Drive-by-wire device integrated with drive plate and variable frequency air conditioning system

Abstract

The utility model discloses a kind of line controller device and frequency conversion air conditioning system of integrated drive board, comprising: shell, its inside integrated communication connection drive board and line controller mainboard, and drive board and line controller mainboard interval arrangement and form electrical gap;Power device on drive board is made of wide bandgap semiconductor material, so that the junction temperature rise amplitude of the power device under rated working current is lower than silicon-based power device;The sidewall of the shell is provided with heat dissipation through-hole, for emitting the heat generated by the power device.The utility model by drive board is integrated in the shell of line controller device, then the power device on drive board is made of wide bandgap semiconductor material, heat reduction, without additional radiator, but through heat dissipation through-hole realizes heat dissipation, to reduce the occupied volume of drive board, realize drive board miniaturization, to optimize space layout, improve space utilization, to realize the miniaturization of line controller device, reduce production cost.

Description

Technical Field

[0001] This utility model relates to the field of electrical equipment technology, and in particular to a wired controller device with an integrated drive board and a variable frequency air conditioning system. Background Technology

[0002] With the trend of electronic devices becoming more intelligent and miniaturized, drive control systems are being used more and more widely in various fields, and the issues of space utilization and cost control in drive control systems are becoming increasingly prominent. In traditional solutions, the wired controller generally does not contain the drive board, but is designed separately from the drive board. The wired controller then needs to be connected to the drive board via external signal lines such as ribbon cables or connectors. Thus, the drive board is responsible for controlling the electronic device, while the wired controller is responsible for receiving and feeding back user commands to the drive board.

[0003] While separating the controller and driver board can meet user needs, it results in a larger overall system size, lower space utilization, and makes it difficult to achieve miniaturization and cost reduction. Utility Model Content

[0004] This utility model provides a wired controller device with an integrated drive board and a variable frequency air conditioning system, which solves the problems of low space utilization, difficulty in miniaturization, and high cost caused by the separate design of the wired controller and drive board in the prior art.

[0005] The technical solution of this utility model is a wired controller device with an integrated driver board, comprising:

[0006] The housing integrates a driver board and a wired controller motherboard for communication connection, and the driver board and the wired controller motherboard are spaced apart and form an electrical gap;

[0007] The power devices on the driver board are all made of wide bandgap semiconductor materials, which makes the junction temperature rise of the power devices at the rated operating current lower than that of silicon-based power devices.

[0008] The side wall of the housing is provided with heat dissipation holes to dissipate the heat generated by the power device.

[0009] Furthermore, a display screen is provided on the outer wall of the housing of the wired controller motherboard facing away from the drive board, and the display screen is electrically connected to the wired controller motherboard.

[0010] Furthermore, the driver board, the wired controller motherboard, and the display screen are all placed in parallel.

[0011] Furthermore, all sidewalls of the housing are provided with an array of heat dissipation holes, forming an air convection channel that runs through the inside and outside of the housing.

[0012] Furthermore, the inner side of the sidewall with the heat dissipation holes is provided with a multi-layered, staggered insulating grid structure.

[0013] Furthermore, the drive board includes: a first region and a second region arranged side by side and extending along the length direction of the drive board;

[0014] The first area contains a first power terminal module, an electromagnetic interference filtering module, and a switching power supply module arranged in parallel.

[0015] The second area contains a motor terminal module, an inverter module, a first main control module, and a first signal transmission module arranged in parallel.

[0016] Furthermore, the wired controller motherboard includes: a third region and a fourth region arranged side by side and extending along the length direction of the wired controller motherboard;

[0017] The third area is provided with a second power terminal module and a touch module arranged side by side; the second power terminal module and the first power terminal module are connected to the inside of the housing via a first power line;

[0018] The fourth region is provided with a second main control module and a second signal transmission module arranged in parallel; the second signal transmission module and the first signal transmission module are connected to the inside of the housing via signal lines.

[0019] Furthermore, all signal lines located within the electrical clearance are provided with a signal shielding layer, and all signal shielding layers are connected to a grounding terminal independently provided inside the housing.

[0020] Furthermore, only the first power terminal module and the motor terminal module of the drive board are exposed outside the housing, and the outer surfaces of the first power terminal module and the motor terminal module are coated with insulating material.

[0021] The first power terminal module is used to connect an external power supply line, and the motor terminal module is used to connect an external motor line.

[0022] This utility model also proposes a variable frequency air conditioning system, which includes the wired controller device with integrated drive board described above.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] This invention integrates the drive board and the wired controller device by directly embedding the drive board inside the housing. The power devices on the drive board are made of wide-bandgap semiconductor materials, which reduces heat generation and eliminates the need for an additional heat sink. Instead, heat dissipation is achieved through heat dissipation holes, thereby reducing the size of the drive board and achieving miniaturization. Furthermore, the wiring between the drive board and the wired controller motherboard is arranged within electrical clearances, thus optimizing the space layout, improving space utilization, and ultimately miniaturizing the wired controller device and reducing production costs. Attached Figure Description

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects and not to describe a particular order.

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a cross-sectional view of the wired controller device proposed in this utility model;

[0028] Figure 2 This is a schematic diagram of the wired controller device proposed in this utility model;

[0029] Figure 3 This is a schematic diagram showing the distribution of the insulating grid structure within the wired controller device proposed in this utility model.

[0030] Figure 4 This is a schematic diagram of the first insulating grid structure proposed in this utility model;

[0031] Figure 5 This is a schematic diagram of the second insulating grid structure proposed in this utility model;

[0032] Figure 6 This is a schematic diagram of the driver board proposed in this utility model;

[0033] Figure 7This is a schematic diagram of the mainboard of the wired controller proposed in this utility model.

[0034] Figure label:

[0035] 10. Shell;

[0036] 101. Heat dissipation vents; 102. Insulating grille structure

[0037] 20. Driver board;

[0038] 201. First area; 202. Second area; 203. First power terminal module; 204. Electromagnetic interference filtering module; 205. Switching power supply module; 206. Motor terminal module; 207. Inverter module; 208. First main control module; 209. First signal transmission module;

[0039] 30. Wired controller motherboard;

[0040] 301. Third area; 302. Fourth area; 303. Second power terminal module; 304. Touch module; 305. Second main control module; 306. Second signal transmission module;

[0041] 40. Electrical clearance;

[0042] 50. Display screen. Detailed Implementation

[0043] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model. Therefore, a feature pointed out in this specification is used to describe one feature of one embodiment of the present utility model, and does not imply that every embodiment of the present utility model must have the described feature. Furthermore, it should be noted that this specification describes many features. Although certain features may be combined to illustrate possible system designs, these features may also be used in other combinations not explicitly stated. Therefore, unless otherwise stated, the described combinations are not intended to be limiting.

[0044] The principle and structure of this utility model will be described in detail below with reference to the accompanying drawings and embodiments.

[0045] In existing technologies, wired controllers generally do not contain a driver board; instead, they are designed separately. The wired controller then needs to connect to the driver board via external signal lines such as ribbon cables or connectors. This allows the driver board to control the electronic equipment, while the wired controller receives and relays user commands to the driver board. This results in a large space occupation for the separately designed wired controller and driver board, leading to low space utilization and making it difficult to achieve miniaturization.

[0046] Therefore, in some embodiments, to improve space utilization and achieve miniaturization, such as Figures 1-2 As shown, this utility model discloses a wired controller device with an integrated driver board, comprising:

[0047] The housing 10 integrates a drive board 20 and a wired controller main board 30 for communication connection. The drive board 20 and the wired controller main board 30 are spaced apart and form an electrical gap 40.

[0048] The power devices on the drive board 20 are all made of wide bandgap semiconductor materials, so that the junction temperature rise of the power devices under rated operating current is lower than that of silicon-based power devices.

[0049] The side wall of the housing 10 is provided with heat dissipation holes 101 for dissipating the heat generated by the power device.

[0050] It should be noted that the electrical clearance 40 must meet the requirements of various standards such as national standards. The essence of the electrical clearance 40 is to use air as an insulating medium to prevent the formation of a conductive channel by air ionization under high voltage by maintaining the shortest straight distance between conductors, thereby avoiding short circuits or fires caused by instantaneous discharge. Furthermore, due to its sufficient spatial spacing, the electrical clearance 40 can eliminate parasitic capacitive coupling caused by potential difference, thereby reducing signal crosstalk and false triggering.

[0051] Wide bandgap semiconductor materials include gallium nitride (GaN), silicon carbide (SiC), diamond, or other materials with low heat generation characteristics, and are not limited thereto. Furthermore, power devices made of wide bandgap semiconductor materials shall not exceed 40% of the junction temperature rise of silicon-based devices at rated operating current. Furthermore, the wide bandgap makes the material less prone to intrinsic excitation at high temperatures (electrons require higher energy to transition from the valence band to the conduction band), thus significantly reducing high-temperature leakage current and Joule heating caused by disordered carrier movement; high thermal conductivity, with silicon carbide having a thermal conductivity as high as 4.9 W / cm·K (silicon only 1.5 W / cm·K), it can conduct 228% more heat per unit time. Although gallium nitride has a thermal conductivity slightly lower than silicon carbide (about 1.3 W / cm·K), combined with its high-frequency switching characteristics, the overall temperature rise is still significantly lower than that of silicon-based devices; low on-resistance, the on-resistance (Rds(on)) of silicon carbide / gallium nitride devices is only 0.1 to 0.2 of that of silicon-based devices, greatly reducing ohmic losses in the on-state; high switching speed, gallium nitride switching speed reaches the nanosecond level (silicon is at the microsecond level), and dynamic losses are reduced to less than 1 / 5 of those of silicon-based devices, reducing heat sources at the source.

[0052] Of course, the power devices on the mainboard 30 of the wired controller can also be made of wide-bandgap semiconductor materials, which is not limited here.

[0053] Compared to existing technologies that use silicon-based power devices, which occupy a large area on the driver board and typically require large heat sinks to ensure heat dissipation, resulting in a large driver board size and difficulty in achieving a compact design, this embodiment uses power devices made of wide-bandgap semiconductor materials. Through material physics innovation (wide bandgap characteristics + high thermal conductivity) and device structure optimization (low on-resistance + high switching speed), it achieves low temperature rise (low heat generation characteristics) through two paths: heat generation (reduced loss) and heat transfer (accelerated heat dissipation). Therefore, there is no need to add an additional heat sink. Heat dissipation is achieved through the heat dissipation through-hole 101, reducing the volume occupied by the driver board 20, realizing the miniaturization design of the driver board 20, reducing the cost of the driver board 20, and improving the heat dissipation effect.

[0054] In this way, by directly embedding the drive board 20 into the housing 10 of the wired controller device, the drive board 20 and the wired controller device are integrated. The power devices on the drive board 20 are made of wide bandgap semiconductor materials, which reduces heat generation and eliminates the need for an additional heat sink. Instead, heat dissipation is achieved through the heat dissipation holes 101, thereby reducing the volume occupied by the drive board 20 and achieving miniaturization of the drive board 20. Furthermore, the wiring between the drive board 20 and the wired controller main board 30 is arranged within the electrical clearance 40, thereby optimizing the space layout and improving space utilization. This achieves the miniaturization of the wired controller device proposed in this utility model and reduces production costs.

[0055] In some embodiments, such as Figure 1 As shown, a display screen 50 is provided on the outer side wall of the housing 10 of the wired controller motherboard 30 facing away from the drive board 20, and the display screen 50 is electrically connected to the wired controller motherboard 30.

[0056] It should be noted that the display screen 50 proposed in this embodiment is preferably a touch screen, which includes touch function, so that when the screen is touched by a finger or stylus, the sensing layer will accurately locate the operation position and directly replace the traditional mechanical button operation; of course, the display screen 50 can also be a screen with only display function and corresponding mechanical buttons, which is not limited here.

[0057] By installing a display screen 50 on the outer wall of the housing 10 of the wire controller motherboard 30 facing away from the drive board 20, and arranging the wiring (signal lines and power lines) between the drive board 20 and the wire controller motherboard 30 within the electrical clearance 40, the space layout is further optimized and the space utilization is improved, thereby achieving miniaturization of the wire controller device.

[0058] In a further embodiment, the driver board 20, the wired controller motherboard 30, and the display screen 50 are all placed in parallel.

[0059] It should be noted that the wired controller motherboard 30 is located between the driver board 20 and the display screen 50.

[0060] Thus, this embodiment, through the parallel placement of the drive board 20, the wired controller motherboard 30, and the display screen 50, can further optimize the spatial layout, improve space utilization, and achieve miniaturization of the wired controller device.

[0061] In some embodiments, to further improve the heat dissipation effect, such as Figure 3 As shown, all side walls of the housing 10 are provided with an array of heat dissipation holes 101, forming an air convection channel that runs through the inside and outside of the housing 10.

[0062] It should be noted that, in addition to the top wall of the display screen 50 and the bottom wall (equivalent to the bottom wall on which the drive board 20 is installed) provided opposite to the display screen 50, the other side walls of the housing 10 proposed in this embodiment are provided with an array of heat dissipation holes 101.

[0063] In this embodiment, a power device made of wide bandgap semiconductor material is used, which greatly reduces heat generation. Therefore, there is no need to add an additional heat sink. Instead, by setting all the side walls of the housing 10 as an array of heat dissipation holes 101 (equivalent to a window structure), air convection is formed to dissipate the heat generated by the driver board 20 and the wired controller motherboard 30 during operation, which better reduces the internal temperature of the wired controller device, further optimizes the heat dissipation effect, and thus improves the stability and service life of the wired controller device.

[0064] In a further embodiment, such as Figure 3 As shown, the inner side of the sidewall with the heat dissipation through hole 101 is provided with a multi-layered, staggered insulating grid structure 102.

[0065] It should be noted that this embodiment uses a two-layer staggered insulating grid structure 102 as an example, and the insulating grid structure 102 can also be a solid structure, which is not limited here. The preferred material for the insulating grid structure 102 is alumina, which has high thermal conductivity, high insulation, high flame retardancy, high cost performance, and good heat dissipation, further optimizing the heat dissipation effect.

[0066] Furthermore, each heat dissipation hole 101 proposed in this embodiment extends vertically, therefore each grid of the first layer of insulating grid structure 102 closest to the heat dissipation hole 101 extends horizontally (e.g., Figure 4 As shown), each grid of the second layer insulating grid structure 102 is inclined (e.g. Figure 5 As shown), this achieves the purpose of staggered distribution. Of course, the insulating grid structure 102 can also be set in other directions, as long as a staggered distribution is formed, which is not limited here.

[0067] Therefore, this embodiment uses a multi-layered, staggered insulating grid structure 102 to suppress creepage discharge within the wired controller device and eliminate tip discharge. Furthermore, the insulating grid structure 102 can prevent metal debris or other small particles from falling onto the drive board 20 and the wired controller motherboard 30, thus preventing short circuits. The insulating grid structure 102 also increases the moisture penetration path, reduces the risk of internal condensation, and improves reliability in humid and hot environments, thereby suppressing moisture diffusion. It also prevents users or maintenance personnel from accidentally inserting their fingers into the heat dissipation holes 101 during use or maintenance, resulting in electric shock.

[0068] In other embodiments, the insulating grid structure 102 may be designed in a fin shape to facilitate heat dissipation while providing insulation.

[0069] In other embodiments, a titanium dioxide photocatalytic coating can be applied to the surface of the insulating grid structure 102, which can decompose dust under ultraviolet light and play a certain role in dust prevention and antibacterial function.

[0070] In some embodiments, to achieve compactness and miniaturization of the driver board 20, thereby reducing the space occupied by the driver board 20, such as... Figure 6 As shown, the drive plate 20 includes: a first region 201 and a second region 202 arranged side by side and extending along the length direction of the drive plate 20;

[0071] The first region 201 is provided with a first power terminal module 203, an electromagnetic interference filtering module 204 and a switching power supply module 205 arranged in parallel.

[0072] The second region 202 is provided with a motor terminal module 206, an inverter module 207, a first main control module 208 and a first signal transmission module 209 arranged in parallel.

[0073] It should be noted that the shape of the drive plate 20 proposed in this embodiment is preferably rectangular, but it can also be square, trapezoidal or other shapes, which are not limited here. "Parallel" refers to the width direction of the drive plate 20, and "side-by-side" refers to the length direction of the drive plate 20.

[0074] The switching power supply module 205 proposed in this embodiment is used to convert the input voltage (such as AC220V or DC high voltage) into a stable low-voltage DC required by the drive board 20, supporting the operation of loads such as the motor and the first main control module 208; the electromagnetic interference filtering module 204 is used to filter out lightning, high-frequency harmonics and spatial radio frequency interference in the power grid, preventing the wired controller device from malfunctioning or data errors due to power supply noise, and preventing the high-frequency electromagnetic noise generated by the switching power supply module 205 and digital circuits of the drive board 20 from feeding back to the power grid, ensuring compliance with electromagnetic compatibility (EMC) standards; the inverter module 207 is used to convert the input DC power... The inverter module 207 converts the three-phase alternating current (AC) required to drive the motor, and precisely controls the motor speed, torque, and power output by adjusting the output frequency and voltage. The first main control module 208 acts as the control center, responsible for controlling the electronic equipment, coordinating the input / output modules, and generating PWM drive signals to adjust the switching state of the inverter module 207. The first signal transmission module 209 is responsible for signal isolation, amplification, and transmission, ensuring that the main control commands (such as the switching control signals for driving the IGBT) are stably transmitted to the inverter module 207, and realizing data interaction with the wired controller motherboard 30 and electronic equipment through networks such as the CAN bus. Its built-in isolation circuit protects against high-voltage interference, preventing system malfunctions caused by signal distortion.

[0075] In some embodiments, to achieve compactness and miniaturization of the wired controller motherboard 30, thereby reducing the space occupied by the wired controller motherboard 30, such as... Figure 7 As shown, the wired controller mainboard 30 includes a third region 301 and a fourth region 302 arranged side by side and extending along the length direction of the wired controller mainboard 30;

[0076] The third region 301 is provided with a second power terminal module 303 and a touch module 304 arranged side by side; the second power terminal module 303 and the first power terminal module 203 are connected to the inside of the housing 10 through a first power line.

[0077] The fourth region 302 is provided with a second main control module 305 and a second signal transmission module 306 arranged in parallel; the second signal transmission module 306 and the first signal transmission module 209 are connected to the inside of the housing 10 through signal lines.

[0078] In this embodiment, the first power terminal module 203 and the second power terminal module 303 are connected by at least one first power line; the first signal transmission module 209 and the second signal transmission module 306 are connected by at least two signal lines (including a transmitting signal line and a receiving signal line), and the lengths of the signal lines and the first power lines are adapted to the distance of the electrical clearance 40 to reduce the use of wires and lower costs. Compared with the traditional solution of connecting the driver board and the wired controller separately through additional exposed signal lines, this embodiment reduces delay, reduces electromagnetic interference, improves electromagnetic compatibility, and ensures signal transmission stability by running the signal lines within the electrical clearance 40; while running the first power line within the electrical clearance 40 ensures the stability and efficiency of the power supply.

[0079] It should be noted that the shape of the wired controller motherboard 30 proposed in this embodiment is preferably rectangular, but it can also be square, trapezoidal or other shapes, which are not limited here. "Side-by-side" refers to the width direction of the wired controller motherboard 30, and "parallel" refers to the length direction of the wired controller motherboard 30.

[0080] The touch module 304 proposed in this embodiment is used to detect user touch operations (such as tapping or swiping), converts physical contact into electrical signals through capacitive or resistive technology, accurately identifies the position and supports multi-touch function, and improves operation sensitivity and interactive experience; the second main control module 305 is responsible for receiving user instructions and transmitting them to the first main control module 208 through the second signal transmission module 306.

[0081] In some embodiments, the signal lines located within the electrical clearance 40 are provided with a signal shielding layer, and the signal shielding layer is connected to an independently provided grounding terminal (not shown, the same throughout) inside the housing 10, thereby ensuring that the signal shielding layer is effectively grounded and reducing signal interference.

[0082] Thus, this embodiment can further ensure anti-interference capability through the signal shielding layer, effectively block electromagnetic interference, improve electromagnetic compatibility, reduce delay, and ensure signal transmission stability.

[0083] After the wiring within the electrical clearance 40 is completed, solid insulating material is filled in. The solid insulating material completely fills the minimum air gap of the electrical clearance 40 and forms a continuous dielectric barrier. The dielectric strength of the solid insulating material is not less than 150% of the design voltage of the electrical clearance 40, and its volume resistivity is greater than 1×10^12 Ω·cm. The solid insulating material is at least one of alumina, thermosetting epoxy resin, mica sheet, silicone rubber, or polyimide film, and the glass transition temperature (Tg) of the thermosetting epoxy resin or polyimide film is not less than 50K above the maximum operating temperature of the equipment.

[0084] In some embodiments, to facilitate the connection of the wired controller device to external power sources and electronic devices such as motors, such as... Figure 1 As shown, only the first power terminal module 203 and the motor terminal module 206 of the drive board 20 are exposed outside the housing 10, and the outer surfaces of the first power terminal module 203 and the motor terminal module 206 are coated with insulating material.

[0085] The first power terminal module 203 is used to connect an external power supply line, and the motor terminal module 206 is used to connect an external motor line.

[0086] It should be noted that the first power terminal module 203 has at least three terminals, which are respectively connected to the live wire, neutral wire and ground wire for power supply; the motor terminal module 206 has at least three terminals, which are respectively connected to the motor wires (including U, V and W phases). In addition, a sealing structure is also provided between the drive board 20 extending to the outside and the corresponding housing 10 to prevent small molecules such as dust and water from entering the interior of the housing 10.

[0087] Furthermore, the outer surfaces of the first power terminal module 203 and the motor terminal module 206 are coated with insulating material to prevent electric shock and short circuits, which could affect the normal use of the wired controller and ensure electrical safety.

[0088] In some embodiments, the present invention also provides a variable frequency air conditioning system, the variable frequency air conditioning system including the wired controller device with integrated drive board described above.

[0089] Therefore, by directly embedding the driver board 20 into the housing 10 of the wired controller device, the driver board 20 and the wired controller device are integrated. Then, the power devices on the wired controller motherboard 30 are made of wide bandgap semiconductor materials, thus eliminating the need for additional heat sinks, reducing the volume occupied by the driver board 20, and optimizing the module layout within the driver board 20 and the wired controller motherboard 30, thereby achieving a miniaturized design of the driver board 20 and the wired controller motherboard 30. Then, the wiring between the driver board 20 and the wired controller motherboard 30 is arranged within the electrical clearance 40, thereby optimizing the space layout, improving space utilization, and thus achieving miniaturization of the wired controller device.

[0090] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A drive-by-wire device for an integrated drive board, characterized by, The application relates to a shell (10) internally integrated with a communication-connected driving plate (20) and a drive-by-wire main plate (30), wherein the driving plate (20) and the drive-by-wire main plate (30) are spaced apart and form an electrical gap (40); power devices on the driving plate (20) are made of wide-bandgap semiconductor materials, so that the junction temperature rise amplitude of the power devices under rated working current is lower than that of silicon-based power devices; and a heat dissipation through hole (101) is arranged on the side wall of the shell (10) for dissipating heat generated by the power devices. A display screen (50) is arranged on the outer side wall of the shell (10) away from the driving plate (20), and the display screen (50) is electrically connected with the drive-by-wire main plate (30). The driving plate (20), the drive-by-wire main plate (30) and the display screen (50) are arranged in parallel. All the side walls of the shell (10) are provided with arrayed heat dissipation through holes (101) to form air convection channels penetrating the shell (10).

2. The integrated drive board's drive-by-wire device of claim 1, wherein, The inner side of the side wall provided with the heat dissipation through hole (101) is provided with a multilayer staggered insulation grid structure (102).

3. The integrated drive board's drive-by-wire device of claim 2, wherein, The driving plate (20) comprises a first region (201) and a second region (202) arranged side by side and extending along the length direction of the driving plate (20); 4. The integrated drive board's drive-by-wire apparatus of claim 1, wherein, The first region (201) is provided with a first power terminal module (203), an electromagnetic interference filtering module (204) and a switching power supply module (205) arranged side by side; 5. The integrated drive board's drive-by-wire apparatus of claim 1 or 4, wherein, The second region (202) is provided with a motor terminal module (206), an inverter module (207), a first main control module (208) and a first signal transmission module (209) arranged side by side.

6. The integrated drive board's drive-by-wire device of claim 1, wherein, The drive-by-wire main plate (30) comprises a third region (301) and a fourth region (302) arranged side by side and extending along the length direction of the drive-by-wire main plate (30); The third region (301) is provided with a second power terminal module (303) and a touch module (304) arranged side by side; the second power terminal module (303) is connected with the first power terminal module (203) through a first power line and the inside of the shell (10); The fourth region (302) is provided with a second main control module (305) and a second signal transmission module (306) arranged side by side; the second signal transmission module (306) is connected with the first signal transmission module (209) through a signal line and the inside of the shell (10).

7. The integrated drive board's drive-by-wire device of claim 6, wherein, The signal lines located in the electrical gap (40) are provided with signal shielding layers, and the signal shielding layers are connected with independently arranged ground terminals in the shell (10). Only the first power terminal module (203) and the motor terminal module (206) of the driving plate (20) are exposed to the outside of the shell (10), and the outer surfaces of the first power terminal module (203) and the motor terminal module (206) are coated with insulation materials. The first power terminal module (203) is used for external connection of a power supply line, and the motor terminal module (206) is used for external connection of a motor line.

8. The integrated drive board's drive-by-wire device of claim 7, wherein, ​ 9. The integrated drive board's drive-by-wire device according to any one of claims 6 to 8, characterized in that, ​ ​ 10. A variable frequency air conditioning system, characterized by, The variable frequency air conditioning system comprises the integrated drive plate's drive-by-wire device according to any one of claims 1 to 9.

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