Resistance temperature coefficient test device

Abstract

This application relates to a resistance temperature coefficient testing device, comprising: a controller; a temperature control stage assembly electrically connected to the controller, the temperature control stage assembly being used to place a sample to be tested, allowing the sample to be subjected to multiple different temperature environments; a temperature testing element for detecting the temperature value at the location where the sample is placed on the temperature control stage assembly; a resistance detection structure including a clamping assembly and at least one pair of probes, the clamping assembly clamping the sample to the temperature control stage assembly, and the probes simultaneously contacting the sample to form a detection circuit to detect the resistance value of the sample; the clamping assembly including a mounting plate having multiple equally spaced mounting holes, into which the probes are inserted. This device can solve the problem of the inability to quantitatively control the probe spacing during repeated testing, improving testing accuracy; in addition, the multiple equally spaced mounting holes on the mounting plate can simultaneously fix multiple pairs of probes, enabling simultaneous testing at multiple sites and improving testing efficiency.

Description

Technical Field

[0001] This application relates to the field of resistance temperature coefficient testing technology, and in particular to a resistance temperature coefficient testing device. Background Technology

[0002] The temperature coefficient of resistance is an important parameter describing the change in resistance of a material with temperature. It is commonly used to evaluate the temperature stability of materials such as electronic components, conductors, and semiconductors. For example, semiconductor thin-film thermistors play a wide and indispensable role in many fields due to their unique property of being extremely sensitive to temperature changes.

[0003] The test method for the equipment used to test the temperature coefficient of resistance is to calculate the TCR (Temperature Coefficient of Resistance) by taking the resistance values ​​of the test sample at different temperatures.

[0004] However, current temperature coefficient of resistance testing equipment cannot quantitatively control the probe spacing during repeated tests, which affects the test results. Utility Model Content

[0005] In view of this, the present application provides a resistance temperature coefficient testing device to solve at least one problem existing in the background art.

[0006] In a first aspect, embodiments of this application provide a resistance temperature coefficient testing device, the resistance temperature coefficient testing device comprising:

[0007] Controller;

[0008] A temperature control stage assembly is electrically connected to the controller. The temperature control stage assembly is used to place the sample to be tested and to allow the sample to be tested to be in multiple different temperature environments.

[0009] A temperature test piece is electrically connected to the controller and is used to detect the temperature value at the location where the sample to be tested is placed on the temperature control assembly.

[0010] A resistance detection structure includes a clamping assembly and at least one pair of probes. The probes are connected to the clamping assembly and electrically connected to the controller. The clamping assembly clamps the temperature control stage assembly, and the probes simultaneously contact the sample to be tested to form a detection circuit for detecting the resistance value of the sample to be tested.

[0011] The clamping assembly includes a mounting plate with multiple equally spaced mounting holes, into which the probe is inserted.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, the clamping assembly further includes:

[0013] The first clamping member is connected to the mounting plate;

[0014] An elastic element, one end of which is connected to the first clamping element;

[0015] The second clamping member, the other end of the elastic member is connected to the second clamping member, the first clamping member and the second clamping member are clamped to the temperature control stage assembly under the elastic force of the elastic member, and the probe contacts the test sample placed on the temperature control stage assembly.

[0016] In conjunction with a first aspect of this application, in an alternative embodiment, the temperature control stage assembly includes a thermoelectric cooler, the cold end or the hot end of which is used to place the sample to be tested.

[0017] In conjunction with the first aspect of this application, in an optional embodiment, the temperature control assembly further includes a heat sink connected to the thermoelectric cooler for dissipating heat from the thermoelectric cooler.

[0018] In conjunction with the first aspect of this application, in an optional embodiment, the heat sink has a slot on one edge near the semiconductor cooling chip, and the second clamping member is located in the slot and is movable within the slot.

[0019] In conjunction with the first aspect of this application, in an optional embodiment, the temperature control assembly further includes:

[0020] A fan, connected to the side of the thermoelectric cooler away from where the sample to be tested is placed, blows room temperature air toward the thermoelectric cooler.

[0021] In conjunction with the first aspect of this application, in an optional embodiment, the temperature control assembly further includes:

[0022] The base is connected between the fan and the heat sink, and the base is used to support the fan, the heat sink and the thermoelectric cooler.

[0023] In conjunction with the first aspect of this application, in an optional embodiment, the base is provided with a first space, through which external air enters the fan and flows to the heat sink and the thermoelectric cooler in the operating state of the fan.

[0024] In conjunction with the first aspect of this application, in an optional embodiment, the resistance temperature coefficient testing device further includes:

[0025] A display, electrically connected to the controller, is used to display the temperature value detected by the temperature test piece and the resistance value detected by the probe.

[0026] In conjunction with the first aspect of this application, in an alternative embodiment, the temperature testing element is a thermistor.

[0027] The resistance temperature coefficient testing device provided in this application includes a clamping assembly comprising a mounting plate with multiple equally spaced mounting holes into which probes are inserted. During the testing process, repeated tests are frequently required. The equally spaced mounting holes on the mounting plate allow for quantitative determination of the distance between a pair of probes, thus solving the problem of uncontrollable probe spacing during repeated tests and improving testing accuracy. Furthermore, the multiple equally spaced mounting holes on the mounting plate can simultaneously fix multiple pairs of probes, enabling simultaneous testing at multiple sites and improving testing efficiency. In addition, the device is compact, portable, and easy to operate.

[0028] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0029] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0030] Figure 1 A three-dimensional structural diagram of the resistance temperature coefficient testing device provided in the embodiments of this application;

[0031] Figure 2 This is a three-dimensional structural diagram of the resistance temperature coefficient testing device provided in the embodiments of this application from another angle;

[0032] Figure 3 This is a schematic diagram of the internal logic of the resistance temperature coefficient testing device provided in the embodiments of this application;

[0033] Figure 4 A schematic diagram of the resistance detection structure in the resistance temperature coefficient testing device provided in the embodiments of this application;

[0034] Figure 5 A schematic diagram showing the relationship between resistance, temperature and time of a sample obtained by using the resistance temperature coefficient testing device provided in the embodiments of this application;

[0035] Figure 6 A schematic diagram showing the relationship between resistance and temperature of a sample at 25°C, obtained by using the resistance temperature coefficient testing device provided in the embodiments of this application.

[0036] Figure label:

[0037] 100. Temperature coefficient of resistance testing device; a. Sample to be tested;

[0038] 10. Temperature control panel assembly; 11. Semiconductor cooling chip; 12. Heat sink; 121. Slot; 13. Fan; 131. Blade; 132. Bracket; 14. Base; 141. First space;

[0039] 20. Temperature testing components; 21. Thermistors;

[0040] 30. Resistance detection structure; 31. Clamping assembly; 311. Mounting plate; 3111. Mounting hole; 312. First clamping element; 313. Elastic element; 314. Second clamping element; 32. Probe. Detailed Implementation

[0041] To make the technical solution and beneficial effects of this utility model more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0042] In the description of this utility model, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this utility model and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this utility model.

[0043] In this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" can explicitly indicate that at least one of those features is included. In the description of this utility model, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0044] In this utility model, unless otherwise explicitly defined, the terms "installation," "connection," "linking," "fixing," and "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0045] In this utility model, unless otherwise explicitly defined, the terms "above," "on top of," "above," "over," "below," "below," "below," or "below" for "first feature above second feature" can refer to direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Furthermore, "above," "above," and "over" for "first feature above second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature below second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0046] TCR (Temperature Coefficient of Resistance) is a key physical quantity used to accurately describe the characteristic of resistance changing with temperature. It represents the relative rate of change of resistance per unit temperature change, and its definition formula is:

[0047]

[0048] Where R is resistance; dR / dT is the rate of change of resistance with temperature.

[0049] For an intrinsic semiconductor, the resistance R satisfies the following formula:

[0050]

[0051] Where R0 is the resistance of the thermistor material when T approaches infinity, ΔE is the activation energy, and k is the Boltzmann constant; then the TCR formula is:

[0052]

[0053] When testing the thermal conductivity (TCR) of semiconductor thin-film thermistors, the resistance values ​​of the material are typically measured at different temperatures from room temperature to 80°C. The logarithm of the resistance value is then plotted on the ordinate, and the reciprocal of the temperature on the abscissa. A linear fit is then performed on the scatter plot, and the slope of the resulting line is the value of ΔE / k. Based on this value, the TCR of the material at room temperature (25°C) is calculated, thus evaluating the material's thermistor performance.

[0054] This application provides a resistance temperature coefficient testing device 100. Please refer to... Figure 1 and Figure 2 The resistance temperature coefficient testing device 100 includes a controller, a temperature control platform assembly 10, a temperature testing element 20, and a resistance detection structure 30.

[0055] The temperature control stage assembly 10 and the temperature test piece 20 are both electrically connected to the controller. The temperature control stage assembly 10 is used to place the sample to be tested a and to allow the sample to be tested a to be in multiple different temperature environments. It can be understood that the temperature control stage assembly 10 can provide different temperature environments to meet the testing requirements of the sample to be tested a under different temperature conditions. The sample to be tested a is a semiconductor thin film, but it is not limited to this; this application uses a semiconductor thin film as an example for description.

[0056] The temperature testing element 20 is used to detect the temperature value at the location where the temperature control assembly 10 holds the sample a to be tested. The temperature testing element 20 is a thermistor 21, which acts as a temperature sensing element to detect the temperature value of the temperature control assembly 10 where the sample a to be tested is placed in real time. The thermistor 21 is a surface-mount Pt100, but it is not limited to this type.

[0057] The resistance detection structure 30 includes a clamping assembly 31 and at least one pair of probes 32. The probes 32 are connected to the clamping assembly 31, and both probes 32 are electrically connected to a controller. The clamping assembly 31 clamps the temperature control assembly 10, and the probes 32 simultaneously contact the sample to be tested (a) and form a detection loop with the controller to detect the resistance value of the sample to be tested (a). In other words, when the clamping assembly 31 is clamped to the temperature control assembly 10, at least one pair of probes 32 simultaneously contact the sample to be tested (a), forming a loop with the sample to be tested (a), the at least one pair of probes 32, and the controller, enabling the detection of the resistance value of the sample to be tested (a).

[0058] The clamping assembly 31 includes a mounting plate 311, which has a plurality of equally spaced mounting holes 3111, and the probe 32 is inserted into the mounting holes 3111.

[0059] During the testing process of the resistance temperature coefficient testing device 100, repeated testing is often required. Quantifying the distance between a pair of probes 32 can solve the problem of the inability to quantitatively control the spacing between probes 32 during repeated testing, thereby improving the accuracy of the test. In addition, the multiple equally spaced mounting holes 3111 on the mounting plate 311 can fix multiple pairs of probes 32 at the same time, allowing for simultaneous testing at multiple sites and improving testing efficiency. Furthermore, the device has a compact structure, is easy to carry, and is simple to operate.

[0060] In an optional embodiment, the axial direction of probe 32 is perpendicular to the surface of the temperature control assembly 10 used to place the sample a to be tested, so as to improve the conductivity between probe 32 and sample a. Furthermore, the end of probe 32 used to contact sample a can be a flat structure or a needle tip structure; this embodiment does not impose a specific limitation.

[0061] For semiconductor thin films with high resistance, a pair of probes 32 can be used for testing; for metal or alloy thin films with low resistance, two or more pairs of probes 32 with higher precision can be used for testing, and zeroing calibration should be performed to remove line resistance before testing.

[0062] Please refer to Figure 3 The controller includes a control module and a data acquisition module. Probe 32 and temperature test piece 20 are both connected to the data acquisition module via wires. The data acquisition module is used to acquire the resistance and temperature values ​​of the sample a under test. The data acquisition module feeds back the acquired resistance and temperature data to the control module.

[0063] The control module is also connected to the temperature control unit 10. The control module sends commands to the temperature control unit 10 to set the initial and target temperatures of the temperature control unit 10, and receives the temperature values ​​measured by the temperature test piece 20 collected by the data acquisition module. Under the control of the control module, the temperature control unit 10 can achieve rapid heating or cooling, as well as the number of repetitions of the heating and cooling cycle.

[0064] The data acquisition module can employ a multi-channel resistance measurement module based on the Modbus-TCP protocol, capable of measuring resistances from 0.02Ω to 40MΩ. Each pair of probes 32 can form a test loop channel, which, when connected to the multi-channel data acquisition module, enables synchronous data acquisition of different regions of the semiconductor thin film, saving testing time.

[0065] The resistance temperature coefficient testing device 100 also includes a display, which is electrically connected to the controller. The display is used to display the temperature value of the probe 32 acquired by the data acquisition module, and also to display the resistance value measured by the probe 32. The display can also be used as an input terminal of the controller, serving as an operating interface.

[0066] In one alternative embodiment, please refer to Figure 1 , Figure 2 and Figure 4 The clamping assembly 31 includes a first clamping member 312, an elastic member 313, and a second clamping member 314. The first clamping member 312 is connected to the mounting plate 311. One end of the elastic member 313 is connected to the first clamping member 312, and the other end is connected to the second clamping member 314. The first clamping member 312 and the second clamping member 314 are clamped to the temperature control stage assembly 10 under the elastic force of the elastic member 313, and the probe 32 contacts the test sample a placed on the temperature control stage assembly 10, so that the probe 32 and the test sample a have good electrical contact.

[0067] The elastic element 313 is a compression spring, but it is not limited to this. Under the elastic force of the elastic element 313, the first clamping member 312, along with the mounting plate 311, enables good electrical contact between the probe 32 mounted on it and the sample a to be tested; in addition, it can also improve the heat transfer effect between the sample a to be tested and the temperature control assembly 10, further improving the test accuracy.

[0068] In an optional embodiment, the temperature control stage assembly 10 includes a thermoelectric cooler 11, which is a solid-state cooling or heating device based on the Peltier effect. It requires no refrigerant and achieves heat transfer via direct current. When a direct current flows through a circuit composed of two different semiconductor materials (N-type and P-type), heat is absorbed at one end of the junction and released at the other. When the current is reversed, the hot and cold ends are interchanged. The cold or hot end of the thermoelectric cooler 11 is used to place the sample to be tested (a) to perform testing during the heating or cooling phase. As an example, the thermoelectric cooler 11 can perform resistance testing during the heating phase from room temperature to 80°C and the cooling phase from 80°C to room temperature.

[0069] In an optional embodiment, the temperature control assembly 10 further includes a heat sink 12 connected to the thermoelectric cooler 11 for dissipating heat from the thermoelectric cooler 11. The heat sink 12 can improve the heat exchange efficiency between the thermoelectric cooler 11 and the environment, thereby increasing the duration of the thermoelectric cooler 11 in a heated or cooled state. The heat sink 12 has a plate-like structure, but is not limited to this; a plate-like structure can increase its surface area, thereby improving heat exchange efficiency.

[0070] In an optional embodiment, the heat sink 12 has a slot 121 on one edge near the thermoelectric cooler 11, and the second clamping member 314 is located within the slot 121 and can move within the slot 121. It can be understood that the slot 121 on the heat sink 12 allows the first clamping member 312 and the second clamping member 314 to clamp the upper and lower surfaces of the thermoelectric cooler 11 respectively, which not only improves the clamping accuracy of the clamping assembly 31 but also facilitates operation. Furthermore, the ability of the clamping assembly 31 to move within the slot 121 allows for resistance testing of a larger area and different areas of the test sample a, further improving the accuracy of the test sample a.

[0071] It can also be understood that, along the axial direction of probe 32, the orthographic projection of slot 121 covers the orthographic projection of second clamping member 314. Clamping assembly 31 can move along the axial direction perpendicular to probe 32, that is, clamping assembly 31 can move in the plane parallel to the upper and lower surfaces of semiconductor cooling chip 11, which can increase the test area of ​​the sample a to be tested.

[0072] It should be noted that the size of the movement range of the second clamping member 314, that is, the specific size of the slot 121, can be set according to the requirements, and this application embodiment does not make specific limitations.

[0073] In an optional embodiment, the temperature control stage assembly 10 further includes a fan 13 connected to the side of the thermoelectric cooler 11 away from the side where the sample to be tested is placed, i.e., the lower surface of the thermoelectric cooler 11, to blow room temperature air toward the thermoelectric cooler 11. With the combined action of the fan 13 and the heat sink 12, the heat exchange efficiency between the thermoelectric cooler 11 and the environment can be further improved, thereby increasing the duration of the thermoelectric cooler 11 in a heated or cooled state.

[0074] The fan 13 includes blades 131 and a bracket 132. The blades 131 are connected to the bracket 132, and the bracket 132 is connected to the heat sink 12 and can support the heat sink 12 and the thermoelectric cooler 11.

[0075] In an optional embodiment, the temperature control assembly 10 further includes a base 14, with a fan 13 connected between the base 14 and the heat sink 12. The base 14 is used to support the fan 13, the heat sink 12, and the thermoelectric cooler 11.

[0076] In an optional embodiment, the base 14 is further provided with a first space 141. When the fan 13 is running, external air enters the fan 13 through the first space 141 and flows to the heat sink 12 and the semiconductor cooling chip 11, which can ensure the airflow and improve the heat exchange efficiency of the heat sink 12.

[0077] The resistance temperature coefficient testing device 100 provided in this application embodiment is used to test the sample a. An initial heating temperature and a target temperature are set; for example, the initial temperature is room temperature and the target temperature is 80°C. Rapid heating and cooling of the thermoelectric cooler 11 are achieved by controlling the current direction of the thermoelectric cooler 11. The heating and cooling cycle is repeated six times. When the surface temperature of the thermoelectric cooler 11, i.e., the temperature measured by the temperature testing element 20, reaches the target temperature, the current direction of the thermoelectric cooler 11 is switched, and the thermoelectric cooler 11 changes from heating mode to cooling mode. When the temperature measured by the temperature testing element 20 reaches room temperature, the current direction is switched again, restoring the heating mode, and the six-cycle operation is completed.

[0078] Figure 5 This diagram illustrates the relationship between time, temperature, and resistance when the resistance temperature coefficient testing apparatus 100 provided in this application performs six cycles on a test sample. Figure 5 It can be seen that six cycles of heating and cooling were completed rapidly within 34 minutes.

[0079] When it is necessary to determine the TCR of this material at room temperature (25°C), one can select... Figure 5 The graph shows the temperature resistance data for the first cycle, and the relevant TCR values ​​are extracted. Please refer to [the provided text]. Figure 6 At room temperature (25°C), the TCR of this material is -2.39%. Figure 6 The equation of the straight line formed by the points shown in the figure is:

[0080] y = 2.1289x - 0.7201;

[0081] The value of ΔE / k is 2.1289 / 1000. Substituting it into the TCR formula, we get TCR equal to -2.39%, where T is the absolute temperature.

[0082] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A resistance temperature coefficient testing device, characterized in that, The resistance temperature coefficient testing device includes: Controller; A temperature control stage assembly is electrically connected to the controller. The temperature control stage assembly is used to place the sample to be tested and to allow the sample to be tested to be in multiple different temperature environments. A temperature test piece is electrically connected to the controller and is used to detect the temperature value at the location where the sample to be tested is placed on the temperature control assembly. A resistance detection structure includes a clamping assembly and at least one pair of probes. The probes are connected to the clamping assembly and electrically connected to the controller. The clamping assembly clamps the temperature control stage assembly, and the probes simultaneously contact the sample to be tested to form a detection circuit for detecting the resistance value of the sample to be tested. The clamping assembly includes a mounting plate with multiple equally spaced mounting holes, into which the probe is inserted.

2. The resistance temperature coefficient testing device according to claim 1, characterized in that, The clamping assembly further includes: The first clamping member is connected to the mounting plate; An elastic element, one end of which is connected to the first clamping element; The second clamping member, the other end of the elastic member is connected to the second clamping member, the first clamping member and the second clamping member are clamped to the temperature control stage assembly under the elastic force of the elastic member, and the probe contacts the test sample placed on the temperature control stage assembly.

3. The resistance temperature coefficient testing device according to claim 2, characterized in that, The temperature control stage assembly includes a thermoelectric cooler, the cold end or the hot end of which is used to place the sample to be tested.

4. The resistance temperature coefficient testing device according to claim 3, characterized in that, The temperature control assembly also includes a heat sink connected to the thermoelectric cooler for dissipating heat from the thermoelectric cooler.

5. The resistance temperature coefficient testing device according to claim 4, characterized in that, The heat sink has a slot on one edge near the semiconductor cooling chip, and the second clamping member is located in the slot and can move within the slot.

6. The resistance temperature coefficient testing device according to claim 4, characterized in that, The temperature control unit also includes: A fan, connected to the side of the thermoelectric cooler away from where the sample to be tested is placed, blows room temperature air toward the thermoelectric cooler.

7. The resistance temperature coefficient testing device according to claim 6, characterized in that, The temperature control unit also includes: The base is connected between the fan and the heat sink, and the base is used to support the fan, the heat sink and the thermoelectric cooler.

8. The resistance temperature coefficient testing device according to claim 7, characterized in that, The base has a first space. When the fan is running, external air enters the fan through the first space and flows to the heat sink and the semiconductor cooling chip.

9. The resistance temperature coefficient testing apparatus according to any one of claims 1 to 8, characterized in that, The resistance temperature coefficient testing device also includes: A display, electrically connected to the controller, is used to display the temperature value detected by the temperature test piece and the resistance value detected by the probe.

10. The resistance temperature coefficient testing apparatus according to any one of claims 1 to 8, characterized in that, The temperature testing device is a thermistor.

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