Chip optical detection device and apparatus

Abstract

The utility model relates to chip detection technical field, specifically disclose chip optical detection device and equipment. The device includes adsorption module and detection module, adsorption module includes suction nozzle drive assembly and material taking suction nozzle, suction nozzle drive assembly is used for driving material taking suction nozzle, makes chip circulate movement between loading position, detection position and unloading position, material taking suction nozzle can adsorb the chip of loading position, material taking suction nozzle can release the chip of unloading position, detection module includes positioning monitoring component and back detection subassembly, positioning monitoring component and back detection subassembly are separately in the both sides of adsorption module, positioning monitoring component includes the loading positioning component for monitoring the front of chip of loading position and the unloading positioning component for monitoring the front of chip of unloading position, and back detection subassembly is used for shooting the back of chip of detection position. The device is through compact design, realizes the parallel operation and efficient cooperation of positioning monitoring component and back detection subassembly to satisfy the detection demand.

Description

Technical Field

[0001] This utility model relates to the field of chip testing technology, and in particular to chip optical testing devices and equipment. Background Technology

[0002] In chip manufacturing and packaging testing, appearance inspection is a critical step in quality control, directly impacting chip yield and reliability. Traditional chip optical inspection equipment typically employs a single-sided layout, with all inspection components concentrated on one side of the chip, making it difficult to simultaneously inspect both the front and back sides. Such equipment requires repeated adjustments to chip orientation or movement of inspection modules during inspection, resulting in long inspection cycles and low efficiency, failing to meet the demands of high-speed, cyclical inspection in modern automated production lines.

[0003] Furthermore, existing testing equipment often suffers from low space utilization and structural redundancy due to the centralized arrangement of testing components, limiting the equipment's integration and scalability. Simultaneously, the lack of a precise positioning mechanism during chip handling and positioning at the loading and unloading stages can easily lead to testing errors or loading failures, affecting the stability and consistency of the overall testing process.

[0004] With the continuous shrinking of chip size and the diversification of packaging forms, traditional testing systems face severe challenges in terms of adaptability, accuracy, and testing speed. Utility Model Content

[0005] The purpose of this invention is to provide a chip optical inspection device and equipment to achieve simultaneous inspection of the front and back of the chip, so as to meet the needs of high-frequency and intelligent inspection scenarios.

[0006] To achieve this objective, the present invention adopts the following technical solution:

[0007] A chip optical inspection device is used to inspect chips, the chips having opposing front and back sides. The chip optical inspection device includes an adsorption module and a detection module. The adsorption module includes a nozzle driving assembly and a pick-up nozzle. The nozzle driving assembly drives the pick-up nozzle to cyclically move the chip between a loading position, a detection position, and a unloading position. The pick-up nozzle can adsorb the chip located at the loading position and release the chip located at the unloading position. The detection module includes a positioning monitoring assembly and a back inspection assembly, located on opposite sides of the adsorption module. The positioning monitoring assembly includes a loading positioning assembly and an unloading positioning assembly. The loading positioning assembly monitors the front side of the chip located at the loading position, and the unloading positioning assembly monitors the front side of the chip located at the unloading position. The back inspection assembly photographs the back side of the chip located at the detection position.

[0008] As an optional technical solution for chip optical inspection devices, the pick-up nozzle rotates about an axis parallel to the vertical direction.

[0009] As an optional technical solution for chip optical inspection devices, the adsorption module also includes a carrier plate, the output end of the suction nozzle drive component is fixed to the carrier plate, and the material suction nozzle is disposed on the carrier plate.

[0010] As an optional technical solution for chip optical inspection devices, the output end of the suction nozzle drive assembly is connected to the bottom end of the carrier plate, and the material suction nozzle is connected to the top end of the carrier plate.

[0011] As an optional technical solution for chip optical inspection devices, the axis of the carrier disk is parallel to the vertical direction, and the output end of the suction nozzle drive component is coaxial with the carrier disk.

[0012] As an optional technical solution for chip optical inspection devices, multiple pick-up nozzles are provided, and all of the pick-up nozzles are evenly distributed around the axis of the carrier disk.

[0013] As an optional technical solution for chip optical inspection devices, the positioning monitoring component and the back inspection component are symmetrically arranged about the axis of the output end of the nozzle driving component.

[0014] As an optional technical solution for chip optical inspection devices, the loading positioning component and the unloading positioning component are arranged side by side along the arrangement direction, which is perpendicular to the vertical direction.

[0015] As an optional technical solution for the chip optical inspection device, the loading and positioning component includes a first camera; the unloading and positioning component includes a second camera; and / or, the back inspection component includes a third camera.

[0016] A chip optical inspection device includes a loading device, a unloading device, and the aforementioned chip optical inspection device. The loading device is used to place the chip at the loading position, and the unloading device is used to remove the chip located at the unloading position.

[0017] The beneficial effects of this utility model are:

[0018] This chip optical inspection device achieves a three-dimensional spatial layout of the inspection module by placing the positioning monitoring component and the back inspection component on opposite sides of the adsorption module. This effectively avoids the space waste caused by component stacking in traditional inspection equipment, optimizes the spatial layout, and improves the overall compactness and integration of the structure. Furthermore, since the loading and unloading positioning components and the back inspection component are located on different sides of the adsorption module, they can operate simultaneously without interference during chip movement, allowing for parallel inspection of the front and back sides of the chip at different positions. The adsorption module uses a nozzle drive component to drive the pick-up nozzle, enabling the chip to cyclically move between the loading, inspection, and unloading positions. This achieves periodic movement and continuous inspection of the chip, improving the reliability and repeatability of the chip optical inspection device. It is suitable for high-frequency inspection requirements in automated production lines. Combined with the positioning monitoring component for real-time monitoring of the chip position, it ensures the positioning accuracy and stability of the chip during handling. The loading and positioning component positions the chip before it is attracted, ensuring accurate orientation as it enters the inspection process. The unloading and positioning component ensures the chip is in the correct position before release, guaranteeing accurate orientation as it leaves the inspection process and avoiding unloading errors, thus achieving precise positioning at multiple locations. The back-side inspection component captures images of the chip's back side while it is in the inspection position, enabling comprehensive identification of defects on the back side through high-quality image acquisition. In summary, this allows for simultaneous inspection of both the front and back sides of the chip, completing a closed-loop inspection of both sides, improving inspection efficiency, and reducing the time the chip spends in the chip optical inspection device. Furthermore, the separate design of the positioning and monitoring component and the back-side inspection component facilitates modular adjustment or replacement according to chip type and size, enhancing the versatility and scalability of the chip optical inspection device. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the chip optical inspection device provided in this embodiment of the utility model.

[0020] In the picture:

[0021] X: Arrangement direction; Z: Vertical direction;

[0022] 100. Feeding and positioning component; 200. Unloading and positioning component; 300. Back inspection component; 400. Picking nozzle. Detailed Implementation

[0023] The technical solution of this utility model will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0024] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The terms "first position" and "second position" refer to two different positions. Moreover, "above," "on top of," and "over" the first feature in relation to the second feature includes the first feature directly above and diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "under," and "below" the first feature in relation to the second feature includes the first feature directly below and diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0025] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0027] like Figure 1As shown, this embodiment provides a chip optical inspection device for inspecting chips. The chips have opposing front and back sides. The chip optical inspection device includes an adsorption module and a detection module. The adsorption module includes a nozzle driving component and a pick-up nozzle 400. The nozzle driving component drives the pick-up nozzle 400 to cyclically move the chip between a loading position, a detection position, and a unloading position. The pick-up nozzle 400 can adsorb the chip located at the loading position and release the chip located at the unloading position. The detection module includes a positioning monitoring component and a back inspection component 300, which are located on opposite sides of the adsorption module. The positioning monitoring component includes a loading positioning component 100 and an unloading positioning component 200. The loading positioning component 100 monitors the front side of the chip located at the loading position, and the unloading positioning component 200 monitors the front side of the chip located at the unloading position. The back inspection component 300 is used to photograph the back side of the chip located at the detection position.

[0028] This chip optical inspection device achieves a three-dimensional spatial layout of the inspection module by placing the positioning monitoring component and the back inspection component 300 on opposite sides of the adsorption module. This effectively avoids the space waste caused by component stacking in traditional inspection equipment, optimizes the spatial layout, and improves the overall compactness and integration of the structure. Furthermore, since the loading positioning component 100, unloading positioning component 200, and back inspection component 300 are located on different sides of the adsorption module, they can operate simultaneously without interference during chip movement, allowing for parallel inspection of the front and back sides of the chip at different positions. The adsorption module, through the nozzle drive component, drives the pick-up nozzle 400 to achieve cyclical movement of the chip between the loading, inspection, and unloading positions. This enables periodic movement and continuous inspection of the chip, improving the reliability and repeatability of the chip optical inspection device. It is suitable for high-frequency inspection requirements in automated production lines. Combined with the real-time monitoring of the chip position by the positioning monitoring component, it ensures the positioning accuracy and stability of the chip during handling. The loading and positioning component 100 is used to position the chip from the front before it is attracted, ensuring the chip's posture accuracy when entering the inspection process. The unloading and positioning component 200 ensures the chip is in the correct position before release, ensuring the chip's posture accuracy when leaving the inspection process and avoiding unloading errors, thus achieving precise positioning at multiple positions. The back inspection component 300 captures images of the back of the chip while it is in the inspection position, achieving comprehensive identification of defects on the back of the chip through high-quality image acquisition. In summary, simultaneous inspection of the front and back of the chip can be achieved, completing a complete double-sided inspection loop, improving inspection efficiency, and reducing the time the chip spends in the chip optical inspection device. Furthermore, because the positioning and monitoring component and the back inspection component 300 are designed separately, they can be easily modularly adjusted or replaced according to chip type and size, enhancing the versatility and scalability of the chip optical inspection device.

[0029] The material pick-up nozzle 400 and the nozzle drive assembly are both conventional settings in this technical field. Their specific structure and working principle are common knowledge in this field. Furthermore, the material pick-up nozzle 400 and the nozzle drive assembly are not the focus of protection in this embodiment, and will not be described in detail here.

[0030] In this embodiment, the material suction nozzle 400 rotates about an axis parallel to the vertical direction Z.

[0031] The pick-up nozzle 400 can rotate around the vertical Z-axis after picking up the chip, allowing the orientation of the chip to be adjusted according to inspection requirements. This facilitates adjustment of the chip's orientation during inspection, adapting to different inspection angles or paths and enhancing the flexibility of orientation adjustment. It can also accommodate chips with different package types or pin arrangements, enhancing the compatibility and adaptability of the chip optical inspection device. In optical inspection, some chip defects may only be visible at specific angles. This rotation function allows the inspection system to capture or inspect the chip from multiple angles, improving the comprehensiveness of defect identification and avoiding false or missed detections due to incorrect orientation. This improves inspection accuracy and adaptability to meet different optical inspection requirements. By replacing the complex mechanical flipping structure in traditional inspection equipment with the rotation of the pick-up nozzle 400, the complexity of the mechanical structure of the chip optical inspection device is reduced, lowering maintenance costs and failure rates.

[0032] The aforementioned structure is simple and easy to control, making it suitable for high-frequency, high-speed testing scenarios. In automated testing processes, this structure facilitates integration with external devices, thereby improving overall compatibility.

[0033] Furthermore, the adsorption module also includes a support plate, the output end of the suction nozzle drive component is fixed to the support plate, and the material suction nozzle 400 is disposed on the support plate.

[0034] The pick-up nozzle 400 is mounted on a carrier plate and connected to the nozzle drive assembly via the carrier plate, forming a modular structure. This ensures the stability and reliability of the pick-up nozzle 400, facilitates future replacement and maintenance, improves the maintainability and efficiency of the chip optical inspection device, reduces maintenance costs, and prevents adsorption failure of a single pick-up nozzle 400 due to structural loosening. The fixed connection between the nozzle drive assembly and the carrier plate increases the rigidity of the overall structure, facilitates the linkage control between the nozzle drive assembly and multiple pick-up nozzles 400, ensures the stability and synchronization of the chip during movement, and reduces detection errors caused by vibration. Moreover, the carrier plate design provides a basic platform for the layout of multiple pick-up nozzles 400, facilitating parallel operation of multiple pick-up nozzles 400, improving chip handling efficiency, and reserving space for future expansion to include simultaneous multi-chip inspection capabilities.

[0035] Furthermore, the output end of the suction nozzle drive assembly is connected to the bottom end of the carrier plate, and the material suction nozzle 400 is connected to the top end of the carrier plate.

[0036] The suction nozzle drive assembly is connected to the bottom of the support plate, while the pick-up nozzle 400 is located at the top. This distribution lowers the center of gravity of the entire adsorption module, making it more stable during movement and reducing the impact of vibration on chip adsorption stability. This also helps maintain the balance of the robotic arm and improves stability during movement. Furthermore, the arrangement of the vertical suction nozzle drive assembly at the bottom and the pick-up nozzle 400 at the top makes the structure more compact, facilitating the integration of more detection components within a limited space. Moreover, placing the drive assembly at the bottom facilitates daily maintenance and wiring layout, while preventing the pick-up nozzle 400 and chip area from being obstructed by mechanical parts, thus avoiding interference with the detection field of view.

[0037] In this embodiment, the axis of the carrier disk is parallel to the vertical direction Z, and the output end of the suction nozzle drive assembly is coaxial with the carrier disk.

[0038] The coaxial arrangement of the carrier disk and the drive output ensures coaxiality during rotation, guaranteeing the accuracy and stability of the carrier disk during rotation, reducing rotational errors caused by eccentricity, and improving positioning accuracy during detection. Furthermore, the coaxial structure helps reduce energy loss during transmission, simplifies the drive control logic, improves system response speed and control accuracy, easily meets the requirements of high-precision image acquisition, enhances the efficiency of the rotation drive, and helps extend the service life of the chip optical inspection device.

[0039] For example, there are multiple material pick-up nozzles 400, and all material pick-up nozzles 400 are evenly spaced around the axis of the carrier plate.

[0040] Multiple pick-up nozzles 400 are evenly distributed around the axis, enabling simultaneous adsorption of multiple chips within the same cycle for synchronous transport and inspection. This completes the loading, inspection, and unloading operations of multiple chips, achieving simultaneous processing of multiple chips and realizing a highly efficient "multiple-in, multiple-out" inspection mode. This improves the overall utilization and throughput capacity of the chip optical inspection device. Furthermore, the even distribution of the pick-up nozzles 400 facilitates positional matching with multi-station inspection modules, thereby enabling simultaneous inspection of multiple chips and improving system coordination efficiency.

[0041] In this embodiment, the positioning monitoring component and the back inspection component 300 are symmetrically arranged about the axis of the output end of the nozzle drive component.

[0042] A symmetrical layout allows for more balanced forces on the adsorption module during movement, reducing the risk of vibration and displacement, and improving the stability and lifespan of the chip optical inspection device. The symmetrical structure facilitates the arrangement of optical lenses and the alignment of optical paths, making it easier to determine the optical parameters (such as focal length, optical path, and detection angle) of the positioning monitoring component and the back inspection component 300. This helps improve the symmetry and consistency of the inspection images, facilitating image comparison and defect identification. Simultaneously, a symmetrical layout makes it easier to implement symmetrical detection logic at different positions of the chip, improving detection consistency. Furthermore, a symmetrical layout provides a structural foundation for subsequent functional expansion, facilitating equipment upgrades and functional expansion.

[0043] For example, the loading positioning component 100 and the unloading positioning component 200 are arranged side by side along the arrangement direction X, which is perpendicular to the vertical direction Z.

[0044] The side-by-side arrangement reduces the travel distance of the pick-up nozzle 400 in the X direction, which simplifies the design of the drive mechanism and reduces mechanical complexity. Placing the loading and unloading positioning components 100 and 200 side-by-side along the X direction fully utilizes horizontal space, improves overall compactness, simplifies the planar layout and path planning of the chip optical inspection device, avoids wasting vertical space, and also shortens chip handling time, improving overall inspection efficiency. The side-by-side arrangement of the loading and unloading positioning components 100 and 200 facilitates efficient integration with upstream and downstream equipment, enhancing the overall integration of the chip optical inspection device.

[0045] In one embodiment of this invention, the loading positioning component 100 includes a first camera; the unloading positioning component 200 includes a second camera; and the back inspection component 300 includes a third camera.

[0046] The first camera, second camera, and third camera are used as the loading positioning, unloading positioning, and back inspection components 300, respectively. They use mature vision technology and have good detection accuracy and cost advantages.

[0047] As a standard image acquisition device, the camera can seamlessly integrate with existing image processing algorithms and AI recognition technologies to achieve automatic identification and classification, facilitating future software development and upgrades. Independent cameras are used for front and back imaging, with clear functional division and comprehensive inspection content, enabling simultaneous and accurate dual-sided chip inspection and significantly improving the comprehensiveness of defect identification. Furthermore, different cameras can undergo independent image processing algorithm optimization for their respective inspection tasks, thereby improving detection accuracy and recognition efficiency, and facilitating independent optimization of image processing and defect identification algorithms.

[0048] In another embodiment of this example, the loading positioning component 100, the unloading positioning component 200, and the back inspection component 300 may each include a corresponding camera.

[0049] The camera is a conventional device in this technical field, and its specific structure and working principle are common knowledge in this field. Moreover, the camera is not the focus of this embodiment, so it will not be described in detail here.

[0050] This embodiment also provides a chip optical inspection device, including a loading device, a unloading device, and the aforementioned chip optical inspection device. The loading device is used to place the chip at the loading position, and the unloading device is used to remove the chip located at the unloading position.

[0051] This chip optical inspection equipment integrates loading and unloading devices, enabling fully automated operation of chip pick-up, placement, inspection, and return processes. This reduces errors and time costs associated with manual operation, aligning with the development trend of intelligent manufacturing and improving inspection efficiency. The organic combination of loading, inspection, and unloading forms a closed-loop inspection process, facilitating data tracking and quality control management. These features allow for the flexible application of this integrated chip optical inspection equipment to different types of chip inspection production lines, meeting diverse needs from R&D testing to mass production inspection.

[0052] Both the feeding device and the unloading device are conventional devices in this technical field, and their specific structures and working principles are common knowledge in this field. Furthermore, the feeding device and the unloading device are not the focus of this embodiment, and will not be described in detail here.

[0053] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A chip optical inspection apparatus for inspecting a chip having opposite front and back surfaces, characterized by, The chip optical inspection device includes: The adsorption module includes a suction nozzle driving component and a pick-up nozzle (400). The suction nozzle driving component is used to drive the pick-up nozzle (400) to make the chip move cyclically between the loading position, the detection position and the unloading position. The pick-up nozzle (400) can adsorb the chip located at the loading position and the pick-up nozzle (400) can release the chip located at the unloading position. The detection module includes a positioning monitoring component and a back inspection component (300), which are located on opposite sides of the adsorption module. The positioning monitoring component includes a loading positioning component (100) and a unloading positioning component (200). The loading positioning component (100) is used to monitor the front of the chip located at the loading position, and the unloading positioning component (200) is used to monitor the front of the chip located at the unloading position. The back inspection component (300) is used to photograph the back of the chip located at the detection position.

2. The chip optical inspection device according to claim 1, characterized in that, The material suction nozzle (400) rotates about an axis parallel to the vertical direction (Z).

3. The chip optical inspection device according to claim 2, characterized in that, The adsorption module also includes a support plate, the output end of the suction nozzle drive component is fixed to the support plate, and the material suction nozzle (400) is disposed on the support plate.

4. The chip optical inspection device according to claim 3, characterized in that, The output end of the suction nozzle drive assembly is connected to the bottom end of the carrier plate, and the material suction nozzle (400) is connected to the top end of the carrier plate.

5. The chip optical inspection device according to claim 3, characterized in that, The axis of the carrier plate is parallel to the vertical direction (Z), and the output end of the suction nozzle drive assembly is coaxial with the carrier plate.

6. The chip optical inspection device according to claim 3, characterized in that, The material pick-up nozzle (400) is provided in multiple ways, and all the material pick-up nozzles (400) are evenly distributed around the axis of the carrier plate.

7. The chip optical inspection device according to claim 3, characterized in that, The positioning monitoring component and the back inspection component (300) are symmetrically arranged about the axis of the output end of the nozzle drive component.

8. The chip optical inspection device according to claim 2, characterized in that, The loading positioning component (100) and the unloading positioning component (200) are arranged side by side along the arrangement direction (X), which is perpendicular to the vertical direction (Z).

9. The chip optical inspection apparatus according to any one of claims 1-8, characterized in that, The loading positioning component (100) includes a first camera; the unloading positioning component (200) includes a second camera; and / or, the back inspection component (300) includes a third camera.

10. A chip optical inspection device, characterized in that, The device includes a loading device, a unloading device, and a chip optical inspection device according to any one of claims 1-9, wherein the loading device is used to place the chip at the loading position, and the unloading device is used to remove the chip located at the unloading position.

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