A dual-mode micro ice maker based on tec

Abstract

The utility model relates to a kind of dual-mode micro ice maker based on TEC, shell and ice making component, further include ice making basket and lifting device, the ice making component includes semiconductor refrigerating sheet, shaped ice tray, radiating fin and radiating fan, the radiating fin and shaped ice tray are respectively arranged on semiconductor refrigerating sheet upper and lower sides, radiating fan is located above radiating fin, the ice making basket is located below shaped ice tray, and lifting device is connected with ice making component, drives ice making component to move up and down, so that shaped ice tray is inserted or leaves ice making basket.The design is based on a kind of dual-mode micro semiconductor ice maker of semiconductor refrigerating sheet design, the device refrigeration is realized through semiconductor refrigerating sheet, make up the problem of bulky, noisy in the market existing micro ice maker, realize extremely small volume (0.005m 3 ) high efficiency ice making, single ice output 40g.

Description

Technical Field

[0001] This utility model relates to the field of ice-making equipment technology, specifically to a dual-mode micro ice-making device based on TEC. Background Technology

[0002] Currently, most mini ice makers on the market use traditional compressor technology, which has problems such as large size, heavy weight, and high noise. For example, CN216814705U uses traditional refrigeration equipment such as compressors and can only make ice, which cannot meet the demand for rapid cooling water. Traditional mini ice makers generally rely on compressor refrigeration systems. Their mechanical structure results in large equipment size (typical thickness > 200mm), significant operating noise (45-55dB range), and functions are limited to a single ice-making scenario, making it difficult to meet the combined needs of modern families for compact, quiet equipment and instant cold water preparation. Utility Model Content

[0003] The purpose of this invention is to overcome the above-mentioned technical problems and provide a dual-mode micro ice maker that uses a semiconductor thermoelectric refrigeration module for cooling and can both cool water and make ice.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a dual-mode micro ice-making device based on TEC, comprising a housing and an ice-making component, further including an ice-making basket and a lifting device. The ice-making component includes a semiconductor cooling chip, a forming ice tray, heat dissipation fins, and a heat dissipation fan. The heat dissipation fins and the forming ice tray are respectively disposed on the upper and lower sides of the semiconductor cooling chip. The heat dissipation fan is located above the heat dissipation fins. The ice-making basket is located below the forming ice tray. The lifting device is connected to the ice-making component, driving the ice-making component to move up and down, so that the forming ice tray extends into or leaves the ice-making basket.

[0005] Furthermore, thermally conductive silicone grease is applied between the molded ice plate and the cold end of the semiconductor cooling chip, and between the heat dissipation fins and the hot end of the semiconductor cooling chip.

[0006] Furthermore, the ice-making basket includes a drawer and an ice tray, with the ice tray placed inside the drawer.

[0007] Furthermore, the ice tank is made of silicone.

[0008] Furthermore, the molded ice tray includes an ice-making plate and an ice-making head. The ice-making plate is in close contact with the semiconductor cooling chip, and the ice-making head is fixed to the bottom of the ice-making plate and extends into the ice tank.

[0009] Furthermore, the lifting device includes a lifting handle and a guide shaft. The housing is provided with a strip-shaped through hole. The lifting handle passes through the strip-shaped through hole and is fixed on the heat dissipation fins. The guide shaft is located inside the housing. The heat dissipation fins are provided with through holes corresponding to the guide shaft. The guide shaft passes through the through holes.

[0010] Furthermore, the lifting handle is provided with a locking hook, which is elastically hinged to the lifting handle, and the housing is provided with a locking hole corresponding to the locking hook, into which the locking hook can extend.

[0011] The beneficial effects of this invention are as follows: This invention uses a semiconductor thermoelectric refrigeration module to replace the mechanical compressor, and integrates a semiconductor refrigeration chip with a high-efficiency air-cooling system with a thickness of only 4mm, thereby reducing the overall volume of the machine to 0.01m². 3 Below, the operating noise is reduced to a silent level of 30-33dB. Building upon this, a dual-mode function is added: in chilled water mode, the ice tray rapidly cools the water in 10 minutes, lowering the temperature from 25℃ to 7±2℃, making it drinkable; in ice-making mode, it continuously cools for 20 minutes to produce complete ice granules, with a single ice production weight of up to 40g. This dual-mode micro-semiconductor ice-making device fundamentally solves the inherent defects of traditional equipment, such as bulkiness, noise, and limited functionality. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the longitudinal section structure of a dual-mode micro ice-making device based on TEC according to this utility model;

[0013] Figure 2 This is a schematic diagram of the ice-making component of a dual-mode micro ice-making device based on TEC according to this utility model;

[0014] Figure 3 This is a schematic diagram of the ice-making basket of a dual-mode micro ice-making device based on TEC according to this utility model;

[0015] Figure 4 This is a schematic diagram of the longitudinal section structure of a dual-mode micro ice-making device based on TEC according to this utility model;

[0016] Figure 5 This is a schematic diagram of the lifting handle of a dual-mode micro ice-making device based on TEC according to this utility model.

[0017] 1. Housing; 2. Ice-making assembly; 3. Ice basket; 4. Lifting device; 5. Semiconductor cooling chip; 6. Ice tray; 7. Heat dissipation fins; 8. Cooling fan; 9. Drawer; 10. Ice tray; 11. Ice-making plate; 12. Ice-making head; 13. Lifting handle; 14. Guide rail shaft; 15. Strip-shaped through hole; 16. Locking hook; 17. Lock hole. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0019] Embodiments of this utility model: such as Figure 1-5 As shown, a dual-mode micro ice-making device based on TEC includes a housing 1 and an ice-making component 2, as well as an ice-making basket 3 and a lifting device 4. The ice-making component 2 includes a semiconductor cooling chip 5, a forming ice tray 6, heat dissipation fins 7, and a cooling fan 8. The heat dissipation fins 7 and the forming ice tray 6 are respectively disposed on the upper and lower sides of the semiconductor cooling chip 5. The cooling fan 8 is located above the heat dissipation fins 7. The ice-making basket 3 is located below the forming ice tray 6, and the lifting device 4 is connected to the ice-making component 2, driving the ice-making component 2 to move up and down, so that the forming ice tray 6 extends into or leaves the ice-making basket 3.

[0020] Thermal grease is applied between the molded ice plate 6 and the cold end of the semiconductor cooling chip 5, and between the heat dissipation fins 7 and the hot end of the semiconductor cooling chip 5.

[0021] It is worth noting that the thermoelectric cooler 5 is only 4mm thick. The side wall of the housing 1 has heat dissipation mesh holes, which surround the cooling fan 8.

[0022] In the above structure, the ice tray 6 is used to lower the temperature in the ice basket 3 so that the water freezes into ice; the heat dissipation fins 7 and the heat dissipation fan 8 provide sufficient heat dissipation to the hot end of the semiconductor cooling chip 5; applying thermal grease can effectively conduct heat and reduce the interface thermal resistance.

[0023] Through the above structure, by energizing the semiconductor cooling chip 5, its cold end temperature is lower than its hot end temperature, so as to absorb the heat of the formed ice plate 6, and then absorb the heat of the water to achieve cooling. This utility model has a dual-mode function: in the cooling water mode, the formed ice plate 6 quickly cools down the water temperature from 25℃ to 7±2℃ within 10 minutes, making it drinkable cold water; in the ice-making mode, it continuously cools down for 20 minutes to generate complete ice particles, with a single ice-making weight of up to 40g.

[0024] like Figure 3 As shown, the ice basket 3 includes a drawer 9 and an ice tray 10, with the ice tray 10 placed inside the drawer 9.

[0025] The ice tank 10 is made of silicone.

[0026] It is worth noting that drawer 9 has pull-out rails on both sides, making it easy to pull out drawer 9.

[0027] The above structure allows for easy disassembly and cleaning.

[0028] like Figure 2 As shown, the molded ice tray 6 includes an ice-making plate 11 and an ice-making head 12. The ice-making plate 11 is in close contact with the semiconductor cooling chip 5, and the ice-making head 12 is fixed to the bottom of the ice-making plate 11 and extends into the ice trough 10.

[0029] like Figure 1 , 4 As shown, the lifting device 4 includes a lifting handle 13 and a guide shaft 14. The housing 1 is provided with a strip-shaped through hole 15. The lifting handle 13 passes through the strip-shaped through hole 15 and is fixed on the heat dissipation fins 7. The guide shaft 14 is located inside the housing 1. The heat dissipation fins 7 are provided with through holes corresponding to the guide shaft 14. The guide shaft 14 passes through the through holes.

[0030] like Figure 4 , 5 As shown, the lifting handle 13 is provided with a locking hook 16, which is elastically hinged to the lifting handle 13. The housing 1 is provided with a locking hole 17 corresponding to the locking hook 16, and the locking hook 16 can be inserted into the locking hole 17.

[0031] like Figure 4 As shown, it is worth noting that the lifting handle 13 has a groove corresponding to the locking hook 16. A hinge shaft is provided in the groove and is hinged to the locking hook 16 through the hinge shaft. A return spring is provided at the bottom of the locking hook 16 and is connected to the inner wall of the groove. When the spring is in its natural state, the locking hook 16 can be inserted into the lock hole 17 to hook it. Pressing the bottom end of the locking hook 16 will make it rotate, which will allow the locking hook 16 to leave the lock hole 17, thereby facilitating the up and down movement of the lifting handle 13.

[0032] With the above structure, when ice is needed, the user presses the bottom of the locking hook 16 to unlock it, and then pulls the handle 13 to move the ice-making component 2 down, so that the ice-making head 12 is immersed in the ice tank 10 to make ice. After the ice is made, the user pulls the handle 13 to move the ice-making component 2 up away from the ice tank 10, and fixes it to the casing with the locking hook 16. The drawer 9 can be pulled out to retrieve ice.

[0033] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

[0035] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A dual-mode micro ice-making device based on TEC, comprising a housing (1) and an ice-making assembly (2), characterized in that: It also includes an ice-making basket (3) and a lifting device (4). The ice-making assembly (2) includes a semiconductor cooling chip (5), a forming ice tray (6), heat dissipation fins (7) and a cooling fan (8). The heat dissipation fins (7) and the forming ice tray (6) are respectively arranged on the upper and lower sides of the semiconductor cooling chip (5). The cooling fan (8) is located above the heat dissipation fins (7). The ice-making basket (3) is located below the forming ice tray (6). The lifting device (4) is connected to the ice-making assembly (2) and drives the ice-making assembly (2) to move up and down, so that the forming ice tray (6) extends into or leaves the ice-making basket (3).

2. The dual-mode micro ice-making device based on TEC according to claim 1, characterized in that: Thermal grease is applied between the molded ice plate (6) and the cold end of the semiconductor cooling chip (5), and between the heat dissipation fins (7) and the hot end of the semiconductor cooling chip (5).

3. The dual-mode micro ice-making device based on TEC according to claim 1, characterized in that: The ice basket (3) includes a drawer (9) and an ice tray (10), with the ice tray (10) placed inside the drawer (9).

4. A dual-mode micro ice-making device based on TEC according to claim 3, characterized in that: The ice tank (10) is made of silicone.

5. A dual-mode micro ice-making device based on TEC according to claim 1, characterized in that: The molded ice tray (6) includes an ice-making plate (11) and an ice-making head (12). The ice-making plate (11) is in close contact with the semiconductor cooling chip (5), and the ice-making head (12) is fixed to the bottom of the ice-making plate (11) and extends into the ice trough (10).

6. The dual-mode micro ice-making device based on TEC according to claim 1, characterized in that: The lifting device (4) includes a lifting handle (13) and a guide shaft (14). The housing (1) is provided with a strip-shaped through hole (15). The lifting handle (13) passes through the strip-shaped through hole (15) and is fixed on the heat dissipation fins (7). The guide shaft (14) is located inside the housing (1). The heat dissipation fins (7) are provided with through holes corresponding to the guide shaft (14). The guide shaft (14) passes through the through holes.

7. A dual-mode micro ice-making device based on TEC according to claim 6, characterized in that: The lifting handle (13) is provided with a locking hook (16), which is elastically hinged to the lifting handle (13). The housing (1) is provided with a locking hole (17) corresponding to the locking hook (16), and the locking hook (16) can be inserted into the locking hole (17).

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