Temperature and pressure integrated sensor

Abstract

This utility model discloses an integrated temperature and pressure sensor, including electrical terminals. Multiple pins are disposed inside the electrical terminals. One end of the electrical terminals is connected to a core support. A flexible circuit board and a ceramic core are connected between the core support and the electrical terminals. The flexible circuit board is connected to the pins. A base is disposed on the outside of the core support. A thermistor is connected to the end of the core support. A connecting insert for connecting the thermistor and the flexible circuit board is disposed inside the core support. A first sealing part is disposed on the outside of the pins, and a second sealing part is disposed on the outside of the connecting insert. Both the first and second sealing parts are covered with a sealing material layer. The electrical terminals and the core support are both encased in the corresponding sealing material layers. This utility model solves the technical problem that substances in harsh environments can flow into or seep into the internal structure requiring environmental isolation through the interface of different materials in the sensor.

Description

Technical Field

[0001] This utility model relates to the field of temperature and pressure sensor technology, specifically to an integrated temperature and pressure sensor. Background Technology

[0002] As a core sensing device that simultaneously achieves accurate detection of both pressure and temperature parameters, the integrated temperature and pressure sensor is widely used in industrial control, home appliances, automotive electronics and other fields. The automotive industry is its most critical application scenario, and with the popularization of new energy vehicles, the performance requirements for the sensor are becoming increasingly stringent.

[0003] Temperature and pressure integrated electronic components are generally divided into three parts. The first is the sensing area for detecting physical quantities and achieving the detection function; the second is the processing area for converting physical changes into electrical or optical signals; and the third is the interface part that connects to the outside world. In the sensor, areas with injection-molded insert structures are distributed in all three locations. One is the interface part mentioned above, referred to as the terminal, which matches the male or female connector of external wiring harnesses in the environment. Contact is typically achieved through plugging, locking, or other methods to allow current flow and signal transmission. Another part lies between the first and second parts, located inside the sensor. This structure is used to fix core components such as pressure sensing units, temperature sensing units, and humidity sensing units. Fixing these components requires injection molding to embed metal or non-metal structures to achieve various functions such as signal conduction and position fixing. Here, the main function is to embed metal wires within the injection-molded resin material as good conductors of electricity to transmit signals.

[0004] When precision electronic components are in harsh environments, such as refrigerant liquids (phase change refrigerants such as R1234yf, R290; non-phase change refrigerants Novec 7000, EGW; ethylene glycol solution as a refrigerant), high temperature, high pressure, and high humidity gases (CO2 gas environment, pressure scenarios with liquid evaporation), etc., and liquids filled with solid impurities (metal scraps, organic or inorganic solid fine impurities), these substances in harsh environments can flow into or seep into the internal structure that needs to be isolated from the environment through the interface of dissimilar materials (referring to ordinary insert injection molding or structural overlap), adversely affecting the overall structure, resulting in product quality or even functional failure.

[0005] Currently, the main method for sealing dissimilar material inserts on the market is to use epoxy adhesives to apply glue to exposed areas through simple physical sealing. This method has several limitations: First, applying the glue after the product is assembled can contaminate the product itself and cause VOC problems; second, it results in a huge waste of glue, as these electronic adhesives are expensive, and large areas are usually applied to seal exposed ports. To reduce air bubbles and defects during the application process, the amount used must be increased; third, regardless of the amount applied, the actual sealing area that prevents leakage is limited to the boundary between the dissimilar materials in the exposed area. Utility Model Content

[0006] This invention provides an integrated temperature and pressure sensor that seals the interfacial pores at the interface or region where dissimilar materials are combined, preventing the formation of media penetration channels. This solves the technical problem that substances in harsh environments can flow into or seep into internal structures that require environmental isolation through the interface of dissimilar materials in the sensor.

[0007] To achieve the above objectives, this utility model provides an integrated temperature and pressure sensor, including electrical terminals. Multiple pins are disposed inside the electrical terminals. One end of the electrical terminals is connected to a core support. A flexible circuit board and a ceramic core are disposed between the core support and the electrical terminals. The flexible circuit board is connected to the pins. A base is disposed on the outer side of the core support. The core support includes a support body for supporting and positioning the ceramic core and a detection extension post located on one side of the support body. The detection extension post extends to the outer side of the base and its end is connected to a thermistor. A connecting insert for connecting the thermistor and the flexible circuit board is disposed inside the core support. The outer side of the pins is provided with... The device has a first sealing part and a second sealing part on the outer side of the connecting insert. Both the first and second sealing parts are wrapped with a sealing material layer. The electrical terminals and the core support are wrapped with the corresponding sealing material layer. The electrical terminals and the core support are both injection molded parts. The electrical terminals and the connecting insert are both metal inserts integrally formed with the injection molded parts. Therefore, by pre-embedding a sealing material layer between the injection molded parts and the insert, the interface pores existing in the interface or area of ​​dissimilar materials are sealed, preventing the formation of medium penetration channels, slowing down the electrochemical corrosion rate, reducing the crack propagation caused by stress concentration, and reducing the occurrence of creep relaxation that weakens the sealing force. Moreover, it solves the technical problems existing in the exposed dispensing and coating methods in the prior art.

[0008] Preferably, the sealing material layer is formed by curing a polymer adhesive. The cured organic elastomer can penetrate into the air bubbles and other pores of the injection molding material to fill them, thus avoiding sealing failure caused by irregular air bubbles in the injection molded parts.

[0009] Preferably, the surfaces of the first sealing part and / or the second sealing part are arranged with concave and convex structures. By setting concave and convex structures, the contact area between the sealing part and the sealing material layer can be increased, and the contact surface between the injection molded part and the sealing material layer can be increased, thereby improving the anti-permeability effect and bonding strength.

[0010] Preferably, at least one side of the first sealing part and / or the second sealing part is provided with a serrated protrusion structure, which can improve the sealing effect between the two sides of the first sealing part and the second sealing part and the sealing material layer.

[0011] Preferably, the concave-convex structure includes spherical inner grooves and spherical protrusions arranged alternately at intervals. The spherical inner grooves and spherical protrusions can increase the contact area between the sealing part and the sealing material layer, preventing the appearance of positions not covered by the sealing material layer. At the same time, the alternating arrangement of spherical inner grooves and spherical protrusions can increase the axial bonding strength between the sealing part and the sealing material layer.

[0012] Preferably, a first sealing ring is installed between the ceramic core and the first end face of the support body, and a second sealing ring is installed between the second end face of the support body and the inner bottom surface of the base. The first and second sealing rings can seal the upper and lower end faces of the support body, further preventing external media from entering the flexible circuit board and the ceramic core from the gap between the base and the core support, thus ensuring good sealing performance.

[0013] Preferably, the outer side of the detection extension column is fitted with a sheath, and thermally conductive adhesive is filled between the detection extension column and the sheath. A sealing groove is provided on the detection extension column, and a third sealing ring is embedded in the sealing groove. The third sealing ring is in contact with the inner sidewall of the sheath. Using the sheath to protect the thermistor reduces the occurrence of short circuits and improves reliability and safety. At the same time, using thermally conductive adhesive to fill the gap between the sheath and the thermistor improves heat exchange efficiency and shortens the response time of the thermistor.

[0014] Preferably, the outer side of the detection extension post is provided with a riveting groove for riveting connection with the side wall of the sheath, which can improve the bonding strength between the sheath and the detection extension post and prevent displacement between the thermistor and the sheath from affecting the thermal conductivity of the thermistor.

[0015] Preferably, the upper two side walls of the support body are provided with snap-fit ​​seats, and the snap-fit ​​seats are provided with snap-fit ​​grooves on both sides. The electrical terminals are provided with claws that extend to both sides of the snap-fit ​​seats and enter into the snap-fit ​​grooves to snap with the snap-fit ​​seats. The snap-fit ​​between the claws and the snap-fit ​​seats can realize the quick connection between the core support and the electrical terminals. During installation, there is no need to accurately align complex holes, which improves the installation efficiency. At the same time, after the claws snap with the snap-fit ​​seats, the flexible circuit board and the ceramic core can be pressed and positioned.

[0016] Preferably, the connecting insert includes an upper connecting pin located inside the support body and a lower connecting pin located inside the detection extension column. The upper connecting pin and the lower connecting pin are connected by a bent connecting part. The second sealing part is disposed on the bent connecting part. The second sealing part being disposed at the bend of the connecting insert is beneficial for blocking external media.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] The electrical terminals and core support in the sensor are all injection molded parts, and the electrical terminals and connecting inserts are all metal inserts integrally formed with the injection molded parts. Therefore, by pre-embedding a sealing material layer between the injection molded parts and the inserts, the interface pores existing in the interface or area where dissimilar materials are combined are sealed, preventing the formation of medium penetration channels, slowing down the electrochemical corrosion rate, reducing the crack propagation caused by stress concentration, and reducing the occurrence of creep relaxation that weakens the sealing force. Moreover, it solves the technical problems existing in the exposed glue application and coating methods in the prior art. Furthermore, the thickness of the sealing layer on the surface of the part is in the range of 1-2500 micrometers using the impregnation process, which greatly reduces the amount used and the cost. Because the entire surface of the sealing part of the insert is impregnated, the sealing area is much larger than the mainstream external exposed port glue coating on the market.

[0019] Meanwhile, by setting concave and convex structures and serrated protrusions on the insert, the contact area between the sealing part and the sealing material layer can be increased, and the contact surface between the injection molded part and the sealing material layer can also be increased, thereby improving the anti-permeability effect and bonding strength. Attached Figure Description

[0020] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0021] Figure 2 This is a front sectional view of the present invention;

[0022] Figure 3 This is a three-dimensional structural view of the present invention after the base has been removed;

[0023] Figure 4 This is a three-dimensional structural diagram of the PIN pin and sealing material layer of this utility model;

[0024] Figure 5 This is a three-dimensional structural diagram of the PIN pin of this utility model;

[0025] Figure 6 This is a front view structural diagram of the PIN pin of this utility model;

[0026] Figure 7 This is a partial cross-sectional view of the PIN pin and sealing material layer of this utility model;

[0027] Figure 8 This is a side cross-sectional view of the PIN pin and sealing material layer of this utility model.

[0028] Figure 9 This is a structural diagram of the connecting insert of this utility model.

[0029] Figure label:

[0030] 1. Sealing material layer; 11. Fourth sealing ring; 12. Second sealing ring; 13. First sealing ring; 14. Riveting groove; 15. Third sealing ring; 16. Sealing groove; 17. Snap-fit ​​groove; 18. Snap-fit ​​seat; 19. Claw; 2. Flexible circuit board; 3. Connecting insert; 31. Bending connection part; 32. Lower connecting pin; 33. Upper connecting pin; 4. Electrical terminal; 5. Thermistor; 6. Core support; 61. Support body; 62. Detection extension column; 7. Base; 8. Ceramic core; 9. Sheath; 10. PIN pin; 100. First sealing part; 110. Serrated protrusion structure; 120. Concave-convex structure; 121. Spherical inner groove; 122. Spherical protrusion; 200. Second sealing part. Detailed Implementation

[0031] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.

[0032] like Figure 1-9As shown, this utility model addresses the technical problem that substances in harsh environments can flow into or seep into the internal structure requiring environmental isolation through the interface of different materials within the sensor. The following technical solution is provided: A temperature and pressure integrated sensor includes an electrical terminal 4, with multiple pins 10 disposed inside the electrical terminal 4. One end of the electrical terminal 4 is connected to a core support 6. A flexible circuit board 2 and a ceramic core 8 are connected between the core support 6 and the electrical terminal 4. The flexible circuit board 2 is connected to the pins 10. A base 7 is disposed on the outer side of the core support 6. The core support 6 includes a support body 61 for supporting and positioning the ceramic core 8 and a detection extension post 62 located on one side of the support body 61. The detection extension post 62 extends to the outer side of the base 7 and its end is connected to a thermistor 5. A connection is provided inside the core support 6. The connecting insert 3 connects the thermistor 5 and the flexible circuit board 2. The outer side of the PIN pin 10 is provided with a first sealing part 100, and the outer side of the connecting insert 3 is provided with a second sealing part 200. The outer sides of the first sealing part 100 and the second sealing part 200 are both wrapped with a sealing material layer 1. The electrical terminal 4 and the core support 6 are both wrapped with the corresponding sealing material layer 1. The electrical terminal 4 and the core support 6 are both injection molded parts. The electrical terminal 4 and the connecting insert 3 are both metal inserts integrally formed with the injection molded parts. Therefore, by pre-embedding the sealing material layer 1 between the injection molded parts and the insert, the interface pores existing in the interface or area of ​​dissimilar materials are sealed, preventing the formation of medium penetration channels, slowing down the electrochemical corrosion rate, reducing the crack propagation caused by stress concentration, and reducing the occurrence of creep relaxation causing the sealing force to weaken. Moreover, it solves the technical problems existing in the exposed dispensing and coating methods in the prior art.

[0033] In this embodiment, the sealing material layer 1 is formed by curing polymer adhesive. The cured organic elastomer will penetrate into the air bubbles and other pores of the injection molding material to fill them, thus avoiding sealing failure caused by irregular air bubbles in the injection molded parts.

[0034] In this embodiment, the surfaces of the first sealing part 100 and / or the second sealing part 200 are provided with concave and convex structures 120. By providing concave and convex structures 120, the contact area between the sealing part and the sealing material layer 1 can be increased, and the contact surface between the injection molded part and the sealing material layer 1 can also be increased, thereby improving the anti-permeability effect and bonding strength. Furthermore, at least one side of the first sealing part 100 and / or the second sealing part 200 is provided with serrated protrusions 110. These serrated protrusions 110 improve the sealing effect between the sides of the first sealing part 100 and the second sealing part 200 and the sealing material layer 1. Depending on the width of the connecting insert 3 and the PIN pin 10, different numbers of concave-convex structures 120 can be selected. These structures can be protruding, concave, or a combination of both. Similarly, the serrated protrusions 110 can be provided on both sides of the elongated connecting insert 3 and the PIN pin 10. The number of serrated protrusions 110 and concave-convex structures 120 can be determined based on the sealing material layer 1 and the area of ​​the injection molded part. Simultaneously, the serrated design with an inclination angle θ increases the lateral engagement force between the injection molded part and the sealing material layer 1 by 30%, and the relative displacement under vibration is ≤0.01mm. The size constraint of D4≥0.5D5 ensures that the bending strength of the connecting insert 3 and PIN pin 10 is ≥200MPa.

[0035] In this embodiment, the concave-convex structure 120 includes spherical grooves 121 and spherical protrusions 122 arranged alternately. The spherical grooves 121 and spherical protrusions 122 can increase the contact area between the sealing part and the sealing material layer, preventing areas not covered by the sealing material layer. Simultaneously, the alternating arrangement of the spherical grooves 121 and spherical protrusions 122 can increase the axial bonding strength between the sealing part and the sealing material layer. Furthermore, the alternating arrangement of the spherical grooves 121 and spherical protrusions 122 increases the contact area of ​​the sealing material layer 1 by 40% and improves the axial bonding strength by 25%. The curvature design of the spherical structure can disperse the impact force during injection molding and reduce the bubble rate of the adhesive layer.

[0036] In this embodiment, the center-to-center distance between adjacent spherical grooves 121 or spherical protrusions 122 is D1, and the radius of the spherical grooves 121 or spherical protrusions 122 is R. Therefore, 4R ≤ D1 < 5R, allowing for a denser arrangement within manufacturing constraints and enabling the deployment of as many elements as possible without affecting the structural strength of the connecting inserts 3 and PIN pins 10. The width of the connecting inserts 3 and PIN pins 10 is D4, and the radius of the spherical grooves 121 and spherical protrusions 122 is R. Therefore, 1 / 2D4 ≤ R < D4, maximizing the contact area between the spherical grooves 121 and spherical protrusions 122 and the sealing material layer 1.

[0037] The width of the connecting insert 3 and PIN pin 10, plus the serrated protrusion structure 110, is D5, and the width of the connecting insert 3 and PIN pin 10 is D4. Therefore, D4 ​​≥ 0.5D5, which ensures the strength of the connecting insert 3 and PIN pin 10. Furthermore, the side of the serrated protrusion structure 110 is inclined at an angle of θ, where 90° ≤ θ < 180°. This inclined structure facilitates demolding during injection molding.

[0038] like Figure 6 As shown, D2 is the tooth spacing of the side serrated structure, and D3 is the width at the root of a single serrated trapezoid. The distance between D2 and D3 should be deployed in a 1:1 ratio as much as possible; Appendix Figure 7 D6 in the figure represents the thickness after adhesive adhesion, which is determined by the type of adhesive. Different types of adhesives have different D6 values. In principle, the consistency of the adhesive thickness and stress concentration after curing need to be considered. Epoxy resin adhesives have a high elastic modulus after curing (≥0.8GPa) and can bond even as thin as 0.05μm, but lead protection needs to be ≥100μm to ensure mechanical strength. Silicone / polyurethane: It has better flexibility and can be as thin as 50μm, but the thickness needs to be increased to compensate for its low modulus characteristics.

[0039] In this embodiment, a first sealing ring 13 is installed between the ceramic core 8 and the first end face of the support body 61, and a second sealing ring 12 is installed between the second end face of the support body 61 and the inner bottom surface of the base 7. The first sealing ring 13 and the second sealing ring 12 can seal the upper and lower end faces of the support body 61, further preventing external media from entering the flexible circuit board 2 and the ceramic core 8 through the gap between the base 7 and the core support 6, resulting in good sealing performance. At the same time, a fourth sealing ring 11 is sleeved on the outer side of the base 7, which can improve the sealing effect.

[0040] In this embodiment, a sheath 9 is fitted around the outer side of the detection extension post 62, and thermally conductive adhesive is filled between the detection extension post 62 and the sheath 9. A sealing groove 16 is provided on the detection extension post 62, and a third sealing ring 15 is embedded in the sealing groove 16. The third sealing ring 15 is in contact with the inner wall of the sheath 9. The sheath 9 protects the thermistor 5, reducing the occurrence of short circuits and improving reliability and safety. At the same time, the thermally conductive adhesive fills the gap between the sheath 9 and the thermistor 5, improving heat exchange efficiency and shortening the response time of the thermistor.

[0041] In this embodiment, the outer side of the detection extension post 62 is provided with a riveting groove 14 for riveting connection with the side wall of the sheath 9, which can improve the bonding strength between the sheath 9 and the detection extension post 62 and prevent displacement between the thermistor 5 and the sheath 9, thus affecting the thermal conductivity of the thermistor 5.

[0042] In this embodiment, the upper two side walls of the support body 61 are provided with snap-fit ​​seats 18, and the two sides of the snap-fit ​​seats 18 are provided with snap-fit ​​grooves 17. The electrical terminal 4 is provided with claws 19 that extend to the sides of the snap-fit ​​seats 18 and enter into the snap-fit ​​grooves 17 to snap-fit ​​with the snap-fit ​​seats 18. The snap-fit ​​between the claws 19 and the snap-fit ​​seats 18 can realize the quick connection between the core support 6 and the electrical terminal 4. During installation, there is no need to accurately align the complex holes, which improves the installation efficiency. At the same time, after the claws 19 snap-fit ​​with the snap-fit ​​seats 18, the flexible circuit board 2 and the ceramic core 8 can be pressed and positioned.

[0043] In this embodiment, the connecting insert 3 includes an upper connecting pin 33 located inside the support body 61 and a lower connecting pin 32 located inside the detection extension post 62. The upper connecting pin 33 and the lower connecting pin 32 are connected by a bent connecting part 31. The second sealing part 200 is disposed on the bent connecting part 31. The second sealing part 200 is disposed at the bend of the connecting insert 3 to facilitate the blocking of external media.

[0044] In this embodiment, the temperature sensing of the integrated temperature and pressure sensor involves the medium contacting the sheath 9 through the threaded end of the base 7, transferring heat to the sheath 9, then to the thermally conductive adhesive, and finally to the thermistor 5. The thermally conductive adhesive is used to eliminate air gaps, reduce thermal resistance, and can adapt to irregular surfaces to achieve full-coverage contact heat conduction. The medium seeps in through the gap between the sheath 9 and the core support, but is restricted by the sealing structure formed by the third sealing ring 15, the sealing groove 16, and the inner wall of the sheath 9, and cannot penetrate the sealed space where the thermally conductive adhesive and the thermistor are located.

[0045] Even if the surfaces of the heat source and heat sink appear to be in close contact, there are actually micron-sized gaps (due to insufficient surface roughness and flatness). Air, with its extremely low thermal conductivity, forms a significant thermal barrier, hindering heat transfer. Thermally conductive adhesive, with a thermal conductivity far exceeding that of air (common models range from 0.5-10 W / (m·K), while high-conductivity models can reach 20-50 W / (m·K)), fills these gaps, reducing thermal resistance to an extremely low level and allowing heat to be rapidly conducted from the heat source to the heat sink. Some heat-generating components (such as irregularly shaped chips or curved LED panels) or heat-generating components (such as finned heat sinks) have irregular surfaces, making it difficult for traditional metal pads and thermal grease to adhere completely. Thermally conductive adhesive, with its fluidity (liquid / paste) or flexibility (after curing), can tightly adhere to irregular surfaces, forming a seamless thermal interface and maximizing the thermal contact area. Flexible thermally conductive adhesives (such as silicone thermally conductive gel and thermally conductive foam adhesive) have a certain degree of elasticity after curing, which can buffer the mechanical stress caused by thermal expansion and contraction between the heat-generating element and the heat-dissipating element (such as deformation and pulling caused by the difference in the thermal expansion coefficients between the metal heat sink and the plastic shell), avoid problems such as component pin breakage and package cracking, and improve the reliability of the equipment in high and low temperature cycling environments. The above problems can be solved by setting the first sealing part 100 and / or the second sealing part 200.

[0046] Furthermore, the integrated temperature and pressure sensor of the present invention achieves pressure sensing in the following manner: the medium reaches the core support 6 through the threaded end of the base 7, and acts on the surface of the ceramic core through the channel on the core support 6; here the channel is the first channel and the second channel placed symmetrically to make the pressure distribution uniform; when the medium passes through the base 7, it is restricted by the sealing structure formed by the second sealing ring 12 and the surface of the core support, and can only enter the interior of the core support 6 through the first channel and the second channel; inside the core support 6, the medium is restricted by the sealing structure formed by the first sealing ring 13 and the surface of the ceramic core 8, and can only transmit pressure to the ceramic core 8, and cannot reach the space where the flexible circuit board is located.

[0047] In this embodiment, the sealed space inside the base 7 is filled with nitrogen, which can enhance the insulation performance, adapt to high voltage scenarios, provide an inert environment, and avoid chemical reactions. The sealed space is the space where the flexible circuit board is located. Its lower end is sealed by the method described in the previous paragraph, and its upper end is formed by the riveting structure formed by the base 7 being riveted to the surface of the electrical terminal and then coated with adhesive.

[0048] Metal components of electronic parts (such as relay contacts, silver-plated electrodes of crystal oscillators, and chip pins) are highly susceptible to oxidation under oxygen, forming oxide layers (such as silver oxide and copper oxide). These oxide layers increase contact resistance, reduce conductivity, and can even cause malfunctions like contact sticking and signal interruption. Oxidation of crystal oscillator electrodes can also lead to excessive frequency deviation and oscillation failure. Nitrogen, as an inert gas, can reduce the oxygen concentration in a sealed space to extremely low levels, effectively blocking oxidation and ensuring that metal components maintain good conductivity and contact performance over the long term. Nitrogen's insulation strength (breakdown field strength) is significantly higher than that of ordinary air (dry nitrogen has a breakdown field strength of approximately 30 kV / cm, while air has approximately 25 kV / cm), and it is unaffected by humidity (insulation performance decreases significantly with increasing air humidity). For high-voltage electronic components (such as high-voltage capacitors, power electronic modules, and high-voltage relays), filling the sealed space with nitrogen can improve the overall insulation level, reduce the risk of short circuits and burnout due to insulation breakdown, and enable stable operation in higher voltage environments. Furthermore, nitrogen does not chemically react with any materials of electronic components (such as plastic casings, epoxy resin encapsulations, and metal plating), and will not produce corrosive substances or cause material aging (such as plastic embrittlement or encapsulation cracking). This is especially suitable for electronic devices that operate for extended periods (such as industrial control modules and aerospace electronic components), ensuring stable component performance throughout their entire lifespan and reducing the probability of "sudden failures."

[0049] This embodiment also includes a process for molding the insert sealing structure within the aforementioned integrated temperature and pressure sensor, comprising the following steps:

[0050] S1. Clean the surfaces of the connecting insert 3 and PIN pin 10, and then air dry them. After air drying, perform plasma treatment. The surface cleaning of the connecting insert 3 and PIN pin 10 can be performed by ultrasonic cleaning with deionized water or by cleaning with solvent or cleaning agent. Different cleaning methods can be selected according to different connecting inserts 3 and PIN pins 10 to ensure that the surface of the connecting insert 3 and PIN pin 10 achieves the adhesion required for impregnation.

[0051] S2. Apply or impregnate the first sealing part 100 and the second sealing part 200 with polymer adhesive. After the adhesive adheres to the surface, let it air dry and / or bake it. The air drying time is 30-60 minutes. The baking requires an oven at 60°C for 10 minutes.

[0052] S3. Repeat the process in step S2, apply or impregnate the polymer adhesive again, and then allow it to air dry and / or bake. The adhesive needs to be left dry for one week, during which time it must be kept clean and free from contamination.

[0053] S4. After the polymer adhesive adheres, the connecting insert 3 and PIN pin 10 can be placed into the corresponding positions in the mold for insert injection molding. After injection molding, a dense elastic material layer as a sealing material layer 1 will be attached between the surface of the connecting insert 3 and PIN pin 10 and the injection molded part. The sealing material layer 1 tightly wraps the insert while compressing the injection molding area. Different injection molding materials correspond to different injection molding temperatures. The temperature range of the adhesive and the required injection molding temperature range of the injection molding material need to be fully considered when selecting the adhesive. For example: PPS+GF30 injection molding temperature 300-350 degrees Celsius, mold temperature 120-180 degrees Celsius; PPE+PA+GF30% injection molding temperature 280-320 degrees Celsius, mold temperature 80-120 degrees Celsius. After injection molding, a dense elastic organic material as a sealing material will be attached between the surface of the metal insert and the injection molding material, tightly wrapping the insert while compressing the injection molding area. During injection molding, due to the high temperature of the mold, this organic elastomer will penetrate into the air bubbles and other pores of the injection molding resin material and fill them, thus avoiding sealing failure caused by irregular air bubbles in the injection molded parts.

[0054] In summary, this invention, by pre-embedding a sealing material layer 1 to seal the pores at the interface of dissimilar materials, can reduce the permeation of refrigerant liquids (such as R1234yf, R290) by more than 90%, and control the leakage rate of high-temperature, high-pressure CO2 gas to below 0.01cc / h. Compared with traditional exposed dispensing methods, the interception efficiency of liquid media containing solid impurities (particle size 5-50μm) is increased to 99.5%, preventing impurities from entering the interior of precision components and causing short circuits or mechanical jamming.

[0055] After the polymer adhesive has cured, the elastomer (such as silicone rubber) will have a sealing force reduction of ≤5% under temperature cycling from -40℃ to 125℃ (compared to ≥30% for traditional dispensing methods), ensuring that the sealing requirements are still met after 100,000 cycles.

[0056] The concave-convex structure 120 and the serrated protrusion structure 110 disperse stress (reducing the stress concentration factor from 2.5 to 1.2), thereby extending the crack initiation time of the first sealing part 100 and the second sealing part 200 under vibration environment (10-2000Hz, acceleration 20g) to more than 3 times that of the conventional structure.

[0057] Sealing material layer 1 is embedded inside the injection molded part to prevent the adhesive from being exposed to air, with VOC emissions ≤0.1mg / m³. 3 (Compliant with EU REACH regulations) solves the pollution problem of traditional adhesive application.

[0058] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0059] Furthermore, in this utility model, the use of terms such as "first," "second," etc., is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly and specifically defined.

[0060] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0061] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

Claims

1. A temperature and pressure integrated sensor, comprising an electrical terminal (4), wherein the electrical terminal (4) is provided with a plurality of pins (10), one end of the electrical terminal (4) is connected to a core support (6), a flexible circuit board (2) and a ceramic core (8) are provided between the core support (6) and the electrical terminal (4), the flexible circuit board (2) is connected to the pins (10), a base (7) is provided on the outside of the core support (6), the core support (6) includes a support body (61) for supporting and positioning the ceramic core (8) and a detection extension post (62) located on one side of the support body (61), the detection extension post (62) extends to the outside of the base (7) and its end is connected to a thermistor (5), and a connecting insert (3) for connecting the thermistor (5) and the flexible circuit board (2) is provided inside the core support (6), characterized in that, The PIN pin (10) is provided with a first sealing part (100) on the outside, and the connecting insert (3) is provided with a second sealing part (200) on the outside. Both the first sealing part (100) and the second sealing part (200) are wrapped with a sealing material layer (1). The electrical terminal (4) and the core support (6) are both wrapped with the corresponding sealing material layer (1).

2. The integrated temperature and pressure sensor according to claim 1, characterized in that: The sealing material layer (1) is formed by curing polymer adhesive.

3. The integrated temperature and pressure sensor according to claim 2, characterized in that: The surfaces of the first sealing part (100) and / or the second sealing part (200) are provided with an uneven structure (120).

4. The integrated temperature and pressure sensor according to claim 3, characterized in that: At least one side of the first sealing part (100) and / or the second sealing part (200) is provided with a serrated protrusion structure (110).

5. The integrated temperature and pressure sensor according to claim 3, characterized in that: The aforementioned concave-convex structure (120) includes spherical inner grooves (121) and spherical protrusions (122) arranged alternately at intervals.

6. The integrated temperature and pressure sensor according to claim 1, characterized in that: A first sealing ring (13) is installed between the ceramic core (8) and the first end face of the support body (61), and a second sealing ring (12) is installed between the second end face of the support body (61) and the inner bottom surface of the base (7).

7. The integrated temperature and pressure sensor according to claim 5, characterized in that: The outer side of the detection extension column (62) is fitted with a sheath (9), and thermally conductive adhesive is filled between the detection extension column (62) and the sheath (9). A sealing groove (16) is provided on the detection extension column (62), and a third sealing ring (15) is embedded in the sealing groove (16). The third sealing ring (15) is in contact with the inner sidewall of the sheath (9).

8. The integrated temperature and pressure sensor according to claim 6, characterized in that: The outer side of the detection extension column (62) is provided with a riveting groove (14) for riveting connection with the side wall of the sheath (9).

9. The integrated temperature and pressure sensor according to claim 1, characterized in that: The upper two side walls of the support body (61) are provided with snap-fit ​​seats (18), and the two sides of the snap-fit ​​seats (18) are provided with snap-fit ​​grooves (17). The electrical terminal (4) is provided with claws (19) that extend to the two sides of the snap-fit ​​seats (18) and enter into the snap-fit ​​grooves (17) to snap-fit ​​the snap-fit ​​seats (18).

10. The integrated temperature and pressure sensor according to claim 1, characterized in that: The connecting insert (3) includes an upper connecting pin (33) located inside the support body (61) and a lower connecting pin (32) located inside the detection extension post (62). The upper connecting pin (33) and the lower connecting pin (32) are connected by a bent connecting part (31), and the second sealing part (200) is provided on the bent connecting part (31).

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