed, wait for the equipment to cool down completely and stop. Hold the push-pull handle on the outside of the chip collection frame 6 and pull the chip collection frame 6 out along the limiting slide groove on the inner wall of the anti-splash enclosure 4. Clean the stamping waste and small iron filings collected inside the chip collection frame 6. After cleaning, check the condition of the elastic buffer pad. After confirming that there is no debris left, push the chip collection frame 6 back to its original position and reset it to fit the limiting slide groove.

[0032] In this invention, the frame 1, drive unit 2, stamping unit 3, and worktable 7 work together to form a complete and stable main structure for metal stamping, enabling the stamping of workpieces. At the same time, the anti-splash enclosure 4, transparent protective plate 5, chip collection frame 6, and guide plate assembly work together to collect and buffer the falling waste generated during the stamping process, effectively preventing waste from rebounding and splashing. It can also guide and collect small debris that splashes everywhere during the stamping process, achieving an integrated protection and collection effect of waste self-separation and chip anti-splash, thus improving the safety of equipment operation.

[0033] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A metal stamping processing device with waste self-separation and anti-splash buffer functions, comprising a worktable (7), characterized in that, The workbench (7) is vertically slidably mounted with a stamping unit (3) above the frame (1). The frame (1) is equipped with a drive unit (2). The drive unit (2) is used to drive the stamping unit (3) to make vertical reciprocating motion. The front end of the workbench (7) is covered with a splash guard (4). The front end of the splash guard (4) has an operation port (42) for picking up and putting in metal workpieces. The front end of the splash guard (4) is vertically slidably mounted with a transparent protective plate (5). The front end of the splash guard (4) is rotatably provided with a movable support plate (8). When the transparent protective plate (5) slides upward and closes the operation port (42), the movable support plate (8) can rotate to a horizontal state to support and limit the transparent protective plate (5). The workbench (7) has a material discharge hole in the middle corresponding to the punch of the stamping unit (3). The inner wall of the anti-splash enclosure (4) is provided with a limiting groove. The chip collection frame (6) is slidably engaged with the limiting groove to receive the waste material falling from the material discharge hole. An elastic buffer pad is fixedly laid inside the chip collection frame (6). The elastic buffer pad is used to buffer the falling waste material and prevent the waste material from rebounding and splashing. An inclined chip guide assembly is provided on the inner side of the anti-splash enclosure (4), above the chip collection frame (6), and outside the workbench (7). The chip guide assembly guides the debris splashed during the operation into the chip collection frame (6).

2. The metal stamping processing device with waste self-separation and anti-splash buffer functions according to claim 1, characterized in that, The front end of the anti-splash enclosure (4) is provided with a groove (43) for the movable support plate (8) to move, and the front end of the anti-splash enclosure (4) is provided with a sliding groove (41) for the transparent protective plate (5) to slide vertically.

3. A metal stamping processing device with waste self-separation and anti-splash buffering functions according to claim 2, characterized in that, A rotating shaft is fixedly installed on one side of the movable support plate (8). The two ends of the rotating shaft are rotatably connected to the top and bottom of the groove (43) respectively through bearing assemblies. An auxiliary slot is provided on the top surface of the movable support plate (8). The auxiliary slot is used to insert and cooperate with the bottom of the transparent protective plate (5) after it is raised to achieve support and positioning.

4. A metal stamping processing device with waste self-separation and anti-splash buffer functions according to claim 3, characterized in that, The anti-splash enclosure (4) includes a base, a C-shaped protective side plate and a protective top plate. The base is set on the outside of the workbench and is used to support the chip collection frame (6). The C-shaped protective side plate is vertically fixed on the base. The opening of the C-shaped protective side plate faces the side where the workpiece is picked up and placed. The protective top plate is fixedly installed on the top of the C-shaped protective side plate. The base, the C-shaped protective side plate and the protective top plate together form an integral protective cavity.

5. A metal stamping processing device with waste self-separation and anti-splash buffer functions according to claim 4, characterized in that, The chip guiding assembly includes a first chip guiding plate (9) and a second chip guiding plate (10). The second chip guiding plate (10) is fixedly installed on the inner side of the C-shaped protective side plate and located below the operating port (42). The first chip guiding plate (9) is symmetrically installed at both ends of the inner side of the C-shaped protective side plate. The ends of the first chip guiding plate (9) and the second chip guiding plate (10) are connected. The first chip guiding plate (9) has a first chip guiding surface that is inclined toward the second chip guiding plate (10), and the second chip guiding plate (10) has a second chip guiding surface that is inclined toward the chip collection frame (6).

6. A metal stamping processing device with waste self-separation and anti-splash buffer functions according to claim 5, characterized in that, The elastic buffer pad is a rubber pad, which is fixed to the inner bottom surface and inner side wall of the chip collection frame (6) in a full-coverage manner. A push-pull handle is installed on the outer side wall of the chip collection frame (6).

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