A communication management apparatus

Abstract

This utility model relates to the field of communication device technology, specifically a communication management device, including a device body. The device body includes an upper shell, a lower shell, and a communication management working unit, which is located between the upper and lower shells. The upper and lower shells are detachably connected. A vibration-damping mounting platform is provided on the lower shell. The communication management working unit includes a CMU motherboard, a battery, and a wireless data transmission module. The CMU motherboard and the battery are both mounted on the vibration-damping mounting platform. The battery supplies power to the CMU motherboard and the wireless data transmission module. The wireless data transmission module is located outside the CMU motherboard and is connected to the CMU motherboard via signal. By implementing vibration-damping design on the core components of the existing communication management device, the impact of complex vibration conditions such as vehicle-mounted and airborne applications is reduced, making it more suitable for military communication scenarios.

Description

Technical Field

[0001] This utility model relates to the field of communication device technology, specifically a communication management device. Background Technology

[0002] Communication management devices are often the core component of the measurement and control platform. They mainly undertake corresponding communication management tasks and generally have functions such as wireless communication, data storage, and power management in actual use.

[0003] Chinese Patent No. CN216700846U discloses a communication management device with dustproof function, which adds a dustproof structure to the existing communication management device structure to improve its dustproof function. Meanwhile, Chinese Patent No. CN219834564U discloses a communication management device for dispatch room, which sets up a lifting plate and other structures based on the specific use scenario so that it can be placed stably in the dispatch room.

[0004] In addition to the scenarios mentioned above, communication management devices also have a wide range of applications in military communication scenarios. In these scenarios, they need to operate stably in harsh field environments for a long time to ensure mission execution. Such harsh field environments often involve frequent complex vibration conditions such as vehicle-mounted and airborne operations. The above-mentioned communication management devices are obviously unsuitable due to their wide range of vibration frequencies and large impact loads. Utility Model Content

[0005] The purpose of this utility model is to provide a communication management device to address the problems mentioned above.

[0006] The technical solution adopted by this utility model is as follows: a communication management device, including a device body, the device body including an upper shell, a lower shell and a communication management working part, the communication management working part being disposed between the upper shell and the lower shell, wherein the upper shell and the lower shell are detachably connected, a vibration damping mounting platform is provided on the lower shell, and the communication management working part including a CMU motherboard, a battery and a wireless data transmission module;

[0007] The CMU motherboard and battery are both mounted on a vibration-damping mounting platform;

[0008] The battery powers the CMU motherboard and the wireless data transmission module.

[0009] The wireless data transmission module is located outside the CMU motherboard and is connected to the CMU motherboard signal.

[0010] Furthermore, the upper and lower shells are rectangular in shape and have rounded edges at the four corners, allowing the upper shell to cover the lower shell.

[0011] Furthermore, the arc edge is provided with an arc edging, and both the upper and lower surfaces of the arc edging are provided with vibration damping pads.

[0012] Furthermore, the vibration damping mounting platform includes a vibration damping disc base, a first protrusion, a second protrusion, and a third protrusion;

[0013] The first protrusion, the second protrusion, and the third protrusion are all mounted on the vibration damping disc base;

[0014] The third protrusion is located between the first protrusion and the second protrusion, and the height of the third protrusion is lower than the height of the first protrusion and the height of the second protrusion.

[0015] Furthermore, the CMU motherboard is mounted on the first protrusion, and the battery is fixed on the second protrusion.

[0016] Furthermore, the CMU motherboard is equipped with a processor, an Ethernet controller, a communication interface chip, a CAN-FD transceiver, a USB conversion chip, and an audio output module.

[0017] The processor is connected to the Ethernet controller, communication interface chip, CAN-FD transceiver, USB conversion chip and audio output module.

[0018] The Ethernet controller is used to transmit data input from the Ethernet network to the processor and output data fed back from the processor to the Ethernet network.

[0019] The communication interface chip is used to transmit data input via the RS232 serial interface to the processor and output data fed back by the processor to the RS232 serial interface;

[0020] The CAN-FD transceiver is used to transmit data input via the CAN bus to the processor and output data fed back by the processor to the CAN bus.

[0021] The USB conversion chip is used to transmit input data from the wireless data transmission module to the processor and output data fed back from the processor to the wireless data transmission module.

[0022] The audio output module is used to transmit the data output by the processor to the speaker.

[0023] Furthermore, the processor is model FT-2000 / 4, the Ethernet controller is model WX1860AL2, the communication interface chip is model RM2232DCP16M, the CAN-FD transceiver is model RM2552AP8M, and the USB conversion chip is model CH348Q.

[0024] Furthermore, the audio output module includes an audio amplifier, a digital audio SOC, and an audio codec;

[0025] The data output by the processor is processed by the digital audio SOC and the audio codec and then transmitted to the audio amplifier.

[0026] The audio amplifier receives data processed by the digital audio SOC and audio codec, and outputs it to the speaker.

[0027] Furthermore, the audio amplifier is model AIP8004, the digital audio SOC is model CJC6811A, and the audio codec is model TLV320AIC23.

[0028] Furthermore, an antenna slot is provided on the upper housing, and an antenna is installed in the antenna slot. The antenna is connected to the wireless data transmission module.

[0029] The beneficial effects of this utility model include at least one of the following;

[0030] 1. By setting up a vibration-damping mounting platform on the existing shell structure of the communication management device, the core components such as the CMU motherboard, battery, and wireless data transmission module are raised, thereby reducing the impact of complex vibration conditions such as vehicle-mounted and airborne applications, making it more suitable for military communication scenarios.

[0031] 2. The structure adopts rounded edges at the four corners and further rounded edges to reduce the chance of damage during transportation. On the other hand, by setting vibration damping pads on the rounded edges, the lower shell is raised to reduce the contact area with the ground and other vibrating surfaces, thus protecting the internal core components to a certain extent.

[0032] 3. In the selection of core component models, a large number of domestically produced components are used. While ensuring that the key indicators of operating temperature range and impact resistance meet the standards, the reliance on imported components in equipment manufacturing is reduced, making it more suitable for the field of military communications. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of a communication management device.

[0034] Figure 2 This is a schematic diagram of the bottom structure of a communication management device;

[0035] Figure 3 This is a schematic diagram of the internal structure of a communication management device;

[0036] Figure 4 This is a schematic diagram of the vibration damping disc base structure;

[0037] Figure 5 This is a hardware schematic diagram.

[0038] In the picture:

[0039] 1 is the upper housing, 2 is the antenna slot, 3 is the antenna, 4 is the vibration damping disc base, 5 is the handle, 6 is the CMU motherboard, 7 is the battery, 8 is the wireless data transmission module, 9 is the lower housing, 10 is the arc-shaped edge, 11 is the internal cavity, 12 is the first protrusion, 13 is the second protrusion, and 14 is the third protrusion. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can typically be arranged and designed in various different configurations.

[0041] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0042] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other.

[0043] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0044] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0045] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0046] like Figures 1 to 3 As shown, a communication management device includes a device body, which includes an upper housing 1, a lower housing 9, and a communication management working unit. The communication management working unit is located between the upper housing 1 and the lower housing 9, wherein the upper housing 1 and the lower housing 9 are detachably connected. A vibration damping mounting platform is provided on the lower housing 9. The communication management working unit includes a CMU motherboard 6, a battery 7, and a wireless data transmission module 8.

[0047] Both the CMU motherboard 6 and the battery 7 are mounted on the vibration damping mounting platform;

[0048] The battery 7 supplies power to the CMU motherboard 6 and the wireless data transmission module 8;

[0049] The wireless data transmission module 8 is located outside the CMU motherboard 6 and is connected to the CMU motherboard 6 via signal.

[0050] The purpose of this design is to raise the core components such as the CMU motherboard, battery, and wireless data transmission module by setting up a vibration-damping mounting platform on the existing shell structure of the communication management device, thereby reducing the impact of complex vibration conditions such as vehicle-mounted and airborne operations, making it more suitable for military communication scenarios.

[0051] In this embodiment, the upper shell 1 and the lower shell 9 are rectangular structures, and rounded edges are provided at the four corners. The upper shell 1 can cover the lower shell 9. The rounded edges are provided with rounded edging 10, and vibration damping pads are provided on both the upper and lower surfaces of the rounded edging 10.

[0052] The purpose of this design is to use a structure with rounded corners and rounded edges on top of the rounded edges. On the one hand, this can reduce the chance of damage from bumps during transportation. On the other hand, by setting vibration damping pads on the rounded edges, the lower shell is raised to reduce the contact area with the ground and other vibrating surfaces, thereby protecting the internal core components to a certain extent.

[0053] like Figure 4 As shown, in this embodiment, a specific structure of a vibration damping mounting platform is provided, wherein the vibration damping mounting platform includes a vibration damping disc base 4, a first protrusion 12, a second protrusion 13 and a third protrusion 14;

[0054] The first protrusion 12, the second protrusion 13 and the third protrusion 14 are all disposed on the vibration damping disc base 4;

[0055] The third protrusion 14 is disposed between the first protrusion 12 and the second protrusion 13, and the height of the third protrusion 14 is lower than the height of the first protrusion 12 and the height of the second protrusion 13.

[0056] Meanwhile, the CMU motherboard 6 is mounted on the first protrusion 12, and the battery 7 is fixed on the second protrusion 13.

[0057] In practical applications, the vibration damping disc base can adopt a three-layer structure. The bottom layer is the base material layer, which is used to connect with the lower shell. The material can be a viscoelastic material, such as silicone rubber modified epoxy resin. This utilizes the viscoelastic properties of the material to undergo plastic deformation under the vibration energy of the lower shell. The middle layer is the support frame layer, which can be made of rigidity materials such as titanium alloy. It mainly provides structural rigidity support to avoid displacement of the main board caused by excessive deformation of the viscoelastic material below. The vibration load is dispersed by adjusting the local stiffness. The top layer is the damping layer, which can be made of composite materials such as carbon fiber reinforced polytetrafluoroethylene, which can suppress high-frequency vibration to a certain extent.

[0058] The first and second protrusions can lift the CMU motherboard 6 and battery 7 respectively, so that they are further away from the lower housing. A third protrusion, which is lower in height, is set between the two protrusions. Although it protrudes from the vibration damping disc seat, it is lower in height than the first and second protrusions, so that the corresponding cables can be installed in it.

[0059] like Figure 5 As shown, in this embodiment, the CMU motherboard 6 is equipped with a processor, an Ethernet controller, a communication interface chip, a CAN-FD transceiver, a USB conversion chip, and an audio output module.

[0060] The processor is connected to the Ethernet controller, communication interface chip, CAN-FD transceiver, USB conversion chip and audio output module.

[0061] The Ethernet controller is used to transmit data input from the Ethernet network to the processor and output data fed back from the processor to the Ethernet network.

[0062] The communication interface chip is used to transmit data input via the RS232 serial interface to the processor and output data fed back by the processor to the RS232 serial interface;

[0063] The CAN-FD transceiver is used to transmit data input via the CAN bus to the processor and output data fed back by the processor to the CAN bus.

[0064] The USB conversion chip is used to transmit input data from the wireless data transmission module to the processor and output data fed back from the processor to the wireless data transmission module.

[0065] The audio output module is used to transmit the data output by the processor to the speaker.

[0066] Meanwhile, the processor model is FT-2000 / 4, the Ethernet controller model is WX1860AL2, the communication interface chip model is RM2232DCP16M, the CAN-FD transceiver model is RM2552AP8M, and the USB conversion chip model is CH348Q.

[0067] Furthermore, the audio output module includes an audio amplifier, a digital audio SOC, and an audio codec;

[0068] The data output by the processor is processed by the digital audio SOC and the audio codec and then transmitted to the audio amplifier.

[0069] The audio amplifier receives data processed by the digital audio SOC and audio codec, and outputs it to the speaker.

[0070] Meanwhile, the audio amplifier model is AIP8004, the digital audio SOC model is CJC6811A, and the audio codec model is TLV320AIC23.

[0071] The purpose of this design is to use a large number of domestically produced components in the selection of core component models, thereby reducing the reliance on imported components in equipment manufacturing while ensuring that key indicators such as operating temperature range and impact resistance meet the standards, making it more suitable for the field of military communications.

[0072] It should also be noted that, in actual use, in addition to the components mentioned above, those skilled in the art can add other components as needed, such as setting up an HDMI interface for audio and video output, adding a hard drive for data storage and connecting it to the processor, and setting up a fan to cool the entire device according to the needs of outdoor use scenarios. Those skilled in the art can set up these connection methods themselves based on existing materials, and will not elaborate further here.

[0073] Meanwhile, in this embodiment, an antenna slot 2 is provided on the upper housing 1, and an antenna 3 is provided in the antenna slot 2. The antenna 3 is connected to the wireless data transmission module 8.

[0074] In practical use, the antenna can be bent. When in use, it can be bent upright; when not in use, it can be bent back and stored in the antenna slot.

[0075] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A communication management device, comprising a device body, the device body including an upper housing (1), a lower housing (9) and a communication management working unit, the communication management working unit being disposed between the upper housing (1) and the lower housing (9), characterized in that, The upper housing (1) and the lower housing (9) are detachably connected. The lower housing (9) is provided with a vibration damping mounting platform. The communication management unit includes a CMU motherboard (6), a battery (7) and a wireless data transmission module (8). The CMU motherboard (6) and battery (7) are both mounted on a vibration damping mounting platform; The battery (7) supplies power to the CMU motherboard (6) and the wireless data transmission module (8); The wireless data transmission module (8) is placed outside the CMU motherboard (6) and is connected to the CMU motherboard (6) via signal.

2. The communication management device according to claim 1, characterized in that, The upper shell (1) and the lower shell (9) are rectangular in shape and have rounded edges at the four corners. The upper shell (1) can cover the lower shell (9).

3. A communication management device according to claim 2, characterized in that, The arc edge is provided with an arc edging (10), and both the upper and lower surfaces of the arc edging (10) are provided with vibration damping pads.

4. A communication management device according to claim 1, characterized in that, The vibration damping mounting platform includes a vibration damping disc base (4), a first protrusion (12), a second protrusion (13) and a third protrusion (14). The first protrusion (12), the second protrusion (13) and the third protrusion (14) are all disposed on the vibration damping disc seat (4); The third protrusion (14) is located between the first protrusion (12) and the second protrusion (13), and the height of the third protrusion (14) is lower than the height of the first protrusion (12) and the height of the second protrusion (13).

5. A communication management device according to claim 4, characterized in that, The CMU motherboard (6) is mounted on the first protrusion (12), and the battery (7) is fixed on the second protrusion (13).

6. A communication management device according to claim 1, characterized in that, The CMU motherboard (6) is equipped with a processor, an Ethernet controller, a communication interface chip, a CAN-FD transceiver, a USB conversion chip, and an audio output module. The processor is connected to the Ethernet controller, communication interface chip, CAN-FD transceiver, USB conversion chip and audio output module. The Ethernet controller is used to transmit data input from the Ethernet network to the processor and output data fed back from the processor to the Ethernet network. The communication interface chip is used to transmit data input via the RS232 serial interface to the processor and output data fed back by the processor to the RS232 serial interface; The CAN-FD transceiver is used to transmit data input via the CAN bus to the processor and output data fed back by the processor to the CAN bus. The USB conversion chip is used to transmit input data from the wireless data transmission module to the processor and output data fed back from the processor to the wireless data transmission module. The audio output module is used to transmit the data output by the processor to the speaker.

7. A communication management device according to claim 6, characterized in that, The processor is model FT-2000 / 4, the Ethernet controller is model WX1860AL2, the communication interface chip is model RM2232DCP16M, the CAN-FD transceiver is model RM2552AP8M, and the USB converter chip is model CH348Q.

8. A communication management device according to claim 6, characterized in that, The audio output module includes an audio amplifier, a digital audio SOC, and an audio codec. The data output by the processor is processed by the digital audio SOC and the audio codec and then transmitted to the audio amplifier. The audio amplifier receives data processed by the digital audio SOC and audio codec, and outputs it to the speaker.

9. A communication management device according to claim 8, characterized in that, The audio amplifier is model AIP8004, the digital audio SOC is model CJC6811A, and the audio codec is model TLV320AIC23.

10. A communication management device according to any one of claims 1 to 9, characterized in that, The upper housing (1) has an antenna slot (2) and an antenna (3) is provided in the antenna slot (2). The antenna (3) is connected to the wireless data transmission module (8).

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