Silver ink containing an adhesion promoter
A silver carboxylate and titanium carboxylate-based ink composition addresses storage stability and adhesion issues in MOD inks, ensuring stable and conductive structures on diverse substrates with low curing temperatures.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- ヘレウス プリンティド エレクトロニクス ゲーエムベーハー
- Filing Date
- 2025-11-10
- Publication Date
- 2026-05-27
AI Technical Summary
Existing MOD inks for conductive structures face issues with storage stability, precipitation of metal particles, nozzle clogging, and poor adhesion to substrates, especially at low curing temperatures and on heat-sensitive materials.
A composition comprising silver carboxylate and titanium carboxylate dissolved in specific organic solvents, which provides high storage stability and adhesion to substrates even at low curing temperatures, preventing nozzle clogging and enabling high conductivity.
The composition achieves stable storage for weeks at room temperature, maintains adhesion to substrates under thermal stress, and produces conductive structures with high conductivity, suitable for various substrates including heat-sensitive materials.
Smart Images
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