Circuit board copper plating device with good copper plating effect

Abstract

The utility model discloses circuit board copper deposition device with good copper deposition effect relates to circuit board copper deposition technical field, including circuit board fixed component, set up in the side of L type board, be used for the insertion fixed of circuit board, and circuit board fixed component includes the fixed frame of setting up in one side of L type board, and the fixed frame is fixedly installed with the partition strip, and the fixed frame is provided with anti -drop mechanism, drive mechanism sets up on L type board and circuit board fixed component, and drive mechanism includes the pivot that rotates and installs in L type board, and the fixed frame is fixedly installed on the pivot, and the end of pivot is fixedly installed with worm wheel, and the worm wheel is meshed with the installation of worm, in the utility model, through the setting of circuit board fixed component, drive mechanism, can fix circuit board in the fixed frame when copper deposition, and the fixed frame agitates the solution in copper deposition pool, makes the solution concentration distribution even in copper deposition pool, and drives circuit board activity, and then can make the copper surface distribution even after circuit board copper deposition, and the copper deposition effect is better.

Claims

1. A circuit board copper plating apparatus with good copper plating effect, comprising an L-shaped board (1), characterized in that, Also includes: A circuit board fixing assembly (2) is disposed on the side of the L-shaped plate (1) for inserting and fixing the circuit board. The circuit board fixing assembly (2) includes a fixing frame (21) disposed on one side of the L-shaped plate (1). A slot (22) is provided in the fixing frame (21). A partition strip (23) is fixedly installed on the fixing frame (21). An anti-detachment mechanism (24) is provided on the fixing frame (21). A drive mechanism (3) is provided on the L-shaped plate (1) and the circuit board fixing assembly (2) to drive the movement of the circuit board and stir the copper plating liquid in the copper plating pool. The drive mechanism (3) includes a rotating shaft (31) rotatably installed in the L-shaped plate (1), a fixing frame (21) fixedly installed on the rotating shaft (31), a worm gear (32) fixedly installed at the end of the rotating shaft (31), and a worm (33) meshing on the worm gear (32).

2. The circuit board copper plating apparatus with good copper plating effect according to claim 1, characterized in that: The anti-detachment mechanism (24) includes an anti-detachment seal (241) detachably installed on the fixed frame (21). One end of the anti-detachment seal (241) is fixedly installed with a plug (242). A miniature socket (243) is fixedly installed on the fixed frame (21). A movable locking block (244) is movably installed inside the miniature socket (243). The movable locking block (244) is engaged in the plug (242).

3. The circuit board copper plating apparatus with good copper plating effect according to claim 2, characterized in that: A telescopic spring (245) and a guide telescopic rod (246) are fixedly installed on the movable card block (244), and the other end of the telescopic spring (245) and the guide telescopic rod (246) are fixedly installed inside the miniature socket (243).

4. The circuit board copper plating apparatus with good copper plating effect according to claim 3, characterized in that: The bottom of the insert (242) is provided with an opening (248), and a pressing block (247) is fixedly installed on the movable locking block (244).

5. The circuit board copper plating apparatus with good copper plating effect according to claim 4, characterized in that: The other end of the anti-detachment seal (241) is fixedly installed with a plug rod (2410), and a plug sleeve (249) is fixedly installed on the fixed frame (21). A compression spring (2411) is fixedly installed inside the plug sleeve (249), and the plug rod (2410) is inserted into the plug sleeve (249).

6. The circuit board copper plating apparatus with good copper plating effect according to claim 1, characterized in that: The drive mechanism (3) further includes a U-shaped plate (34) fixedly installed on the top of the L-shaped plate (1). A drive motor (36) is fixedly installed on the top of the U-shaped plate (34). A drive shaft (35) is fixedly installed at the output end of the drive motor (36). The drive shaft (35) is fixedly installed at the output end of the drive motor (36).

7. The circuit board copper plating apparatus with good copper plating effect according to claim 6, characterized in that: A first limiting ring (37) is fixedly sleeved on the drive shaft (35), and a second limiting ring (38) is fixedly sleeved on the rotating shaft (31).

Images