High-precision pneumatic switch sensor based on MEMS thermal principle

Abstract

The utility model discloses a high-precision pneumatic switch sensor based on an MEMS thermal principle, which relates to the technical field of thermal pneumatic switch sensing and comprises a signal sensing unit, a signal processing unit, a shell component and a power management unit. The signal sensing unit is connected with the information processing unit and the power supply unit; the signal sensing unit is used for outputting a voltage signal by the thermal conductive chip caused by gas flow; the signal processing unit is used for amplifying a voltage signal output by the thermal conductive chip of the signal induction unit and carrying out algorithm processing to obtain gas flow information; the power supply management unit provides a power supply for the signal induction unit and the signal processing unit; the shell component is used for placing and fixing the signal induction unit, the signal processing unit and the power management unit circuit board. The sensor has the advantages of being capable of providing accurate measurement under the conditions of pulsating flow and low flow, high in sensitivity, extremely low in failure rate, low in cost and simple in structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to hot type pneumatic switch sensing technical field especially based on MEMS hot type principle high accuracy pneumatic switch sensor. BACKGROUND

[0002] Because the current market measures gas flow mainly to adopt the principle of turbine or rotor plus hall switch, there is the risk of jamming and low flow sensitivity difference and many problems such as insufficient problem. SUMMARY

[0003] The utility model discloses at least solve one of the technical problems existing in the prior art, and for this purpose, the utility model embodiment proposes based on MEMS hot type principle high accuracy pneumatic switch sensor, and the gas flow sensor based on the hot type principle solves these insufficient while having the advantages such as low cost, long service life, simple structure.

[0004] According to the embodiment of the utility model first aspect proposes a kind of based on MEMS hot type principle high accuracy pneumatic switch sensor, comprising: signal sensing unit, signal processing unit, shell component, power management unit;The signal sensing unit is connected with the signal processing unit;

[0005] The signal sensing unit includes heat conduction chip and signal sensing unit peripheral circuit, and the signal sensing unit is used to heat conduction chip output voltage signal caused by gas flow;

[0006] The signal processing unit includes micro-processing control chip and signal processing unit peripheral circuit, and the signal processing unit amplifies and obtains gas flow information after algorithm processing to the signal sensing unit heat conduction chip output voltage signal;

[0007] The power management unit includes power management chip and power management unit peripheral circuit, and the power management unit is connected with the signal sensing unit, signal processing unit, provides power supply for the signal sensing unit, signal processing unit;

[0008] The shell component is used to place and fix signal sensing unit, signal processing unit, power management unit circuit board.

[0009] Further, the signal sensing unit heat conduction chip includes heater and thermocouple;The power management unit includes power output VHT end, power input VIN end, the heater 6th pin HTR2 end is grounded, the heater 3rd pin HTR1 end is connected with the one end of 5th resistance, and the other end of 5th resistance is connected with power management unit output VHT end.

[0010] Further, the signal sensing unit thermocouple is two; the signal sensing unit first thermocouple first pin is connected with the signal processing unit microprocessor control chip fourth pin SIP end, the signal sensing unit first thermocouple second pin is connected with the third resistance, the fourth resistance, the seventh capacitor, the signal sensing unit second thermocouple fourth pin in parallel; the other end of the seventh capacitor is grounded; the other end of the third resistance is connected with the signal processing unit microcontroller chip fifth pin SVDD end; the other end of the fourth resistance is connected with the signal processing unit microcontroller chip third pin SVSS end; the signal sensing unit second thermocouple fifth pin is connected with the signal processing unit microcontroller chip sixth pin SIN end.

[0011] Further, the signal processing unit microprocessor chip seventh pin IC end, second pin VSS end, fifteenth pin EPAD end are connected with ground in parallel; the signal processing unit microprocessor chip second pin VSS end is connected with the sixth capacitor one end, and the other end of the sixth capacitor is connected with the power management unit output VHT end, the signal processing unit microprocessor chip first pin VDD end in parallel; the signal processing unit microprocessor chip third pin SVSS end is connected with the eighth capacitor one end, the ninth capacitor one end in parallel; the other end of the eighth capacitor is connected with the signal processing unit microprocessor chip fourth pin SIP end; the other end of the ninth capacitor is connected with the signal processing unit microprocessor chip sixth pin SIN end; the signal processing unit microprocessor chip fourth pin SIP end is connected with the fifth capacitor one end, and the other end of the fifth capacitor is connected with the signal processing unit microprocessor chip sixth pin SIN end; the signal processing unit microprocessor chip fourteenth pin AODO end is connected with the first interface socket third pin VOUT end; the signal processing unit microprocessor chip eleventh pin MISO / SDA end is connected with the second interface socket third pin SDA end; the signal processing unit microprocessor chip tenth pin SCK / SCL end is connected with the second interface socket second pin SCL end; the signal processing unit microprocessor chip ninth pin NCS / SAO end is connected with the second interface socket fourth pin GND end, the first interface socket J1 second pin GND end in parallel; the second interface socket J2 first pin is connected with the power management unit output VHT end; the first interface socket J1 first pin is connected with the power management unit VIN end, the second bidirectional voltage stabilizing diode one end, and the other end of the second bidirectional voltage stabilizing diode is grounded; the first bidirectional voltage stabilizing diode one end is connected with the first interface socket J1 third pin VOUT end, and the other end of the first bidirectional voltage stabilizing diode is grounded.

[0012] Further, the power management unit comprises a power management chip and peripheral circuits, the first pin IN of the power management chip is connected with the second pin of the negative electrode of the voltage stabilizing diode, the fifth pin OUT of the power management chip is connected with the power output end VHT, the power input end VIN is connected with the first pin of the positive electrode of the voltage stabilizing diode, one end of the first capacitor and one end of the second capacitor are connected in parallel with the negative electrode of the voltage stabilizing diode, the other end of the first capacitor and the other end of the second capacitor are connected in parallel with the second pin GND of the power management chip and are grounded; the fourth pin NC / FB of the power management chip is connected in parallel with one end of the second resistor and one end of the first resistor; the other end of the second resistor is grounded; the other end of the first resistor is connected in parallel with one end of the third capacitor, one end of the fourth capacitor and the power output VHT; the other end of the third capacitor and the other end of the fourth capacitor are connected in parallel and grounded.

[0013] Further, the shell component comprises two quick plug interfaces and a circuit board mounting component, the two quick plug interfaces are connected axially, and the circuit board mounting component is vertically arranged at the middle part of the two quick plug interfaces.

[0014] Further, the circuit board mounting component comprises a cover plate and a base, the base is vertically arranged on the two quick plug interfaces, the base is fastened with the cover plate, and the base is provided with a mounting portion, and the mounting portion of the base is connected with a signal sensing unit, a signal processing unit and a power management unit.

[0015] The utility model discloses another aspect based on MEMS thermal type high accuracy pneumatic switch sensing circuit board, including the signal sensing unit, signal processing unit, shell component, power management unit of based on MEMS thermal type high accuracy pneumatic switch sensor of the utility model first aspect proposed circuit.

[0016] The technical scheme provided by the embodiment of the utility model, based on MEMS technology development's thermal type high accuracy pneumatic switch sensor, has excellent sensitivity and response speed, can provide accurate measurement under the condition of pulsating flow and low flow. Because there is no movable part, the sensor detection part will not be stuck, and there will be no mechanical failure, and it is not necessary to disassemble when cleaning. Because there is no obstacle such as turbine, rotor in the flow path, the gas flow resistance is small, and it can be used in the circulating system driven by gravity and low-power pump. BRIEF DESCRIPTION OF DRAWINGS

[0017] The above and / or additional aspects and advantages of the utility model will become apparent and more readily appreciated from the following description of the embodiments, with reference to the following drawings, in which:

[0018] Figure 1 It is the principle diagram of signal sensing unit of thermal type high accuracy pneumatic switch sensor based on MEMS technology development of the utility model embodiment;

[0019] Figure 2The utility model discloses an embodiment of high precision pneumatic switch sensor based on MEMS thermal principle signal processing part principle diagram for the utility model embodiment,

[0020] Figure 3 The utility model discloses an embodiment of high precision pneumatic switch sensor based on MEMS thermal principle power management unit principle diagram for the utility model embodiment,

[0021] Figure 4 The utility model discloses an embodiment of high precision pneumatic switch sensor based on MEMS thermal principle principle diagram,

[0022] Figure 5 The utility model discloses an embodiment of high precision pneumatic switch sensor based on MEMS thermal principle MEMS shell part schematic view,

[0023] Figure 6 The utility model discloses an embodiment of high precision pneumatic switch sensor based on MEMS thermal principle shell part structure diagram,

[0024] The drawings show that: 2, the first quick interface, 4, the second quick interface, 1, the cover plate, 5, the cavity, 3, the mounting part, 6, the base. DETAILED DESCRIPTION

[0025] The embodiments of the utility model are described in detail below, and the examples of the embodiments are shown in the drawings, wherein the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the utility model and cannot be understood as limiting the utility model.

[0026] Reference Figures 1 to 5 The utility model discloses a high precision pneumatic switch sensor based on MEMS thermal principle, and the sensor disclosed in the embodiment is composed of shell parts and electronic circuits. The shell parts are used to place and fix the sensor circuit board, the cavity composed of the shell parts is an internal flow channel for rectification, and the outer part of the shell parts is respectively provided with two quick interfaces, gas flows into the sensor from the quick interface inlet, and then flows out of the sensor from the quick interface outlet after passing through the internal flow channel of the sensor.

[0027] The circuit of the high precision pneumatic switch sensor based on MEMS thermal principle mainly comprises a signal sensing part, a signal processing part and a power management unit. The signal sensing part circuit is used to detect the voltage signal between the two thermal conductive chips and the thermocouple caused by the gas flow. The signal processing part circuit amplifies the weak electric signal between the two thermocouples of the sensor thermal conductive chip and obtains the gas flow information after algorithm processing. The power management unit provides power supply for the signal sensing and signal processing units.

[0028] Referring to Figures 1 to 4 The MEMS thermal principle-based high-precision pneumatic switch sensor circuit part of the present embodiment is described as follows:

[0029] The sensor signal sensing part includes a thermal conduction chip and a peripheral circuit. The thermal conduction chip is composed of a heater and a thermocouple. According to the thermal principle, when the gas enters the sensor flow channel from the fast connector interface inlet, the heat carried away by the gas of different flow rates is different, resulting in a change in the voltage signal output by the thermocouple of the thermal conduction chip.

[0030] When a stable voltage is provided to the heater pin HTR1 of the thermocouple, the heater will heat the adiabatic base, and both thermocouples will produce a weak electromotive force change. When no gas flows through the sensor chip, the differential voltage between the two thermocouples is close to a fixed value; when the gas flows through the surface of the sensor chip, the heat carried away by the thermocouples before and after the gas medium passes through is different, and the output voltage signals of the two thermocouples are also different, so the differential voltage signal between them will change with the size of the gas flow.

[0031] In the present embodiment, the circuit connection relationship of the sensor signal sensing part is as follows:

[0032] The signal sensing unit thermal conduction chip includes a heater and a thermocouple, and the power management unit includes a power output VHT terminal and a power input VIN terminal. The 6th pin HTR2 of the heater is connected to ground, the 3rd pin HTR1 of the heater is connected to one end of the 5th resistor, and the other end of the 5th resistor is connected to the power management unit output VHT terminal.

[0033] In the present embodiment, the MEMS thermal conductivity chip model can be selected as F1PTFD21.

[0034] Referring to Figure 2 and Figure 4 The signal processing part of the present embodiment is described as follows. The signal processing part circuit mainly includes a microprocessor chip with a built-in multi-channel 16-bit ADC, referred to as MCU. It processes the differential voltage signal output by the thermocouple of the sensor through internal A / D conversion, signal amplification, filtering, and other functions, converts the analog differential voltage signal into a 16-bit digital signal, then calculates the target flow value through an algorithm, and finally outputs the target flow value in the form of an analog voltage through a DAC.

[0035] In the present embodiment, the circuit connection relationship of the sensor signal sensing part, the information processing unit, and the power management unit is as follows:

[0036] The 7th pin IC end, the 2nd pin VSS end, the 15th pin EPAD end of the signal processing unit microprocessor chip are connected with the ground in parallel; the 2nd pin VSS end of the signal processing unit microprocessor chip is connected with one end of the 6th capacitor, and the other end of the 6th capacitor is connected with the output VHT end of the power management unit and the 1st pin VDD end of the signal processing unit microprocessor chip in parallel; the 3rd pin SVSS end of the signal processing unit microprocessor chip is connected with one end of the 8th capacitor and one end of the 9th capacitor in parallel; the other end of the 8th capacitor is connected with the 4th pin SIP end of the signal processing unit microprocessor chip; the other end of the 9th capacitor is connected with the 6th pin SIN end of the signal processing unit microprocessor chip; one end of the 5th capacitor is connected with the 4th pin SIP end of the signal processing unit microprocessor chip, and the other end of the 5th capacitor is connected with the 6th pin SIN end of the signal processing unit microprocessor chip; the 14th pin AODO end of the signal processing unit microprocessor chip is connected with the 3rd pin VOUT end of the 1st interface socket; the 11th pin MISO / SDA end of the signal processing unit microprocessor chip is connected with the 3rd pin SDA end of the 2nd interface socket; the 10th pin SCK / SCL end of the signal processing unit microprocessor chip is connected with the 2nd pin SCL end of the 2nd interface socket; the 9th pin NCS / SAO end of the signal processing unit microprocessor chip is connected with the 4th pin GND end of the 2nd interface socket and the 2nd pin GND end of the 1st interface socket J1 in parallel; the 1st pin of the 2nd interface socket J2 is connected with the output VHT end of the power management unit; the 1st pin of the 1st interface socket J1 is connected with the VIN end of the power management unit and one end of the 2nd bidirectional voltage stabilizing diode, and the other end of the 2nd bidirectional voltage stabilizing diode is connected with the ground; one end of the 1st bidirectional voltage stabilizing diode is connected with the 3rd pin VOUT end of the 1st interface socket J1, and the other end of the 1st bidirectional voltage stabilizing diode is connected with the ground

[0037] The microprocessor chip model in the embodiment can be selected as: E703.11.

[0038] With reference to Figure 3 and Figure 4 , the embodiment describes the power management unit part, which includes a power chip, a power unit input end VIN and a power unit output end VHT. The power unit is used to provide power supply for the signal sensing unit and the signal processing unit.

[0039] The power management unit includes a power management chip and peripheral circuits, the first pin IN end of the power management chip is connected with the second pin of the negative electrode of the voltage stabilizing diode, the fifth pin OUT end of the power management chip is connected with the power output end VHT, the power input VIN end is connected with the first pin of the positive electrode of the voltage stabilizing diode, one end of the first capacitor and one end of the second capacitor are connected in parallel with the negative electrode of the voltage stabilizing diode, the other end of the first capacitor and the other end of the second capacitor are connected in parallel with the second pin GND end of the power management chip and grounded; the fourth pin NC / FB end of the power management chip is connected in parallel with one end of the second resistor and one end of the first resistor; the other end of the second resistor is grounded; the other end of the first resistor is connected in parallel with one end of the third capacitor, one end of the fourth capacitor and the power output VHT; the other end of the third capacitor and the other end of the fourth capacitor are connected in parallel and grounded.

[0040] After being processed by the microprocessor chip of the signal processing unit, the analog signal output by the signal sensing unit is converted into a data signal, and software filtering, digital gain adjustment, calibration and other processing are performed, and finally the information is sent to the upper computer through IIC communication. In the embodiment, a first interface socket J1 is provided for the upper computer to call.

[0041] In the embodiment, the microcontroller model can be selected as: E703.11.

[0042] Referring to Figure 4 and Figure 6 , the power supply part is exemplified, wherein VIN is the input power supply, VHT is the output power supply of the power management unit, which provides the power supply voltage for the microprocessor chip and the ADC sampling bias voltage; GND is the common ground part.

[0043] The power management unit includes a power management chip and peripheral circuits, the first pin IN end of the power management chip is connected with the second pin of the negative electrode of the voltage stabilizing diode, the fifth pin OUT end of the power management chip is connected with the power output end VHT, the power input VIN end is connected with the first pin of the positive electrode of the voltage stabilizing diode, one end of the first capacitor and one end of the second capacitor are connected in parallel with the negative electrode of the voltage stabilizing diode, the other end of the first capacitor and the other end of the second capacitor are connected in parallel with the second pin GND end of the power management chip and grounded; the fourth pin NC / FB end of the power management chip is connected in parallel with one end of the second resistor and one end of the first resistor; the other end of the second resistor is grounded; the other end of the first resistor is connected in parallel with one end of the third capacitor, one end of the fourth capacitor and the power output VHT; the other end of the third capacitor and the other end of the fourth capacitor are connected in parallel and grounded.

[0044] In the embodiment, the power control chip can be selected as TC1055-3.3.

[0045] In this embodiment, the sensor housing is described. The housing component includes two quick-connect interfaces, namely a first quick-connect interface 2 and a second quick-connect interface 4, and a circuit board mounting component. The first quick-connect interface 2 and the second quick-connect interface 4 are axially connected, and the circuit board mounting component is vertically disposed in the middle of the two quick-connect interfaces. The circuit board mounting component includes a cover plate 1 and a base 6. The base is vertically disposed on the two quick-connect interfaces; the base 6 is fastened to the cover plate 1, for example, by means of a snap-fit ​​fastening. The base has a mounting part 3, which is connected to the circuit boards of the signal sensing unit, the signal processing unit, and the power management unit. The mounting part 3 can be provided with mounting posts or studs for fastening the sensor circuit board. The quick-connect interfaces of the housing component are designed as hollow cylinders, and the cavity 5 of the circuit board mounting component forms an internal airflow channel. The two quick-connect interfaces of the housing component and the base of the circuit board mounting component can be integrally molded by injection molding.

[0046] This embodiment also proposes a circuit board based on a MEMS thermal high-precision pneumatic switch sensor, on which the circuit consisting of the aforementioned MEMS thermal high-precision pneumatic switch sensor signal sensing unit, signal processing unit, housing component, and power management unit is printed.

[0047] Based on the above scheme, the MEMS thermal high-precision pneumatic switch sensor can be used as a pneumatic switch in products such as oxygen generators, ventilators, and nebulizers. Compared with pneumatic switches based on other principles, this scheme has the advantages of high sensitivity, extremely low failure rate, low cost, and simple structure.

[0048] The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings. However, the present utility model is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present utility model.

[0049] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0050] In the description of the present specification, the description referring to the terms "one embodiment", "some embodiments", "exemplary embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the exemplary description of the above terms does not necessarily mean the same embodiment or example. Furthermore, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0051] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made thereto without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A high-precision pneumatic switch sensor based on the MEMS thermal principle, characterized in that, The utility model relates to a kind of gas flow sensor, including: Signal sensing unit, signal processing unit, shell component, power management unit; The signal sensing unit is connected with the signal processing unit; The signal sensing unit includes heat conduction chip, and the signal sensing unit is used to heat conduction chip output voltage signal caused by gas flow; The signal processing unit includes microprocessor control chip, and the signal processing unit amplifies and obtains gas flow information after algorithm processing by the signal sensing unit heat conduction chip output voltage signal; The power management unit includes power management chip, and the power management unit is connected with the signal sensing unit, signal processing unit, provides power supply for the signal sensing unit, signal processing unit; The shell component is used to place and fix signal sensing unit, signal processing unit, power management unit circuit board.

2. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 1, characterized in that, The signal sensing unit heat conduction chip includes heater and thermocouple;The power management unit includes power output VHT end, power input VIN end, the heater 6th pin HTR2 end is grounded, the heater 3rd pin HTR1 end is connected with the one end of 5th resistance, and the other end of 5th resistance is connected with power management unit output VHT end.

3. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 2, characterized in that, The signal sensing unit thermocouple is two;The signal sensing unit first thermocouple 1st pin is connected with the signal processing unit microprocessor control chip 4th pin SIP end, and the signal sensing unit first thermocouple 2nd pin is connected with 3rd resistance, 4th resistance, 7th capacitor, signal sensing unit second thermocouple 4th pin in parallel;7th capacitor other end is grounded;3rd resistance other end is connected with the signal processing unit microcontroller chip 5th pin SVDD end;4th resistance other end is connected with the signal processing unit microcontroller chip 3rd pin SVSS end;The signal sensing unit second thermocouple 5th pin is connected with the signal processing unit microcontroller chip 6th pin SIN end.

4. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 1, wherein, The signal processing unit microprocessor chip 7th pin IC end, 2nd pin VSS end, 15th pin EPAD end are connected with ground in parallel; the signal processing unit microprocessor chip 2nd pin VSS end is connected with one end of the 6th capacitor, the other end of the 6th capacitor is connected with power management unit output VHT end, signal processing unit microprocessor chip 1st pin VDD end in parallel; signal processing unit microprocessor chip 3rd pin SVSS end is connected with one end of the 8th capacitor and one end of the 9th capacitor in parallel; the other end of the 8th capacitor is connected with signal processing unit microprocessor chip 4th pin SIP end; the other end of the 9th capacitor is connected with signal processing unit microprocessor chip 6th pin SIN end; signal processing unit microprocessor chip 4th pin SIP end is connected with one end of the 5th capacitor, the other end of the 5th capacitor is connected with signal processing unit microprocessor chip 6th pin SIN end; signal processing unit microprocessor chip 14th pin AODO end is connected with 1st interface socket 3rd pin VOUT end; signal processing unit microprocessor chip 11th pin MISO / SDA end is connected with 2nd interface socket 3rd pin SDA end; signal processing unit microprocessor chip 10th pin SCK / SCL end is connected with 2nd interface socket 2nd pin SCL end; signal processing unit microprocessor chip 9th pin NCS / SAO end is connected with 2nd interface socket 4th pin GND end, 1st interface socket J1 2nd pin GND end in parallel with ground; 2nd interface socket J2 1st pin is connected with power management unit output VHT end; 1st interface socket J1 1st pin is connected with power management unit VIN end and one end of the 2nd bidirectional voltage stabilizing diode, the other end of the 2nd bidirectional voltage stabilizing diode is connected with ground; one end of the 1st bidirectional voltage stabilizing diode is connected with 1st interface socket J1 3rd pin VOUT end, the other end of the 1st bidirectional voltage stabilizing diode is connected with ground.

5. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 1, wherein, The power management unit includes a power management chip and a power management unit peripheral circuit, the power management chip 1st pin IN end is connected with the 2nd pin of the negative electrode of the voltage stabilizing diode, the power management chip 5th pin OUT end is connected with the power output end VHT, the power input VIN end is connected with the 1st pin of the positive electrode of the voltage stabilizing diode, one end of the 1st capacitor and one end of the 2nd capacitor are connected with the negative electrode of the voltage stabilizing diode in parallel, the other end of the 1st capacitor and the other end of the 2nd capacitor are connected with the 2nd pin GND end of the power management chip in parallel with ground; the 4th pin NC / FB end of the power management chip is connected with one end of the 2nd resistor and one end of the 1st resistor in parallel; the other end of the 2nd resistor is connected with ground; the other end of the 1st resistor is connected with one end of the 3rd capacitor, one end of the 4th capacitor and the power output VHT in parallel; the other end of the 3rd capacitor and the other end of the 4th capacitor are connected with ground in parallel.

6. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 1, wherein, The shell component includes a 1st quick plug interface, a 2nd quick plug interface and a circuit board mounting component, the two quick plug interfaces are connected axially, and the circuit board mounting component is vertically arranged in the middle of the two quick plug interfaces.

7. The MEMS thermal principle based high precision aerodynamic switch sensor according to claim 6, characterized in that, The circuit board mounting component comprises a cover plate and a base, the base is vertically arranged on the two quick plug interfaces; the base is fastened with the cover plate, the base is provided with a mounting portion, and the base mounting portion is connected with a signal sensing unit, a signal processing unit and a power management unit circuit board.

8. A high-precision MEMS thermal principle-based pneumatic switch sensor circuit board, characterized in that, The sensor is the sensor as claimed in any one of claims 1 to 5, and the circuit board is composed of circuits of a signal sensing unit, a signal processing unit, a housing component and a power management unit of the sensor.

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