Wet cleaning brush head and wet cleaning equipment

Abstract

The utility model provides a wet cleaning brush head and wet cleaning equipment. According to the wet cleaning brush head, a nozzle and a brush are combined into a whole, so that the nozzle directly sprays cleaning liquid towards the brush, rapid wetting of the brush is achieved, and the problem that in the prior art, the brush cannot make contact with the cleaning liquid is solved. The nozzles are arranged on the inner walls of the grooves in the bottom of the liquid storage tank, the hair bundles of the brush are arranged at the bottoms of the grooves, and the nozzles can be directly distributed relative to the hair bundles, so that the corresponding hair bodies can be deeply cleaned in a targeted mode, the cleaning effect is good, operation is convenient and fast, and the cleaning efficiency is improved. And an external cleaning device is not needed, so that the cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing, in particular to a wet cleaning brush head and wet cleaning equipment. Background Art

[0002] Wet cleaning is one of the important process steps in the preparation of semiconductor devices. Among them, water-based wet cleaning (scrubber) has the advantages of strong decontamination ability, low wafer damage, energy saving and environmental protection, and is now widely used in single-wafer cleaning. Figure 1 The existing water-washing wet cleaning equipment uses ultrapure water (UPW) and a brush 101 to clean the surface of the wafer W. The ultrapure water is provided by an external nozzle 102. That is, during the cleaning process, the nozzle 102 sprays ultrapure water toward the surface of the rotating wafer W at a set flow rate to form a water film F on the surface of the wafer W. At the same time, the brush 101 approaches the water film F under the control of the robot arm 103, and adjusts the flow state of the water film F by self-rotation, thereby achieving a high-cleanliness water film brushing effect.

[0003] However, in the actual process, the brush 101 is prone to fail to contact the water film, seriously affecting the cleaning effect of the wafer W. The main reason for this is that the thickness of the water film is difficult to control. Because the nozzle 102 is external, and the thickness of the water film is affected by multiple factors such as water flow rate and wafer W rotation speed, the spray state of the nozzle 102 during the cleaning process needs to be adapted to the position and movement state of the brush 101. However, it is difficult to adjust the two to a better state in the existing process, so it is easy for the brush 101 to fail to contact the water film F, and even the nozzle 102 may spray water onto the brush 101, causing splashing and affecting the cleaning process.

[0004] In addition, since the brush 101 is generally made of a sponge-like hydrophilic material (such as polyvinyl alcohol), it is easy to absorb polluted particles on the surface of the wafer W during the brushing process. For this reason, the brush 101 needs to be cleaned during the idle rinse process in a non-working state. The existing method is to rinse the brush 101 separately through an external pipe. However, this method can only rinse the outer surface of the brush 101, and it is difficult to clean the inside of the brush 101 in a targeted manner. The polluted particles will remain in the brush 101, which is easy to cause cross infection to the wafer W during the cleaning operation, affecting the cleanliness of the wafer W.

[0005] Therefore, a new wet cleaning equipment is urgently needed to solve the above technical problems. Utility Model Content

[0006] The utility model aims to provide a wet cleaning brush head and a wet cleaning device to solve at least one of the problems that the brush cannot contact the water film and how to improve the cleaning effect of the brush.

[0007] In order to solve the above technical problems, the utility model provides a wet cleaning brush head for cleaning wafers, comprising: a liquid supply component, a brush and a plurality of nozzles;

[0008] The liquid supply assembly includes a liquid storage tank; the liquid storage tank has a cavity for storing cleaning liquid; wherein the bottom surface of the liquid storage tank has a plurality of grooves;

[0009] The brush comprises a plurality of bundles of bristles; each bundle of the bristles is connected to the bottom of the groove, and the bristles are arranged along the extension direction of each groove;

[0010] A plurality of nozzles are arranged at intervals on the inner wall of each groove and are connected to the cavity, so that the cleaning liquid in the cavity is sprayed onto each bundle of the bristles through the nozzles and flows at least along the bristles to the wafer surface.

[0011] Optionally, in the wet cleaning brush head, a plurality of the grooves are spaced apart and distributed on the bottom surface of the liquid storage tank, and the shapes of the grooves include linear, circular, "V"-shaped, "W"-shaped and wavy.

[0012] Optionally, in the wet cleaning brush head, the multiple bundles of bristles are evenly distributed in each of the grooves.

[0013] Optionally, in the wet cleaning brush head, each bundle of the bristles is arranged at an angle to the groove bottom, and one end of each bundle of the bristles away from the groove bottom extends out of the groove.

[0014] Optionally, in the wet cleaning brush head, the plurality of nozzles are arranged linearly or in an array along the inner wall of each groove.

[0015] Optionally, in the wet cleaning brush head, along the extension direction of each of the grooves, the nozzles arranged on the inner walls of the grooves on opposite sides of the grooves are staggered.

[0016] Optionally, in the wet cleaning brush head, the liquid supply assembly also includes a liquid supply box and a liquid supply pipe; the liquid supply box, the liquid supply pipe and the liquid storage tank are connected in sequence, and the cleaning liquid is stored in the liquid supply box, so that the cleaning liquid flows to the liquid storage tank through the liquid supply pipe.

[0017] Optionally, in the wet cleaning brush head, the liquid supply component also includes a switch and a pressure valve; the switch and the pressure valve are respectively arranged on the liquid supply pipeline, and the switch is used to adjust the opening and closing of the liquid supply pipeline, and the pressure valve is used to adjust the flow rate of the cleaning liquid.

[0018] Optionally, in the wet cleaning brush head, the wet cleaning brush head also includes a robotic arm; the robotic arm is connected to the top surface of the liquid storage tank, and can drive the liquid storage tank and the brush to move along at least one degree of freedom; and the robotic arm has a through hole, and part of the liquid supply pipe passes through the through hole to connect with the liquid storage tank.

[0019] Based on the same concept, the utility model also provides a wet cleaning device, comprising at least one cleaning chamber, and each of the cleaning chambers is provided with the wet cleaning brush head.

[0020] In summary, the utility model provides a wet cleaning brush head and a wet cleaning device. The wet cleaning brush head combines a nozzle and a brush into one, so that the nozzle directly sprays cleaning liquid toward the brush to achieve rapid wetting of the brush, thereby avoiding the problem in the prior art that the brush cannot contact the cleaning liquid. Each of the nozzles is arranged on the inner wall of a plurality of grooves at the bottom of the liquid storage tank, and each bundle of bristles of the brush is distributed at the bottom of the groove. Then, each of the nozzles can be directly distributed relative to the bristles, so that the corresponding bristles can be deeply cleaned in a targeted manner. Not only is the cleaning effect good and the operation is convenient, but also no external cleaning device is required, which is conducive to reducing costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Those skilled in the art will appreciate that the drawings are provided for a better understanding of the present invention, but do not constitute any limitation on the scope of the present invention.

[0022] Figure 1 It is a structural schematic diagram of wet cleaning equipment in the prior art.

[0023] Figure 2 It is a structural schematic diagram of a wet cleaning brush head in an embodiment of the utility model.

[0024] Figure 3 It is a schematic diagram of the morphology and distribution of grooves in an embodiment of the utility model.

[0025] Figure 4 It is a schematic diagram of another groove morphology and distribution in an embodiment of the utility model.

[0026] Figure 5 It is a schematic diagram of the staggered distribution of nozzles in an embodiment of the utility model.

[0027] Figure 6 It is a structural schematic diagram of a wet cleaning device in an embodiment of the utility model.

[0028] And, in the attached drawings:

[0029] 101-brush; 102-nozzle; 103-mechanical arm;

[0030] 20-wet cleaning brush head; 201-liquid supply assembly; 2011-liquid storage tank; 2012-liquid supply tank; 2013-liquid supply pipeline; 2014-switch; 2015-pressure valve; 202-brush; 2021-brush body; 203-nozzle; 204-mechanical arm;

[0031] 30-carrying platform;

[0032] W-wafer; F-water film; C-groove. DETAILED DESCRIPTION

[0033] In order to make the purpose, advantages and features of the utility model clearer, the utility model is further described in detail in conjunction with the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the utility model. In addition, the structure shown in the drawings is often a part of the actual structure. In particular, the emphasis of each drawing is different, and sometimes different proportions are used. It should also be understood that, unless otherwise specified or indicated, the terms "first", "second", "third", etc. in the specification are only used to distinguish between the various components, elements, steps, etc. in the specification, and are not used to represent the logical relationship or sequential relationship between the various components, elements, steps, etc.

[0034] In addition, the X-axis direction, Y-axis direction and Z-axis direction referred to in the specification and drawings of this application are three directions perpendicular to each other in three-dimensional space; the extension direction of the groove refers to the groove length direction of the groove on the plane where the X-axis-Y-axis is located.

[0035] See also Figure 2The present embodiment provides a wet cleaning brush head 20 for cleaning wafers. The wet cleaning brush head 20 comprises: a liquid supply component 201, a brush 202 and a plurality of nozzles 203; the liquid supply component 201 comprises a liquid storage tank 2011; the liquid storage tank 2011 has a cavity for storing cleaning liquid; wherein the bottom surface of the liquid storage tank 2011 has a plurality of grooves C; the brush 202 comprises a plurality of bundles of bristles 2021; each bundle of the bristles 2021 is connected to the bottom of the groove C, and the bristles 2021 are arranged along the extension direction of each groove C; the plurality of nozzles 203 are arranged at intervals on the inner wall of each groove C, and are connected to the cavity, so that the cleaning liquid in the cavity is sprayed onto each bundle of the bristles 2021 through the nozzles 203, and flows to the surface of the wafer at least along the bristles 2021.

[0036] It can be seen that the wet cleaning brush head 20 provided in this embodiment combines the nozzle 203 and the brush 202 into one body, so that the nozzle 203 directly sprays the cleaning liquid toward the brush 202, so as to quickly wet the brush 202, thereby avoiding the problem that the brush cannot contact the cleaning liquid in the prior art. And each of the nozzles 203 is arranged on the inner wall of the grooves C at the bottom of the liquid storage tank 2011, and each bundle of bristles 2021 of the brush 202 is arranged at the bottom of the groove C, then each of the nozzles 203 can be directly distributed relative to the body 2021, so that the corresponding bundles of bristles 2021 can be targeted and deeply cleaned, which not only has a good cleaning effect and is convenient to operate, but also does not require an external cleaning device, which is conducive to reducing costs.

[0037] The following is combined with Figures 2 to 6 The wet cleaning brush head 20 provided in this embodiment is described in detail.

[0038] Please continue reading Figure 2The wet cleaning brush head 20 includes: a liquid supply component 201, a brush 202, a plurality of nozzles 203 and a robot arm 204. The liquid supply component 201 is used to provide a cleaning liquid. Optionally, the cleaning liquid is ultrapure water. The brush 202 is used to scrub the surface of the wafer. The nozzle 203 is connected to the liquid supply component 201 and is used to spray the cleaning liquid toward the brush 202, which can not only quickly wet the brush 202, but also facilitate the brush 202 to fully contact with the formed water film during the cleaning process to improve the cleaning effect, and can also rinse the brush 202 in a non-working state, and fully rinse each bundle of the bristles 2021 in the brush 202, so as to improve the cleanliness of the brush 202 and avoid cross infection between the brush 202 and the wafer during the cleaning process. The robot arm 204 is used to at least drive the brush 202 to move along the three-dimensional space to achieve position adjustment of the brush 202; and the robot arm 204 is also used to drive the brush 202 to rotate along the Z-axis direction during the cleaning process to improve the wafer cleaning effect.

[0039] Specifically, the liquid supply assembly 201 includes a liquid storage tank 2011, a liquid supply tank 2012, a liquid supply pipeline 2013, a switch 2014 and a pressure valve 2015. The liquid supply tank 2012, the liquid supply pipeline 2013 and the liquid storage tank 2011 are sequentially connected and communicated, and the cleaning liquid is stored in the liquid supply tank 2012, so that the cleaning liquid flows into the liquid storage tank 2011 through the liquid supply pipeline 2013. In addition, the switch 2014 and the pressure valve 2015 are respectively arranged on the liquid supply pipeline 2013, and the switch 2014 is used to adjust the opening and closing of the liquid supply pipeline 2013, and the pressure valve 2015 is used to adjust the flow rate of the cleaning liquid, thereby adjusting the injection pressure of the nozzle 203 connected to the liquid storage tank 2011. It should be noted that the present embodiment does not specifically limit the specific capacity and size of the liquid storage tank 2011, the liquid supply tank 2012 and the liquid supply pipe 2013, nor does it specifically limit the type and model of the switch 2014 and the pressure valve 2015. Also, the present embodiment does not limit the specific connection position of the liquid supply pipe 2013 relative to the liquid storage tank 2011 and the liquid supply tank 2012, and can be set at any part of the corresponding box. However, in order to facilitate the installation of the brush 202 on the bottom surface of the liquid storage tank 2011, the liquid supply pipe 2013 can be connected to the top surface or side wall of the liquid storage tank 2011.

[0040] Furthermore, the liquid storage tank 2011 has a cavity for storing the cleaning liquid. The bottom surface of the liquid storage tank 2011 has a plurality of grooves C, and the openings of the grooves C are away from the cavity. In other words, each of the grooves C is opened on the bottom surface of the outside of the liquid storage tank 2011, and the openings of the grooves C are away from the cavity relative to the bottom of the grooves C. Preferably, a plurality of the grooves C are distributed at intervals on the bottom surface of the liquid storage tank 2011, and the shapes of the grooves C include but are not limited to linear, circular, "V"-shaped, "W"-shaped and wavy. Figure 3 As shown in the example, each of the grooves C is in a "V" shape; or Figure 4 As shown, some of the grooves C are in a "V" shape, and one of the grooves C is in a "W" shape. In other examples, the grooves C may also be in an irregular shape, which is not specifically limited in this embodiment. Also, the specific number and size of the grooves C are not limited in this embodiment. However, since the bristles 2021 are connected to the grooves C, it is preferred that the grooves C evenly cover the bottom surface of the liquid storage tank 2011 to ensure that each bundle of the bristles 2021 can evenly apply force toward the water film on the surface of the wafer during the wafer cleaning process. And the groove width of the groove C should not be too large to ensure that the width of the bristles is moderate, so that the nozzle 203 can deeply clean each of the bristles 2021, remove the dirt in the dead corners of each of the bristles 2021, and ensure that each bundle of the bristles 2021 has a better cleanliness.

[0041] Please continue reading Figures 2 to 4 The bristle brush 202 includes a plurality of bundles of bristles 2021, and each bundle of the bristles 2021 includes a plurality of bristles, which can be pressed or bundled into a bundle. Each bundle of the bristles 2021 is connected to the bottom of the groove C, and is arranged along the extension direction of each groove C. In other words, the bristle brush 202 provided in this example is connected to the bottom of each groove C on the bottom surface of the liquid storage tank 2011. Each bundle of bristles 2021 is distributed in one groove C, and the morphology of the bristles 2021 is adapted to the morphology of the groove C, that is, the bristles 2021 are distributed along the extension direction of the groove C. For example, please refer to Figure 3 , the bottom surface of the liquid storage box 2011 is provided with four grooves C, and the brush 202 is correspondingly provided with four bundles of bristles 2021. Each groove C is in a "V" shape, and the distribution morphology of each bundle of bristles 2021 is also in a "V" shape. And, Figure 4As shown, the bottom surface of the liquid storage box 2011 is provided with three grooves C, and the brush 202 is correspondingly provided with three bundles of bristles 2021. Among them, two of the three grooves C are in a "V" shape, and the distribution morphology of the bristles 2021 arranged therein is also in a "V" shape; the remaining groove C is in a "W" shape, and the corresponding bristles 2021 are also in a "W" shape along with the distribution of the groove C.

[0042] Furthermore, in view of the narrow groove width of the groove C, the width of the bristles 2021 is also narrow, so that the nozzle 203 can deeply clean each bundle of the bristles 2021. And, preferably, the bristles 2021 are evenly distributed in the corresponding groove C, so that the brush 202 can apply a uniform force to the water film formed on the surface of the wafer. Furthermore, each bundle of the bristles 2021 is set at an angle to the bottom of the groove. For example Figure 2 As shown, the setting direction of the bristles 2021 is perpendicular to the plane where the bottom of the groove is located, so as to ensure that the water flow can drip vertically along the bristles 2021 to the surface of the wafer. It should be noted that this embodiment does not limit the specific connection method of the bristles 2021 to the bottom of the groove, which can be bonding or clamping. In addition, this embodiment does not limit the specific length of the bristles 2021, but preferably, the lengths of the bristles 2021 are the same, and one end of each bundle of bristles 2021 away from the bottom of the groove extends out of the groove C to facilitate brushing the wafer.

[0043] Furthermore, a plurality of nozzles 203 are arranged at intervals on the inner wall of each groove C, and are connected to the cavity of the liquid storage box 2011, so that the cleaning liquid in the cavity is sprayed onto the corresponding bristle body 2021 through the nozzle 203, and flows along the bristle body 2021 and the inner wall of the groove C to the surface of the wafer. It can be understood that, based on the connection and distribution relationship between the groove C and the brush 202, each nozzle 203 can be distributed along the corresponding bristle body 2021, so as to directly spray the cleaning liquid toward the corresponding bristle body 2021, which is conducive to achieving rapid wetting and deep cleaning of the bristle body 2021. It should be supplemented that the spraying direction of the nozzle 203 is toward the bristle body 2021, and during the cleaning process, the wafer is located below the brush 202.

[0044] Preferably, the plurality of nozzles 203 are arranged linearly or in an array along the inner wall of each groove C, so as to be able to synchronously spray the cleaning liquid toward each bristle 2021, thereby realizing rapid wetting of the bristle 2021 in the working state, effectively avoiding the problem that the bristle brush cannot contact the water film in the existing process; and in the non-working state, each bundle of the bristle 2021 can be cleaned in a targeted manner from multiple angles, ensuring that the bristle brush 202 has a high degree of cleanliness and avoiding cross infection of the wafer. Further, as Figure 5 As shown, along the extension direction of each groove C, the nozzles 203 arranged on the groove inner walls on opposite sides of the groove C are staggered. That is, the jets formed during the spraying process of each nozzle 203 are staggered, which will not cause collision between the nozzles 203, avoid unstable fluid flow rate, and avoid damage to the bristle body 2021.

[0045] Please continue reading Figure 2 In order to facilitate the mechanical arm 204 to drive the liquid storage tank 2011 and the brush 202 to move or rotate, preferably, the mechanical arm 204 is connected to the top surface of the liquid storage tank 2011. In addition, the mechanical arm 204 also has a through hole, so that part of the pipe body of the liquid supply pipe 2013 can pass through the through hole to achieve communication with the liquid storage tank 2011. It can be understood that the mechanical arm 204 needs to be connected to an external control device to set its parameters such as rotation direction, rotation speed and displacement, which will not be described in detail in this embodiment.

[0046] Based on the same concept, this embodiment also provides a wet cleaning device. Figure 2 and Figure 6The wet cleaning equipment includes at least one cleaning chamber, and each cleaning chamber is provided with the wet cleaning brush head 20. A carrier 30 is provided in the cleaning chamber for carrying the wafer W. The wet cleaning brush head 20 is located above the wafer W, and there is a certain gap between the wet cleaning brush head 20 and the wafer W to prevent the brush 202 from contacting the wafer W and causing damage to the wafer W. During the cleaning process, the cleaning liquid in the liquid supply tank 2012 flows to the liquid storage tank 2011 through the liquid supply pipe 2013, and is sprayed to the bristle body 2021 through each of the nozzles 203 to wet the bristle body 2021. Subsequently, the cleaning liquid will flow along the bristle body 2021 and the groove wall of the groove C to the surface of the wafer W to form a water film on the surface of the wafer W. At the same time, the robot arm 204 will drive the brush 202 to rotate, and the carrier 30 will also drive the wafer W to rotate, so as to enhance the friction of the brush 202 on the water film, thereby improving the cleaning effect of the water film on the wafer W. In addition, in a non-working state, by adjusting the pressure valve 2015, the jet velocity of the nozzle 203 is increased, so that the nozzle 203 flushes each of the bristles 2021 in a high-pressure state, and no external device is required, so that efficient cleaning of the brush 202 can be achieved. And, preferably, the wet cleaning equipment includes multiple cleaning chambers, so that multiple wafers W can be wet cleaned at the same time, thereby improving process efficiency.

[0047] In summary, the wet cleaning brush head 20 and wet cleaning equipment provided in this embodiment combine the nozzle 203 and the brush 202 into one body, so that the nozzle 203 directly sprays the cleaning liquid toward the brush 202, avoiding the problem that the brush cannot contact the cleaning liquid in the prior art. And under the setting of multiple grooves C, each of the nozzles 203 can be directly distributed relative to the bristle body 2021, so that the corresponding bristle body 2021 can be deeply cleaned in a targeted manner, which not only has a good cleaning effect and is easy to operate, but also does not require an external cleaning device, which is conducive to reducing costs.

[0048] In addition, it should be recognized that although the present invention has been disclosed as a preferred embodiment, the above embodiment is not intended to limit the present invention. For any technician familiar with the art, without departing from the scope of the technical solution of the present invention, the above disclosed technical content can be used to make many possible changes and modifications to the technical solution of the present invention, or modified into equivalent embodiments of equivalent changes. Therefore, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the present invention without departing from the content of the technical solution of the present invention still falls within the scope of protection of the technical solution of the present invention.

Claims

1. A wet cleaning brush head for cleaning wafers, characterized in that: include: A liquid supply assembly, a brush and a plurality of nozzles; The liquid supply assembly includes a liquid storage tank; the liquid storage tank has a cavity for storing cleaning liquid; wherein the bottom surface of the liquid storage tank has a plurality of grooves; The brush comprises a plurality of bundles of bristles; each bundle of the bristles is connected to the bottom of the groove, and the bristles are arranged along the extension direction of each groove; A plurality of nozzles are arranged at intervals on the inner wall of each groove and are connected to the cavity, so that the cleaning liquid in the cavity is sprayed onto each bundle of the bristles through the nozzles and flows at least along the bristles to the wafer surface.

2. The wet cleaning brush head according to claim 1, characterized in that: A plurality of the grooves are distributed at intervals on the bottom surface of the liquid storage tank, and the shapes of the grooves include linear, circular, "V"-shaped, "W"-shaped and wavy.

3. The wet cleaning brush head according to claim 1, characterized in that: The multiple bundles of hair are evenly distributed in each of the grooves.

4. The wet cleaning brush head according to claim 1 or 3, characterized in that: Each bundle of the bristles is arranged at an angle to the groove bottom, and one end of each bundle of the bristles away from the groove bottom extends out of the groove.

5. The wet cleaning brush head according to claim 1, characterized in that: The plurality of nozzles are arranged linearly or in an array along the inner wall of each groove.

6. The wet cleaning brush head according to claim 1 or 5, characterized in that: Along the extension direction of each of the grooves, the nozzles arranged on the inner walls of the grooves on opposite sides of the grooves are staggered.

7. The wet cleaning brush head according to claim 1, characterized in that: The liquid supply assembly also includes a liquid supply box and a liquid supply pipeline; the liquid supply box, the liquid supply pipeline and the liquid storage tank are connected in sequence, and the cleaning liquid is stored in the liquid supply box so that the cleaning liquid flows to the liquid storage tank through the liquid supply pipeline.

8. The wet cleaning brush head according to claim 7, characterized in that: The liquid supply component also includes a switch and a pressure valve; the switch and the pressure valve are respectively arranged on the liquid supply pipeline, and the switch is used to adjust the opening and closing of the liquid supply pipeline, and the pressure valve is used to adjust the flow rate of the cleaning liquid.

9. The wet cleaning brush head according to claim 7 or 8, characterized in that: The wet cleaning brush head also includes a robotic arm; the robotic arm is connected to the top surface of the liquid storage tank and can drive the liquid storage tank and the brush to move along at least one degree of freedom; and the robotic arm has a through hole, and part of the liquid supply pipeline passes through the through hole to connect with the liquid storage tank.

10. A wet cleaning device, characterized in that: The invention comprises at least one cleaning chamber, and each of the cleaning chambers is provided with a wet cleaning brush head as claimed in any one of claims 1 to 9.

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