Novel reflow furnace jig

Abstract

The utility model discloses a novel reflow soldering furnace fixture, including the fixture upper cover, the fixture upper cover is equipped with recess portion, the recess portion is fixed with the heat dissipation subassembly, the heat dissipation subassembly includes the heat dissipation base and the integrated multiple heat dissipation teeth, the heat dissipation base bottom surface close recess portion upper surface. The utility model discloses technical effect and advantage: install heat dissipation tooth on the welding fixture upper cover, after the fixture enters the soldering furnace, the large -area advantage of heat dissipation tooth is shown, it can rapidly absorb heat, absorbs more heat in shorter time, thereby lets the solder paste reach melting point in shorter time, then again in the cooling section, the heat is scattered fast, makes the solder paste quick solidification and reduces the temperature when the fixture is discharged, guarantees the temperature of the fixture and product when discharging not too high, thereby solves the personnel scald hidden danger, guarantees the product and is equipped into the tray, will not cause the tray deformation, product damage.

Description

Technical Field

[0001] This utility model relates to the field of reflow oven fixture technology, and more specifically to a novel reflow oven fixture. Background Technology

[0002] As chip power consumption increases and laptop performance continues to improve, heat dissipation modules are becoming larger and more complex.

[0003] This article focuses on the soldering fixtures needed to address the continuous optimization and upgrades of cooling modules in high-performance gaming laptops and other devices. As laptop cooling modules become larger and more complex, the drawbacks of traditional soldering furnace fixture designs have become apparent.

[0004] Due to changes in the length, number, and bending of the heat pipes in the heat dissipation module, the fixture itself becomes heavier. This results in the fixture and module remaining very hot even after passing through the soldering furnace cooling section, posing a risk of burns to operators and the trays during operation. Even slight lapses in attention can lead to burns from the fixture or module, and excessively high temperatures can cause tray deformation, rendering them unusable, and product damage. This situation needs to be improved to reduce the risk of burns and lower production costs. Utility Model Content

[0005] In order to overcome the above-mentioned defects of the prior art, this utility model provides a new type of reflow furnace fixture.

[0006] The technical solution of this utility model is as follows: A novel reflow oven fixture includes a fixture cover with a groove. A heat dissipation component is fixed in the groove. The heat dissipation component includes a heat dissipation base and multiple integrally formed heat dissipation teeth. The bottom surface of the heat dissipation base is in close contact with the upper surface of the groove.

[0007] The fixture cover is detachably mounted on the fixture base.

[0008] The fixture top cover has multiple mounting holes around its perimeter, and the fixture base cover also has multiple mounting holes at corresponding positions around its perimeter.

[0009] The technical effects and advantages of this utility model are as follows: Heat dissipation fins are installed on the top cover of the soldering fixture. After the fixture enters the soldering furnace, the large area advantage of the heat dissipation fins becomes apparent. They can absorb heat quickly and absorb more heat in a shorter time, thus allowing the solder paste to reach its melting point in a shorter time. Then, the heat is quickly dissipated in the cooling section, which allows the solder paste to solidify quickly and reduces the temperature of the fixture when it comes out of the furnace. This ensures that the temperature of the fixture and the product does not get too high when they come out of the furnace, thereby eliminating the risk of burns to personnel and ensuring that the product is placed in the tray without causing the tray to deform or the product to be damaged. The recessed design ensures the stability of the fixture cover while reducing its thickness, thus facilitating rapid heat transfer between the fixture and the heat dissipation components. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of the present invention. Detailed Implementation

[0011] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0012] like Figure 1 and Figure 2 The present invention relates to a novel reflow oven fixture, comprising a fixture cover 1, wherein the fixture cover is provided with a groove 11, and a heat dissipation component 2 is fixed in the groove. The heat dissipation component 2 includes a heat dissipation base 21 and a plurality of integrally formed heat dissipation teeth 22, wherein the bottom surface of the heat dissipation base 21 is in close contact with the upper surface of the groove 11.

[0013] Furthermore, the fixture cover 1 is detachably mounted on the fixture base 3.

[0014] Furthermore, the upper cover of the fixture is provided with multiple mounting holes a around its periphery, and the base cover of the fixture is also provided with multiple mounting holes a at corresponding positions around its periphery.

[0015] This patent features a heat dissipation component installed on the top cover of the soldering fixture. After the fixture enters the soldering furnace, the large surface area of ​​the heat dissipation fins becomes apparent, allowing it to absorb heat rapidly and in a shorter time, thus enabling the solder paste to reach its melting point in a shorter time. Then, the heat is quickly dissipated in the cooling section, causing the solder paste to solidify rapidly and reducing the temperature of the fixture when it exits the furnace. This ensures that the temperature of the fixture and the product does not become too high when exiting the furnace, thereby eliminating the risk of burns to personnel and ensuring that the product is placed in the tray without causing tray deformation or product damage.

[0016] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel reflow oven fixture, characterized in that: The fixture includes a top cover, which has a recessed portion. A heat dissipation component is fixed inside the recessed portion. The heat dissipation component includes a heat dissipation base and multiple integrally formed heat dissipation teeth. The bottom surface of the heat dissipation base is in close contact with the upper surface of the recessed portion.

2. A novel reflow furnace fixture according to claim 1, characterized in that: The fixture cover is detachably mounted on the fixture base.

3. A novel reflow furnace fixture according to claim 1, characterized in that: The fixture top cover has multiple mounting holes around its perimeter, and the fixture base cover also has multiple mounting holes at corresponding positions around its perimeter.

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