Audio signal fidelity circuit and microphone loudspeaker
By employing an isolation unit design in the microphone amplifier to avoid Bluetooth signal processing, and utilizing the electronic volume control chip U3 to process the microphone signal, the problems of signal compression and attenuation are solved, achieving high-quality sound reproduction and improved production yield.
Patent Information
- Application Number
- CN202520241755.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-12-30
- Estimated Expiration
- 2035-02-14
AI Technical Summary
The audio signals in existing microphone amplifiers need to be processed by Bluetooth chips, which leads to signal compression and attenuation, affecting sound reproduction and product yield.
The design employs a first isolation unit and a second isolation unit to isolate the Bluetooth signal and the microphone signal, preventing the signal from being processed by the Bluetooth chip. Instead, the signal is processed by the electronic volume control chip U3 to ensure that the signal is not compressed.
It improves sound fidelity, reduces signal attenuation, and enhances product yield and quality.
Smart Images
Figure CN223744878U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of audio electronics, and particularly relates to an audio signal fidelity circuit and a microphone loudspeaker. BACKGROUND
[0002] Audio electronics mainly develops around the production, processing, transmission, amplification and playing of audio signals, and is widely applied to many scenes such as daily life, professional audio fields and industry.
[0003] Most wired and wireless microphone signals on the existing market are processed through Bluetooth chips, so that the audio signals need to be converted and modulated inside the Bluetooth chips, resulting in that the internal signal processing is seriously compressed, and when the wireless Bluetooth audio signal output and the wired and wireless microphone audio signal are combined, the sound will be attenuated, causing poor sound restoration and reducing the product production yield. CONTENT OF THE UTILITY MODEL
[0004] In order to solve the problems of the prior art, the application provides an audio signal fidelity circuit and a microphone loudspeaker, wired and wireless microphone signals are not processed through Bluetooth chips, and the design of the first isolation unit and the second isolation unit separates the Bluetooth signals and the microphone signals, which can avoid the compression of internal signals, reduce signal attenuation, effectively improve the sound restoration, improve the product production yield, and ensure the product production quality.
[0005] The technical effects achieved by the application are realized through the following aspects:
[0006] In a first aspect, the application provides an audio signal fidelity circuit, which comprises
[0007] An audio signal processing module is provided with a first audio signal end MIC_OUT and a second audio signal end DACL;
[0008] An electronic volume control module comprises an electronic volume control chip U3, a first isolation unit and a second isolation unit, the first isolation unit is connected between the first audio signal end MIC_OUT and the input end VIN1 of the electronic volume control chip U3, the second isolation unit is connected between the second audio signal end DACL and the input end VIN1 of the electronic volume control chip U3, and
[0009] An audio output module is connected with the output end of the electronic volume control module.
[0010] In some implementations, the first isolation unit comprises a resistor R52 and a capacitor C19 connected in series.
[0011] In some implementations, the second isolation unit includes a resistor R58 and a capacitor C61 connected in series.
[0012] In some implementations, the audio signal processing module includes a Bluetooth signal processing module, a first signal processing module, and a second signal processing module, an output end of the Bluetooth signal processing module is connected with the second audio signal end DACL, an output end of the first signal processing module and an input end of the second signal processing module are connected, and an output end of the second signal processing module is connected with the first audio signal end MIC_OUT.
[0013] In some implementations, the first signal processing module includes a wired signal end MIC1_IN, a first processing chip U6, and a first signal output end MIC_OUT2, the wired signal end MIC1_IN is connected with an input end P3 of the first processing chip U6, and the first signal output end MIC_OUT2 is connected with an output end P1 of the first processing chip U6.
[0014] In some implementations, the second signal processing module includes a connector JP1 and a second processing chip U7, the connector JP1 is provided with a wireless signal output pin JP1-6, the wireless signal output pin JP1-6 is connected with an input end P8 of the second processing chip U7, the first signal output end MIC_OUT2 is connected with an input end P9 of the second processing chip U7, and an output end P6 of the second processing chip U7 is connected with the first audio signal end MIC_OUT.
[0015] In some implementations, the first signal processing module further includes a first anti-distortion unit, the first anti-distortion unit is connected between the first processing chip U6 and the wired signal end MIC1_IN and is grounded.
[0016] In some implementations, the second signal processing module further includes a second anti-distortion unit, the second anti-distortion unit is connected between the wireless signal output pin JP1-6 and the second processing chip U7 and is grounded.
[0017] In some implementations, the audio output module includes a power amplifier unit and a loudspeaker, an input end of the power amplifier unit is connected with an output end of the electronic volume control module, and an output end of the power amplifier unit is connected with the loudspeaker.
[0018] In the second aspect, the application provides a microphone loudspeaker including the above-mentioned audio signal fidelity circuit.
[0019] In summary, the application has at least the following advantages:
[0020] The audio signal fidelity circuit provided in this application is designed so that wired and wireless microphone signals do not pass through the Bluetooth chip, thus avoiding the phenomenon of internal signal compression. Furthermore, the wired and wireless microphone signals and Bluetooth signals are separated by the first isolation unit and the second isolation unit, so that the signal attenuation of the two signals entering the electronic volume control chip U3 is very small, effectively improving the sound reproduction accuracy, increasing the product production yield, and thus ensuring the product production quality. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the audio signal fidelity circuit in Embodiment 1 of this application.
[0022] Figure 2 This is a schematic diagram of the electronic volume control module in Embodiment 1 of this application.
[0023] Figure 3 This is a schematic diagram of the structure of the first signal processing module in Embodiment 1 of this application.
[0024] Figure 4 This is a schematic diagram of the structure of the second signal processing module in Embodiment 1 of this application.
[0025] Figure 5 This is a schematic diagram of the structure of the first signal processing module in Embodiment 2 of this application.
[0026] Figure 6 This is a schematic diagram of the structure of the second signal processing module in Embodiment 2 of this application.
[0027] Figure 7 This is a schematic diagram of the audio output module in Embodiment 2 of this application.
[0028] Figure 8 This is a schematic diagram of the microphone amplifier in Embodiment 3 of this application.
[0029] Marked in the image:
[0030] 1. Audio signal processing module; 11. First signal processing module; 111. First anti-distortion unit; 12. Second signal processing module; 121. Second anti-distortion unit; 2. Electronic volume control module; 21. First isolation unit; 22. Second isolation unit; 3. Audio output module; 31. Power amplifier unit; 32. Speaker; 100. Audio signal fidelity circuit; 200. Microphone amplifier. Detailed Implementation
[0031] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The described embodiments are only some embodiments of this application, not all embodiments.
[0032] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.
[0033] Example 1:
[0034] Please see the appendix Figures 1-2 The audio signal fidelity circuit of this application includes an audio signal processing module 1, an electronic volume control module 2, and an audio output module 3.
[0035] The audio signal processing module 1 has a first audio signal terminal MIC_OUT and a second audio signal terminal DACL. The first audio signal terminal MIC_OUT is for wired / wireless microphone signals. The second audio signal terminal DACL is for Bluetooth signals.
[0036] The electronic volume control module 2 includes an electronic volume control chip U3, a first isolation unit 21, and a second isolation unit 22. The first isolation unit 21 is connected between the first audio signal terminal MIC_OUT and the input terminal VIN1 of the electronic volume control chip U3, and the second isolation unit 22 is connected between the second audio signal terminal DACL and the input terminal VIN1 of the electronic volume control chip U3.
[0037] Specifically, the first isolation unit 21 includes a resistor R52 and a capacitor C19 connected in series. The second isolation unit 22 includes a resistor R58 and a capacitor C61 connected in series.
[0038] The input terminal of the audio output module 3 is connected to the output terminal of the electronic volume control module 2 to enable sound playback.
[0039] In this embodiment, the audio signal fidelity circuit 100 directly connects the first audio signal terminal MIC_OUT to the electronic volume control chip U3, eliminating the need for the first audio signal terminal MIC_OUT to be connected to the Bluetooth chip. This effectively prevents the audio signal from undergoing internal conversion and modulation when passing through the Bluetooth chip, avoiding signal compression and loss, and ensuring high sound fidelity. Furthermore, the wired / wireless microphone signal and the Bluetooth signal are separated by the first isolation unit 21 and the second isolation unit 22, resulting in minimal signal attenuation when both signals enter the electronic volume control chip U3. This design avoids severe signal compression and reduces signal attenuation, effectively improving sound fidelity, increasing product yield, and ensuring product quality.
[0040] In some embodiments, please refer to the appendix. Figures 3-4The audio signal processing module 1 includes a Bluetooth signal processing module, a first signal processing module 11, and a second signal processing module 12. The output of the Bluetooth signal processing module is connected to the second audio signal terminal DACL. The output of the first signal processing module 11 is connected to the input of the second signal processing module 12. The output of the second signal processing module 12 is connected to the first audio signal terminal MIC_OUT.
[0041] The first signal processing module 11 includes a wired signal terminal MIC1_IN, a first processing chip U6, and a first signal output terminal MIC_OUT2. The wired signal terminal MIC1_IN is connected to the input terminal P3 of the first processing chip U6, and the first signal output terminal MIC_OUT2 is connected to the output terminal P1 of the first processing chip U6.
[0042] The second signal processing module 12 includes a connector JP1 and a second processing chip U7. The connector JP1 is provided with a wireless signal output pin JP1-6, which is connected to the input terminal P8 of the second processing chip U7. The first signal output terminal MIC_OUT2 is connected to the input terminal P9 of the second processing chip U7, and the output terminal P6 of the second processing chip U7 is connected to the first audio signal terminal MIC_OUT.
[0043] In this embodiment, the audio signal processing module 1 transmits the wired signal to the first processing chip U6 via the wired signal terminal MIC1_IN, performing preliminary processing on the wired signal to ensure that some signal attenuation to ground maintains signal integrity. Next, the processed wired signal output from the first processing chip U6 is transmitted to the second processing chip U7 via the first signal output terminal MIC_OUT2 for secondary processing. This further amplifies, feeds back, and divides the wired signal, outputting it from the first audio signal terminal MIC_OUT. After the wired signal processing is complete, it is directly sent to the electronic volume control module 2.
[0044] At the same time, the wireless signal is transmitted to the second processing chip U7 via connector JP1, which amplifies, feeds back, and divides the wireless signal, and outputs it from the first audio signal terminal MIC_OUT. Thus, the wired and wireless microphone signals coexist, which can effectively reduce the difference in sound quality between the wireless and wired microphone signals and ensure good sound quality. In addition, it can also avoid the phenomenon of severe signal attenuation and effectively ensure the stability of signal output.
[0045] Example 2:
[0046] The difference between this embodiment and Embodiment 1 is that, please refer to... Figure 5The first signal processing module 11 in this embodiment also includes a first anti-distortion unit 111, which is connected between the first processing chip U6 and the wired signal terminal MIC1_IN and is grounded.
[0047] Please see Figure 6 The second signal processing module 12 also includes a second anti-distortion unit 121, which is connected between the wireless signal output pin JP1-6 and the second processing chip U7 and is grounded.
[0048] In this embodiment, the first anti-distortion unit 111 and the second anti-distortion unit 121 can provide a reference voltage of approximately 2.1V. Their appropriate bias voltage ensures that the operational amplifier or other amplifiers operate within their linear operating region, so that the signal is not clipped or saturated, effectively avoiding distortion.
[0049] In some embodiments, see Figure 7 The audio output module 3 includes a power amplifier unit 31 and a speaker 32. The input terminal of the power amplifier unit 31 is connected to the output terminal of the electronic volume control module 2, and the output terminal of the power amplifier unit 31 is connected to the speaker 32. This ensures stable sound transmission and good sound quality.
[0050] Example 3:
[0051] This embodiment is based on the above embodiment; please refer to [link / reference]. Figure 8 A microphone amplifier 200 is provided, including the aforementioned audio signal fidelity circuit 100.
[0052] The microphone amplifier 200 in this embodiment, by employing the aforementioned audio signal fidelity circuit 100, avoids severe compression of the audio signal, resulting in very low sound attenuation, high sound fidelity, and excellent sound quality. This effectively improves the production yield of the microphone amplifier 200 and ensures the production quality of the microphone amplifier 200.
[0053] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.
[0054] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0055] Furthermore, terms such as "horizontal," "vertical," and "sag" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal relative to "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0056] In this application, unless otherwise expressly specified and limited, "above or below" a first feature may include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on" a first feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" a first feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0057] Although the description of this application has been made in conjunction with the specific embodiments described above, it is obvious to those skilled in the art that many substitutions, modifications, and variations can be made based on the above description. Therefore, all such substitutions, modifications, and variations are included within the spirit and scope of the appended claims.
Claims
1. An audio signal fidelity circuit, characterized by, The audio signal processing module is provided with a first audio signal end MIC_OUT and a second audio signal end DACL. The electronic volume control module comprises an electronic volume control chip U3, a first isolation unit and a second isolation unit. The audio output module is connected with the output end of the electronic volume control module. The first isolation unit comprises a resistor R52 and a capacitor C19 connected in series.
2. The audio signal fidelity circuit of claim 1, wherein, The second isolation unit comprises a resistor R58 and a capacitor C61 connected in series.
3. The audio signal fidelity circuit of claim 1, wherein, The audio signal processing module comprises a Bluetooth signal processing module, a first signal processing module and a second signal processing module.
4. The audio signal fidelity circuit of claim 1, wherein, The first signal processing module comprises a wired signal end MIC1_IN, a first processing chip U6 and a first signal output end MIC_OUT2.
5. The audio signal fidelity circuit of claim 4, wherein, The second signal processing module comprises a connector JP1 and a second processing chip U7.
6. The audio signal fidelity circuit of claim 5, wherein, The first signal processing module further comprises a first anti-distortion unit connected between the first processing chip U6 and the wired signal end MIC1_IN and grounded.
7. The audio signal fidelity circuit of claim 5, wherein, The second signal processing module further comprises a second anti-distortion unit connected between the wireless signal output pin JP1-6 and the second processing chip U7 and grounded.
8. The audio signal fidelity circuit of claim 6, wherein, The audio output module comprises a power amplifier unit and a loudspeaker.
9. The audio signal fidelity circuit of claim 1, wherein, The audio signal fidelity circuit comprises the audio signal fidelity circuit according to any one of claims 1-9.
10. A microphone loudspeaker characterized by